Typical Applications Functional Diagram The HMC28AMS8 / HMC28AMS8E is ideal for: Base Stations PCMCIA Transceivers Cable Modems Portable Wireless Features Ultra Small Package: MSOP8 Conversion Loss: db LO / RF Isolation: 24 db Input IP3: +17 dbm General Description Electrical Specifications, T A = +25 C, As a Function of LO Drive The HMC28AMS8 & HMC28AMS8E are ultra miniature double-balanced mixers in 8 lead plastic surface mount packages (MSOP). This passive MMIC mixer is constructed of GaAs Schottky diodes and novel planar transformer baluns on the chip. The device can be used as an upconverter, downconverter, biphase (de)modulator, or phase comparator. The consistent MMIC performance will improve system operation and assure regulatory compliance. Parameter LO = IF = 7 MHz LO = +1 dbm IF = 7 MHz Units Min. Typ. Max. Min. Typ. Max. Frequency Range, RF & LO.7-2..8-1.2 GHz Frequency Range, IF DC -.5 DC -.5 GHz Conversion Loss 1.5 8.5 1.5 db Noise Figure (SSB) 1.5 8.5 1.5 db LO to RF Isolation 2 24 32 4 db LO to IF Isolation 13 17 22 3 db RF to IF Isolation 1 14 17 22 db IP3 (Input) 13 17 12 16 dbm 1 db Gain Compression (Input) 7 1 5 8 dbm - 1
Conversion Loss vs Temperature @ LO = Isolation @ LO = CONVERSION LOSS (db) -1-4 C.5 1 1.5 2 2.5 Conversion Loss vs. LO Drive Return Loss @ LO = CONVERSION LOSS (db) +7 dbm + dbm +15 dbm +11 dbm -1.5 1 1.5 2 2.5 IF Bandwidth @ LO = CONVERSION LOSS (db) -1 ISOLATION (db) RETURN LOSS (db) -1-3 -4 RF/IF LO/IF LO/RF -6.5 1 1.5 2 2.5-1 RF IF LO -25.5 1 1.5 2 2.5 P1dB vs. Temperature @ LO = P1dB (dbm) 14-4 C 13 12 11 1-25.2.4.6.8 1 IF - 2
Input IP3 vs. LO Drive 3 Input IP3 vs. Temperature @ LO = 25 IP3 (dbm) 25 2 15 1 5 Input IP2 vs. LO Drive IP2 (dbm) 7 6 5 4 3 + dbm +11 dbm LO + dbm +11 dbm 2 LO IP3 (dbm) 23 21 1 17-4 C 15 LO Input IP2 vs. Temperature @ LO = IP2 (dbm) 7 6 5 4 3-4 C 2 LO - 3
MxN Spurious Outputs Absolute Maximum Ratings RF / Input LO Drive +27 dbm Storage Temperature -65 to +15 C Operating Temperature -4 to +85 C ESD Sensitivity (HBM) nlo Class 1A mrf 1 2 3 4 xx 2 28 16 51 1 12 43 45 2 2 73 64 6 61 78 3 68 >5 87 63 2 4 >5 >5 >5 >5 >5 RF =. GHz @ -1 dbm LO =.7 GHz @ All values in dbc relative to the IF Harmonics of LO LO Freq. (GHz) nlo Spur at RF Port 1 2 3 4.7 4 47 41 73. 44 5 3 68 1.1 38 5 5 7 1.3 37 52 47 85 1.5 32 8 58 1.7 2 58 63 LO = Values in dbc below input LO level measured at RF Port. ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS - 4
Outline Drawing Package Information NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.15 mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.25 mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H28A HMC28AMS8 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H28A HMC28AMS8E RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn MSL1 XXXX [1] Max peak reflow temperature of 235 C [2] Max peak reflow temperature of 26 C [3] 4-Digit lot number XXXX - 5
Evaluation PCB List of Materials for Evaluation PCB 1183 [1] Item J1 - J3 U1 PCB [2] Description PCB Mount SMA RF Connector HMC28AMS8 / HMC28AMS8E Mixer 11828 Evaluation Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 435 The circuit board used in the application should use RF circuit design techniques. Signal lines should have 5 Ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. - 6