Advanced Sensor Technologies Jörg Amelung Fraunhofer Institute for Photonics Microsystems Name of presenter date
Sensors as core element for IoT Next phase of market grow
New/Advanced Requirements based on IoT High functionality Multisensor function Low Power consumption Lower cost/ High volume Miniaturization IoT mobile sensor/ actor Connectivity
On site food analysis using smart phone spectrometer
New/Improved Requirements based on IoT Miniaturization Hybrid integrated MEMS spectrometer Low Power consumption High functionality Lower cost/ High volume Connectivity
MEMS Scanning Micro Mirrors Electrostatically driven 1D and 2D resonant micro scanning mirror Frequencies 70 Hz 35 khz Mirror diameter 0.35 mm 4.0 mm Deflection angle Up to +/- 34 (136 optical scan range) Mirror flatness Better than /10
MEMS scanning grating technology Examples of MEMS grating structures Anisotropic silicon etch Easy to control, slow Under-etch Generates smooth surfaces Efficiencies up to 85% possible
MEMS scanning grating spectrometer
Miniaturized hybrid-integrated MEMS spectrometer MEMS scanning grating spectrometer established for NIR Miniaturization through hybrid integration to enter mobile and handheld applications 720 cm³ 2,1 cm³
Miniaturized hybrid-integrated MEMS spectrometer Classical System Planar Approach
Z X Y Miniaturized hybrid-integrated MEMS spectrometer Input Fiber & Ferrule Photodetector MEMS Carrier Spacer Optics
Miniaturized hybrid-integrated MEMS spectrometer Ultra precision micromachined Optics with two integrated mirrors, (aluminium) Machined Spacer, potentially including stray light suppression structures, (aluminium) MEMS Grating with integrated piezoelectric position detection, entrance and exit slit, (SOI) Photodiode, (InGaAs) Carrier Substrate with ultra fine tracks and pads, (FR4 PCB) Optical Input Fiber / Ferrule, (Quarz / Steel)
Z X Y Miniaturized hybrid-integrated MEMS spectrometer Parameter Form Typ Unit Grating constant g 1600 nm Diffraction order m -1 Deflection amplitude ±9.5 Spectral range 950 nm Minimum Wavelength min 950 nm Maximum Wavelength max 1900 nm Spectral resolution d 9 nm Outer dimensions L x B x H 15 x 10 x 14 mm³
Smart phone spectrometer
Application examples Meat processing Alcohol content of spirits
New/Improved Requirements based on IoT Miniaturization Low Power consumption High functionality Lower cost/ High volume Connectivity Integrated Capacitive Micromachined Ultrasonic Transducers (CMUT) based on Post-CMOS technology
Capacitive Micromachined Ultrasonic Transducers (CMUT) Advantages High sensitivity Array integration High Bandwidth Reproducibility Miniaturization / Integration on CMOS Applications Acoustic spectroscopy Acoustic microscopy Medical / NDT imaging Counter plate Cavity Metal plate
Transmission and reception operation Transmitter Receiver
Surface MEMS based CMUT technology Sacrificial layer technology implemented now: Element diameter: 10 µm 200 µm Structural layer thickness: 500 nm 2000 nm -> Center Frequencies: 500 khz 140 MHz (very low variation < 5%) Amorphous TiAl layer
MEMS in post-cmos technology Benefits Highest Miniaturization Lowest Power consumption based on low parasitics Easy scalable based on standard CMOS
Advanced Distributed Pilot Line for More-than-Moore Technologies
ADMONT - Concept
Results of sound field scan: Active area of 0.6 mm
Application scenario: Acoustic spectroscopy for mobile fluid Analysis
Conclusion The mobile sensor market segment and the IoT trend generate a huge demand for innovative technologies. Miniaturization, Low cost, low power consumption, connectivity and new functionalities are the main driver for the developments. New functionalities like spectrometry allows the fulfilling of customer demands regarding food monitoring. The Fraunhofer IPMS miniaturized MEMS spectrometer allows the mobile detection of food quality. Fully integrated CMUTs in post CMOS technology allow the very compact characterization of material properties