74F273 Octal D-Type Flip-Flop

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Octal D-Type Flip-Flop General Description The 74F273 has eight edge-triggered D-type flip-flops with individual D inputs and Q outputs. The common buffered Clock (CP) and Master Reset (MR) inputs load and reset (clear) all flip-flops simultaneously. The register is fully edge-triggered. The state of each D input, one setup time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop s Q output. All outputs will be forced LOW independently of Clock or Data inputs by a LOW voltage level on the MR input. The device is useful for applications where the true output only is required and the Clock and Master Reset are common to all storage elements. Features April 1988 Revised September 2000 Ideal buffer for MOS microprocessor or memory Eight edge-triggered D-type flip-flops Buffered common clock Buffered, asynchronous Master Reset See 74F377 for clock enable version See 74F373 for transparent latch version See 74F374 for 3-STATE version 74F273 Octal D-Type Flip-Flop Ordering Code: Order Number Package Number Package Description 74F273SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F273SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F273PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide Devices also available in Tape and Reel. Specify by appending the suffix letter X to the ordering code. Logic Symbols Connection Diagram IEEE/IEC 2000 Fairchild Semiconductor Corporation DS009511 www.fairchildsemi.com

Unit Loading/Fan Out U.L. Input I IH /I IL Pin Names Description HIGH/LOW Output I OH /I OL D 0 D 7 Data Inputs 1.0/1.0 20 µa/ 0.6 ma MR Master Reset (Active LOW) 1.0/1.0 20 µa/ 0.6 ma CP Clock Pulse Input (Active Rising Edge) 1.0/1.0 20 µa/ 0.6 ma Q 0 Q 7 Data Outputs 50/33.3 1 ma/20 ma Mode Select-Function Table H = HIGH Voltage Level steady state h = HIGH Voltage Level one setup time prior to the LOW-to-HIGH clock transition L = LOW Voltage Level steady state I = LOW Voltage Level one setup time prior to the LOW-to-HIGH clock transition X = Immaterial = LOW-to-HIGH clock transition Logic Diagram Operating Mode Inputs Output MR CP D n Q n Reset (Clear) L X X L Load 1 H h H Load 0 H l L Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. www.fairchildsemi.com 2

Absolute Maximum Ratings(Note 1) Storage Temperature 65 C to +150 C Ambient Temperature under Bias 55 C to +125 C Junction Temperature under Bias 55 C to +150 C V CC Pin Potential to Ground Pin 0.5V to +7.0V Input Voltage (Note 2) 0.5V to +7.0V Input Current (Note 2) 30 ma to +5.0 ma Voltage Applied to Output in HIGH State (with V CC = 0V) Standard Output 0.5V to V CC 3-STATE Output 0.5V to +5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (ma) ESD Last Passing Voltage (min) 4000V Recommended Operating Conditions Free Air Ambient Temperature Supply Voltage 0 C to +70 C +4.5V to +5.5V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. 74F273 DC Electrical Characteristics Symbol Parameter Min Typ Max Units V CC Conditions V IH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal V IL Input LOW Voltage 0.8 V Recognized as a LOW Signal V CD Input Clamp Diode Voltage 1.2 V Min I IN = 18 ma V OH Output HIGH 10% V CC 2.5 Voltage 5% V CC 2.7 V Min I OH = 1 ma V OL Output LOW 10% V CC 0.5 Voltage 5% V CC 0.5 V Min I OL = 20 ma I IH Input HIGH Current 5.0 µa Max V IN = 2.7V I BVI Input HIGH Current Breakdown Test 7.0 µa Max V IN = 7.0V I CEX Output HIGH Leakage Current 50 µa Max V OUT = V CC V ID Input Leakage I ID = 1.9 µa 4.75 V 0.0 Test All other pins grounded I OD Output Leakage V IOD = 150 mv 3.75 µa 0.0 Circuit Current All other pins grounded I IL Input LOW Current 0.6 ma Max V IN = 0.5V I OS Output Short-Circuit Current 60 150 ma Max V OUT = 0V I CCH Power Supply Current 44 CP = ma Max I CCL 56 D n = MR = HIGH 3 www.fairchildsemi.com

AC Electrical Characteristics Symbol Parameter T A = +25 C T A = 55 C to +125 C T A = 0 C to +70 C V CC = +5.0V V CC = 5.0V V CC = 5.0V C L = 50 pf C L = 50 pf C L = 50 pf Units Min Typ Max Min Max Min Max f MAX Maximum Clock Frequency 160 95 130 MHz t PLH Propagation Delay 3.0 7.0 2.5 9.5 2.5 7.5 ns t PHL Clock to Output 4.0 9.00 3.0 11.0 3.5 9.0 t PLH Propagation Delay 4.5 9.5 3.0 11.0 4.0 10.0 ns t PHL MR to Output AC Operating Requirements T A = +25 C T A = 55 C to +125 C T A = 0 C to +70 C Symbol Parameter V CC = +5.0V V CC = 5.0V V CC = 5.0V Units Min Max Min Max Min Max t S (H) Setup Time, HIGH or LOW 3.0 3.5 3.0 t S (L) Data to CP 3.5 4.0 3.5 t H (H) Hold Time, HIGH or LOW 0.5 1.0 0.5 t H (L) Data to CP 1.0 1.0 1.0 ns t W (L) MR Pulse Width, LOW 6.0 4.0 6.0 ns t W (H) CP Pulse Width 6.0 5.0 6.0 ns t W (L) HIGH or LOW 6.0 5.0 6.0 t REC Recovery Time, MR to CP 3.0 4.5 3.5 ns www.fairchildsemi.com 4

Physical Dimensions inches (millimeters) unless otherwise noted 74F273 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide Package Number M20B 5 www.fairchildsemi.com

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D www.fairchildsemi.com 6

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 74F273 Octal D-Type Flip-Flop 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide Package Number N20A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 7 www.fairchildsemi.com