The is a miniaturized, multi-octave 185 GHz IQ mixer. It features matched double balanced mixers connected with an integrated LO hybrid and RF power divider. It can be used for either up or downconversion. Applications include optical communications systems with advanced modulation formats, communications or radar systems with advanced digital modulation formats and phase modulated signals, test and measurement, or electronic warfare. Image reject or single sideband modulation with excellent suppression is possible with use of an external IF quadrature (9 ) hybrid. Features Compact Chip Style Package (.24 x.24 x.1 ) CAD Optimized for Superior Amplitude / Phase Balance and Image Rejection Broadband Performance Excellent Unit-to-Unit Repeatability Fully nonlinear software models available with Marki PDK for Microwave Office RoHS Compliant Electrical Specifications - Specifications guaranteed from 5 to +1 C, measured in a 5Ω system. Parameter LO RF IF Min Typ Max Diode Option 1 (GHz) (GHz) (GHz) LO drive level (dbm) Conversion Loss (db) 185 DC 8 13 (Combined IF with Test Hybrid) 6 1 15 Image Rejection (db) (Combined IF with Test Hybrid) See Plots I/Q Amplitude Balance (db).11 I/Q Quadrature Phase Balance (Degrees) Isolation (db) LO-RF LO-IF RF-IF Input 1 db Compression (dbm) +8 L (+11 to +18) (Combined IF with Test Hybrid) +13 I (+18 to +24) Input Two-Tone Intercept (dbm) +15 L (+11 to +18) (Combined IF with Test Hybrid) +2 I (+18 to +24) 1 Contact factory for other diode options. 5 See Plots Part Number Options 1 Part Number Description Package Green Status Product Lifecycle Export Classification Recommended Part Number LCH Chip CH MMIQLCH Active ICH Chip CH RoHS MMIQ-137HCH Not EAR99 L Connectorized - Compliant Recommended MMIQLS for New Designs I Connectorized - MMIQ-137HS 1 Refer to our website for a list of definitions for terminology presented in this table. 215 Vineyard Court, Morgan Hill, CA 9537 Ph: 48.778.42 Fax 48.778.43 info@markimicrowave.com 12/8/217
Page 2 IF DC to 2 GHz Figure 1a. I/Q Mixer Schematic Figure 1b. Image Reject Mixer Schematic Figure 1c. Single Sideband Mixer Schematic 12/8/217
Page 3-1 Combined IF Downconversion Loss (db) 1 RF in < LO RF in > LO 15 2 25 3 35 4 45 5 Typical Performance -1 5-3 -35 5 IF DC to 2 GHz Combined IF Downconversion Image Rejection (db) 1 RF in < LO RF in > LO 15 2 25 3 35 4 45 5-1 Combined IF Upconversion Loss (db) 1 RF out < LO RF out > LO 15 2 25 3 35 4 45 5-1 5-3 -35 5 Combined IF Upconversion Sideband Suppression (db) 1 RF out < LO RF out > LO 15 2 25 3 35 4 45 5-1 Individual I/Q 1 MHz IF Conversion Loss (db) 1 Port "I" Port "Q" 15 2 25 3 35 4 45 5-1 Relative IF Response (db) 2 4 6 8 1 12 14 16 18 2 22 24 26 IF Frequency (GHz) -1 Individual I/Q, 7 GHz IF, LO>RF Conversion Loss (db) 1 Port "I" Port "Q" 1 15 2 25 3 35 4 45 5 55-1 Individual I/Q, 7 GHz IF, LO<RF Conversion Loss (db) 1 Port "I" Port "Q" 1 15 2 25 3 35 4 45 5 55 12/8/217
Page 4 3 Port "I" to Port "Q" IF Amplitude Match (db) Typical Performance (cont.) IF DC to 2 GHz Port "I" to Port "Q" IF Quadrature Phase Deviation (Degrees) 2 1-1 -3 22 24 26 28 3 32 34 36 38 4 42 44 46-7 -9-1 -11 22 24 26 28 3 32 34 36 38 4 42 44 46 LO to RF Isolation (db) LO to IF Isolation (db) -1-1 -3-3 15 2 25 3 35 4 45 5 LO Frequency (GHz) 15 2 25 3 35 4 45 5 LO Frequency (GHz) RF to IF Isolation (db) IF Return Loss (db) -1-3 -1 15 2 25 3 35 4 45 5 2 4 6 8 1 12 14 16 18 2 22 24 26 IF Frequency (GHz) RF Return Loss (db) LO Return Loss (db) -1-1 15 2 25 3 35 4 45 5 LO Frequency (GHz) 15 2 25 3 35 4 45 5 LO Frequency (GHz) 12/8/217
Page 5 IF DC to 2 GHz Typical Performance (cont.) Combined IF Input IP3 (dbm) 3 25 2 15 1 5 L-Diode I-Diode -1 18 21 24 27 3 33 36 39 42 45 2xLO Harmonic to RF Isolation (db) -1-3 -7-9 15 2 25 3 35 4 45 5 LO Output Frequency (GHz) 3xLO Harmonic to RF Isolation (db) -1-3 -7-9 15 2 25 3 35 4 45 5 LO Output Frequency (GHz) 2RF x 2LO Spurious Suppression (dbc) with a -1 dbm Input L-Diode -1 I-Diode -3-7 18 21 24 27 3 33 36 39 42 45 RF Input Frequency (GHz) 3 25 2 15 1 5 Combined IF Output IP3 (dbm) L-Diode I-Diode -1 18 21 24 27 3 33 36 39 42 45-1 -3-7 2xLO Harmonic to IF Isolation (db) -9 15 2 25 3 35 4 45 5-1 -3-7 LO Output Frequency (GHz) 3xLO Harmonic to IF Isolation (db) -9 15 2 25 3 35 4 45 5-1 -3-7 LO Output Frequency (GHz) 2IF x 1LO Spurious Suppression (dbc) with a -1 dbm Input L-Diode I-Diode 18 21 24 27 3 33 36 39 42 45 RF Input Frequency (GHz) 12/8/217
Page 6 IF DC to 2 GHz [1.6] I.24 [7.11].63.114 [2.9] Q L Ground pad, 8 PL PROJECTION INCH [MM] XXX=±.5 XX=±.2.24 [6.1].18 [4.57].236 [5.99] R.12 [3.5].5 sq. minimum bonding pad, 4 PL.5 [.13] min clearance.236 [5.99].1 [.25] Figure 2a. Outline Drawing CH *CH Substrate material is.1 thick Ceramic. I/O traces and ground plane finish is 2.5 microns Au over.5 microns WTi. Wire Bonding - Ball or wedge bond with.25 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 15 C and a ball bonding force of 4 to 5 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <.31 mm (12 mils)..4 [11.2].95 [24.1] Port LO RF I/Q Connector Type 2.4 mm Female 2.4 mm Female SMA Female.8 [2.32].65 [16.51] I Q microwave MLIQ1845L LO.75 [1.9].4 [1.2] D/C RF.75 [1.9] Ø.1 Thru [2.54] 4 PL.68 [17.1] 1.275 [32.38] 1.35 [34.29] PROJECTION INCH [MM] XXX=±.5 XX=±.2.33 [8.4].16 [3.9] Figure 2b. Outline Drawing - Connectorized 12/8/217
Page 7 IF DC to 2 GHz Downconversion Spurious Suppression Spurious data is taken by selecting RF and LO frequencies (+mlo+nrf) within the RF/LO bands, to create a spurious output within the IF band. The mixer is swept across the full spurious band and the mean is calculated. The numbers shown in the table below are for a -1 dbm RF input. Spurious suppression is scaled for different RF power levels by (n- 1), where n is the RF spur order. For example, the 2RFx2LO spur is 59 dbc for a -1 dbm input, so a dbm RF input creates a spur that is (2-1) x (-1 db) db lower, or 69 dbc. Typical Downconversion Spurious Suppression (dbc): L-diode (I-Diode) 5-1 dbm RF Input xlo 1xLO 2xLO 3xLO 4xLO 5xLO 1xRF 21 (21) Reference 29 (25) 11 (16) N/A N/A 2xRF 55 (69) 59 (59) 59 (6) 6 (68) 62 (68) 57 (65) 3xRF 86 (87) 58 (66) 75 (77) 62 (68) 77 (88) 66 (82) 4xRF N/A 112 (113) 98 (99) 12 (17) 1 (12) 13 (118) 5xRF N/A N/A 11 (123) 15 (117) 116 (123) 15 (12) Upconversion Spurious Suppression Spurious data is taken by mixing an input within the IF band, with LO frequencies (+mlo+nif), to create a spurious output within the RF output band. The mixer is swept across the full spurious output band and the mean is calculated. The numbers shown in the table below are for a -1 dbm individual IF input, with the unused port terminated in 5 ohms. Spurious suppression is scaled for different IF input power levels by (n-1), where n is the IF spur order. For example, the 2IFx1LO spur is typically 6 dbc for a -1 dbm input, so a dbm IF input creates a spur that is (2-1) x (-1 db) db lower, or 7 dbc. Typical Upconversion Spurious Suppression (dbc): L-diode (I-Diode) 5-1 dbm IF Input xlo 1xLO 2xLO 3xLO 4xLO 5xLO 1xIF 16 (12) Reference 22 (15) 9 (14) N/A N/A 2xIF 56 (57) 6 (64) 59 (64) 6 (57) 58 (58) N/A 3xIF 77 (87) 63 (75) 71 (85) 63 (71) 71 (74) 58 (66) 4xIF 13 (113) 98 (18) 16 (115) 15 (19) 98 (11) 97 (16) 5xIF 118 (126) 18 (12) 119 (127) 116 (123) 111 (124) 98 (116) 12/8/217
Page 8 IF DC to 2 GHz Port Description DC Interface Schematic LO The LO port is DC open to ground and AC matched to 5 Ohms from 18 to 45 GHz. Blocking capacitor is optional. RF The RF port is DC short to ground and AC matched to 5 Ohms from 18 to 45 GHz. Blocking capacitor is optional. RF I/Q The I/Q ports are DC coupled to the diodes. Blocking capacitor is optional. IF Absolute Maximum Ratings RF DC Current LO DC Current IF DC Current 1 RF Power Handling (RF+LO) Parameter IF Power Handling (each IF port, with +24 dbm maximum LO) Operating Temperature Storage Temperature Maximum Rating 1 Amp 1 Amp 5 ma +29 dbm at +25 C, derated linearly to +24 dbm at +1 C +25 dbm at +25 C, derated linearly to +2 dbm at +1 C 5ºC to +1ºC 5ºC to +125ºC 1 Application of DC current has been known to damage mixer diodes. Any application of DC current could cause field damage and void the warranty. DATA SHEET NOTES: 1. Mixer Conversion Loss, Rejection, Sideband Suppression, and IP3 plot IF frequency is 6 MHz. 2. Mixer Noise Figure typically measures within.5 db of conversion loss for IF frequencies greater than 5 MHz. 3. Conversion Loss typically degrades less than.5 db for LO drives 2 db below the lowest and 3 db above highest nominal LO drive levels. 4. Conversion Loss typically degrades less than.5 db at +1 C and improves less than.5 db at 5 C. 5. Unless otherwise specified L diode data taken with +15 dbm LO drive and I diode data taken with +21 dbm LO drive. 6. Specifications are subject to change without notice. Contact Marki Microwave for the most recent specifications and data sheets. 7. Catalog mixer circuits are continually improved. Configuration control requires custom mixer model numbers and specifications. Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice. Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any product. Marki Microwave, Inc. 215 Vineyard Court, Morgan Hill, CA 9537 Ph: 48.778.42 Fax 48.778.43 info@markimicrowave.com www.markimicrowave.com 12/8/217