Heimann Sensr HTPA32x32d 32x32 Infrared Thermpile Array Sensr Imaging reprt by Sylvain HALLEREAU April 2018 22 BD BENONI GOULLIN 44200 NANTES - FRANCE +33 2 40 18 09 16 inf@systemplus.fr www.systemplus.fr 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 1
Table f Cntents Overview / Intrductin 4 Executive Summary Reverse Csting Methdlgy Cmpany Prfil 4 16 Methdlgy Package Package Views, Dimensins & Marking Package Opening Silicn Lens View, Dimensins Crss-Sectin Lens cating EERPOM Die Thermpile Die View, Dimensins & Marking MEMS Opening Crss-Sectin ROIC Characteristics Prcess Characteristics Cmparisn HTPA32x32d - ISC1403L Manufacturing Prcess Flw 78 Glbal Overview EEPROM Frnt-End Prcess EEPROM Wafer Fabricatin Unit ROIC Frnt-End Prcess ROIC Wafer Fabricatin Unit Thermpile Frnt-End Prcess Thermpile Wafer Fabricatin Unit Thermpile Back-End 0 : Prbe test & Dicing Silicn Lens Frnt-End Prcess Package Assembly Unit Back-End: Final test Cst Analysis 95 Yields Explanatin & Hyptheses EEPROM Die Silicn Lens Frnt-End Cst Wafer & Die Cst Frnt-End Cst Wafer & Die Cst Thermpile Die Frnt-End Cst Cmpnent Wafer & Die Cst Back-End : Packaging Cst Back-End : Final Test Cst Cmpnent Cst Estimated Price Analysis 111 Definitin f Prices Manufacturer Financial ratis Estimated Manufacturer price Selling price 100K, 500k, 1M & 10M Units Cmpany services 116 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 2
Executive Summary Overview / Intrductin Executive Summary Reverse Csting Methdlgy Cmpany Prfil & Supply Manufacturing Prcess Flw Cst Analysis Abut System Plus This full reverse csting study has been cnducted t prvide insight n technlgy data, manufacturing cst and selling price f the HTPA32x32d frm Heimann Sensr. The HTPA32x32d is an Infrared Thermpile Array Sensr with a reslutin f 32x32 Pixel in a TO39 package. Thank t the integrated EEPROM and the I²C interface it is very friendly t integrate in a system. The framerate can be set internally via the sensr clck and ADC-reslutin up t 15 Hz (highest reslutin) r up t 60 Hz (lwest reslutin). Heimann Sensr ffers nw lw cst slutin with cheap silicn lens instead f expensive germanium lens. The reprt includes technlgy and cst analysis f the HPTA32x32d. These analyses prvide the technical intelligence necessary t understand this technlgy. Simulatins fr lw vlume and high manufacturing vlume are perfrmed in rder t estimate the price if the thermpile is largely emplyed. A cmparisn between the HPTA32x32d, the ldest thermpile frm Heimann Sensr and the ISC1403 lwer definitin micrblmeter frm Flir. 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 3
Reverse Csting Methdlgy Overview / Intrductin Executive Summary Reverse Csting Methdlgy The reverse csting analysis is cnducted in 3 phases: Cmpany Prfil & Supply Manufacturing Prcess Flw Cst Analysis Abut System Plus Teardwn analysis Csting analysis Package is analyzed and measured The dies are extracted in rder t get verall data: dimensins, main blcks, pad number and pin ut, die marking Setup f the manufacturing prcess. Setup f the manufacturing envirnment Cst simulatin f the prcess steps Selling price analysis Supply chain analysis Analysis f the selling price 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 4
9 mm 10.5 mm 4.5 mm Package View & Dimensins Overview / Intrductin Cmpany Prfil & Supply Summary Package Silicn Lens EEPROM Die MEMS Die Manufacturing Prcess Flw Package: 4-pin TO39 Dimensins: 9 x 9 x 10.5 mm 9 mm Cst Analysis 2.49 mm Abut System Plus Package Tp View Optical View Package Side View Optical View Package Bttm View Optical View 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 5
Package Opening Overview / Intrductin Cmpany Prfil & Supply Package pening (metal sawn) lets appear 2 dies cnnected with wire bnding and a silicn lens. The sensr is filled with N2 inert gas. There is n getter in the case. Summary Package Silicn Lens EEPROM Die MEMS Die Manufacturing Prcess Flw Cst Analysis Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 6
Package Crss-Sectin 1 Overview / Intrductin Cmpany Prfil & Supply Summary Package Silicn Lens EEPROM Die MEMS Die Manufacturing Prcess Flw Cst Analysis Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 7
Thermpile Die View & Dimensins Overview / Intrductin XX mm Cmpany Prfil & Supply Die Area: XX mm² Number f PGDW per X-inch wafer: XX Summary Package Silicn Lens EEPROM Die MEMS Die Cst Analysis XX mm Manufacturing Prcess Flw Abut System Plus Thermpile Overview PGDW: Ptential Gd Dies per Wafer 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 8
Pixel View & Dimensins Overview / Intrductin Cmpany Prfil & Supply Summary Package Silicn Lens EEPROM Die MEMS Die Manufacturing Prcess Flw Cst Analysis Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 9
Ht End Thermcuples Overview / Intrductin Cmpany Prfil & Supply Summary Package Silicn Lens EEPROM Die MEMS Die Manufacturing Prcess Flw Cst Analysis Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 10
Thermpile Crss-Sectin Oxide Revelatin Overview / Intrductin Cmpany Prfil & Supply Summary Package Silicn Lens EEPROM Die MEMS Die Manufacturing Prcess Flw Cst Analysis Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 11
Thermpile Prcess Flw Overview / Intrductin Cmpany Prfil & Supply Manufacturing Prcess Flw Glbal Overview EEPROM Frnt-End Prcess ROIC Frnt-End Prcess Thermpile Frnt-End Prcess MEMS Back-End 0 Silicn Lens Frnt-End Prcess Packaging Prcess Cst Analysis Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 12
Thermpile Frnt-End Cst Overview / Intrductin Cmpany Prfil & Supply Manufacturing Prcess Flw Cst Analysis Ecnmic Hypthesis & Yields EEPROM Wafer & Die Cst Silicn Lens Wafer & Die Cst Thermpile Wafer & Die Cst Back-End Cst Cmpnent Cst Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 13
Thermpile Frnt-End Step Cst Overview / Intrductin Cmpany Prfil & Supply Manufacturing Prcess Flw Cst Analysis Ecnmic Hypthesis & Yields EEPROM Wafer & Die Cst Silicn Lens Wafer & Die Cst Thermpile Wafer & Die Cst Back-End Cst Cmpnent Cst Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 14
SELLING P R I C E 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 15
Estimated Manufacturer Price Overview / Intrductin Cmpany Prfil & Supply Manufacturing Prcess Flw Cst Analysis Financial Ratis Manufacturer Price Selling Price Abut System Plus 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 16
Related Reprts Overview / Intrductin Cmpany Prfil & Supply Manufacturing Prcess Flw Cst Analysis Abut System Plus Cmpany services Feedbacks Cntact Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING IMAGING FLIR Bsn a small, innvative, lw pwer, smart thermal camera cre Autliv s 3rd Generatin Autmtive Night Visin Camera with FLIR s ISC0901 MIcrblmeter Thermal Expert Infrared Camera fr Smartphnes and i3system 3BOL384_17A Micrblmeter MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT IMAGING Uncled Infrared Imagers Market and Technlgy Trends 2017 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 17
ORDER FORM Please prcess my rder fr Heimann Sensr HTPA32x32d Reverse Csting Reprt Ref.: SP18396 Full Reverse Csting reprt: EUR 3,490* Annual Subscriptin ffers pssible frm 3 reprts, including this reprt as the first f the year. Cntact us fr mre infrmatin *Fr price in dllars please use the day s exchange rate *All reprts are delivered electrnically in pdf frmat *Fr French custmer, add 20 % fr VAT *Our prices are subject t change. Please check ur new releases and price changes n www.systemplus.fr. The present dcument is valid 6 mnths after its publishing date: April 2018 SHIP TO Name (Mr/Ms/Dr/Pr):... Jb Title:... Cmpany:... Address:... City: State:... Pstcde/Zip:... Cuntry:... VAT ID Number fr EU members:... Tel:... Email:... Date:... Signature:... BILLING CONTACT First Name:... Last Name:... Email:... Phne:... PAYMENT DELIVERY n receipt f payment: By credit card: Number: Expiratin date: / Card Verificatin Value: By bank transfer: HSBC - CAE- Le Terminal -2 rue du Charrn- 44800 St HerblainFrance BIC cde: CCFRFRPP In EUR Bank cde : 30056 - Branch cde : 00955 - Accunt : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439 In USD Bank cde : 30056 - Branch cde : 00955 - Accunt : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797 Return rder by: FAX: +33 2 53 55 10 59 MAIL: SYSTEM PLUS CONSULTING 22 rue Benni Gullin 44200 Nantes France Cntact: EMAIL: sales@systemplus.fr TEL: +33 2 40 18 09 16 ABOUT SYSTEM PLUS CONSULTING System Plus Cnsulting is specialized in the cst analysis f electrnics frm semicnductr devices t electrnic systems. A cmplete range f services and csting tls t prvide in-depth prductin cst studies and t estimate the bjective selling price f a prduct is available. Our services: TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS www.systemplus.fr - sales@systemplus.fr Perfrmed by
TERMS AND CONDITIONS OF SALES 1.INTRODUCTION The present terms and cnditins apply t the ffers, sales and deliveries f services managed by System Plus Cnsulting except in the case f a particular written agreement. Buyer must nte that placing an rder means an agreement withut any restrictin with these terms and cnditins. 2.PRICES Prices f the purchased services are thse which are in frce n the date the rder is placed. Prices are in Eurs and wrked ut withut taxes. Cnsequently, the taxes and pssible added csts agreed when the rder is placed will be charged n these initial prices. System Plus Cnsulting may change its prices whenever the cmpany thinks it necessary. Hwever, the cmpany cmmits itself in invicing at the prices in frce n the date the rder is placed. 3.REBATES and DISCOUNTS The quted prices already include the rebates and discunts that System Plus Cnsulting culd have granted accrding t the number f rders placed by the Buyer, r ther specific cnditins. N discunt is granted in case f early payment. 4.TERMS OF PAYMENT System Plus Cnsulting delivered services are t be paid within 30 days end f mnth by bank transfer except in the case f a particular written agreement. If the payment des nt reach System Plus Cnsulting n the deadline, the Buyer has t pay System Plus Cnsulting a penalty fr late payment the amunt f which is three times the legal interest rate. The legal interest rate is the current ne n the delivery date. This penalty is wrked ut n the unpaid invice amunt, starting frm the invice deadline. This penalty is sent withut previus ntice. When payment terms are ver 30 days end f mnth, the Buyer has t pay a depsit which amunt is 10% f the ttal invice amunt when placing his rder. 5. OWNERSHIP System Plus Cnsulting remains sle wner f the delivered services until ttal payment f the invice. 6.DELIVERIES The delivery schedule n the purchase rder is given fr infrmatin nly and cannt be strictly guaranteed. Cnsequently any reasnable delay in the delivery f services will nt allw the buyer t claim fr damages r t cancel the rder. 7.ENTRUSTED GOODS SHIPMENT The transprt csts and risks are fully brn by the Buyer. Shuld the custmer wish t ensure the gds against lst r damage n the base f their real value, he must imperatively pint it ut tsystem Plus Cnsulting when the shipment takes place. Withut any specific requirement, insurance terms fr the return f gds will be the carrier current nes (reimbursement based n gd weight instead f the real value). 8.FORCE MAJEURE System Plus Cnsulting respnsibility will nt be invlved in nn executin r late delivery f ne f its duties described in the current terms and cnditins if these are the result f a frce majeure case. Therefre, the frce majeure includes all external event unpredictable and irresistible as defined by the article 1148 f the French Cde Civil? 9.CONFIDENTIALITY As a rule, all infrmatin handed by custmers t system Plus Cnsulting are cnsidered as strictly cnfidential. A nn-disclsure agreement can be signed n demand. 10.RESPONSABILITY LIMITATION The Buyer is respnsible fr the use and interpretatins he makes f the reprts delivered by System Plus Cnsulting. Cnsequently, System Plus Cnsulting respnsibility can in n case be called int questin fr any direct r indirect damage, financial r therwise, that may result frm the use f the results f ur analysis r results btained using ne f ur csting tls. 11.APPLICABLE LAW Any dispute that may arise abut the interpretatin r executin f the current terms and cnditins shall be reslved applying the French law. It the dispute cannt be settled ut-f-curt, the cmpetent Curt will be the Tribunal de Cmmerce de Nantes. Perfrmed by
COMPANY SERVICES 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 18
Business Mdels Fields f Expertise Overview / Intrductin Cmpany Prfil & Supply Manufacturing Prcess Flw Cst Analysis Abut System Plus Cmpany services Feedbacks Cntact Legal Custm Analyses (>130 analyses per year) Reprts (>50 reprts per year) Csting Tls Trainings 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 19
Cntact Overview / Intrductin Cmpany Prfil & Supply Manufacturing Prcess Flw Cst Analysis PHOENIX YOLE Inc. FRANKFURT/MAIN Eurpe Sales Office NANTES Headquarter LYON YOLE HQ KOREA YOLE TOKYO YOLE KK Abut System Plus Cmpany services Feedbacks Cntact Legal GREATER CHINA YOLE Headquarters 22 rue Benni Gullin 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr www.systemplus.fr Eurpe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phenix USA (310) 600-8267 laferriere@yle.fr Asia Sales Office Takashi ONOZAWA Tky JAPAN nzawa@yle.fr Mavis WANG GREATER CHINA wang@yle.fr 2018 System Plus Cnsulting Heimann Sensr HTPA32x32 Thermpile 20