HSMW-C12, HSMW-C13, HSMW-C191, HSMW-C197, HSMW-C265 White ChipLEDs Data Sheet Description These white ChipLEDs come in unique shades of white and provide product differentiation for backlighting application. They are designed in industry standard package for ease of handling and use. These chipleds come in either a side emitting package (HSMW-C12) or in top emitting packages (HSMW- C13, C191, C197 and C265). The packages all compatible with IR reflow soldering process and come in 8 mm tape on 7" diameter reel. They are compatible with automatic placement equipment. In order to facilitate pick and place operation, these chipleds are shipped in tape and reel with 4 units per reel for HSMW-C12, C13, C191 and C197 packages, and 3 units per reel for HSMW-C265 package. Features White color Small size Industry standard footprint Compatible with reflow soldering Compatible with automatic placement equipment Operating temperature range 4 C to +85 C Come in 8 mm tape on 7" diameter reels Applications LCD backlighting Keypad backlighting Pushbutton backlighting Symbol backlighting CAUTION: HSMW-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions LED Die MARK LED DIE.8.31 DIFFUSED EPOXY 1.6 (.63) 1.2 (.47).3 (.12).6 (.24) POLARITY DIFFUSED EPOXY PCB BOARD 1.6.63 1.15.45 (.8).23.9 Polarity.35.14 PC BOARD LINE.5 (.2) 1. (.39) 3 Ð.3 (.12).3±.15.12±.6 LINE.12.5.3±.15.12±.6.7 MIN..28 SOLDERING TERMINAL SOLDERING TERMINAL HSMW-C12 HSMW-C13 LED DIE MARK LED DIE.8 (.31) 1.6 (.63 ).4 (.16) 1.6 (.63 ).4 (.16).8 (.31).3 (.12) DIFFUSED EPOXY 1. (.39) POLARITY DIFFUSED EPOXY.16 (.6) POLARITY PC BOARD LINE.6 (.23).3 (.12) PC BOARD.4 (.16).3 ±.15 (.12 ±.6).3 ±.15 (.12 ±.6).7 (.28) MIN. LINE.3 ±.15 (.12 ±.6).7 (.28) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMW-C191 HSMW-C197 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±.1 mm UNLESS OTHERWISE NOTED. 2
Package Dimensions, continued LED DIE MARK 1.25 (.49) 3.4 (.134 ) DIFFUSED EPOXY 1.1 (.43) PC BOARD 1.2 (.47) 1.1 (.43) POLARITY LINE.5 ±.15 (.2 ±.6).3 (.12).5 ±.15 (.2 ±.6) SOLDERING TERMINAL HSMW-C265 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±.1 mm UNLESS OTHERWISE NOTED. 3
Device Selection Guide Package Dimension (mm) White Package Description 1.6 (L) x.6 (W) x 1. (H) HSMW-C12 Untinted, Diffused 1.6 (L) x.8 (W) x.35 (H) HSMW-C13 Untinted, Diffused 1.6 (L) x.8 (W) x.6 (H) HSMW-C191 Untinted, Diffused 1.6 (L) x.8 (W) x.4 (H) HSMW-C197 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H) [2] HSMW-C265 Untinted, Diffused Notes: 1. Right angle package. 2. Reverse mount package. Absolute Maximum Ratings at T A = 25 C Parameter HSMW-Cxxx Units DC Forward Current [1] 2 ma Power Dissipation 78 mw Reverse Voltage (I R = μa) 5 V LED Junction Temperature 95 C Operating Temperature Range 4 to +85 C Storage Temperature Range 4 to +85 C Soldering Temperature See reflow soldering profile (Figures & 11) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at T A = 25 C Reverse Forward Voltage Breakdown Capacitance C Thermal V F (Volts) V R (Volts) (pf), V F =, Resistance @ I F = 2 ma [1] @ I R = μa f = 1 MHz R J-PIN ( C/W) Part Number Typ. Max. Min. Typ. Typ. HSMW-Cxxx 3.6 3.9 5 55 45 Note: 1. V F tolerance: ±.1 V. Optical Characteristics at T A = 25 C Luminous Intensity Chromaticity Luminous I v (mcd) Coordinates [2] Viewing Angle Efficacy @ 2 ma [1, 4] Typ. 2 1/2 Degrees [3] v (lm/w) Part Number Min. Typ. x y Typ. Typ. HSMW-C12 45 16.29.27 155 24 HSMW-C13 45 15.29.27 145 24 HSMW-C191 71.5 2.29.27 14 24 HSMW-C197 45 16.29.27 13 24 HSMW-C265 71.5 18.29.27 15 24 Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λ d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. Luminous intensity (I v ) tolerance: ± 15%. 4
Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Bin ID Min. Max. A.11.18 B.18.29 C.29.45 D.45.72 E.72 1. F 1. 1.8 G 1.8 2.8 H 2.8 4.5 J 4.5 7.2 K 7.2 11.2 L 11.2 18. M 18. 28.5 N 28.5 45. P 45. 71.5 Q 71.5 112.5 R 112.5 18. S 18. 285. T 285. 45. U 45. 715. V 715. 1125. W 1125. 18. X 18. 285. Y 285. 45. Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Limits (Chromaticity Coordinate) Bin x y A1.27.246.27.278.25.25.25.218 A2.27.246.27.213.25.185.25.218 B1.27.246.27.278.29.36.29.274 B2.27.246.27.213.29.241.29.274 C1.29.36.3.336.3.33.29.274 C2.29.241.3.271.3.33.29.274 D1.3.33.3.336.33.365.33.333 D2.3.33.3.271.33.3.33.333 LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 1.2 1..8.6.4.2 I F MAX. - MAXIMUM FORWARD CURRENT - ma 5 15 2 25 2 3 4 5 6 7 8 9 I F - FORWARD CURRENT - ma T A - AMBIENT TEMPERATURE - o C 25 2 15 5 Figure 1. Color bin limits (CIE 1931 Chromaticity Diagram) [Tolerance: ±.2]. Figure 2. Forward current vs. forward voltage. 5
Y-COORDINATE.4.38.36 SMT WHITE COLOR BIN STRUCTURES.34 D1.32.3 C1 D2.28.26 B1 C2.24.22.2.18.16.24 A1 A2.26 B2.28.3.32.34 X-COORDINATE I F - FORWARD CURRENT - ma 1.1 2. 2.5 3. 3.5 4. V F - FORWARD VOLTAGE - V Figure 3. Luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature. RELATIVE INTENSITY 9 8 7 6 5 4 3 2-9 -8-7 -6-5 -4-3 -2-2 3 4 5 6 7 8 9 ANGLE RELATIVE INTENSITY 9 8 7 6 5 4 3 2-9 -8-7 -6-5 -4-3 -2-2 3 4 5 6 7 8 9 ANGLE Figure 5. Relative intensity vs. angle for HSMW-C12. 6
RELATIVE INTENSITY - % 9 8 7 6 5 4 3 2-9 -8-7 -6-5 -4-3 -2-2 3 4 5 6 7 8 9 Figure 6. Relative intensity vs. angle for HSMW-C13. RELATIVE INTENSITY - % 9 8 7 6 5 4 3 2-9 -8-7 -6-5 -4-3 -2-2 3 4 5 6 7 8 9 Figure 7. Relative intensity vs. angle for HSMW-C191. RELATIVE INTENSITY - % 9 8 7 6 5 4 3 2-9 -8-7 -6-5 -4-3 -2-2 3 4 5 6 7 8 9 Figure 8. Relative intensity vs. angle for HSMW-C197. RELATIVE INTENSITY - % 9 8 7 6 5 4 3 2-9 -8-7 -6-5 -4-3 -2-2 3 4 5 6 7 8 9 Figure 9. Relative intensity vs. angle for HSMW-C265. 7
TEMPERATURE 14-16 C SEC. MAX. 23 C MAX. 4 C/SEC. MAX. OVER 2 MIN. TIME Figure. Recommended reflow soldering profile. 4 C/SEC. MAX. 3 C/SEC. MAX. TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6-12 SEC. TIME Figure 11. Recommended Pb-free reflow soldering profile. SEC. MAX. 6 C/SEC. MAX. 6 SEC. MAX..4 (.16).4 (.16).8 (.31).7 (.28).15 (.6).8 (.31) 1.2 (.47).8 (.31) CENTERING BOARD.8 (.31).7 (.28).8 (.31) Figure 12. Recommended soldering pad pattern for HSMW-C12. Figure 13. Recommended soldering pattern for HSMW-C13, HSMW-C191, and HSMW-C197. 2.2 (.87) DIA. PCB HOLE 1.25 (.49) 1.4 (.55) 2.3 (.91) 1.4 (.55) Figure 14. Recommended soldering pad pattern for HSMW-C265. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 8
USER FEED DIRECTION SIDE PRINTED LABEL Figure 15. Reeling orientation. 8. ± 1. (.315 ±.39) Ø 13.1 ±.5 (Ø.516 ±.2).5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) 178.4 ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Figure 16. Reel dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 9
4. (.157) 1.5 (.59) 1.75 (.69) DIM. C.2 ±.5 (.8 ±.2).23 ±.5 (.9 ±.2) FOR HSMR-C13 DIM. A 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B 2. ±.5 (.79 ±.2) HSMx-C12 POSITION IN CARRIER TAPE DIM. A 4. (.157) PART NUMBER HSMx-C12 SERIES HSMx-C13 SERIES HSMx-C191 SERIES HSMx-C197 SERIES USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±. (.4) 1.9 (.75) 1.75 (.69) 1.85 (.73) 1.75 (.69) DIM. B ±. (.4) 1.15 (.45).88 (.35).88 (.35).95 (.37) COVER TAPE DIM. C ±. (.4).8 (.31).5 (.2).88 (.35).6 (.24) CARRIER TAPE DIM. B FOR HSMx-C12 R.5 ±.5 (.2 ±.2) 4. (.157) 1.5 (.59) DIM. C.2 ±.5 (.8 ±.2) 1.75 (.69) DIM. A 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B 2. ±.5 (.79 ±.2) 4. (.157) PART NUMBER USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±. (.4) DIM. B ±. (.4) COVER TAPE DIM. C ±. (.4) HSMx-C265 SERIES 3.7 (.146) 1.45 (.57) 1.3 (.51) CARRIER TAPE Figure 17. Tape dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
END START THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 18. Tape leader and trailer dimensions. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 6, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 3 C @ 6% RH max. Baking is required under the condition: 1. Humidity Indicator Card is > % when read at 23±5 C. 2. Device expose to factory conditions < 3 C/6% RH more than 672 hours. Baking recommended condition: 6 ± 5 C for 2 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 25-2 Avago Technologies. All rights reserved. Obsoletes AV1-685EN AV2-186EN - May 5, 2