ASM-PxB9-Txxxx Envisium TM Power PL-4 Surface Mount LED Data Sheet Envisium TM Envisium TM is the premier class of mid-power LEDs using TS AlInGaP chip technology. Envisium TM LEDs offer unparalleled performance, engineering and design flexibility. Description The Envisium TM Power PL-4 SMT LED is an extension of Avago s PL-4 SMT LEDs. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the conventional PL-2 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the conventional PL-4 SMT LEDs. The Envisium TM Power PL-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. These LEDs are compatible with the IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. The Envisium TM Power PL-4 SMT LED is available in 3 colors, red, red-orange and amber. Features Industry standard PL-4 (Plastic Leaded hip arrier) High reliability LED package High brightness with optimum flux performance using TS AlInGaP dice technologies Available in Red, Red Orange and Amber colors High optical efficiency Higher ambient temperature at the same current possible compared to PL-2 Super wide viewing angle at 12 Available in 8 mm carrier tape on 7-inch reel ompatible with both IR and TTW soldering process Applications Interior automotive Instrument panel backlighting entral console backlighting Navigation and audio system Push button backlighting Exterior automotive Turn signals Side repeaters HMSL Rear combination lamp Puddle light Electronic signs and signals hannel lettering ontour lighting Indoor variable message sign Office automation, home appliances, industrial equipment Front panel backlighting Push button backlighting Display backlighting
Package Dimensions 2.8 ±.2 1.9 ±.2 2.2 ±.2.1 TYP..8 ±.1 A 3.2 ±.2 3.5 ±.2.8 ±.3 ATHODE MARKING.7 ±.1.5 ±.1 NOTE: ALL DIMENSIONS IN mm. Table 1. Device Selection Guide (T J = 25 ) olor Part Number Intensity Bin Min. IV (mcd) Test urrent (ma) Dice Technology Red ASM-PRB9-TV5 V1 715. 5 AlInGaP V2 9. W1 1125. Red Orange ASM-PHB9-TW5 W1 1125. 5 AlInGaP W2 14. X1 18. Amber ASM-PAB9-TV5 V1 715. 5 AlInGaP V2 9. W1 1125. Notes 1. The luminous intensity, I V, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. F V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 3. Tolerance = ±12% 2
Part Numbering System ASM - PX 1 B9 - TX 2 X 3 X 4 X 5 Packaging Option olor Bin Selection Intensity Bin Limit Intensity Bin Selection LED hip olor Absolute Maximum Ratings (T A = 25 ) Parameters ASM-PxB9-Txxxx D Forward urrent [1] 7 ma [3,4] Peak Forward urrent [2] Power Dissipation Reverse Voltage 2 ma 24 mw 5 V Junction Temperature 125 Operating Temperature Storage Temperature -4 to +1-4 to +1 Notes: 1. Derate linearly as shown in figure 4. 2. Duty factor = 1%, Frequency = 1 khz. 3. Drive current between 1 ma and 7 ma is recommended for best long-term performance. 4. Operation at currents below 5 ma is not recommended. Optical haracteristics (T J = 25 ) Luminous Intensity/ Peak Dominant Viewing Luminous Total Flux Wavelength Wavelength Angle 2q 1 / [2] 2 Efficacy h [3] V I V (mcd)/ Dice l PEAK (nm) l [1] D (nm) (Degrees) (lm/w) F [4] V (lm) olor Part Number Technology Typ. Typ. Typ. Typ. Typ. Red ASM-PRB9-Txxx5 AlInGaP 639. 63. 12 155.3 Red Orange ASM-PHB9-Txxx5 AlInGaP 623. 617. 12 263.29 Amber ASM-PAB9-Txxx5 AlInGaP 594. 592. 12 5.26 Notes: 1. The dominant wavelength, l D, is derived from the IE hromaticity Diagram and represents the color of the device. 2. q 1 / 2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = I V /h V, where I V is the luminous intensity in candelas and h V is the luminous efficacy in lumens/watt. 4. F V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. Electrical haracteristics (T J = 25 ) Forward Voltage V F (Volts) @ I F = 5 ma Reverse Voltage V R @ 1 µa Part Number Typ. Max. Min. ASM-PxB9-Txxx5 2.8 3.4 5 3
RELATIVE INTENSITY 1. RED ORANGE.9 AMBER.8 RED.7.6.5.4.3.2.1 38 43 48 53 58 63 68 73 78 WAVELENGTH nm Figure 1. Relative intensity vs. wavelength FORWARD URRENT ma 8 7 6 5 4 3 2 1 1 2 FORWARD VOLTAGE V Figure 2. Forward current vs. forward voltage 3 4 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 ma) 1.4 1.2 1..8.6.4.2 5 1 15 2 25 3 35 4 45 5 55 6 65 7 D FORWARD URRENT ma 75 MAXIMUM FORWARD URRENT ma 8 7 6 5 4 3 2 1 2 4 6 8 1 12 AMBIENT TEMPERATURE Figure 3. Relative intensity vs. forward current Figure 4. Maximum forward current vs. ambient temperature. Derated based on T J MAX = 125, Rq JA = 3 /W RELATIVE INTENSITY 1..9.8.7.6.5.4.3.2.1-9 -7-5 -3-1 1 3 5 7 9 ANGLE DEGREES Figure 5. Radiation pattern 4
TEMPERATURE 2 SE. MAX. 24 MAX. 3 /SE. MAX. 1-15 3 /SE. MAX. 183 6 /SE. MAX. TEMPERATURE 217 255 3 /SE. MAX. 125 ± 25 MAX. 12 SE. +5-1 to 2 SE. 6 /SE. MAX. 6 to 15 SE. 12 SE. MAX. 6-15 SE. TIME Figure 6a. Recommended Sn-Pb reflow soldering profile TIME * THE TIME FROM 25 TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 6b. Recommended Pb-free reflow soldering profile For detailed information on reflow soldering of Avago surface mount LEDs, refer to Avago Application Note AN 16, Surface Mounting SMT LED Indicator omponents. TEMPERATURE 25 2 15 1 5 3 FLUXING TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF P BOARD TOP SIDE OF P BOARD ONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 15 (1 PB) SOLDER WAVE TEMPERATURE = 245 AIR KNIFE AIR TEMPERATURE = 39 AIR KNIFE DISTANE = 1.91 mm (.25 IN.) AIR KNIFE ANGLE = 4 SOLDER: SN63; FLUX: RMA PREHEAT NOTE: ALLOW FOR BOARDS TO BE SUFFIIENTLY OOLED BEFORE EXERTING MEHANIAL FORE. 1 2 3 4 5 6 7 8 9 1 TIME SEONDS Figure 7. Recommended wave soldering profile 5
2.6 (.13) X X.4 (.16) 1.1 (.43).5 (.2) Y 4.5 (.178) 1.5 (.59) Y DIMENSIONS IN mm (INHES). Figure 8. Recommended soldering pad pattern SOLDER RESIST REPRESENTS ELETRIAL ONNETIVITY BETWEEN PADS TRAILER OMPONENT LEADER 2 mm MIN. FOR 18 REEL. 2 mm MIN. FOR 33 REEL. 48 mm MIN. FOR 18 REEL. 96 mm MIN. FOR 33 REEL. A USER FEED DIRETION Figure 9. Tape leader and trailer dimensions 6
Ø1.5 +.1 4 ±.1 4 ±.1 2 ±.5 1.75 ±.1 2.29 ±.1 3.5 ±.5 8 +.3.1 3.8 ±.1 3.5 ±.1 Ø1 +.1.229 ±.1 A 8 ALL DIMENSIONS IN mm. Figure 1. Tape dimensions USER FEED DIRETION ATHODE SIDE PRINTED LABEL Figure 11. Reeling orientation 7
Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-2. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN535 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use Unopen moisture barrier bag (MBB) can be stored at <4 /9%RH for 12 months. If the actual shelf life has exceeded 12 months and the HI indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. It is not recommended to open the MBB prior to assembly (e.g., for IQ). B. ontrol after opening the MBB The humidity indicator card (HI) shall be read immediately upon opening of MBB. The LEDs must be kept at <3 /6%RH at all times and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours.. ontrol for unfinished reel For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. ontrol of assembled boards If the PB soldered with the LEDs is to be subjected to other high temperature processes, the PB needs to be stored in sealed MBB with desiccant or desiccator at <5% RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: 1% is Not blue and 5% HI indicator turns pink. The LEDs are exposed to condition of >3 /6% RH at any time. The LEDs floor life exceeded 672 hours. Recommended baking condition: 6 ± 5 for 2 hours. 8
Intensity Bin Select (X 2 X 3 ) Individual reel will contain parts from one half bin only X 2 X 3 Min I V Bin Full Distribution 2 2 half bins starting from X 2 1 3 3 half bins starting from X 2 1 4 4 half bins starting from X 2 1 5 5 half bins starting from X 2 1 6 2 half bins starting from X 2 2 7 3 half bins starting from X 2 2 8 4 half bins starting from X 2 2 9 5 half bins starting from X 2 2 Intensity Bin Limits & Typical Flux Bin ID Min. (mcd) Max. (mcd) V1 715. 9. V2 9. 1125. W1 1125. 14. W2 14. 18. X1 18. 224. X2 224. 285. Tolerance of each bin limit = ±12% olor Bin Select (X 4 ) Individual reel will contain parts from one full bin only. X 4 Full Distribution A B D E G H J K M N P R S 1 and 2 only 2 and 3 only 3 and 4 only 4 and 5 only 5 and 6 only 1, 2 and 3 only 2, 3 and 4 only 3, 4 and 5 only 4, 5 and 6 only 1, 2, 3 and 4 only 2, 3, 4 and 5 only 3, 4, 5 and 6 only 1, 2, 3, 4, and 5 only 2, 3, 4, 5 and 6 only Packaging Option (X 5 ) olor Bin Limits Amber/ Yellow Min. (nm) Max. (nm) 1 582. 584.5 2 584.5 587. 3 587. 589.5 4 589.5 592. 5 592. 594.5 6 594.5 597. Red Orange Min. (nm) Max. (nm) 1 611. 616. 2 616. 62. Red Min. (nm) Max. (nm) Full Distribution Tolerance of each bin limit = ± 1 nm. Option Test urrent Package Type Reel Size 5 5 ma Top Mount 7 inch Forward Voltage Bin Table For ASM-PXB9-Txxxx only Bin Min. Max. VA 1.9 2.2 VB 2.2 2.5 V 2.5 2.8 VD 2.8 3.1 VE 3.1 3.4 Tolerance of each bin limit = ±.5. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. opyright 25-215 Avago Technologies. All rights reserved. Obsoletes 5989-396EN AV2-495EN - July 16, 215