High Performance Surface Mount Chip LEDs Technical Data SunPower Series HSMx-S66 Series HSMx-S67 Series HSMx-S69 Series Features High Brightness AlInGaP Material Industry Standard 2. x 1.25 mm Package Industry Standard 1.6 x.8 mm (Low Profile) Package Right Angle Package Three Colors Available Diffused Optics Compatible with IR Solder Process Available in 8 mm Tape on 7 (178 mm) Diameter Reels Applications Keypad Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator Description These chip-type LEDs utilize aluminum indium gallium phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The 59 nm amber, 65 nm orange, and 626 nm red colors are available in three compact, low profile packages. The HSMx-S67 is the industry standard 2. x 1.25 mm package, and is an excellent all around package. The HSMx-S69 is the industry standard 1.6 x.8 mm package. Its low.7 mm profile and wide viewing angle make this LED excellent for backlighting applications. The HSMx-S66 right angle, 3. x 2. x 1. mm LED is optimum for side lighting applications where direct backlighting is not practical. All packages are compatible with IR and convective reflow soldering processes. Device Selection Guide Footprint Amber Orange Red (mm) [1][2] 59 nm 65 nm 626 nm 1.6 x.8 x.7 HSMA-S69 HSMD-S69 HSMC-S69 2. x 1.25 x.8 HSMA-S67 HSMD-S67 HSMC-S67 3. x 2. x 1. HSMA-S66 HSMD-S66 HSMC-S66 Notes: 1. Dimensions in mm. 2. Tolerance ±.1 mm unless otherwise noted.
2 Package Dimensions 1.25.8 +.1 -.5.3 ANODE.8.7.2 ANODE 2. (.13) 1.3 1.2.4 1.6 (.28) 1.2 1.1.35 MARK 1 2 3.4 POLARITY MARK MARK 1 2 3.35 POLARITY MARK HSMx-S67 Series HSMx-S69 Series 3. 1 1..3.3 FRONT VIEW R.8 2. 2 3 1. 2. TOP VIEW.25 (.88).25 ANODE PIN CONNECTION MARK HSMx-S66 Series REAR VIEW R.45 TO REINFORCE SOLDERING (NON-PIN CONNECTION) Notes: 1. Dimensions are in millimeters (inches). 2. Tolerance, unless otherwise specified, ±.1 mm (±.4 inch). Absolute Maximum Ratings at T A = 25ºC Parameter HSMx-S66 HSMx-S67 HSMx-S69 Units DC Forward Current [1][2][3][4] 3 3 3 ma Power Dissipation 81 81 81 mw Reverse Voltage (I R = 1 µa) 5 5 5 V Operating Temperature Range -4 to +85-4 to +85-4 to +85 ºC Storage Temperature Range -4 to +1-4 to +1-4 to +1 ºC Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents between 1 ma and 3 ma are recommended for best long term performance. 3. Operating at currents below 1 ma is not recommended. Please contact your Agilent representative for further information. 4. Maximum temperature for tape and reel packaging is 6 C.
3 Optical Characteristics at T A = 25ºC Luminous Color, Intensity I V Peak Dominant Viewing Luminous (mcd) @ I F = Wavelength Wavelength Angle 2θ 1/2 Efficacy 2 ma [1] λ peak (nm) λ [2] d (nm) Degrees [3] η V Part Number Color Min. Typ. Typ. Typ. Typ. (lm/w) HSMA-S66 Amber 16. 65. 592 59 155 48 HSMA-S67 Amber 16. 65. 592 59 165 48 HSMA-S69 Amber 16. 65. 592 59 165 48 HSMD-S66 Orange 16. 65. 69 65 155 37 HSMD-S67 Orange 16. 65. 69 65 165 37 HSMD-S69 Orange 16. 65. 69 65 165 37 HSMC-S66 Red 16. 5. 63 626 155 197 HSMC-S67 Red 16. 5. 63 626 165 197 HSMC-S69 Red 16. 5. 63 626 165 197 Notes: 1. The luminous intensity I V is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominate wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at T A = 25ºC Forward Reverse Voltage V F Breakdown Thermal (Volts) @ I F V R (Volts) @ Capacitance C Resistance = 2 ma I R = 1 µa (pf), V F =, Rθ J-PIN Part Number Color Typ. Max. Min. f = 1 MHz Typ. (ºC/W) HSMA-S66 Amber 1.9 2.4 5 45 6 HSMA-S67 Amber 1.9 2.4 5 45 3 HSMA-S69 Amber 1.9 2.4 5 45 3 HSMD-S66 Orange 1.9 2.4 5 45 6 HSMD-S67 Orange 1.9 2.4 5 45 3 HSMD-S69 Orange 1.9 2.4 5 45 3 HSMC-S66 Red 1.9 2.4 5 45 6 HSMC-S67 Red 1.9 2.4 5 45 3 HSMC-S69 Red 1.9 2.4 5 45 3
4 Yellow/Amber Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 582. 584.5 B 584.5 587. C 587. 589.5 D 589.5 592. E 592. 594.5 F 594.5 597. Tolerance: ±.5 nm. Tolerance: ± 1 nm. Orange Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 597. 6. B 6. 63. C 63. 66. D 66. 69. E 69. 612. F 612. 615. Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information on currently available bins.
5 Tolerance ± 15% Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Bin ID Min. Max. A.11.18 B.18.29 C.29.45 D.45.72 E.72 1.1 F 1.1 1.8 G 1.8 2.8 H 2.8 4.5 J 4.5 7.2 K 7.2 11.2 L 11.2 18. M 18. 28.5 N 28.5 45. P 45. 71.5 Q 71.5 112.5 R 112.5 18. S 18. 285. T 285. 45. U 45. 715. V 715. 1125. W 1125. 18. X 18. 285. Y 285. 45. Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information on currently available bins.
6 1. AMBER ORANGE RELATIVE INTENSITY.5 RED 55 594 6 67 63 65 7 WAVELENGTH nm Figure 1. Relative Intensity vs. Wavelength. I F FORWARD CURRENT ma 1 5 2 1 5 2 1.5.5 1. 1.5 2. 2.5 3. 3.5 V F FORWARD VOLTAGE V Figure 2. Forward Current vs. Forward Voltage. RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 2.5 2. 1.5 1..5 I F MAX. MAXIMUM FORWARD CURRENT ma 1 2 3 4 5 2 4 6 8 1 I F DC FORWARD CURRENT ma T A AMBIENT TEMPERATURE C 35 3 25 2 15 1 5 Rθ J-A = 6 C/W Rθ J-A = 5 C/W Figure 3. Relative Luminous Intensity vs. Forward Current. Figure 4. Maximum Forward Current vs. Ambient Temperature.
7 3 2 1 1. 5 6 7 8 4.8.6.4.2 NORMALIZED INTENSITY 9 1 2 3 4 5 6 7 8 9 1 ANGULAR DISPLACEMENT DEGREES Figure 5. Relative Luminous Intensity vs. Angular Displacement for HSMx-S66. NORMALIZED INTENSITY 1..9.8.7.6.5.4.3.2.1-1-9-8 -7-6 -5-4 -3-2 -1 1 2 3 4 5 6 7 8 9 1 ANGULAR DISPLACEMENT DEGREES Figure 6. Relative Luminous Intensity vs. Angular Displacement for HSMx-S67. NORMALIZED INTENSITY 1..9.8.7.6.5.4.3.2.1-1-9-8 -7-6 -5-4 -3-2 -1 1 2 3 4 5 6 7 8 9 1 ANGULAR DISPLACEMENT DEGREES Figure 7. Relative Luminous Intensity vs. Angular Displacement for HSMx-S69.
8.9.2 2.4.8.8 5. 2..9 HSMX-S69 SERIES 1.5 RWS CENTER 3.4 1.1 MOUNTING EXAMPLE 1.3 EMITTED DIRECTION HSMX-S67 SERIES HSMX-S66 SERIES Figure 8. Recommended Solder Patterns. TEMPERATURE 255 C (+5/-) 217 C 3 C/SEC. MAX. 14-16 C MAX. 12 SEC. 1 to 2 SEC. 6 C/SEC. MAX. 6 to 15 SEC. TIME * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 9. Recommended Pb-Free IR Reflow Profile.
9 21. (.83) Ø 18 (7.8) USER FEED DIRECTION 2. (.8) Ø 6. (2.36) LABEL Ø 13. (.51) PRINTED LABEL SIDE 6 6 NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES). 1.5 (.6) TYP. 13. (.51) 1. (.39) Figure 1. Reeling Orientation. Figure 11. Reel Dimensions. 4. ±.1 (.157 ±.4) 1.5 +.1 Ø (.59 +.4) 1.3 ±.1 (.51 ±.4).2 ±.5 (.8 ±.2) 1.75 ±.1 (.69 ±.4) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2. ±.5 (.79 ±.2) 4. ±.1 (.157 ±.4) USER FEED DIRECTION 3.5 ±.5 (.138 ±.2) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B ±.1 (.4) ±.1 (.4) HSMX-S67 SERIES 2.25 (.89) 1.45 (.57) HSMX-S69 SERIES 1.85 (.73) 1. (.39) 8. ±.3 (.315 ±.12) CARRIER TAPE COVER TAPE HOLE FOR HSMX-S69 SERIES Figure 12. Tape Dimensions HSMx-S67, HSMx-S69.
1 4. ±.1 (.157 ±.4) 1.5 +.1 Ø (.59 +.4) 1.75 ±.1 (.69 ±.4) 2. 1.2 3.35 (.15) 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) HOLE 2.3 (.8) (Ø1.1) HOLE 2. ±.5 (.79 ±.2) 4. ±.1 (.157 ±.4) USER FEED DIRECTION Figure 13. Tape Dimensions HSMx-S66. END START THERE SHALL BE A MINIMUM OF 4 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 4 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 15 mm-36 mm (5.9-14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 14. Tape Leader and Trailer Dimensions. Storage Condition: 5 to 3 C @ 6% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 6 +/ 5 C for 2 hours.
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