New Serial Link Simulation Process, 6 Gbps SAS Case Study

Similar documents
DesignCon New Serial Link Simulation Process, 6 Gbps SAS Case Study. Donald Telian, SI Consultant

New Technologies for 6 Gbps Serial Link Design & Simulation, a Case Study

New Techniques for Designing and Analyzing Multi-GigaHertz Serial Links

Using Allegro PCB SI GXL to Make Your Multi-GHz Serial Link Work Right Out of the Box

Combating Closed Eyes Design & Measurement of Pre-Emphasis and Equalization for Lossy Channels

Combating Closed Eyes Design & Measurement of Pre-Emphasis and Equalization for Lossy Channels

Comparison of NRZ, PR-2, and PR-4 signaling. Qasim Chaudry Adam Healey Greg Sheets

AMI Simulation with Error Correction to Enhance BER

Practical De-embedding for Gigabit fixture. Ben Chia Senior Signal Integrity Consultant 5/17/2011

DesignCon Simulation Techniques for 6+ Gbps Serial Links. Donald Telian, Siguys

New Techniques for Designing and Analyzing Multi-GigaHertz Serial Links

PAM4 signals for 400 Gbps: acquisition for measurement and signal processing

EVALUATION KIT AVAILABLE 12.5Gbps Settable Receive Equalizer +2.5V +3.3V V CC1 V CC. 30in OF FR-4 STRIPLINE OR MICROSTRIP TRANSMISSION LINE SDI+ SDI-

Measurements and Simulation Results in Support of IEEE 802.3bj Objective

Brian Holden Kandou Bus, S.A. IEEE GE Study Group September 2, 2013 York, United Kingdom

Draft Baseline Proposal for CDAUI-8 Chipto-Module (C2M) Electrical Interface (NRZ)

Powering Collaboration and Innovation in the Simulation Design Flow Agilent EEsof Design Forum 2010

USB 3.1 ENGINEERING CHANGE NOTICE

PCIe: EYE DIAGRAM ANALYSIS IN HYPERLYNX

Duobinary Transmission over ATCA Backplanes

Approach For Supporting Legacy Channels Per IEEE 802.3bj Objective

CAUI-4 Chip to Chip Simulations

Signal Integrity Design Using Fast Channel Simulator and Eye Diagram Statistics

Emphasis, Equalization & Embedding

Eye Doctor II Advanced Signal Integrity Tools

The Challenges of Measuring PAM4 Signals

AMI Modeling Methodology and Measurement Correlation of a 6.25Gb/s Link

Practical Receiver Equalization Tradeoffs Applicable to Next- Generation 28 Gb/s Links with db Loss Channels

Simulations of Duobinary and NRZ Over Selected IEEE Channels (Including Jitter and Crosstalk)

SECQ Test Method and Calibration Improvements

Presentation to IEEE P802.3ap Backplane Ethernet Task Force July 2004 Working Session

MR Interface Analysis including Chord Signaling Options

Ali Ghiasi. Nov 8, 2011 IEEE GNGOPTX Study Group Atlanta

Measurements Results of GBd VCSEL Over OM3 with and without Equalization

XLAUI/CAUI Electrical Specifications

EVALUATION KIT AVAILABLE Multirate SMPTE SD/HD Cable Driver with Selectable Slew Rate TOP VIEW +3.3V. 10nF IN+ IN- MAX3812 SD/HD GND RSET +3.

Features. For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

10mm x 10mm. 20m (24AWG) 15m (28AWG) 0.01μF TX_IN1 V CC[1:4] TX_OUT1 TX_OUT2 TX TX_IN3 TX_IN2 TX_OUT3 TX_OUT4 SERDES TX_IN4 RX_OUT1 RX_IN1 RX_OUT2

Forensic Analysis of Closed Eyes

HMC958LC5 HIGH SPEED LOGIC - SMT. Typical Applications. Features. Functional Diagram. General Description

DesignCon Pavel Zivny, Tektronix, Inc. (503)

System-Level Timing Closure Using IBIS Models

HMC-C060 HIGH SPEED LOGIC. 43 Gbps, D-TYPE FLIP-FLOP MODULE. Features. Typical Applications. General Description. Functional Diagram

Exceeding the Limits of Binary Data Transmission on Printed Circuit Boards by Multilevel Signaling

CU4HDD Backplane Channel Analysis

De-embedding Gigaprobes Using Time Domain Gating with the LeCroy SPARQ

32 G/64 Gbaud Multi Channel PAM4 BERT

GT Dual-Row Nano Vertical SMT High Speed Characterization Report For Differential Data Applications

The Effect of Inserted ISI on Transition Density Plots and DCD & ISI Histograms of MJS Patterns

Serial Data Link Analysis Visualizer (SDLA Visualizer) Option SDLA64, DPOFL-SDLA64

Summary of NRZ CDAUI proposals

Systematic Tx Eye Mask Definition. John Petrilla, Avago Technologies March 2009

Thoughts about adaptive transmitter FFE for 802.3ck Chip-to-Module. Adee Ran, Intel Phil Sun, Credo Adam Healey, Broadcom

What really changes with Category 6

Samtec Final Inch PCIE Series Connector Differential Pair Configuration Channel Properties

Improving IBIS-AMI Model Accuracy: Model-to-Model and Model-to-Lab Correlation Case Studies

ELECTRICAL PERFORMANCE REPORT

Time Domain Simulations

Optimizing BNC PCB Footprint Designs for Digital Video Equipment

HMC-C064 HIGH SPEED LOGIC. 50 Gbps, XOR / XNOR Module. Features. Typical Applications. General Description. Functional Diagram

How to overcome/avoid High Frequency Effects on Debug Interfaces Trace Port Design Guidelines

Keysight Method of Implementation (MOI) for VESA DisplayPort (DP) Standard Version 1.3 Cable-Connector Compliance Tests Using E5071C ENA Option TDR

Transmission Distance and Jitter Guide

BER margin of COM 3dB

GT Dual-Row Nano Vertical Thru-Hole High Speed Characterization Report For Differential Data Applications

Validation of VSR Module to Host link

Draft 100G SR4 TxVEC - TDP Update. John Petrilla: Avago Technologies February 2014

PBR-310C E-BERT. 10Gb/s BERT System with Eye Diagram Tracer

100Gb/s Single-lane SERDES Discussion. Phil Sun, Credo Semiconductor IEEE New Ethernet Applications Ad Hoc May 24, 2017

SDLA Visualizer Serial Data Link Analysis Visualizer Software Printable Application Help

PCI Express. Francis Liu Project Manager Agilent Technologies. Nov 2012

Ali Ghiasi. Jan 23, 2011 IEEE GNGOPTX Study Group Newport Beach

Receiver Testing to Third Generation Standards. Jim Dunford, October 2011

Synchronizing Multiple ADC08xxxx Giga-Sample ADCs

A Way to Evaluate post-fec BER based on IBIS-AMI Model

CDAUI-8 Chip-to-Module (C2M) System Analysis #3. Ben Smith and Stephane Dallaire, Inphi Corporation IEEE 802.3bs, Bonita Springs, September 2015

100GEL C2M Channel Reach Update

InfiniBand Trade Association

DesignCon Simulating Large Systems with Thousands of Serial Links. Donald Telian, SiGuys

Quad Copper-Cable Signal Conditioner

CAUI-4 Chip to Chip and Chip to Module Applications

Clause 74 FEC and MLD Interactions. Magesh Valliappan Broadcom Mark Gustlin - Cisco

SV1C Personalized SerDes Tester

Update on FEC Proposal for 10GbE Backplane Ethernet. Andrey Belegolovy Andrey Ovchinnikov Ilango. Ganga Fulvio Spagna Luke Chang

Next Generation Ultra-High speed standards measurements of Optical and Electrical signals

10 Gb/s Duobinary Signaling over Electrical Backplanes Experimental Results and Discussion

UNH-IOL Physical Layer Knowledge Document

Half-Rate Decision-Feedback Equalization Di-Bit Response Analysis and Evaluation EDA365

SDAIII-CompleteLinQ Multi-Lane Serial Data, Noise and Crosstalk Analysis

Fast Ethernet Consortium Clause 25 PMD-EEE Conformance Test Suite v1.1 Report

FEC Applications for 25Gb/s Serial Link Systems

C65SPACE-HSSL Gbps multi-rate, multi-lane, SerDes macro IP. Description. Features

SI Analysis & Measurement as easy as mobile apps ISD, ADK, X2D2

ASNT_PRBS20B_1 18Gbps PRBS7/15 Generator Featuring Jitter Insertion, Selectable Sync, and Output Amplitude Control

Comment #147, #169: Problems of high DFE coefficients

On Figure of Merit in PAM4 Optical Transmitter Evaluation, Particularly TDECQ

52Gb/s Chip to Module Channels using zqsfp+ Mike Dudek QLogic Barrett Bartell Qlogic Tom Palkert Molex Scott Sommers Molex 10/23/2014

For the SIA. Applications of Propagation Delay & Skew tool. Introduction. Theory of Operation. Propagation Delay & Skew Tool

Solutions to Embedded System Design Challenges Part II

Keysight Technologies M8048A ISI Channels

Transcription:

ew Serial Link Simulation Process, 6 Gbps SAS Case Study Donald Telian SI Consultant Session 7-TH2 Donald Telian SI Consultant

About the Authors Donald Telian is an independent Signal Integrity Consultant. Building on 25 years of SI experience at Intel, Cadence, HP, and others, his recent focus has been on helping customers correctly implement today s Multi-GHz serial links. He has published numerous works on this and other topics. Donald is widely known as the SI designer of the PCI bus and the originator of IBIS modeling and has taught SI techniques to thousands of engineers in more than 15 countries. Donald can be reached at: telian@sti.net Paul Larson is a senior Hard Disk Drive (HDD) development engineer for Hitachi GST. Prior to that he held a similar position at IBM, for a combined 29 years of experience in HDD development, integration and in ensuring FC and SAS HDD Signal Integrity. Paul can be reached at: paul.larson@hitachigst.com Ravinder Ajmani is a Senior Engineer with Hitachi GST. He has over 15 years of experience on High-speed PCB Design, Signal integrity, and Electromagnetic Compatibility. During this period he has worked on several generations of disk drive products, and resolved numerous design and customer integration issues with these products. Ravinder can be reached at: ravinder.ajmani@hitachigst.com Kent Dramstad is an ASIC Application Engineer at IBM. He has over 27 years of experience working on both power and signal integrity issues for a wide variety of applications. His current emphasis is on helping customers select and integrate IBM s series of High Speed Serdes (HSS) cores into their ASIC designs. Kent can be reached at: dramstad@us.ibm.com Adge Hawes is a Development Architect for IBM at its Hursley Labs, United Kingdom. He has worked for IBM for more than 30 years across such hardware as Graphic Displays, Printing Subsystems, PC development, Data Compression, and High-Speed Serial Links. He has represented the company in many standards bodies such as PCI, SSA and Fibre Channel. Recently he has moved from Digital Logic to Analog and Mixed-Signal, where he develops simulators for IBM's High Speed Serial Link customers. Adge can be reached at: adge@uk.ibm.com 2

Agenda Intro to Project, Tools, & Technologies Verifying SAS Spec Compliance Virtual Systems Analysis Conclusions 6 Gbps links 3

Agenda Intro to Project, Tools, & Technologies Verifying SAS Spec Compliance Virtual Systems Analysis Conclusions 6 Gbps links 4

About the Project Identify and implement new simulation environment for future 6+ Gbps Hard Disk Drive (HDD) designs Prove-in environment on design of future products 6 Gbps Challenges Loss ~20dB (10% of Tx signal at Rx) Rx signal un-measurable Complex equalization schemes ew model formats (AMI) ew simulation techniques ew modeling standards emerging Spec compliance requires simulation Coordinate ~15 key industry players Customers, suppliers, tool vendors, standards committees 5

Project Phases Assessment Proof-of-Concept Model Development System Analysis Kit Environment ~ 6-month Effort 6

Terminology SAS = Serial Attached SCSI Serial Link = Channel Channel Analysis = Serial Link Simulation CA = Channel Analysis = simulation tool DFE = Decision Feedback Equalization = Rx Eq FFE = Feed-Forward Equalization = Tx Eq SerDes = IBM 6 Gbps core, in this case AMI = Algorithmic Modeling Interface 7

AMI Model Review Circuit Analysis with Existing Models Algorithmic Models Image courtesy IBIS-ATM Group and Todd Westerhoff: http://www.vhdl.org/pub/ibis/summits/sep07/ Algorithmic models typically implemented in.dll files AMI format approved by IBIS Committee in ov. 07 More background see: CDLive! 2007 Session 8.3 8

Hard Disk Drive Model SYSTEM C O R O U T E IC P K G Tx Rx A M I R O U T E IC P K G A M I = Tx = HDD Rx HDD model used with both compliance and system loads 9

Agenda Intro to Project, Tools, & Technologies Verifying SAS Spec Compliance Virtual Systems Analysis Conclusions 6 Gbps links 10

SAS Compliance Testing Tx Rx HDD Reference Tx (2-tap FFE) C O RTTL (Reference Transmitter Test Load) Rx Stress Circuit C O Reference Rx (3-tap DFE) HDD Measure eye after Rx DFE Port Measure S-Parameters at PCB edge HDD 11

Tx Compliance Testing Simulation specified as only way to validate Eye measured inside IC at output of Rx DFE Spec calls out Reference Rx 3-tap LMS DFE Transmit through -15dB RTTL S-parameters oise Channel Channel Under Test 12

Tx RTTL Simulation Results 4 taps configured in Tx, noise channel active Tx set at spec reference levels (nominal EQ) Height/width = 179mV/0.41UI (100/0.40 spec) Comfortable with small margin on width 13

Rx Compliance Testing SAS device connects here Channel Under Test oise Channel Rx stress testbench implemented in simulation environment Delivered crosstalk, loss, eye w/h, from Reference Tx as specified 14

Rx Stress Test Results Two HDD route styles tested 100 Ohm microstrip 85 Ohm stripline Eye height & width measured at 1e15 bits height extrapolated Parameter o100 i85 Unit Derive design margins Eye Height (1e6 bits) Eye Height Margin (60mV - 10%) 108 37 131 58 mv mv Guide design choices Eye Width (1e15 bits) Margin in UI (target = 0.2 UI min) 0.408 0.208 0.418 0.218 UI UI Margin in ps 35 36 ps 15

S-Parameter Limit Compliance Differential nets extracted for virtual VA measurement Plot SDD, SCC, SCD against specified limits (in red) All measurements below limits SCC SDD SCD 16

Agenda Intro to Project, Tools, & Technologies Verifying SAS Spec Compliance Virtual Systems Analysis Conclusions 6 Gbps links 17

System Configuration Testing TYP Reference Tx & Rx 4 P C B C O 8 backplane with vias C O HDD WC1 Reference Tx & Rx 4 P C B C O 16 backplane with vias C O HDD WC2 Reference Tx & Rx 4 P C B 16 cable & 2 conns 6 P C B C O 10 backplane with vias C O HDD 18

System Configuration Metrics Parameter TYP WC1 WC2 Unit PCB & Cable Length 13 21 37 inches # of Connectors 2 2 4 # # of Vias 4 4 4 vias Propagation Time 2.5 4 6 ns 6 Gbps bits in channel 15 24 36 bits Channel Loss (SDD21 @ 3 GHz) -8.9-13.6-16 db Apply experience to augment spec s coverage Acquire intuitive sense of what works, what doesn t Wide range of length, loss, discontinuities Drive with minimal Tx, recover signal with IBM DFE 19

7-Step Link Analysis Process Step Task Purpose Output 1 Collect & Connect Models Build Link Model Link Ready-to-Run 2 Model Sanity Check Verify Model TD Functional 3 Quantify Loss & Crosstalk Understand & Gauge Link S21 db, mv RMS 4 Plot Impulse Response & ISP Measure ISP, Calculate #bits #bits for CA 5 Verify Eye Convergence Test #bits, Confirm Coverage CA Functional 6 Parameter Determination Setup for Worst-Case CA Parameters 7 Corner Case Analysis Derive Design Margins Eye h/w Margins Illustrate on WC1 channel (TYP & WC2 in paper) Can be applied to any serial link SI analysis 20

Step 1: Collect & Connect Models Step 2: Model Sanity Check CtlrTx/Rx 4 trace Conn BpVia 16 tr BpVia Conn 100Ohm 1 mstrip trace Pkg IBM Tx/Rx Voltages, System Loss, Time Delay Reasonable Short TD Eye at Rx Input Mostly Collapsed Typical CA Eye Re-opened, Rx DFE Functioning 21

Step 3: Quantify Loss & Crosstalk S21 Connector Loss Total Loss = 2*BpVia + 2*CdVia + 2*Conn + 21 *0.33dB/inch + Misc Hand Calculation = 2*1 + 2*0.3 + 2*1 + 21/3 + 2 = 13.6dB Crosstalk = 5.6 mv rms 22

Step 4: Plot Impulse Response & ISP Step 5: Verify Eye Convergence Impulse Response shows noise to ~8nS Interconnect Storage Potential (ISP) = 1.6 ns Bit affected by 10 bits previous (1 symbol) Eye converges ~1e5 bits #bits parameter for CA ISP defined in this paper http://www.t11.org/ftp/t11/pub/fc/fcsm2/05-215v0.pdf 23

Step 6: Parameter Determination # Variable Influences Source Value Unit Apply In otes 1 Tx Swing Eye shape SAS Spec Table 61 800 mv ppd Tx Model minimum allowed 2 Tx De-emp Eye shape SAS Tables 64 65-2 db Tx Model Ref Tx value 3 Bit Pattern Jitter, Eye SAS Spec, etc CJTPAT CA Form 4 Dj Eye, B-tub Tx Parameter 23.4 ps p-p chsim.clm = 0.14% UI 5 Rotator Linearity Eye, Bathtub AMI Model Kit pr_slow.dat file Rx model pr_fast.dat a bit better 6 On-chip Sparams Eye shape AMI Model Kit 0 Tx/Rx models enabled 7 Rj Eye, B-tub Tx Parameter 1.4 ps rms CA Form = 0.84% UI 8 Duty Cycle Dist. Eye shape Tx Parameter 0.05 UI CA Form Use 45 as HI% 9 Pj Magnitude Jitter, Eye AMI Model Kit 0.05 UI CA Form Enter as 0.05 10 Pj Cycles/UI Jitter, Eye AMI Model Kit 0.01 UI CA Form Enter as 0.01 Extract from specs for worst-case analysis Unlike standard SI (has wc parameters in models) 24

Step 7: Corner Case Analysis Width: corner (red) decreases significantly to 0.25 UI Height: must derate to 1e15 (155 mv) Margin: 95mV/0.05UI against 60mV/0.20UI targets 25

Margins for All Systems Margins at 1e15 per SAS spec IBM Rx DFE Handles all Cases WC2 Margins Approaching Limit Parameter PCB & Cable Length # of Connectors # of Vias Propagation Time 6 Gbps bits in channel Channel Loss (SDD21 @ 3 GHz) Crosstalk TYP 13 2 4 2.5 15-8.9 9.1 WC1 21 2 4 4 24-13.6 5.6 WC2 37 4 4 6 36-16 7.4 Unit inches # vias ns bits db mv rms Design Margin vs Channel Length ISP #bits for Coverage 1.5 1e4 1.6 1e5 2.1 1e5 ns bits Height Margin (mv), Width Margin (ps) 180 160 140 120 100 80 60 40 20 0 12 20 36 Length of Channel (inches) Height Margin Width Margin Corner Eye Height (1e6 bits) Eye Height Margin (60 mv -10%) Typ Eye Width (1e6 bits) Corner Case Width (1e15 bits) Margin in UI (to 0.20UI target) Margin in ps 244 160 0.72 0.34 0.14 24 172 95 0.59 0.25 0.05 9 103 30 0.52 0.218 0.018 3 mv mv UI UI UI ps 26

Agenda Intro to Project, Tools, & Technologies Verifying SAS Spec Compliance Virtual Systems Analysis Conclusions 6 Gbps links 27

Key Learnings HDD implementation has margin against all tests, IBM SerDes performing well Worst-case margins become questionable around -16dB, typical channels <= -10dB 6 Gbps sim environment with AMI models now functional, performance meets expectations Environment enables compliance testing that previously required physical hardware 28

In Summary Serial link frequencies continue to increase Specs require virtual probing inside IC AMI models are starting to appear Simulation environment functional A process for link SI described Refer to paper for complete details 29

THAK YOU Donald Telian SI Consultant telian@sti.net rev 1.0