BAS40 series; 1PSxxSB4x series

BAS40 series; PSxxSB4x series Rev. 9 8 March 05 Product data sheet. Product profile. General description in small Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number Package Configuration NXP JEITA PS70SB40 SOT SC-70 single diode PS76SB40 SOD SC-76 single diode PS79SB40 SOD5 SC-79 single diode BAS40 SOT - single diode BAS40H SODF - single diode BAS40L SOD88 - single diode BAS40W SOT SC-70 single diode PS70SB44 SOT SC-70 dual series BAS40-04 SOT - dual series BAS40-04W SOT SC-70 dual series PS70SB45 SOT SC-70 dual common cathode PS75SB45 SOT46 SC-75 dual common cathode BAS40-05 SOT - dual common cathode BAS40-05W SOT SC-70 dual common cathode PS70SB46 SOT SC-70 dual common anode BAS40-06 SOT - dual common anode BAS40-06W SOT SC-70 dual common anode BAS40-07 SOT4B - dual isolated BAS40-07V SOT666 - dual isolated BAS40-05V SOT666 - quadruple common cathode/ common cathode PS88SB48 SOT6 SC-88 quadruple common cathode/ common cathode BAS40XY SOT6 SC-88 quadruple; series

. Features and benefits High switching speed Low leakage current High breakdown voltage Low capacitance AEC-Q0 qualified. Applications Ultra high-speed switching Voltage clamping.4 Quick reference data Table. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode I F forward current - - 0 ma V F forward voltage I F =ma [] - - 80 mv V R reverse voltage - - 40 V [] Pulse test: t p 00 s; 0.0.. Pinning information Table. Pinning Pin Description Simplified outline Symbol BAS40H; PS76SB40; PS79SB40 cathode [] anode sym00 00aab540 BAS40L cathode [] anode sym00 Transparent top view BAS40; BAS40W; PS70SB40 anode not connected cathode n.c. 006aaa46 006aaa44 BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 of

Table. Pinning continued Pin Description Simplified outline Symbol BAS40-04; BAS40-04W; PS70SB44 anode (diode ) cathode (diode ) cathode (diode ), anode (diode ) 006aaa44 006aaa47 BAS40-05; BAS40-05W; PS70SB45; PS75SB45 anode (diode ) anode (diode ) cathode (diode ), cathode (diode ) BAS40-06; BAS40-06W; PS70SB46 cathode (diode ) cathode (diode ) anode (diode ), anode (diode ) 006aaa44 006aaa44 006aaa48 006aaa49 BAS40-07 cathode (diode ) cathode (diode ) 4 4 anode (diode ) 4 anode (diode ) 006aaa44 BAS40-07V anode (diode ) not connected cathode (diode ) 4 anode (diode ) 5 not connected 6 cathode (diode ) 6 5 4 6 5 4 006aaa440 BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 of

Table. Pinning continued Pin Description Simplified outline Symbol BAS40-05V; PS88SB48 anode (diode ) anode (diode ) cathode (diode ), cathode (diode 4) 4 anode (diode ) 5 anode (diode 4) 6 cathode (diode ), cathode (diode ) BAS40XY anode (diode ) cathode (diode ) anode (diode ), cathode (diode 4) 4 anode (diode 4) 5 cathode (diode ) 6 cathode (diode ), anode (diode ) [] The marking bar indicates the cathode. 6 5 4 00aab555 6 5 4 6 5 4 006aaa446 6 5 4 006aaa56 BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 4 of

. Ordering information Table 4. Type number Ordering information Package Name Description Version PS70SB40 SC-70 plastic surface-mounted package; leads SOT PS76SB40 SC-76 plastic surface-mounted package; leads SOD PS79SB40 SC-79 plastic surface-mounted package; leads SOD5 BAS40 - plastic surface-mounted package; leads SOT BAS40H - plastic surface-mounted package; leads SODF BAS40L - leadless ultra small plastic package; terminals; SOD88 body.0 0.6 0.5 mm BAS40W SC-70 plastic surface-mounted package; leads SOT PS70SB44 SC-70 plastic surface-mounted package; leads SOT BAS40-04 - plastic surface-mounted package; leads SOT BAS40-04W SC-70 plastic surface-mounted package; leads SOT PS70SB45 SC-70 plastic surface-mounted package; leads SOT PS75SB45 SC-75 plastic surface-mounted package; leads SOT46 BAS40-05 - plastic surface-mounted package; leads SOT BAS40-05W SC-70 plastic surface-mounted package; leads SOT PS70SB46 SC-70 plastic surface-mounted package; leads SOT BAS40-06 - plastic surface-mounted package; leads SOT BAS40-06W SC-70 plastic surface-mounted package; leads SOT BAS40-07 - plastic surface-mounted package; 4 leads SOT4B BAS40-07V - plastic surface-mounted package; 6 leads SOT666 BAS40-05V - plastic surface-mounted package; 6 leads SOT666 PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT6 BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT6 BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 5 of

4. Marking 5. Limiting values Table 5. Marking codes Type number Marking code [] Type number Marking code [] PS70SB40 6* PS75SB45 45 PS76SB40 S4 BAS40-05 45* PS79SB40 T BAS40-05W 65* BAS40 4* PS70SB46 6*6 BAS40H AJ BAS40-06 46* BAS40L S6 BAS40-06W 66* BAS40W 6* BAS40-07 47* PS70SB44 6*4 BAS40-07V 67 BAS40-04 44* BAS40-05V 65 BAS40-04W 64* PS88SB48 8*5 PS70SB45 6*5 BAS40XY 40* [] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 604). Symbol Parameter Conditions Min Max Unit Per diode V R reverse voltage - 40 V I F forward current - 0 ma I FRM repetitive peak forward t p s; 0.5-0 ma current I FSM non-repetitive peak forward t p 0 ms [] - 00 ma current T j junction temperature - 50 C T amb ambient temperature 65 +50 C T stg storage temperature 65 +50 C [] T j =5 C prior to surge. BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 6 of

6. Thermal characteristics 7. Characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per device R th(j-a) thermal resistance from junction to ambient in free air [] SOT - - 500 K/W SOT4B - - 500 K/W SOT6 (PS88SB48) - - 46 K/W SOT46 - - 8 K/W SOT666 (BAS40-05V) [] - - 5 K/W SOT666 (BAS40-07V) [] - - 46 K/W SODF [] - - 0 K/W SOD - - 450 K/W SOD5 [] - - 450 K/W SOD88 [] - - 500 K/W SOT - - 65 K/W R th(j-sp) thermal resistance from junction to solder point SOT6 (BAS40XY) [] - - 60 K/W [] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [] Reflow soldering is the only recommended soldering method. [] Soldering point at pins,, 5 and 6. Table 8. Characteristics T amb =5 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode V F forward voltage [] I F = ma - - 80 mv I F = 0 ma - - 500 mv I F =40mA - - V I R reverse current V R =0V - - A V R =40V - - 0 A C d diode capacitance V R =0V; f=mhz - - 5 pf [] Pulse test: t p 00 s; 0.0. BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 7 of

0 mlc6 0 mlc6 I F (ma) 0 I R (μa) 0 () 0 () () () (4) () 0 0 () 0 0 0. 0.4 0.6 0.8 V F (V) 0 0 0 0 0 40 VR (V) Fig. () T amb = 5 C () T amb =85 C () T amb =5 C (4) T amb = 40 C Forward current as a function of forward voltage; typical values Fig. () T amb = 5 C () T amb =85 C () T amb =5 C Reverse current as a function of reverse voltage; typical values 0 r dif (Ω) mlc64 5 C d (pf) 4 mlc6 0 0 0 0 I F (ma) 0 0 0 0 0 0 40 V R (V) f=0khz T amb =5 C; f = MHz Fig. Differential resistance as a function of forward current; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 8 of

8. Test information 9. Package outline 8. Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q0 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications..5.5. 0.8 0.85 0.75 0.65 0.58 0.45 0.5.7..8.6.65.55.5.5 0.40 0.5 0.5 0.0 0.4 0.6 0.7 0. 0--7 0-- Fig 5. Package outline SOD (SC-76) Fig 6. Package outline SOD5 (SC-79).0.8. 0.9.7.5..0.5..4. 0.45 0.5.6.4.7.5 0.55 0.5.9 0.48 0.8 0.5 0.09 0.70 0.55 0.5 0.0 04--04 04--9 Fig 7. Package outline SOT (TO-6AB) Fig 8. Package outline SODF BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 9 of

0.6 0.55 0.50 0.46..8. 0.8 0.0 0. 0.45 0.5 0.65.0 0.95..0.5.5 0.0 0. 0.55 0.47 cathode marking on top side (if applicable). 0.4 0. 0.5 0.0 0-04-7 04--04 Fig 9. Package outline SOD88 Fig 0. Package outline SOT (SC-70) 4.0.8.9. 0.9..8 6 5 4 0.45 0.5. 0.8.5..4. 0.45 0.5..0.5.5 pin index 0.88 0.78.7 0.48 0.8 0.5 0.09 0. 0.65 0.. 0.5 0.0 04--6 4-0-0 Fig. Package outline SOT4B Fig. Package outline SOT6 (SC-88).8.4 0.95 0.60.7.5 0.6 0.5 0.45 0.5 6 5 4 0. 0..75.45 0.9 0.7.7.5.. pin index 0.0 0.5 0.5 0.0 0.7 0.5 0.7 0.8 0.08 04--04 04--08 Fig. Package outline SOT46 (SC-75) Fig 4. Package outline SOT666 BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 0 of

0. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the NC ordering code. [] Type number Package Description Packing quantity 000 4000 8000 0000 PS70SB40 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 PS76SB40 SOD 4 mm pitch, 8 mm tape and reel -5 - - -5 PS79SB40 SOD5 mm pitch, 8 mm tape and reel - - -5-4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40H SODF 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40L SOD88 mm pitch, 8 mm tape and reel - - - -5 BAS40W SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 PS70SB44 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40-04 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40-04W SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 PS70SB45 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 PS75SB45 SOT46 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40-05 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40-05W SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 PS70SB46 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40-06 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40-06W SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40-07 SOT4B 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS40-07V SOT666 mm pitch, 8 mm tape and reel - - -5-4 mm pitch, 8 mm tape and reel - -5 - - BAS40-05V SOT666 mm pitch, 8 mm tape and reel - - -5-4 mm pitch, 8 mm tape and reel - -5 - - PS88SB48 SOT6 4 mm pitch, 8 mm tape and reel; T [] -5 - - -5 4 mm pitch, 8 mm tape and reel; T [] -5 - - -65 BAS40XY SOT6 4 mm pitch, 8 mm tape and reel; T [] -5 - - -5 4 mm pitch, 8 mm tape and reel; T [] -5 - - -65 [] For further information and the availability of packing methods, see Section 4. [] T: normal taping [] T: reverse taping BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 of

. Soldering.05.80.0.60.65 0.95 0.50 0.60 0.50 ( ) msa4 solder paste Fig 5. Reflow soldering footprint SOD (SC-76) 5.00 4.40.40.75.0 msa45 preferred transport direction during soldering Fig 6. Wave soldering footprint SOD (SC-76).5.0 0.50 0.60 solder paste.80.90 0.0 0.40 mgs4 Reflow soldering is the only recommended soldering method. Fig 7. Reflow soldering footprint SOD5 (SC-79) BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 of

.90.50 0.85.00.0.70 0.85 0.60 (x) solder paste 0.50 (x) 0.60 (x).00.0 MSA49 Fig 8. Reflow soldering footprint SOT (TO-6AB).40.0 (x) 4.60 4.00.0 preferred transport direction during soldering.80 4.50 MSA47 Fig 9. Wave soldering footprint SOT (TO-6AB) BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 of

4.4 4.9.6..6.. solder paste. ( ) Fig 0. Reflow soldering is the only recommended soldering method. Reflow soldering footprint SODF.0 R = 0.05 (8 ) 0.0 R = 0.05 (8 ) 0.90 0.60 ( ) 0.70 ( ) 0.80 ( ) solder paste 0.0 ( ) 0.40 ( ) 0.50 ( ) mbl87 Fig. Reflow soldering is the only recommended soldering method. Reflow soldering footprint SOD88 BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 4 of

.65 0.75.0.5.5 0.85 0.60 ( ) 0.50 ( ).90 solder paste 0.55 ( ).40 msa49 Fig. Reflow soldering footprint SOT (SC-70) 4.60 4.00.5.65.0.70 preferred transport direction during soldering 0.90 ( ) msa49 Fig. Wave soldering footprint SOT (SC-70) BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 5 of

.70 0.60 (4x).5 0.60 (x) 0.50 (x) 4.0.00 solder paste msa44 0.90.00.50 Fig 4. Reflow soldering footprint SOT4B 4.45.0 ( ) 4.5 4.00 4.60.40.00 preferred transport direction during soldering msa4 Fig 5. Wave soldering footprint SOT4B BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 6 of

.65.5.5 0.6 0.5 0.4 ( ) (4 ) (4 ) solder paste 0.5 (4 ) 0.6 ( ) 0.6 (4 ).8 sot6_fr Fig 6. Reflow soldering footprint SOT6 (SC-88).5 4.5 0..5.5.. preferred transport direction during soldering.45 5. sot6_fw Fig 7. Wave soldering footprint SOT6 (SC-88) BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 7 of

0.6. 0.7..0 0.85 0.5 (x).5 0.6 (x).9 msa48 solder paste Fig 8. Reflow soldering footprint SOT46.75.45..6.7 0.58.075 0.55 ( ) 0.4 (6 ) 0.5 ( ) 0. ( ) placement area solder paste.7 0.5 (4 ) 0.75 (4 ) 0.45 (4 ) 0.6 ( ) 0.5 (4 ) 0.65 ( ) sot666_fr Fig 9. Reflow soldering is the only recommended soldering method. Reflow soldering footprint SOT666 BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 8 of

. Revision history Table 0. Revision history Document ID Release date Data sheet status Change notice Supersedes BAS40_PSXXSB4X_SER 0508 Product data sheet - BAS40_PSXXSB4X_SER_8 v.9 Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. BAS40_PSXXSB4X_SER_8 000 Product data sheet - BAS40_PSXXSB4X_SER_7 BAS40_PSXXSB4X_SER_7 00605 Product data sheet - BAS40_PSXXSB4X_SER_6 BAS40_PSXXSB4X_SER_6 0050809 Product data sheet - PS70SB40_ PS75SB45_ PS76SB40_ PS79SB40_ PS88SB48_ BAS40H_ BAS40L_ BAS40-05V_ BAS40-07V_ BAS40W_ BAS40_SERIES_5 PS70SB40_ 999046 Product specification - PS70SB40_ PS75SB45_ 999046 Product specification - PS75SB45_ PS76SB40_ 00406 Product specification - PS76SB40_ PS79SB40_ 999046 Product specification - PS79SB40_ PS88SB48_ 0007 Product specification - PS88SB48_ BAS40H_ 005045 Product data sheet - - BAS40L_ 00050 Product specification - - BAS40-05V_ 00 Product specification - - BAS40-07V_ 0007 Product specification - - BAS40W_ 999046 Product specification - BAS40W_ BAS40_SERIES_5 0000 Product specification - BAS40_4 BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 9 of

. Legal information. Data sheet status Document status [][] Product status [] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [] The term short data sheet is explained in section Definitions. [] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.. Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 604) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 0 of

No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations A non-english (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions..4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 4. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BAS40_PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 05. All rights reserved. Product data sheet Rev. 9 8 March 05 of

5. Contents Product profile........................... General description...................... Features and benefits..................... Applications............................4 Quick reference data.................... Pinning information...................... Ordering information..................... 5 4 Marking................................ 6 5 Limiting values.......................... 6 6 Thermal characteristics.................. 7 7 Characteristics.......................... 7 8 Test information......................... 9 8. Quality information...................... 9 9 Package outline......................... 9 0 Packing information.................... Soldering............................. Revision history........................ 9 Legal information....................... 0. Data sheet status...................... 0. Definitions............................ 0. Disclaimers........................... 0.4 Trademarks........................... 4 Contact information..................... 5 Contents.............................. Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP Semiconductors N.V. 05. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 8 March 05 Document identifier: BAS40_PSXXSB4X_SER

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: NXP: PS70SB40,5 PS70SB44,5 PS70SB45,5 PS70SB46,5 PS75SB45,5 PS75SB45,5 PS76SB40,5 PS79SB40,5 PS88SB48,5 PS79SB40,699 BAS40,5 BAS40-04,5 BAS40-04,5 BAS40-04W,5 BAS40-05,5 BAS40-05,5 BAS40-05V,5 BAS40-05W,5 BAS40-06,5 BAS40-06,5 BAS40-06W,5 BAS40-07,5 BAS40-07V,5 BAS40H,5 BAS40L,5 BAS40,5 BAS40W,5 BAS40XY,5 PS76SB40,5