Create an Industrial 3D Machine Vision System using DLP Technology

Create an Industrial 3D Machine Vision System using DLP Technology -AM572x Processor based DLP Structured Light Terry Yuan Business Development Manager 1

1987 TI DLP Products: A History of Innovation Dr. Larry Hornbeck invents Digital Micromirror Device, known as the DLP Chip 1996 First commercial DLP system ships; enables first ultra portable 6lb projector 1998 DLP receives first Emmy Award for Outstanding Achievement In Engineering Development 2004 DLP becomes highest volume MEMS supplier worldwide 2009 Consumer devices begin to ship worldwide featuring DLP Pico Projectors 2011 Half of all movie theatres converted from film to digital enabled by DLP Cinema technology 2012 New DLP development kit launches allowing developers to use DLP technology in new markets 2013 DLP Products takes display to the automobile 2015 First automotivequalified DLP chipset for heads up display applications Academy Award presented to Dr. Hornbeck for the invention of DMD technology used in DLP Cinema projection. * * Photo credit: Michael Yada / A.M.P.A.S. For more than two decades, award-winning DLP Products innovations have solved some of the world s most complex display and light-control applications.

DLP Products DLP Display Standard & Pico Chipsets Mobile & Laser TV Mobile & Embedded Projectors Digital Signage Projection Mapping Large Venue Industrial 3D Printing Lithography 3D Machine Vision Sensing Spectroscopy NIR Sensing Automotive Head-up Display Headlights

How DLP Technology Works 4

DLP MEMS technology enables many industrial applications Deep UV Ultra-Violet Visible Near-Infrared Infrared DLP chip or DMD Array of micromirrors 363 nm 420 nm 700 nm 2500 nm DLP Capabilities (Today) Works with lamps, LEDs, and Lasers Array of micromirrors that digitally switch to steer light. The Industrial DMD is a fast, efficient, and reliable spatial light modulator (SLM) offering: 1) High Speed Switching Switching of the full array at up to 32 khz 2) Extended Wavelength Supporting UV to near-infrared (NIR) and extended visual spectrum 3) Wavelength Selection Direct and modulate specific wavelengths of light through programmable pixel mapping 5

Introduction to 3D Machine Vision WHAT IS 3D MACHINE VISION? 3D Measurement is a fast and accurate way of gathering physical measurements of an object onto a computer in an organized manner, resulting in 3D Scan Data. Once the scan data is on the computer, all of the dimensions of the object can be taken, such as length, width, height, volume, feature size, feature location, surface area, etc. WHERE IS 3D MACHINE VISION USED? Location & Guidance Measure & Inspect Biometrics Identification User I/F & Gesture

Optical 3D Measurement Systems Use Triangulation (Geometry) to Determine the Depth of an Object By Different Methods: Single Line Laser Scan Stereo Triangulation or Photogrammetry Time of Flight Structured Light

3D Machine Vision with Structured Light One camera captures projected patterns The projected patterns inherently create identifiable features Can easily identify all points because of projected pattern u v u v (x,y,z) Projector Triangulation Base (x,y,z) Camera 8

3D Machine Vision with DLP technology Enabling scalable and high resolution 3D scanning How it Works Why choose DLP technology? DLP Feature Design Benefit 2. Object distorts the light patterns Optical MEMS device Inherently non-invasive approach 4. Image processing and triangulation algorithms determine 3D structure of object High speed pattern rates up to 32 khz with ~2 µs optical switching Real-time light processing and/or display for instant information 1. DLP DMD programs and projects light patterns 3. Camera or sensor detects light distortion External Triggers High bit depth Enables easy synchronization to external cameras and sensors Higher accuracy and resolution DLP chipset End Equipment Examples Extended wavelength support 365-2500nm Enables applications requiring UV, Visible, or NIR light sources or detection (unlike many other spatial light modulators) Factory Automation Dental/Medical Scanners Industrial Metrology Small Form Factor Portable, lower cost solutions when combined with TI's embedded processors

DLP Programmable Patterns Programmable Patterns allow users to gain full control over the Structured Light System Multiple patterns Binary Code Gray Code or N-ary Codes Phase Shift Hybrid: Gray Code + Phase Shift Adaptive Patterns Varying Color/Light and Pattern depending on object response and movement Hybrid Patterns Combination of several patterns

3D Machine Vision System Block Diagram 11

TI Designs for Targeted Applications Spectroscopy 3D Machine Vision 3D Printing & Stereolithography 2015 2015 2015 12

DLP6500 1080p 3D Scanner TI Design Complete set of design files Mechanical schematic of metal frame Preliminary calibration for quick evaluation Executable calibration and scanning program Our test results using this exact design Access to SDK 13

DLP6500 1080p 3D Scanner TI Design Trigger cable assembly guide Executable calibration and scanning program Mechanical schematic of metal frame Preliminary calibration for quick evaluation Our test results using this exact design System diagram Bill of Materials Complete set of design files 14

DLP LightCrafter 4500 Key Specifications DMD Resolution Brightness Interfaces Maximum Pattern Rate Synchronization 0.45-inch WXGA (912x1140 native) 150 lumens (min) from RGB LEDs USB, Mini-HDMI, I 2 C, FPD Link 4225 Hz binary 120 Hz 8-bit grayscale 2x Configurable I/O Triggers DLP LightCrafter 4500 + Beagle Bone = Fully Embedded Solution Load More Patterns Stream Patterns Faster Expand Connectivity Dimensions 122mm x 115mm x 48mm

DLP Structured Light SDK A Complete 3D Machine Vision Development Software Solution DLP Platform Generate high speed programmable binary Gray code patterns Calibration Projector and camera calibration generates system geometry Camera High-speed synchronized captures Structured Light Decode Gray coded patterns to generate disparity map The DLP 3D Structured Light SDK can also be utilized on smaller (DLP LightCrafter) and larger (DLP LightCrafter 6500) resolution DLP EVMs for portable and high resolution 3D scanning applications. Geometry Reconstruct 3D point clouds

Examples in the public domain Seikowave Portable 3D Scanner Carestream Intra Oral Scanner

Cortex A15: AM57x 21

System Components

Getting Started: Easy as 1, 2, 3 Educate Explore the DLP 3D Machine Vision system block diagram Watch the 3D Scanning TI Design Video Evaluate Order DLP LightCrafter4500 EVM from a TI distributor or estore Get connected with the DLP E2E community Create Download the free TI Design: electronics, optics, and software Find a design services or module provider from the DLP Design Network 24

Thank You Terry Yuan Business Development Manager +86 136 6185 1896 / terry-yuan@ti.com 25

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated ( TI ) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, TI Resources ) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI s provision of TI Resources does not expand or otherwise alter TI s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED AS IS AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2017, Texas Instruments Incorporated