High Performance Surface Mount Flip Chip LEDs Technical Data HP SunPower Series HSMA-H67/H69/H77/ H79/R661/R761 HSMC-H67/H69/H77/ H79/R661/R761 HSML-H67/H69/H77/ H79/R661/R761 Features High Brightness AlInGaP Material Improved Reliability through Elimination of Internal Wire Bond -4 to 85 C Operating Temperature Range Three Small Package Sizes Industry Standard 2. x 1.25 mm and 1.6 x.8 mm Footprints Right Angle Package Three Colors Available Diffused Optics Compatible with IR and Through-the-wave Solder Processes Available in 8 mm Tape on 178 mm (7") and 33 mm (13") Diameter Reels Applications Keypad Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator Description The HSMx-H67/H77, -H69/ H79, and -R661/R761 combine high reliability surface mount flip chip LED construction with HP s bright AlInGaP material. These very small, bright LEDs have a high luminous efficiency capable of producing high light output over a wide range of drive currents. The 59 nm amber, 65 nm orange, and 626 nm red colors are available in three compact, low profile packages. The HSMx-H67/H77 has the industry standard 2. x 1.25 mm footprint that is excellent for all around use. The HSMx-H69/ H79 has the industry standard 1.6 x.8 mm footprint, and its low.6 mm profile and wide viewing angle make this LED excellent for backlighting applications. The HSMx-R661/R761 has a small 2.1 x 1.3 mm footprint and a low profile.7 mm height that makes this part ideal for LCD backlighting and sidelighting applications where space is at a premium. All packages are compatible with IR and convective reflow soldering processes. In addition, these parts are also compatible with throughthe-wave soldering processes.
2 Device Selection Guide Amber 59 nm Orange 65 nm Red 626 nm 13" 13" 13" Footprint (mm) [1][2] 7" Reel Reel 7" Reel Reel 7" Reel Reel 1.6 x.8 x.6 HSMA-H69 -H79 HSML-H69 -H79 HSMC-H69 -H79 2. x 1.25 x 1.1 HSMA-H67 -H77 HSML-H67 -H77 HSMC-H67 -H77 2.1 x 1.3 x.7 [3] HSMA-R661 -R761 HSML-R661 -R761 HSMC-R661 -R761 Notes: 1. Dimensions in mm. 2. Tolerances ±.1 mm unless otherwise noted. 3. Right angle package. Package Dimensions HSMx-H67 Series HSMx-H69 Series MARK POLARITY POLARITY MARK 2. (.79) 1.27 (.5) 1.1 (.43) 1.25 (.49) 1..3.6.5 (.2).45.4 (.16).4 (.16).8 TOPSIDE MARK 1.6 BOTTOMSIDE MARK BOTTOMSIDE MARK HSMx-R661 Series ANODE POLARITY MARK 2.1.7.3 EMITTED DIRECTION 1.4 R.5 SOLDERING METALLIZATION 1.3.8 POLARITY MARK
3 Absolute Maximum Ratings at T A = 25 C Parameter Max. Rating Units DC Forward Current [1] 2 ma Power Dissipation 5 mw Reverse Voltage 5 V (I R = 1 µa) Operating Temperature Range -4 to 85 C Storage Temperature Range [2] -4 to 85 C Notes: 1. Derate linearly as shown in Figure 4 for temperatures above 25 C. 2. Maximum temperature for tape and reel packaging is 6 C. Optical Characteristics at T A = 25 C Peak Color, Dominant Viewing Luminous Wavelength Wavelength Angle 2θ 1 / 2 Efficacy η v λ peak (nm) λ [2] d (nm) Degrees [3] (lm/w) Part No. Color Typ. Typ. Typ. HSMA-H6X Amber 592 59 165 48 HSMA-R661 HSML-H6X Orange 67 65 165 37 HSML-R661 HSMC-H6X Red 638 626 165 197 HSMC-R661 Optical Characteristics at T A = 25 C (Cont d) Luminous Luminous Luminous Intensity Intensity Intensity Iv (mcd) Iv (mcd) Iv (mcd) @ I F = 5 ma @ I F = 2 ma @ I F = 2 ma Part No. Color Min. Typ. Typ. Typ. HSMA-H6X Amber 2.5 7.5 35 2.5 HSMA-R661 HSML-H6X Orange 2.5 7.5 35 2.5 HSML-R661 HSMC-H6X Red 2.5 6.5 3 2.5 HSMC-R661 Notes: 1. The dominant wavelength λ d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 2. θ 1 / 2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Operation below I F = 1 ma is not recommended.
4 Electrical Characteristics at T A = 25 C Forward Forward Reverse Capacitance Voltage Voltage Breakdown V R C (pf) V F (Volts) V F (Volts) (Volts) V F =, @ I F = 5 ma @ I F = 2 ma @ I R = 1 µa f = 1 Mhz Part No. Color Typ. Max. Typ. Max. Min. Typ. HSMA-H67 Amber 1.9 2.2 2. 2.4 5. 2 HSMA-H69 1.9 2.2 2. 2.4 5. 2 HSMA-R661 1.9 2.2 2. 2.4 5. 2 HSML-H67 Orange 1.9 2.2 2. 2.4 5. 2 HSML-H69 1.9 2.2 2. 2.4 5. 2 HSML-R661 1.9 2.2 2. 2.4 5. 2 HSMC-H67 Red 1.8 2.2 1.9 2.4 5. 2 HSMC-H69 1.8 2.2 1.9 2.4 5. 2 HSMC-R661 1.8 2.2 1.9 2.4 5. 2 Electrical Characteristics at T A = 25 C (Cont d) Thermal Thermal Resistance R Resistance R Part No. Color θ J-PIN ( C/W) θ J-A ( C/W) HSMA-H67 Amber 275 3 HSMA-H69 35 4 HSMA-R661 35 4 HSML-H67 Orange 275 3 HSML-H69 35 4 HSML-R661 35 4 HSMC-H67 Red 275 3 HSMC-H69 35 4 HSMC-R661 35 4 1. AMBER ORANGE RELATIVE INTENSITY.5 RED 55 594 6 67 63 65 7 WAVELENGTH nm Figure 1. Relative Intensity vs. Wavelength.
5 I F FORWARD CURRENT ma 1 5 2 1 5 2 1.5.5 1. 1.5 2. 2.5 3. 3.5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 ma) 5 4 3 2 1 I F FORWARD CURRENT ma 25 2 15 1 5 5 1 15 2 25 Rθ J-A = 3 C/W Rθ J-A = 4 C/W 2 4 6 8 1 V F FORWARD VOLTAGE V I F FORWARD CURRENT ma T A AMBIENT TEMPERATURE C Figure 2. Forward Current vs. Forward Voltage. Figure 3. Relative Iv vs. DC Forward Current (operation below 1 ma not recommended). Figure 4. Maximum DC Current vs. Ambient Temperature. 3 2 1 1. 5 6 7 8 4.8.6.4.2 NORMALIZED INTENSITY 9 1 2 3 4 5 6 7 8 9 1 ANGLE Figure 5. Intensity vs. Angle for HSMx-H67/H77 and HSMx-H69/H79. 3 2 1 1. 5 6 7 8 4.8.6.4.2 NORMALIZED INTENSITY 9 1 2 3 4 5 6 7 8 9 1 ANGLE Figure 6. Intensity vs. Angle (Horizontal) for HSMx-R661/R761.
6 3 2 1 1. 5 6 7 8 4.8.6.4.2 NORMALIZED INTENSITY 9 1 2 3 4 5 6 7 8 9 1 ANGLE Figure 7. Intensity vs. Angle (Vertical) for HSMx-R661/R761..8 (.31).8.8.85 HSMX-H69/H79 SERIES 1.1 (.43).8 1.25 (.49) 1.1 (.43) 1.25 (.49) HSMX-H67/H77 SERIES 1. 1. 1.4 HSMX-R661/R761 SERIES Figure 8. Recommended Solder Pad Patterns. 1 SEC. MAX. 235 C MAX. 1 SEC. MAX. 25 C MAX. TEMPERATURE PRE-HEAT 125-145 C 3 C/SEC. MAX. 9 SEC. MAX. ABOVE 183 C 3 C/SEC. MAX. TEMPERATURE PRE-HEAT 14-16 C 3 C/SEC. MAX. 9 SEC. MAX. ABOVE 183 C 3 C/SEC. MAX. TIME TIME Figure 9. Recommended IR Reflow Soldering Profile. Figure 1. Recommended Wave Solder Profile.
7 USER FEED DIRECTION SIDE PRINTED LABEL Figure 11. Reeling Orientation. 21. (.83) Ø DIM. A 2. (.8) Ø 13. (.51) Ø 6. (2.36) PART NO. HSMX-X6X HSMX-X7X DIM. A 178 mm (7. IN.) 33 mm (13. IN.) LABEL 1.5 (.6) TYP. 13. (.51) 1. (.39) Figure 12. Reel Dimensions.
8 4. ±.1 (.157 ±.4) 1.5 +.1 Ø (.59 +.4) 1.3 ±.1 (.51 ±.4).2 ±.5 (.8 ±.2) 1.75 ±.1 (.69 ±.4) 2.44 ±.1 (.96 ±.4) 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) 1.68 ±.1 (.66 ±.4) 2. ±.5 (.79 ±.2) 4. ±.1 (.157 ±.4) USER FEED DIRECTION CARRIER TAPE COVER TAPE Figure 13. Tape Dimensions, HSMx-H67/H77 Series. END START THERE SHALL BE A MOUNTED WITH MINIMUM OF 4 mm COMPONENTS (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. THERE SHALL BE A MINIMUM OF 4 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 15 mm-36 mm (5.9-14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 14. Tape Leader and Trailer Dimensions for HSMx-H67/H77 Series.
9 4. ±.1 (.157 ±.4) 1.5 +.1 Ø (.59 +.4).74 ±.1 (.29 ±.4).2 ±.5 (.8 ±.2) 1.75 ±.1 (.69 ±.4) 1.87 ±.1 (.74 ±.4) 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) 1.7 ±.1 (.4 ±.4) 2. ±.5 (.79 ±.2) USER FEED DIRECTION CARRIER TAPE COVER TAPE Figure 15. Tape Dimensions, HSMx-H69/H79 Series. END START THERE SHALL BE A MOUNTED WITH MINIMUM OF 4 mm COMPONENTS (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 15 mm-36 mm (5.9-14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 16. Tape Leader and Trailer Dimensions for HSMx-H69/H79 Series.
4. ±.1 (.157 ±.4) 1.5 +.1 Ø (.59 +.4) 1.2.2 1.75 ±.1 (.69 ±.4) 3.5 ±.5 (.138 ±.2) 2.26 8. ±.3 (.315 ±.12) 1.47 Ø1.1 4. ±.1 (.157 ±.4) USER FEED DIRECTION 2. ±.5 (.79 ±.2) Figure 17. Tape Dimensions for HSMx-RX61. END START THERE SHALL BE A MOUNTED WITH MINIMUM OF 4 mm COMPONENTS (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. THERE SHALL BE A MINIMUM OF 4 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 15 mm-36 mm (5.9-14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 18. Tape Leader and Trailer Dimensions. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 16, Surface Mounting SMT LED Indicator Components. www.hp.com/go/led For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-8-235-312 or 48-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright 1999 Hewlett-Packard Co. Obsoletes 5968-197E (8/98) 5968-3197E (2/99)