Electronic Costing & Technology Experts

Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr December 2013 Version 1 Written by Romain Fraux DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Glossary 1. Overview / Introduction 4 Executive Summary Reverse Costing Methodology 2. Company Profile 7 STMicroelectronics LSM9DS0 Characteristics 3. Physical Analysis 14 Synthesis of the Physical Analysis Physical Analysis Methodology Package Package Views, Dimensions & Pin Out Package Opening Wire Bonding Process Package Cross-Section ASIC dies View, Dimensions & Marking Delayering Main Blocks Identification Cross-Section MEMS Gyro/Accelero die View, Dimensions & Marking Bond Pad Opening & Bond Pad Cap Removed & Cap Details Sensing Area Details Cross-Section (Sensor, Cap & Bonding) X/Y-Axis Magnetometer die View, Dimensions & Marking Delayering Cross-Section Z-Axis Magnetometer die View, Dimensions & Marking Delayering Cross-Section 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 2 4. Manufacturing Process Flow 121 Global Overview ASICs Front-End & RDL Process ASIC Wafer Fabrication Unit MEMS Gyro/Accelero Process Flow MEMS Wafer Fabrication Unit Magnetometer Process Flow Magnetometer Wafer Fabrication Unit Packaging Process Flow Package Assembly Unit 5. Cost Analysis 146 Synthesis of the cost analysis Main steps of economic analysis Yields Hypotheses ASICs Front-End Cost ASICs Back-End 0 : RDL, Probe Test & Dicing ASICs Wafer & Die Cost MEMS Gyro/Accelero Front-End Cost MEMS Gyro/Accelero Front-End Cost per process steps MEMS Gyro/Accelero Back-End 0 : Probe Test & Dicing MEMS Gyro/Accelero Wafer & Die Cost Magnetometer Front-End Cost Magnetometer Cost per process steps Magnetometer Back-End 0 : Probe Test & Dicing X/Y-Axis & Z-Axis Magnetometer Wafer & Die Cost Back-End : Packaging Cost Back-End : Packaging Cost per Process Steps Back-End : Final Test & Calibration Cost LSM9DS0 Component Cost 6. Estimated Price Analysis 197 Manufacturer Financial Ratios Estimated Selling Price Contact 204

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the STMicroelectronics LSM9DS0 component. The LSM9DS0 is a 9-axis MEMS IMU (3-axis gyroscope + 3-axis accelerometer + 3-axis magnetometer). It is suitable for portable applications: Indoor navigation, Smart user interface, Advanced gesture recognition, Gaming and virtual reality input device, Display/map orientation and browsing, ecompass, Position and motion detection functions, Click/double click recognition, Intelligent power saving for handheld devices). The LSM9DS0 provides accurate output across full-scale ranges up to ±2000dps (rotational acceleration), ±16g (linear acceleration) and ±12 Gauss (magnetic field). Compatible with SMD process, the LSM9DS0 is provided in a 4x4x1mm LGA 24-pin package. Note : The LSM9DS0 integrates a 3-axis Gyroscope, a 3-axis Accelerometer and a 3-axis magnetometer. Notations bellow are used in this report : One die constitute the 3-axis Gyroscope and the 3-axis Accelerometer, it is called : MEMS Gyro/Accelero: A microsystem which comprise two parts, MEMS Cap and MEMS Sensor. Two dies constitute the 3-axis Magnetometer, they are called : X/Y-Axis magnetometer : A sensor die which is used to measure the magnetic field on the X-axis and Y-axis. Z-Axis magnetometer A sensor die which is used to measure the magnetic field on the Z-axis. One die constitutes the control IC for the gyroscope function, it is called : Gyroscope ASIC : An IC die which is used to control the MEMS gyroscope. One die constitutes the control IC for the accelerometer and magnetometer functions, it is called : Accelero/Magneto ASIC : An IC die which is used to control the MEMS accelerometer and the 3 axes of the magnetometer. These notations are used both in this report and in the excel file. 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 3

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 14