MEMS pressure sensor: 260-1260 hpa absolute digital output barometer Applications Data brief Altimeter and barometer for portable devices GPS applications Weather station equipment Indoor navigation (Altitude / floor detection) Wearable devices Features HLGA - 10L 2.0 x 2.0 x 0.8 (max) mm 260 to 1260 hpa absolute pressure range High-resolution mode: 0.01 hpa RMS Low power consumption: Low resolution mode: 4 µa High resolution mode with FIFO: 4.5 µa High overpressure capability: 20x full scale Embedded temperature compensation Embedded 24-bit ADC Selectable ODR from 1 Hz to 25 Hz SPI and I²C interfaces Embedded FIFO Supply voltage: 1.7 to 3.6 V High shock survivability: 10,000 g Small and thin package ECOPACK lead-free compliant Description The LPS2HB is an ultra-compact absolute piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world. The sensing element consists of a suspended membrane realized inside a single mono-silicon substrate. It is capable to detect the absolute pressure and is manufactured with a dedicated process developed by ST. The membrane is very small compared to the traditionally built silicon micromachined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper. The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics. The LPS2HB is available in a fully molded holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -30 C to +105 C. The package is holed to allow external pressure to reach the sensing element. Table 1. Device summary Order codes Temperature range [ C] Package Packing LPS2HBTR LPS2HB -30 to +105 HLGA - 10L Tape and reel Tray March 2014 DocID026011 Rev 1 1/6 For further information contact your local STMicroelectronics sales office. www.st.com
Block diagram and pin description LPS2HB 1 Block diagram and pin description Figure 1. LPS2HB block diagram p MUX Low noise analog front end ADC + digital filter Quadratic temperature Compensation 32 Samples FIFO Filter (32 samples average) I 2 C SPI Sensing element Temperature sensor Voltage and current bias Clock and timing Sensor bias AM08736V2 1.1 Pin description Table 2. Pin description Pin n Name Function 1 VDD_IO Power supply for I/O pins 2 SCL SPC I²C serial clock (SCL) SPI serial port clock (SPC) 3 Reserved Connect to GND 4 5 SDA SDI SDI/SDO SDO SA0 6 CS I²C serial data (SDA) 4-wire SPI serial data input (SDI) 3-wire serial data input /output (SDI/SDO) 4-wire SPI serial data output (SDO) I²C less significant bit of the device address (SA0) SPI enable I²C/SPI mode selection (1: I²C mode; 0: SPI enabled) 7 INT_DRDY Interrupt (or data ready) 8 GND 0 V supply 9 GND 0 V supply 10 VDD Power supply 2/6 DocID026011 Rev 1
Package mechanical data 2 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 3. HLGA - 10L (2.0 x 2.0 x 0.8 mm) mechanical data Symbol mm. Min. Typ. Max. A 0.73 0.80 b 0.20 0.25 0.30 b1 0.070 0.075 0.080 D 2.00 BSC D3 1.07 1.12 1.17 E 2.00 BSC E3 1.13 1.18 1.23 e1 e2 0.50 BSC 1.00 BSC e3 0.67 0.70 0.73 e4 0.66 0.69 0.72 L 0.225 0.275 0.325 L1 0.03 0.10 0.17 L2 0.070 0.075 0.080 d 0.020 DocID026011 Rev 1 3/6 6
Package mechanical data LPS2HB Figure 2. Package outline for HLGA - 10L (2.0 x 2.0 x 0.8 max mm.) d POA_8479831 4/6 DocID026011 Rev 1
Revision history 3 Revision history Table 4. Document revision history Date Revision Changes 17-Mar-2014 1 Initial release DocID026011 Rev 1 5/6 6
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