CMOS linear image sensor

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Digital output, built-in 8/10-bit A/D converter, single power supply operation The is a CMOS linear image sensor designed for image input applications. The signal processing circuit has a charge amplifier with excellent input/output characteristics. The circuit also includes a 8-bit/10-bit A/D converter. Features Applications Pixel pitch: 14 μm Pixel height: 50 μm 1024 pixels Single power supply operation: 3.3 to 5 V On-chip charge amplifier with excellent input/output characteristics Built-in timing generator allows operation with only start and clock pulse inputs. Video data rate: 1 MHz max. Spectral response range: 400 to 1000 nm Digital output 8-bit/10-bit switchable ADC Simultaneous all-pixel integration and variable integration time function Low power consumption Analytical instruments Position detection Image reading Structure Parameter Specification Unit Number of pixels 1024 - Pixel pitch 14 μm Pixel height 50 μm Photosensitive area length 14.336 mm Package LCP (liquid crystal polymer) - Window material Tempax - Absolute maximum ratings Parameter Symbol Condition Value Unit Supply voltage Vdd Ta=25 C -0.3 to +6 V A/D mode selection voltage Vsel Ta=25 C -0.3 to +6 V Clock pulse voltage V() Ta=25 C -0.3 to +6 V Start pulse voltage V() Ta=25 C -0.3 to +6 V Operating temperature* 1 Topr -5 to +50 C Storage temperature* 1 Tstg -10 to +60 C *1: No condensation Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. www.hamamatsu.com 1

Recommended terminal voltage Parameter Symbol Min. Typ. Max. Unit Supply voltage Vdd 3.3 5 5.25 V AD mode selection voltage 8-bit 0-0.4 V Vsel 10-bit Vdd - 0.25 Vdd Vdd + 0.25 V Clock pulse voltage High level Vdd - 0.25 Vdd Vdd + 0.25 V V() Low level 0-0.4 V Start pulse voltage High level Vdd - 0.25 Vdd Vdd + 0.25 V V() Low level 0-0.4 V Electrical characteristics (Ta=25 C) Parameter Symbol Min. Typ. Max. Unit 8-bit 1 M - 12 M Clock pulse frequency f() Hz 10-bit 1 M - 6 M Video data rate VR - f()/12 - Hz CL=10 pf*2 - - 30 Digital output rise time (10 to 90%) tr ns CL=30 pf* 2 - - 60 CL=10 pf* 2 - - 30 Digital output fall time (90 to 10%) tf ns CL=30 pf* 2 - - 60 3-12 - Current 10-bit* 4-10 - l ma consumoption 3-16 - 10-bit* 4-14 - *2: CL=Load capacitance of digital output terminal *3: f()=12 MHz *4: f()=6 MHz Electrical and optical characteristics (Ta=25 C) Parameter Symbol Min. Typ. Max. Unit Spectral response range λ 400 to 1000 nm Peak sensitivity wavelength λp - 700 - nm Photosensitivity* 5 R - 30 - V/lx s Dark output* 6-0.04 0.6 10-bit* 8-0.16 2.4 Dd - 0.03 0.6 10-bit* 8-0.12 2.4 digit 7 255 - - Saturation output* 9 10-bit* 8 1023 - - Dsat 255 - - 10-bit* 8 1023 - - digit Readout noise - 0.7 2 10-bit* 8-2.8 8 Nr - 0.7 2 10-bit* 8-2.8 8 digit Offset output 11 29 41 10-bit* 8 44 116 164 Do 7 19 27 10-bit* 8 28 76 108 digit Photoresponse nonuniformity* 5 * 10 PRNU - - ±10 % *5: Measured with a tungsten lamp of 2856 K *6: Integration time Ts=10 s *7: f()=12 MHz *8: f()=6 MHz *9: Absolute value with respect to 0 digit *10: Photoresponse nonuniformity (PRNU) is the output nonuniformity that occurs when the entire photosensitive area is uniformly illuminated by light which is 50% of the saturation exposure level. PRNU is measured using 1022 pixels excluding the pixels at both ends, and is defined as follows: PRNU= ΔX/X 100 (%) X: average output of all pixels, ΔX: difference between X and maximum or minimum output 2

Spectral response (typical example) 100 (Ta=25 C) 80 Relative sensitivity (%) 60 40 20 0 400 600 800 1000 1200 Wavelength (nm) KMPDB0266EB A/D converter specifications (Ta=25 C) Parameter Symbol Specification Unit Digital output format - Serial output - Resolution* 11 8-bit mode 8 RESO 10-bit mode 10 bit Conversion voltage range* 12 0 to 2.2-0 to 3.3 V *11: Vsel=0 V (8-bit mode), Vdd (10-bit mode) *12: Digital output is available from MSB as serial output. 8-bit mode: D7 to D0 10-bit mode: D9 to D0 3

Timing Chart tf() tr() tf() tlp() tr() thp() KMPDC0224EB Parameter Symbol Min. Typ. Max. Unit Start pulse interval 12339/f() - 120000/f() s Start pulse low period tlp() 45/f() - - s Start pulse high period* 13 thp() 6000/f() - - s Start pulse rise and fall times tr(), tf() 0 20 30 ns Clock pulse duty - 40 50 60 % Clock pulse rise and fall times tr(), tf() 0 20 30 ns *13: Signal charge integration time equals the high period of start pulse + 7 cycles. The shift register operation starts at the fall of pulse immediately after pulse sets to low. Integration time can be changed by changing the high-to-low ratio of pulses. 4

8-bit mode In the neighborhood of start pixel 012345 10 15 20 25 tlp() 30 35 40 45 50 55 thp() EOS AO Trig(A) 7 22 AO1 21 34 AO2 33 46 AO3 AO4 45 57 DO Trig(D) EOC D7 34 D0 42 D7 46 D0 54 DO1 DO2 34.5 41.5 46.5 53.5 33 45 57 In the neighborhood of last pixel thp() EOS AO Trig(A) 12286 AO1023 12285 12298 AO1024 12297 12322 DO Trig(D) EOC D0 D7 D0 D7 D0 D7 D0 12282 12286 12294 12298 12306 12310 12318 DO1022 DO1023 DO1024 12281.5 12286.5 12293.5 12298.5 12305.5 12310.5 12317.5 12285 12297 12309 12320 KMPDC0225EB Note: When using analog output AO, read the AO output at the falling edge of Trig(A). When using digital output DO, read the DO output at the falling edge of Trig(D). 5

10-bit mode In the neighborhood of start pixel 012345 10 15 20 25 tlp() 30 35 40 45 50 55 thp() EOS AO Trig(A) 7 22 AO1 21 34 AO2 33 46 AO3 AO4 45 57 DO Trig(D) EOC D9 D0 D9 D0 34 44 46 56 DO1 DO2 34.5 43.5 46.5 55.5 33 45 57 In the neighborhood of last pixel EOS AO Trig(A) thp() 12286 12298 AO1023 AO1024 12285 12297 12322 DO Trig(D) EOC D0 D9 D0 D9 D0 D9 D0 12284 12286 12296 12298 1230812310 12320 DO1022 DO1023 DO1024 12283.5 12286.5 12295.5 12298.5 12307.5 12310.5 12319.5 12285 12297 12309 12320 KMPDC0226EB 6

Dimensional outline (unit: mm) Photosensitive area 14.336 7.168 ± 0.3 Photosensitive surface 1.35 ± 0.2* 1 1.4 ± 0.2* 2 24 a 13 9.1 ± 0.1 10.02 ± 0.3 0.2 10.2 ± 0.5 4.23 ± 0.4 Photosensitive area 50 µm 1 1 ch a 41.6 ± 0.2 Direction of scan 12 0.5 ± 0.05* 3 a-a cross section 3.0 Tolerance unless otherwise noted: ±0.1 *1: Distance from window upper surface to photosensitive surface *2: Distance from package bottom to photosensitive surface *3: Glass thickness 4.0 ± 0.5 2.54 0.51 27.94 6.83 ± 0.2 KMPDA0202EE Pin connections Pin no. Symbol I/O Discription Pin no. Symbol I/O Discription 1 NC No connection 13 NC No connection 2 D.Trig O Trigger signal for digital output 14 NC No connection 3 DO O Digital output 15 NC No connection 4 A.Trig O Trigger signal for analog output 16 EOS O End of scan signal 5 AO O Analog output 17 EOC O Digital conversion end signal 6 NC No connection 18 NC No connection 7 NC No connection 19 Vsel I A/D mode selection voltage 8 Vdd I Supply voltage 20 Vss I GND 9 Vss I GND 21 Vdd I Supply voltage 10 NC No connection 22 I Clock signal 11 NC No connection 23 I Start signal 12 NC No connection 24 NC No connection Note: Leave the NC terminals open and do not connect them to GND. When using the analog output terminal, connect a buffer amplifier for impedance conversion to it so as to minimize the current flow. As the buffer amplifier, use a high input impedance operational amplifier with JFET or CMOS input. 7

Precautions (1) Electrostatic countermeasures This device has a built-in protection circuit against static electrical charges. However, to prevent destroying the device with electrostatic charges, take countermeasures such as grounding yourself, the workbench and tools to prevent static discharges. Also protect this device from surge voltages which might be caused by peripheral equipment. (2) Incident window If dust or dirt gets on the light incident window, it will show up as black blemishes on the image. When cleaning, avoid rubbing the window surface with dry cloth or dry cotton swab, since doing so may generate static electricity. Use soft cloth, paper or a cotton swab moistened with alcohol to wipe dust and dirt off the window surface. Then blow compressed air onto the window surface so that no spot or stain remains. (3) Soldering To prevent damaging the device during soldering, take precautions to prevent excessive soldering temperatures and times. Soldering should be performed within 5 seconds at a soldering temperature below 260 C. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions Notice Image sensors/precautions Information described in this material is current as of July, 2013. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. Type numbers of products listed in the delivery specification sheets or supplied as samples may have a suffix "(X)" which means preliminary specifications or a suffix "(Z)" which means developmental specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184 U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8 France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777 North Europe: Hamamatsu Photonics Norden AB: Thorshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01 Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1 int. 6, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741 China: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866 8 Cat. No. KMPD1088E07 Jul. 2013 DN