Agilent HSMx-A1x-xxxxx PLCC-2 Surface Mount LED Indicator Data Sheet Description This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. The super wide viewing angle at 12 makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. Features Industry standard PLCC-2 package High reliability LED package High brightness using AlInGaP and InGaN dice technologies Available in full selection of colors Super wide viewing angle at 12 Available in 8 mm carrier tape on 7 inch reel (2 pieces) Compatible with both IR and TTW soldering process Applications Interior automotive Instrument panel backlighting Central console backlighting Cabin backlighting Electronic signs and signals Interior full color sign Variable message sign Office automation, home appliances, industrial equipment Front panel backlighting Push button backlighting Display backlighting CAUTION: HSMN,M,K and E-A1x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Agilent Application Note AN-1142 for additional details.
Package Dimensions 2.8 ±.2 2.2 ±.2 1.9 ±.2.1 TYP..8 ±.1 3.2 ±.2 3.5 ±.2.8 ±.3 CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES).5 ±.1 TOP MOUNT 2.8 ±.2 2.2 ±.2 1.9 ±.2 3.2 ±.2 5.2 ±.2.1 TYP. CATHODE MARKING REVERSE MOUNT.5 ±.1 NOTE: ALL DIMENSIONS IN MILLIMETERS. 2
Device Selection Guide Red HSMS-A1-JJ1 4. 15. - 2 GaP HSMS-A1-LJ1 1. 15. - 2 GaP HSMS-A1-H7J2 3. - 8. 1 GaP HSMS-A1-J8J2 5. - 15.5 1 GaP HSMH-A1-LJ1 1. 15. - 2 AlGaAs HSMH-A1-NJ1 25. 5. - 2 AlGaAs HSMH-A1-L7J2 12.5-32. 1 AlGaAs HSMH-A1-M8J2 2. - 62. 1 AlGaAs HSMH-A1-P3J1 4. - 1. 2 AlGaAs HSMC-A1-JJ1 4. 1. - 2 AlInGaP HSMC-A1-QJ1 63. 1. - 2 AlInGaP HSMC-A1-RJ1 1. 14. - 2 AlInGaP HSMC-A11-SJ1 16. 22. - 2 AlInGaP HSMZ-A1-TJ1 25. 35. - 2 AlInGaP HSMC-A1-P3J1 4. - 1. 2 AlInGaP HSMC-A1-Q4J1 63. - 2. 2 AlInGaP HSMC-A11-R8J1 125. - 395. 2 AlInGaP HSMZ-A1-S8J1 2. - 62. 2 AlInGaP Red Orange HSMJ-A1-QJ1 63. 1. - 2 AlInGaP HSMJ-A11-SJ1 16. 2. - 2 AlInGaP HSMV-A1-TJ1 25. 35. - 2 AlInGaP HSMJ-A1-Q3J1 63. - 155. 2 AlInGaP HSMJ-A1-R4J1 1. - 315. 2 AlInGaP HSMJ-A11-R8J1 125. - 395. 2 AlInGaP HSMV-A1-S8J1 2. - 62. 2 AlInGaP Orange HSMD-A1-JJ1 4. 15. - 2 GaP HSMD-A1-LJ1 1. 15. - 2 GaP HSMD-A1-J7PJ2 5. - 12.5 1 GaP HSMD-A1-K4PJ2 6.3-2. 1 GaP HSML-A1-QJ1 63. 1. - 2 AlInGaP HSML-A11-SJ1 16. 22. - 2 AlInGaP HSML-A1-Q7PJ1 8. - 2. 2 AlInGaP HSML-A1-R7PJ1 125. - 315. 2 AlInGaP HSML-A11-R8WJ1 125. - 395. 2 AlInGaP 3
Device Selection Guide, continued Yellow/Amber HSMY-A1-JJ1 4. 12. - 2 GaP HSMY-A1-LJ1 1. 12. - 2 GaP HSMY-A1-J35J2 4. - 1. 1 GaP HSMY-A1-K45J2 6.3-2. 1 GaP HSMA-A1-QJ1 63. 1. - 2 AlInGaP HSMA-A11-SJ1 16. 22. - 2 AlInGaP HSMU-A1-SJ1 16. 32. - 2 AlInGaP HSMA-A1-Q35J1 63. - 155. 2 AlInGaP HSMA-A1-R45J1 1. - 315. 2 AlInGaP HSMA-A11-R8WJ1 125. - 395. 2 AlInGaP HSMU-A1-S4WJ1 16. - 5. 2 AlInGaP Yellow Green HSMG-A1-J2J1 4. 18. - 2 GaP HSMG-A1-K72J2 8. - 2. 1 GaP HSME-A1-M2J1 16. 7. - 2 AlInGaP HSME-A1-N82J1 3. - 1. 2 AlInGaP Emerald Green HSMG-A1-H1J1 2.5 8. - 2 GaP HSMG-A1-G31J2 1.6-4. 1 GaP HSMG-A1-H41J2 2.5-8. 1 GaP HSME-A1-L1J1 1. 4. - 2 AlInGaP HSME-A1-M3PJ1 16. - 4. 2 AlInGaP Green HSMM-A11-RJ1 1. 2. - 2 InGaN HSMM-A1-SJ1 16. 35. - 2 InGaN HSMM-A11-Q7PJ1 8. - 2. 2 InGaN HSMM-A11-R7PJ1 125. - 315. 2 InGaN HSMM-A11-R8PJ1 125. - 395. 2 InGaN HSMM-A1-S8PJ1 2. - 62. 2 InGaN 4
Device Selection Guide, continued Cyan HSMK-A11-RJ1 1. 17. - 2 InGaN HSMK-A1-SJ1 16. 28. - 2 InGaN HSMK-A1-S8WJ1 2. - 62. 2 InGaN HSMK-A11-Q3WJ1 63. - 155. 2 InGaN HSMK-A11-R4WJ1 1. - 315. 2 InGaN Blue HSMB-A1-JJ1 4. 15. - 2 GaN HSMB-A1-J7J2 5. - 12.5 1 GaN HSMB-A1-K8J2 8. - 25. 1 GaN HSMN-A11-NJ1 25. 5. - 2 InGaN HSMN-A1-PJ1 4. 7. - 2 InGaN HSMN-A11-N7YJ1 3. - 8. 2 InGaN HSMN-A11-N8YJ1 3. - 1. 2 InGaN HSMN-A1-P8YJ1 5. - 155. 2 InGaN Note: 1. The luminous intensity, I v, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 5
Part Numbering System HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (T A = 25 C) Parameters HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/K/B/N DC Forward Current [1] 3 ma 3 ma 3 ma [3,4] 2 ma [3,4] 3 ma [3,4] 3 ma Peak Forward Current [2] 1 ma 1 ma 1 ma 1 ma 1 ma 1 ma Power Dissipation 63 mw 6 mw 63 mw 48 mw 72 mw 114 mw Reverse Voltage 5 V Junction Temperature 11 C Operating Temperature 55 C to +1 C Storage Temperature 55 C to +1 C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty factor = 1%, Frequency = 1 khz. 3. Drive current between 1 ma and 3 ma is recommended for best long term performance. 4. Operation at current below 5 ma is not recommended. 6
Optical Characteristics (T A = 25 C) Viewing Luminous Peak Dominant Angle Luminous Intensity/ Wavelength Wavelength [1] 2 θ 1/2 [2] Efficacy η v [3] Total Flux Dice λ PEAK (nm) λ D (nm) (Degrees) (lm/w) I v (mcd)/φ v (mlm) Color Part Number Technology Typ. Typ. Typ. Typ. Typ. Red HSMS-A1 GaP 635 626 12 12.45 HSMH-A1 AlGaAs 645 637 12 63.45 HSMC-A1x AlInGaP 635 626 12 15.45 HSMZ-A1 AlInGaP 639 63 12 155.45 Red Orange HSMJ-A1x AlInGaP 621 615 12 24.45 HSMV-A1 AlInGaP 623 617 12 263.45 Orange HSMD-A1 GaP 6 62 12 38.45 HSML-A1x AlInGaP 69 65 12 32.45 Amber HSMY-A1 GaP 583 585 12 52.45 HSMA-A1x AlInGaP 592 59 12 48.45 HSMU-A1 AlInGaP 594 592 12 5.45 Yellow Green HSMG-A1 GaP 565 569 12 59.45 HSME-A1 AlInGaP 575 57 12 56.45 Emerald Green HSMG-A1 GaP 558 56 12 65.45 HSME-A1 AlInGaP 566 56 12 61.45 Green HSMM-A1x InGaN 523 525 12 5.45 Cyan HSMK-A1x InGaN 52 55 12 3.45 Blue HSMB-A1 GaN 428 462 12 65.45 HSMN-A1x InGaN 468 47 12 75.45 Notes: 1. The dominant wavelength, λ D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, I e in watts/steradian, may be calculated from the equation I e = I v /η v, where I v is the luminous intensity in candelas and η v is the luminous efficacy in lumens/watt. Electrical Characteristics (T A = 25 C) Forward Voltage Reverse Voltage Reverse Voltage Thermal V F (Volts) @ I F = 2 ma V R @ 1 µa V R @ 1 µa Resistance Part Number Typ. Max. Min. Min. Rθ JP ( C/W) HSMS/D/Y/G 2.2 2.6 5 18 HSMH 1.9 2.6 5 18 HSMC/J/L/A/E 1.9 2.4 5 28 HSMZ/V/U 2.2 2.6 5 28 HSMB 3.9 4.3 5 28 HSMM/K/N 3.4 4.5 5 28 7
RELATIVE INTENSITY 1..9.8.7.6.5.4.3.2 BLUE CYAN GREEN EMERALD GREEN YELLOW GREEN AMBER ORANGE RED ORANGE RED.1 38 43 48 53 58 63 68 73 78 WAVELENGTH nm RELATIVE INTENSITY 1..8.6.4.2 GaP EMERALD GREEN GaP YELLOW GREEN GaN BLUE GaP YELLOW GaP ORANGE GaP RED FORWARD CURRENT ma 35 3 25 1 5 HSMS/D/Y/G HSMZ/V/U 2 HSMH 15 HSMC/J/L/A/E HSMM/K/N HSMB 38 43 48 53 58 63 68 73 78 WAVELENGTH nm 1 2 3 4 FORWARD VOLTAGE V 5 Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. 1.8 35 54 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 1.6 1.4 1.2 1..8.6.4.2 Gap AlInGaP AlGaAs InGaN GaN 5 1 15 2 25 3 35 CURRENT ma 3 25 2 15 1 5 HSMS/D/G/ Y/U/V/Z HSMC/J/L/A/E HSMM/K/B/N HSMH 2 4 6 8 1 12 DOMINANT WAVELENGTH nm 53 GREEN 52 51 5 CYAN 49 48 47 BLUE 46 5 1 15 2 25 3 35 DC FORWARD CURRENT ma TEMPERATURE C CURRENT ma Figure 3. Relative intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature. Derated based on T J MAX = 11 C, Rθ JA = 5 C/W. Figure 5. Dominant wavelength vs. forward current InGaN devices. 8
.5 1. DELTA V F (NORMALIZED AT 25 C).4.3.2.1 -.1 -.2 -.3-1 GaP/AlGaAs/ AlInGaP InGaN/GaN -5 5 1 15 NORMALIZED INTENSITY.8.6.4.2-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 TEMPERATURE C ANGULAR DISPLACEMENT DEGREES Figure 6. Forward voltage shift vs. temperature. Figure 7. Radiation Pattern. 1 to 3 SEC. TEMPERATURE 2 SEC. MAX. 24 C MAX. 3 C/SEC. MAX. 1-15 C 3 C/SEC. MAX. 12 SEC. MAX. 6-15 SEC. 183 C 6 C/SEC. MAX. TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6-12 SEC. 6 C/SEC. MAX. 1 SEC. MAX. TIME TIME (Acc. to J-STD-2C) Figure 8a. Recommended SnPb reflow soldering profile. Figure 8b. Recommended Pb-free reflow soldering profile. 4.5 1.5 25 TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE 2.6 TEMPERATURE C 2 15 1 5 3 FLUXING PREHEAT BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 1 2 3 4 5 6 7 8 9 1 TIME SECONDS CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 15 C (1 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 39 C AIR KNIFE DISTANCE = 1.91 mm (.25 IN.) AIR KNIFE ANGLE = 4 SOLDER: SN63; FLUX: RMA ; ;; NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. Figure 9. Recommended wave soldering profile. SOLDER RESIST Figure 1. Recommended soldering pad pattern. 9
TRAILER COMPONENT LEADER 2 mm MIN. FOR 18 REEL. 2 mm MIN. FOR 33 REEL. 48 mm MIN. FOR 18 REEL. 96 mm MIN. FOR 33 REEL. C A USER FEED DIRECTION Figure 11. Tape leader and trailer dimensions. 4 ±.1 4 ±.1 2 ±.5 2.29 ±.1 1.75 ±.1 1.5 +.1 C 3.5 ±.5 8 +.3.1 3.81 ±.1 A 3.5 ±.1 1 +.1 8.229 ±.1 Figure 12. Tape dimensions. 1
18 2 +.5 Ø 2.5 ±.3 + 62.5 2.5 Ø 13 ±.2 +1.5 8.4 (MEASURED AT OUTER EDGE). 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (.25 mm) 7.9 (MIN.) 1.9 (MAX.) Figure 13. Reel dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. Baking is required under the following conditions: a) the humidity indicator turns pink b) the pack has been opened for more than four weeks. Baking recommended condition: 6 ± 5 C for 2 hours. This product is qualified as Moisture Sensitive JEDEC Level 2A. 11
Intensity Bin Select (X 5 X 6 ) Individual reel will contain parts from one half bin only. X 5 Min I v Bin X 6 Full Distribution 3 3 half bins starting from X 5 1 4 4 half bins starting from X 5 1 5 5 half bins starting from X 5 1 7 3 half bins starting from X 5 2 8 4 half bins starting from X 5 2 9 5 half bins starting from X 5 2 Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) G1 1.8 2.24 G2 2.24 2.8 H1 2.8 3.55 H2 3.55 4.5 J1 4.5 5.6 J2 5.6 7.2 K1 7.2 9. K2 9. 11.2 L1 11.2 14. L2 14. 18. M1 18. 22.4 M2 22.4 28.5 N1 28.5 35.5 N2 35.5 45. P1 45. 56. P2 56. 71.5 Q1 71.5 9. Q2 9. 112.5 R1 112.5 14. R2 14. 18. S1 18. 224. S2 224. 285. T1 285. 355. T2 355. 45. U1 45. 56. U2 56. 715. V1 715. 9. V2 9. 1125. Tolerance of each bin limit = ± 12%. 12 Color Bin Select (X 7 ) Individual reel will contain parts from one full bin only. X 7 Full Distribution Z A and B only Y B and C only W C and D only V D and E only U E and F only T F and G only S G and H only Q A, B, and C only P B, C, and D only N C, D, and E only M D, E, and F only L E, F, and G only K F, G, and H only 1 A, B, C, and D only 2 E, F, G, and H only 3 B, C, D, and E only 4 C, D, E, and F only 5 A, B, C, D, and E only 6 B, C, D, E, and F only Color Bin Limits Blue Min. (nm) Max. (nm) A 46. 465. B 465. 47. C 47. 475. D 475. 48. Cyan Min. (nm) Max. (nm) A 49. 495. B 495. 5. C 5. 55. D 55. 51. Green Min. (nm) Max. (nm) A 515. 52. B 52. 525. C 525. 53. D 53. 535. Color Bin Limits Emerald Green Min. (nm) Max. (nm) A 552.5 555.5 B 555.5 558.5 C 558.5 561.5 D 561.5 564.5 Yellow Green Min. (nm) Max. (nm) E 564.5 567.5 F 567.5 57.5 G 57.5 573.5 H 573.5 576.5 Amber Min. (nm) Max. (nm) A 582. 584.5 B 584.5 587. C 587. 589.5 D 589.5 592. E 592. 594.5 F 594.5 597. Orange Min. (nm) Max. (nm) A 597. 6. B 6. 63. C 63. 66. D 66. 69. E 69. 612. Red Orange Min. (nm) Max. (nm) A 611. 616. B 616. 62. Red Min. (nm) Max. (nm) Full Distribution Tolerance of each bin limit = ± 1 nm.
Packaging Option (X 8 X 9 ) Option Test Current Package Type Reel Size J1 2 ma Top Mount 7 inch J4 2 ma Top Mount 13 inch H1 2 ma Reverse Mount 7 inch H4 2 ma Reverse Mount 13 inch J2 1 ma Top Mount 7 inch J5 1 ma Top Mount 13 inch H2 1 ma Reverse Mount 7 inch H5 1 ma Reverse Mount 13 inch www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (8) 235-312 or (916) 788-6763 Europe: +49 () 6441 9246 China: 18 65 17 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 12-61-128 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 244 Taiwan: (+65) 6755 1843 Data subject to change. Copyright 24-25 Agilent Technologies, Inc. Obsoletes 5989-31EN October 31, 25 5989-4186EN