Reverse Surface Mount Flip Chip LEDs Technical Data HSMS-H630/H730 HSMD-H630/H730 HSMY-H630/H730 HSMG-H630/H730 Features Reverse Mountable Surface Mount LED Breakthrough Reliability through Elimination of Internal Wire Bond -40 C to +85 C Operating Temperature Range Small 3.2 x 1.25 mm Footprint Low Profile Diffused Optics Compatible with Reflow or Through-the-Wave Solder Processes Available on 7" (178 mm) or 13" (330 mm) Diameter Reels Applications Keypad Backlighting Symbol Backlighting Status Indication Front Panel Indicator Description The HSMx-H630/H730 is a reverse mountable chip-type LED for lighting the non-component side of a PC board. In this reverse mounting configuration, this LED is designed to emit light through a small hole in the PC board. The HSMx-H630/H730 uses a flip chip construction that eliminates the wire bond between the chip and substrate. As a result of this robust construction, product reliability is greatly improved. This device is available in four colors. The small size, narrow footprint, and low profile make these LEDs excellent for backlighting, status indication, and front panel illumination applications. All the above parts are compatible with IR / convective reflow and through the wave soldering processes. Device Selection Guide Part Number Color Parts/Reel HSMS-H630 High Efficiency Red 3000 HSMS-H730 12000 HSMD-H630 Orange 3000 HSMD-H730 12000 HSMY-H630 Yellow 3000 HSMY-H730 12000 HSMG-H630 Green 3000 HSMG-H730 12000
2 Package Dimensions CATHODE ANODE CATHODE MARK 1.10 0.80 1.10 POLARITY MARK R 0.25 1.25 3.20 Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted.
3 Absolute Maximum Ratings at T A = 25 C Parameter HSMx-H630/H730 Units DC Forward Current [1] 20 ma Power Dissipation 50 mw Reverse Voltage (I R = 100 µa) 5 V Operating Temperature Range -40 to +85 C Storage Temperature Range -40 to +85 C Note: 1. Derate Linearly as shown in Figure 4. Optical Characteristics at T A = 25 C Luminous Color Viewing Luminous Intensity I v Peak Dominant Angle Efficacy (mcd) @ Wavelength Wavelength 2θ 1 / 2 η v I F = 20 ma λ peak (nm) λ [1] d (nm) (degrees) [2] (lm/w) [3] Part No. Color Min. Typ. Typ. Typ. Typ. HSMS-H630 High 1.6 5.0 639 626 165 145 HSMS-H730 Efficiency Red HSMD-H630 Orange 1.6 4.0 606 604 165 380 HSMD-H730 HSMY-H630 Yellow 1.6 5.0 584 586 165 500 HSMY-H730 HSMG-H630 Green 4.0 9.0 566 571 165 595 HSMG-H730 Notes: 1. The dominant wavelength, λ d, is derived from the CIE chromaticity diagram and represents the perceived color of the device with respect to standard illuminant D65. 2. θ 1 / 2 is the off-axis angle where the luminous intensity is 1 / 2 the peak intensity. 3. The luminous efficacy, η v, is the ratio of luminous flux to radiant flux, φ v /φ e.
4 Optical Characteristics at T A = 25 C Forward Reverse Voltage V F Breakdown Capacitance C Thermal (Volts) @ V R (Volts) @ (pf) V F = 0, Resistance I F = 20 ma I R = 100 µa f = 1 MHz Rθ J-PIN ( C/W) Part No. Color Typ. Max. Min. Typ. HSMS-H630 High 2.0 2.6 5 6 250 HSMS-H730 Efficiency Red HSMD-H630 Orange 2.0 2.6 5 5 250 HSMD-H730 HSMY-H630 Yellow 2.1 2.6 5 5 250 HSMY-H730 HSMG-H630 Green 2.3 2.6 5 5 250 HSMG-H730 1.0 GREEN ORANGE RELATIVE INTENSITY 0.5 YELLOW HIGH EFFICIENCY RED 0 500 550 600 650 700 750 WAVELENGTH nm Figure 1. Relative Intensity vs. Wavelength.
5 20 1.2 I F FORWARD CURRENT ma 15 10 5 YELLOW ORANGE HER GREEN 0 1.0 1.5 2.0 2.5 3.0 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 ma) 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 V F FORWARD VOLTAGE V I DC DC FORWARD CURRENT ma Figure 2. Forward Current vs. Forward Voltage. Figure 3. Relative Luminous Intensity vs. DC Forward Current. 30 I F FORWARD CURRENT ma 25 20 15 10 5 0 0 20 40 60 80 100 T A AMBIENT TEMPERATURE C Figure 4. Maximum DC Current vs. Ambient Temperature.
6 30 20 10 0 1.0 50 60 70 80 40.8.6.4.2 NORMALIZED INTENSITY 90 10 20 30 40 50 60 70 80 90 100 ANGLE Figure 5. Intensity vs. Angle. 10 SEC. MAX. 235 C MAX. TEMPERATURE PRE-HEAT 125-145 C 3 C/SEC. MAX. 90 SEC. MAX. ABOVE 183 C 3 C/SEC. MAX. TIME Figure 6. Recommended Reflow Soldering Profile. 10 SEC. MAX. 250 C MAX. TEMPERATURE PRE-HEAT 140-160 C 3 C/SEC. MAX. 90 SEC. MAX. ABOVE 183 C 3 C/SEC. MAX. TIME Figure 7. Recommended Wave Solder Profile.
7 2.00 DIA. PCB HOLE 1.25 mm 1.15 mm 1.40 mm Figure 8. Recommended Solder Pads. USER FEED DIRECTION CATHODE SIDE Figure 9. Reeling Orientation. PRINTED LABEL 21.0 (0.83) Ø DIM. A 2.0 (0.08) Ø 60.0 (2.36) LABEL Ø 13.0 (0.51) 1.5 (0.06) TYP. 13.0 (0.51) 10.0 (0.39) Part Number Dimension A HSMx-H630 178 mm (7") HSMx-H730 330 mm (13") Figure 10. Reel Dimensions.
2.00 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 1.50 ± 0.10 CATHODE 1.75 ± 0.10 8.00 +0.30 0.10 CARRIER TAPE 3.54 ± 0.05 3.48 ± 0.10 1.45 1.00 ± 0.25 R 0.41 (4X) 1.50 ± 0.05 1.47 ± 0.10 2.34 COVER TAPE Figure 11. Tape Dimensions. END START USER FEED DIRECTION 160 MIN. L 160 MIN. 150-360 EMPTY POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS EMPTY POCKETS SEALED WITH COVER TAPE. MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 12. Tape Leader and Trailer Dimensions. www.hp.com/go/led For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright 1999 Hewlett-Packard Co. Obsoletes 5968-1793E (9/98) 5968-3199E (1/99)