LED Display Product Data Sheet LTS-2306CKD-P Spec No.: DS30-2013-0036 Effective Date: 07/20/2013 Revision: - LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto
LED DISPLAY LTS-2306CKD-P DATASHEET ITEM Description By DATE 1 New Spec Reo Lin 2013/02/19 2 Revised P/N error in page 1 Reo Lin 2013/03/08 PART NO.: LTS-2306CKD-P PAGE: 1 of 12
FEATURES *0.28 INCH (7.0 mm) DIGIT HEIGHT *CONTINUOUS UNIFORM SEGMENTS *LOW POWER REQUIREMENT *EXCELLENT CHARACTERS APPEARANCE *HIGH BRIGHTNESS & HIGH CONTRAST *WIDE VIEWING ANGLE *SOLID STATE RELIABILITY *CATEGORIZED FOR LUMINOUS INTENSITY *LEAD FREE PACKAGE (ACCORDING TO ROHS) DESCRIPTION The LTS-2306CKD-P is a 0.28 inch (7.0mm) digit height single digit seven-segment display. This device uses AS-AlInGaP Hyper RED LED chips (AlInGaP on GaAs substrate). The display has a gray face and white segments. DEVICE PART NO. AlInGaP Hyper Red LTS-2306CKD-P DESCRIPTION COMMON CATHODE PART NO.: LTS-2306CKD-P PAGE: 2 of 12
PACKAGE DIMENSIONS NOTES: All dimensions are in millimeters. Tolerances are 0.25-mm (0.01 ) unless otherwise noted. PART NO.: LTS-2306CKD-P PAGE: 3 of 12
0.1m m LITE-ON TECHNOLOGY CORPORATION Solder Pad Vs Painting Diagram Painting 400 μ inch Plastic burr 0.1m m M ax P ainting A u 1μ inch N i 200μ inch M in Solder Pad P C B R eflector C u 1000μ inch M in S cale: 5:1 NOTES: 1. Plastic pins burr max. 0.1mm. 2. All dimensions are in millimeters. Tolerances are 0.25mm (0.01 ) unless otherwise noted. 3. Solder pad materials and thickness: Cu: 1000μinch Ni: Min 200μinch Au: 1μinch. PART NO.: LTS-2306CKD-P PAGE: 4 of 12
INTERNAL CIRCUIT DIAGRAM PART NO.: LTS-2306CKD-P PAGE: 5 of 12
PIN CONNECTION No. CONNECTION 1 NO CONNECTION 2 ANODE D 3 ANODE E 4 COMMON CATHODE 5 ANODE C 6 ANODE DP 7 ANODE B 8 ANODE A 9 COMMON CATHODE 10 ANODE F 11 NO CONNECTION 12 ANODE G PART NO.: LTS-2306CKD-P PAGE: 6 of 12
ABSOLUTE MAXIMUM RATING PARAMETER MAXIMUM RATING UNIT Power Dissipation Per Segment 70 mw Peak Forward Current Per Segment ( Frequency 1Khz, 10% duty cycle) 60 ma Continuous Forward Current Per Segment 25 ma Derating Linear From 25 C Per Segment 0.28 ma/ C Operating Temperature Range -35 C to +105 C Storage Temperature Range -35 C to +105 C Solder Temperature 1/16 inch Below Seating Plane for 3 Seconds at 260 C * HBM: Human Body Model. Seller gives no other assurances regarding the ability of product to withstand ESD. ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta=25 o C PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION Average Luminous Intensity IV 210 650 IF=1mA μcd 8250 IF=10mA Peak Emission Wavelength p 650 nm IF=20mA Spectral Line Half-Width 20 nm IF=20mA Dominant Wavelength d 639 nm IF=20mA Forward Voltage Per Segment VF 2.05 2.6 V IF=20mA Reverse Current Per Segment (2) IR 100 A VR=5V Luminous Intensity Matching Ratio (Same Light Area) IV-m 2:1 IF=1mA Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE (Commision Internationale De L Eclairage) eye-response curve. 2. Reverse voltage is only for IR test. It can not continue to operate at this situation. 3. Cross talk specification 2.5% PART NO.: LTS-2306CKD-P PAGE: 7 of 12
TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES (25 o C Ambient Temperature Unless Otherwise Noted) PART NO.: LTS-2306CKD-P PAGE: 8 of 12
SMT SOLDERING INSTRUCTION (Number of reflow process shall be less than 2 times, and cooling process to normal temperature is required between the first and the second soldering process) Note: 1. Recommended soldering condition: Reflow Soldering (Two times only) Pre-heat: 120~150 C. Pre-heat time: 120sec. Max. Peak temperature: 260 C Max. Soldering time: 5sec. Max. Soldering Iron (One time only) Temperature 300 C Max. Soldering time 3sec. Max. 2. Number of reflow process shall be less than 2 times, and cooling process to normal temperature is required between the first and the second soldering process. PART NO.: LTS-2306CKD-P PAGE: 9 of 12
RECOMMENDED SOLDERING PATTERN (UNIT: mm) PACKING DIMENSIONS PART NO.: LTS-2306CKD-P PAGE: 10 of 12
03 02 04 01 05 00 2 4 3 5 6 7 101112 1 8 9 6 PS 100±0.5 LITE-ON TECHNOLOGY CORPORATION CONFIGURATION OF TAPE REEL DIMENSIONS 330.0±2.0 +1 29.4-0.5 21.0±0.5 2.0 +0.5-0 13.0 +0.5-0.2 120 +2 24.5-0 NOTES: 1. Empty component pockets sealed with top cover tape. 2. 10 inch reel-800 pieces per reel. PART NO.: LTS-2306CKD-P PAGE: 11 of 12
Moisture Proof Packaging All N/D SMD displays are shipped in moisture proof package. The displays should be stored at 30 C or less and 90% RH or less. Once the package opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30 o C, AND LESS THAN 60% RH? YES NO BAKING IS NOT NECESSARY PACKAGE IS OPENED MORE THAN 1 WEEK DAYS? NO YES PERFORM RECOMMENDED BAKING CONDITIONS Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temperature Time In Reel 60 o C 48hours In Bulk 100 o C 4hours 125 o C 2hours Baking should only be done once. PART NO.: LTS-2306CKD-P PAGE: 12 of 12