HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x.8 mm and a height of only.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4 units per reel. These parts are compatible with reflow soldering. Features Small size 63 industry standard footprint Diffused optics Operating temperature range of 4 C to +85 C Compatible with reflow soldering Available in various color combination Available in 8 mm tape on 7" (178 mm) diameter reels Applications Keypad backlighting Symbol indicator LCD backlighting Pushbutton backlighting Front panel indicator Device Selection Guide Part Number Color Package Description HSMF-C162 AlInGaP Red / AlInGaP Amber Untinted, Diffused HSMF-C163 AlInGaP Red / Green Untinted, Diffused HSMF-C164 AlInGaP Red / Blue Untinted, Diffused HSMF-C165 High Efficiency Red / GaP Green Untinted, Diffused HSMF-C166 GaP Yellow / GaP Green Untinted, Diffused HSMF-C167 GaP Orange / GaP Green Untinted, Diffused HSMF-C168 Green / Blue Untinted, Diffused HSMF-C169 AlInGaP Amber / Blue Untinted, Diffused CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.1 standard. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions LED DIES CATHODE LINE 1 2 3 4.8 (.31) 1.6 (.63 ) DIFFUSED EPOXY PC BOARD.16 (.6).5 (.2) CATHODE LINE.4 (.16).3 (.12) SOLDERING TERMINALS POLARITY HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169 1 3 AMBER BLUE BLUE BLUE 2 4 RED RED RED RED YELLOW ORANGE AMBER Notes: 1. All Dimensions in millimeters (Inches). 2. tolerance is ±.1 mm (±.4 in.) unless otherwise specified. Absolute Maximum Ratings for Each Die at T A = 25 C Parameter AlInGaP GaP Units DC Forward Current [1] 2 1 2 ma Power Dissipation 48 38 52 mw Reverse Voltage 5 5 5 V LED Junction Temperature 95 95 95 C Operating Temperature Range 4 to +85 C Storage Temperature Range 4 to +85 C Soldering Temperature See reflow soldering profile (Figure 6 & 7) Note: 1. Derate linearly as shown in Figure 4. 2
Electrical Characteristics at T A = 25 C Reverse Breakdown Capacitance Thermal Forward Voltage V R (Volts) C (pf), @ V F =, Resistance V F (Volts) @ I F [1] @ I R = 1 µa f = 1 MHz Rθ J-PIN ( C/W) Color Typ. Max. Min. Typ. Typ. AlInGaP Red 2 ma 1.9 2.4 5 15 3 AlInGaP Amber 2 ma 1.9 2.4 5 11 3 AlInGaP Red [2] 1 ma 1.8 2.3 5 15 3 AlInGaP Amber [2] 1 ma 1.8 2.3 5 11 3 Green 1 ma 3.4 3.8 5 35 5 Blue 1 ma 3.4 3.8 5 35 5 HER 2 ma 1.95 2.6 5 5 325 GaP Orange 2 ma 2.2 2.6 5 7 325 GaP Yellow 2 ma 2.1 2.6 5 6 325 GaP Green 2 ma 2.2 2.6 5 9 325 Notes: 1. V F Tolerance: ±.1 V. 2. The product testing is based on 2 ma. This is for reference only. Optical Characteristics at T A = 25 C Color Peak Dominant luminous luminous Intensity wavelength Wavelength Viewing Angle Efficacy I v (mcd) @ I F [1] λ peak (nm) λ d [2] (nm) 2 θ 1/2 Degrees [3] η v (lm/w) Color Min. Typ. Typ. Typ. Typ. Typ. AlInGaP Red 2 ma 28.5 9 637 626 12 155 AlInGaP Amber 2 ma 28.5 9 595 592 12 48 AlInGaP Red [4] 1 ma 11.2 35 637 626 12 155 AlInGaP Amber [4] 1 ma 11.2 35 595 592 12 48 Green 1 ma 18 45 523 525 12 5 Blue 1 ma 2.8 1 468 47 12 8 HER 2 ma 2.8 1 636 621 12 145 GaP Orange 2 ma 2.8 8 65 64 12 38 GaP Yellow 2 ma 2.8 8 589 586 12 5 GaP Green 2 ma 4.5 15 57 572 12 595 Notes: 1. The luminous intensity I v is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength λ d is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. The product testing is based on 2 ma. This is for reference purpose. 3
Color Bin Limits [1] Green Color Bins [1] A 561.5 564.5 B 564.5 567.5 C 567.5 57.5 D 57.5 573.5 E 573.5 576.5 Tolerance: ±.5 nm Blue Color Bins [1] A 46. 465. B 465. 47. C 47. 475. D 475. 48. Tolerance: ± 1 nm Orange Color Bins [1] A 597. 6. B 6. 63. C 63. 66. D 66. 69. E 69. 612. F 612. 615. Tolerance: ± 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Yellow/Amber Color Bins [1] A 582. 584.5 B 584.5 587. C 587. 589.5 D 589.5 592. E 592. 594.5 F 594.5 597. Tolerance: ±.5 nm Green Color Bins [1] A 515. 52. B 52. 525. C 525. 53. D 53. 535. Tolerance: ± 1 nm Intensity (I v ) Bin Limits [1] Intensity @ 2 ma (mcd) A.11.18 B.18.29 C.29.45 D.45.72 E.72 1.1 F 1.1 1.8 G 1.8 2.8 H 2.8 4.5 J 4.5 7.2 K 7.2 11.2 L 11.2 18. M 18. 28.5 N 28.5 45. P 45. 71.5 Q 71.5 112.5 R 112.5 18. S 18. 285. T 285. 45. U 45. 715. V 715. 1125. W 1125. 18. X 18. 285. Y 285. 45. Tolerance: ± 15%. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 4
RELATIVE INTENSITY % 1 9 8 7 6 5 4 3 2 1 4 BLUE AS AMBER AS ORANGE AS RED 45 5 55 6 65 7 WAVELENGTH nm RELATIVE INTENSITY 1..5 GaP GaP YELLOW GaP ORANGE 5 55 6 65 7 75 WAVELENGTH - nm HER Figure 1. Relative intensity vs. wavelength. 1 1 IF FORWARD CURRENT ma 1 1 AS AlInGaP IF FORWARD CURRENT ma 1 1 HER GaP ORANGE GaP YELLOW GaP.1 1.5 2. 2.5 3. 3.5 4. V F FORWARD VOLTAGE V 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 V F FORWARD VOLTAGE V Figure 2. Forward current vs. forward voltage. 1.4 1.6 1.4 1.2 1.4 1.2 LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 1..8.6.4 AS AlInGaP LUMINOUS INTENSITY (NORMALIZED AT 1 ma) 1.2 1..8.6.4 LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 1..8.6.4 GaP.2.2.2 5 1 15 2 25 3 2 4 6 8 1 12 14 I F FORWARD CURRENT ma I F FORWARD CURRENT ma 16 5 1 15 2 25 3 I F FORWARD CURRENT ma Figure 3. Luminous intensity vs. forward current. 5
25 1 IF MAX. MAXIMUM FORWARD CURRENT ma 2 15 1 5 AlInGaP/GaP 1 2 3 4 5 6 7 8 9 1 T A AMBIENT TEMPERATURE C RELATIVE INTENSITY % 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 4. Maximum forward current vs. ambient temperature. Figure 5. Relative intensity vs. angle. 1-3 SEC. TEMPERATURE 14-16 C 1 SEC. MAX. 4 C/SEC. MAX. 23 C MAX. OVER 2 MIN. 4 C/SEC. MAX. 3 C/SEC. MAX. TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6-12 SEC. 6 C/SEC. MAX. 1 SEC. MAX. TIME TIME (Acc. to J-STD-2C) Figure 6. Recommended reflow soldering profile. Figure 7. Recommended Pb-free reflow soldering profile..3 (.12).6 (.24).4 (.16).7 (.28).7 (.28).4 (.16) Figure 8. Recommended soldering pad pattern. 6
USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling orientation. 8. ± 1. (.315 ±.39) Ø 13.1 ±.5 (Ø.516 ±.2) 1.5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) 178.4 ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Note: 1. All Dimensions in millimeters (Inches). Figure 1. Reel dimensions. 7
4. (.157) 1.5 (.59) CATHODE DIM. C (SEE TABLE 1).2 ±.5 (.8 ±.2) 1.75 (.69) DIM. A (SEE TABLE 1) 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B (SEE TABLE 1) 2. ±.5 (.79 ±.2) 4. (.157) USER FEED DIRECTION COVER TAPE CARRIER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C PART NUMBER ±.1 (±.4) ±.1 (±.4) ±.1 (±.4) HSMF-C16x 1.75 (.69).95 (.37).6 (.24) Figure 11. Tape dimensions. END START THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Notes: 1. All Dimensions in millimeters (Inches). 2. tolerance is ±.1 mm (±.4 in.) unless otherwise specified. Figure 12. Tape leader and trailer dimensions. Reflow Soldering For more information on reflow soldering, refer to Application Note 16, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 3 C @ 6% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/ transparent color b) the pack has been opened for more than 672 hours. Baking recommended condition: 6 ± 5 C for 2 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 25-212 Avago Technologies. All rights reserved. Obsoletes 5989-481EN AV2-584EN - April 3, 212