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Transcription:

Delay Line Series MN33S Full Multi-AL-Compatible Video Signal Delay Element Overview The MN33S is a signal delay element for video signal processing applications. It contains such components as a shift register clock driver, charge I/O s, /nd frequency doubler, two switchable analog shift registers, a clamp bias circuit, resampling s, a mode selection circuit and booster circuits. When the switch is "H" level, the MN33S samples the using the supplied clock signal with a frequency 7.909 MHz of twice the NTSC color signal delay, produces independent delays of H (the horizontal scan period for the NTSC system) each for the two lines. When the switch is "M" level, the MN33S samples the using the supplied clock signal with a frequency.6737 MHz of twice the AL color signal delay, produces independent delays of H (the horizontal scan period for the NTSC system) each for the two lines. When the switch is "L" level, the MN33S samples the using the supplied clock signal with a frequency.6737 MHz of twice the AL color signal delay, produces independent delays of H (the horizontal scan period for the AL system) for the Y output and H for the C output. Features Single.9 V power supply Single chip combining luminance signal delay element and delay element for color signal converted to low frequency Full Multi-AL support, switchable between NTSC,.3 NTSC, and AL systems Applications Full multi-al-compatible VCRs in Assignment V BB VOY ( TO VIEW ) SO06--0 3 6 7 6 3 0 9 VINC XI

MN33S Delay Line Series Block Diagram Bias circuit VINC 6 3 N 3N 3 XI Waveform amplifier adjustment Clamp circuit 3N 9 -V BB stages 7. stages 0 stages /nd frequency doubler stages øs driver ø driver ø driver ør driver 0 stages stages Mode selection circuit detection detection Three levels: H: NTSC M:.3 NTSC L: AL Resampling øs driver ø driver ø driver ør driver Resampling 7 VOY

Delay Line Series MN33S Application Circuit Example 0µF 0.µF (0.0µF) Bias circuit VINC 6 (0.0µF) 3 0.7µF N 3N XI 3 Waveform amplifier adjustment 000pF Clamp circuit 9 3N -V BB stages 7. stages (0.0µF) 0 stages /nd frequency doubler stages øs driver ø driver ø driver ør driver 0 stages stages Mode selection circuit Three levels: H: NTSC M:.3 NTSC L: AL detection Resampling øs driver ø driver ø driver ør driver detection Resampling 7 VOY (0.0µF) Note: When an electlytic capacitor is attached to pin, connect the negative pole to pin. 3

MN33S Delay Line Series ackage Dimensions (Unit:mm) SO06--0 0.0±0.0 6 9.7 (0.6) 0.0±0.0 SEATING LANE.30±0.0.0±0.0 0.0±0.0 6.0±0.0.60 0.0-0.0 0. 0.0-0.0.0±0.0 0 to 0 0.0min.

Request for your special attention and precautions in using the technical information and semiconductors described in this book () If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. () The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. () The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date roduct Standards in advance to make sure that the latest specifications satisfy your requirements. () When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.