EE C247B ME C218 Introduction to MEMS Design Spring 2017 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture Module 1: Admin & Overview EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 1 Instructor: Prof. Clark T.-C. Nguyen Education: Ph.D., University of California at Berkeley, 1994 1995: joined the faculty of the Dept. of EECS at the University of Michigan 2006: (came back) joined the faculty of the Dept. of EECS at UC Berkeley Research: exactly the topic of this course, with a heavy emphasis on vibrating RF MEMS Teaching: (at the UofM) mainly transistor circuit & physics; (UC Berkeley) 140/240A, 143, 243, 245,247B/ME218 2001: founded Discera, the first company to commercialize vibrating RF MEMS technology Mid-2002 to 2005: DARPA MEMS program manager ran 10 different MEMS-based programs topics: power generation, chip-scale atomic clock, gas analyzers, nuclear power sources, navigation-grade gyros, on-chip cooling, micro environmental control EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 2 Copyright @ 2017 Regents of the University of California 1
Course Overview Goals of the course: Accessible to a broad audience (minimal prerequisites) Design emphasis Exposure to the techniques useful in analytical design of structures, transducers, and process flows Perspective on MEMS research and commercialization circa 2017 Related courses at UC Berkeley: EE 143: Microfabrication Technology EE 147/247A: Introduction to MEMS ME 119: Introduction to MEMS (mainly fabrication) BioEng 121: Introduction to Micro and Nano Biotechnology and BioMEMS ME C219 EE C246: MEMS Design Assumed background for EE C247B/ME C218: graduate standing in engineering or physical/bio sciences knowledge of microfabrication technology EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 3 Course Overview The mechanics of the course are summarized in the course handouts, described in lecture today Course Information Sheet Course description Course mechanics Textbooks Grading policy Syllabus Lecture by lecture timeline w/ associated reading sections Midterm Exam: Tuesday, March 21 Final Exam: Friday, May 12, 7-10 p.m. (Group 20) Project due date TBD (but near semester s end) EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 4 Copyright @ 2017 Regents of the University of California 2
What Should You Know? D D G Sub G Sub S S G D S G D S P + N P+ N + P N + N Well - PMOS Substrate P Well - NMOS Substrate P EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 5 What Should You Know? EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 6 Copyright @ 2017 Regents of the University of California 3
Lecture Outline Reading: Senturia, Chapter 1 Lecture Topics: Definitions for MEMS MEMS roadmap Benefits of Miniaturization EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 7 MEMS: Micro Electro Mechanical System A device constructed using micromachining (MEMS) tech. A micro-scale or smaller device/system that operates mainly via a mechanical or electromechanical means At least some of the signals flowing through a MEMS device are best described in terms of mechanical variables, e.g., displacement, velocity, acceleration, temperature, flow Input: voltage, current acceleration, velocity light, heat Transducer Transducer to to Convert Convert Control Control to to a Mechanical Mechanical Variable Variable (e.g., (e.g., displacement, displacement, velocity, velocity, stress, stress, heat, heat, ) ) Control: voltage, current acceleration velocity light, heat, MEMS Output: voltage, current acceleration, velocity light, heat, [Wu, UCLA] Angle set by mechanical means to control the path of light EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 8 Copyright @ 2017 Regents of the University of California 4
Other Common Attributes of MEMS Feature sizes measured in microns or less [Najafi, Michigan] 80 mm Gimballed, Spinning Micromechanical Macro-Gyroscope Vibrating Ring Gyroscope MEMS Technology (for 80X size Reduction) Merges computation with sensing and actuation to change the way we perceive and control the physical world Planar lithographic technology often used for fabrication can use fab equipment identical to those needed for IC s however, some fabrication steps transcend those of conventional IC processing 1 mm Signal Conditioning Circuits EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 9 Bulk Micromachining and Bonding Use the wafer itself as the structural material Adv: very large aspect ratios, thick structures Example: deep etching and wafer bonding 1 mm [Najafi, Michigan] Micromechanical Vibrating Ring Gyroscope [Pisano, UC Berkeley] Movable Silicon Substrate Structure Silicon Substrate Electrode Glass Substrate Metal Interconnect Anchor Microrotor (for a microengine) EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 10 Copyright @ 2017 Regents of the University of California 5
EE C247B/ME C218: Introduction to MEMS Surface Micromachining Fabrication steps compatible with planar IC processing EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 11 Single-Chip Ckt/MEMS Integration Completely monolithic, low phase noise, high-q oscillator (effectively, an integrated crystal oscillator) Oscilloscope Output Waveform [Nguyen, Howe [Nguyen, Howe1993] 1993] To allow the use of >600oC processing temperatures, tungsten (instead of aluminum) is used for metallization EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen Copyright @ 2017 Regents of the University of California 8/20/09 12 6
3D Direct-Assembled Tunable L [Ming Wu, UCLA] EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 13 Technology Trend and Roadmap for MEMS increasing ability to compute Number of Transistors 10 9 10 8 10 7 10 6 10 5 10 4 10 3 10 2 10 1 10 0 Majority of Early MEMS Devices (mostly sensors) CPU s Pentium 4 ADXL-50 Inertial Navigation On a Chip i-stat 1 Weapons, Safing, Arming, and Fusing ADXL-278 ADXRS ADXL-78 Terabit/cm 2 Data Storage Phased-Array Antenna OMM 32x32 Caliper Adaptive Optics Optical Switches & Aligners Distributed Structural Control Displays Integrated Fluidic Systems 10 0 10 1 10 2 10 3 10 4 10 5 10 6 10 7 10 8 10 9 Number of Mechanical Components increasing ability to sense and act Digital Micromirror Device (DMD) Future MEMS Integration Levels Enabled Applications EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 14 Copyright @ 2017 Regents of the University of California 7
Example: Micromechanical Accelerometer The MEMS Advantage: Tiny >30X size reduction for Tiny mass mass means means small accelerometer mechanical small output output element need need integrated integrated transistor transistor allows integration with circuits circuits IC sto to compensate compensate Basic Operation Principle 400 m x o x F i ma x Displacement Spring a Inertial Force Proof Mass Acceleration Analog Devices ADXL 78 EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 15 Technology Trend and Roadmap for MEMS increasing ability to compute Number of Transistors 10 9 10 8 10 7 ADXL-50 Analog 10 Devices 6 ADXRS Integrated Gyroscope Inertial 10 5 Navigation Adv.: On a Chip Adv.: small small size size i-stat 1 10 4 Weapons, Caliper Safing, Arming, and Fusing 10 3 ADXL-278 10 Caliper 2 Microfluidic ADXRS Chip ADXL-78 10 1 10 0 Majority of Early MEMS Devices (mostly sensors) CPU s Pentium 4 Distributed Structural Terabit/cm OMM 2 8x8 Optical Control Data Storage Cross-Connect Switch Adv.: Adv.: faster faster Phased-Array switching, low Displays low loss, Antenna OMM loss, larger 32x32larger networks Integrated Fluidic Systems Adaptive Optics Optical Switches & Aligners 10 0 10 1 10 2 10 3 10 4 10 5 10 6 10 7 10 8 10 9 Number of Mechanical Components Adv.: Adv.: small small size, size, small small sample, fast fast analysis speed speed increasing ability to sense and act Digital Micromirror Device (DMD) Future MEMS Integration Levels Enabled Applications TI Digital Micromirror Device Adv.: Adv.: low low loss, loss, fast fast switching, high high fill fill factor factor EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 16 Copyright @ 2017 Regents of the University of California 8
Technology Trend and Roadmap for MEMS increasing power consumption increasing ability to compute Number of Transistors 10 9 10 8 10 7 10 6 10 5 10 4 10 3 10 2 10 1 10 0 Majority of Early MEMS Devices (mostly sensors) CPU s Pentium 4 ADXL-50 Inertial Navigation On a Chip i-stat 1 Weapons, Safing, Arming, and Fusing ADXL-278 ADXRS ADXL-78 Terabit/cm 2 Data Storage Phased-Array Antenna OMM 32x32 Caliper Adaptive Optics Optical Switches & Aligners Distributed Structural Control Displays Integrated Fluidic Systems 10 0 10 1 10 2 10 3 10 4 10 5 10 6 10 7 10 8 10 9 Number of Mechanical Components increasing ability to sense and act Digital Micromirror Device (DMD) Future MEMS Integration Levels Enabled Applications Lucrative Ultra-Low Power Territory (e.g, mechanically powered devices) EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 17 Benefits of Size Reduction: MEMS Benefits of size reduction clear for IC s in elect. domain size reduction speed, low power, complexity, economy MEMS: enables a similar concept, but MEMS extends the benefits of size reduction beyond the electrical domain Performance enhancements for application domains beyond those satisfied by electronics in the same general categories Speed Power Consumption Complexity Economy Robustness Frequency, Thermal Time Const. Actuation Energy, Heating Power Integration Density, Functionality Batch Fab. Pot. (esp. for packaging) g-force Resilience EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 18 Copyright @ 2017 Regents of the University of California 9