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RELIABILITY REPORT FOR MAX2112CTI+ PLASTIC ENCAPSULATED DEVICES February 9, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1/5

Conclusion The MAX2112CTI+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards. Table of Contents I....Device Description V....Quality Assurance Information II....Manufacturing Information III....Packaging Information VI....Reliability Evaluation IV....Die Information...Attachments I. Device Description A. General The MAX2112 low-cost, direct-conversion tuner IC is designed for satellite set-top and VSAT applications. The IC is intended for 8PSK and Digital Video Broadcast (DVB-S2) applications. The MAX2112 directly converts the satellite signals from the LNB to baseband using a broadband I/Q downconverter. The operating frequency range extends from 925MHz to 2175MHz. The device includes an LNA and an RF variable-gain amplifier, I and Q downconverting mixers, and baseband lowpass filters with programmable cutoff frequency control and digitally controlled baseband variable-gain amplifiers. Together, the RF and baseband variable-gain amplifiers provide more than 80dB of gain control range. The IC is compatible with virtually all DVB-S2 demodulators. The MAX2112 includes fully monolithic VCOs, as well as a complete fractional-n frequency synthesizer. Additionally, an on-chip crystal oscillator is provided along with a buffered output for driving additional tuners and demodulators. Synthesizer programming and device configuration are accomplished with a 2-wire serial interface. The IC features a VCO autoselect (VAS) function that automatically selects the proper VCO. For multituner applications, the device can be configured to have one of two 2-wire interface addresses. A low-power standby mode is available whereupon the signal path is shut down while leaving the reference oscillator, digital interface, and buffer circuits active, providing a method to reduce power in single and multituner applications. The MAX2112 is the most advanced DBS tuner available today. The low noise figure eliminates the need for an external LNA. A small number of passive components are needed to form a complete DVB-S2 RF front-end solution. The tuner is available in a very small 28-pin thin QFN package. Maxim Integrated Products. All rights reserved. Page 2/5

II. Manufacturing Information A. Description/Function: Complete, Direct-Conversion Tuner for DVB-S2 Applications B. Process: MB3H C. Number of Device Transistors: D. Fabrication Location: California E. Assembly Location: UTL Thaliand, Unisem Malaysia F. Date of Initial Production: July 28, 2007 III. Packaging Information A. Package Type: 28-pin TQFN 5x5 B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive Epoxy E. Bondwire: Gold (1 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: #05-9000-2339 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 1 J. Single Layer Theta Ja: 47 C/W K. Single Layer Theta Jc: 2.1 C/W L. Multi Layer Theta Ja: 29 C/W M. Multi Layer Theta Jc: 2.1 C/W IV. Die Information A. Dimensions: 98 X 84 mils B. Passivation: BCB C. Interconnect: 2 x Aluminum/Cu (Cu = 0.5%), top layer 100% Cu D. Backside Metallization: None E. Minimum Metal Width: 0.35 um F. Minimum Metal Spacing: 0.35 um G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO 2 I. Die Separation Method: Saw Maxim Integrated Products. All rights reserved. Page 3/5

V. Quality Assurance Information A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering) Bryan Preeshl (Managing Director of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135 C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows: = 1 = 1.83 (Chi square value for MTTF upper limit) MTTF 192 x 4340 x 48 x 2 (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV) = 22.4 x 10-9 = 22.4 F.I.T. (60% confidence level @ 25 C) The following failure rate represents data collected from Maxim s reliability monitor program. Maxim performs quarterly 1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/. Current monitor data for the MB3H Process results in a FIT Rate of 0.7 @ 25C and 11.5 @ 55C (0.8 ev, 60% UCL) B. Moisture Resistance Tests The industry standard 85 C/85%RH or HAST testing is monitored per device process once a quarter. C. E.S.D. and Latch-Up Testing The WG17 die type has been found to have all pins able to withstand a HBM transient pulse of +/-500 V per JEDEC JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-250 ma. Maxim Integrated Products. All rights reserved. Page 4/5

Table 1 Reliability Evaluation Test Results MAX2112CTI+ TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES Static Life Test (Note 1) Ta = 135 C Biased Time = 192 hrs. DC Parameters 48 0 Moisture Testing (Note 2) 85/85 Ta = 85 C RH = 85% Biased Time = 1000hrs. DC Parameters 77 0 Mechanical Stress (Note 2) Temperature Cycle -65 C/150 C 1000 Cycles Method 1010 DC Parameters 77 0 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data Maxim Integrated Products. All rights reserved. Page 5/5