Technical Data Sheet White SMD Surface Mount Device

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Transcription:

Technical Data Sheet White SMD Surface Mount Device Features Fluorescence Type High Luminous Intensity High Efficiency Emission Color:x=0.29,y=0.30 Descriptions The white LED which was fabricated using a blue LED and a phosphor, and the phosphor is excited by blue light and emits yellow fluorescence. The mixture of blue light and yellow light results in a white emission. Applications OA Equipment Backlighting of Full Color LCD Automotive Equipment Replacement of Conventional Light Bulbs and Fluorescent Lamps Device Selection Guide Chip Lens Color Material Emitted Color InGaN White Water Clear

Package Dimensions LC LC + Polarity - For reflow soldering (propose) Notes:.All dimensions are in millimeters Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Rating Units Forward Current I F 25 ma Pulse Forward Current *1 I FP 100 ma Reverse Voltage V R 5 V Power Dissipation P d 110 mw Operating Temperature T opr -40 ~ +85 Storage Temperature T stg -40 ~ +100 Soldering Temperature *2 T sol 260 Electrostatic Discharge ESD 150 V Notes: *1:I FP Conditions--Pulse Width 10msec and Duty 1/10. *2:Soldering time 5 seconds.

Electro-Optical Characteristics (Ta=25 ) Parameter Symbol *Chip Min. Typ. Max. Units Condition Rank A4 100 290 -- Luminous Intensity I V A5 200 360 -- mcd I F =20mA A6 240 450 -- Forward Voltage V F -- -- 3.5 4.3 V I F =20mA Reverse Current I R -- -- -- 10 A V R =5V Viewing Angle 2 1/2 -- -- 120 -- deg I F =20mA Chromaticity x -- -- 0.29 -- -- I F =20mA Coordinates y -- -- 0.30 -- -- I F =20mA * Chip Rank Notes: *The C.I.E. 1931 chromaticity diagram. *The products are sensitive to static electricity and care must be fully taken when handling products. Chromaticity Coordinates Specifications for Bin Grading Color grading CIE_x CIE_y Min Max Min Max A 0.22 0.27 0.215 0.315 B C B1 0.25 0.285 0.245 0.325 B2 0.265 0.3 0.255 0.335 C1 0.28 0.315 0.265 0.345 C2 0.295 0.33 0.275 0.355 D 0.31 0.37 0.285 0.385

CIE Chromaticity Diagram

Typical Electro-Optical Characteristics Curves

Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is 0.1mm,Unit = mm

Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel. Note: The tolerances unless mentioned is 0.1mm, Angle 0.5 Unit = mm Moisture Resistant Packaging Label Aluminum moistue-proof bag Desiccant Label

Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level 90% LTPD 10% No. Items Test Condition Test Hours/Cycles 1 Reflow Soldering Temp. : 240 5 5sec. H : +100 15min 2 Temperature Cycle 5 min L : -40 15min H : +100 5min 3 Thermal Shock 10 sec L : -10 5min 4 High Temperature Storage 5 Low Temperature Storage Sample Size Ac/Re 6 min 22 PCS. 0/1 300 Cycles 22 PCS. 0/1 300 Cycles 22 PCS. 0/1 Temp. : 100 1000 Hrs. 22 PCS. 0/1 Temp. : -40 1000 Hrs. 22 PCS. 0/1 6 DC Operating Life IF = 20 ma 1000 Hrs. 22 PCS. 0/1 7 High Temperature / High Humidity 85 /RH85% 1000 Hrs. 22 PCS. 0/1

Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30 or less and 90%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 30 or less and 70%RH or less. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60 5 for 24 hours. 3. Soldering Condition 3.1 Lead solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 280 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.

5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.