The Status of the ATLAS Inner Detector Introduction Hans-Günther Moser for the ATLAS Collaboration Outline Tracking in ATLAS ATLAS ID Pixel detector Silicon Tracker Transition Radiation Tracker System Aspects Schedule Conclusions 1
Requirements for Tracking in ATLAS Rapidity coverage: η < 2.5 Momentum resolution for isolated leptons: Track reconstruction efficiency (high-p T ) Ghost tracks < 1% (for isolated tracks) Impact parameter resolution: σ r-φ = (11 + 2 60/ p T ) µm, σ z = (70 + 2 100/ p T ) µm, Low material budget Lifetime > 10 LHC years σp T / p T ~0.1 p T (TeV) > 95%, (isolated tracks) > 90%, (in jets) Occupancy: 700 tracks per high luminosity event inside acceptance Short bunch crossing time (25 ns) High radiation: up to 10 14 neutrons/cm 2 /year (1 MeV equivalent) 2
ATLAS and ATLAS Inner Detector ID length: 7 m ID diameter: 2m 3
The ATLAS Inner Detector Three subdetectors using different technologies to match the requirements of granularity and radiation tolerance Sub- Detector r(cm) element size resolution hits/track channels Pixel 5-12.5 50µm x400µm 12µm x 60µm 3 93x10 6 (Silicon) (3D) SCT 30-52 80µm x 12cm 16µm x 580µm 4 6x10 6 (Silicon Strip) (stereo) TRT 56-107 4 mm x 74cm 170µm 36 0.4x10 6 (Straw Tubes) (projective) 4
Pixel Detector Layout 3 barrel cylinders 2 x 3 endcap disks Insertable layout -> can be inserted after installation of SCT/TRD -> easy upgrade Only the support tube needs to be installed beforehand Decouples SCT/TRT and Pixel schedule Last subdetector to be installed! 5
Pixel Modules Each Module (16.4 x 60.8 mm 2 ) has one sensor with 46080 pixels 16 frontend chips are bump-bonded on the sensor for readout 3 barrel layers need 1744 modules 2x3 endcaps 288 modules Sensors are in production: CiS (Germany): 600 produced, 400 in production Tesla (Czech Republic): 50 produced, full series to start 6
Pixel Electronics FE readout chip in Deep Submicron (DSM) technology (DMILL failed) First prototype batches basically working, however, some fixes necessary Production yield >90%! MCCI2 (module control) New version with triple logic for SEU (single event upset) tolerance Final production expected to be ready by now 7
Pixel Support High precision/low mass objects Support tube in production (needs to be ready first!) Global support ready Local supports (staves and sectors) in production A bit late, but not critical 8
Test Beam Results before after Resolution: 13.2 µm after irradiation Efficiency: 99.3% before irrad. 97.7% (60 Mrad) Operation of 6 modules in parallel with one power supply/cable: No change of performance 9
SCT Layout Four barrel layers -barrel radii: 300, 371, 443 and 514 mm; -length 1600 mm -in total 2112 modules Forward Modules on 2x9 disks -disk distance from z = 0: 835-2788 mm, -radii: 259-560 mm -total of 1976 modules (3 rings: 40,40, 52 modules each) 10
Basic Concept (Endcap) SCT Modules -4 Si-strip detectors in 2 planes (40 mrad stereo) strip direction -Mechanical carrier made from Thermal Pyrolytic Graphite (C k >1700 W/m/ K) and AlN -Flex Hybrid (Kapton) on carbon substrate with ASIC readout electronics -Glas pitch adaptors for mechanical/electrical connection detector-electronics (heat barrier) strip direction 11
SCT Silicon Detectors Radiation tolerant up to 3x10 p/cm 2 p-on-n n single sided detectors 285 micron 2-82 kohm 4 substrate Barrel: 64x64 mm 2 Forward: wedge shaped (5 shapes) 768 readout strips with ca 80 µm m pitch No intermediate strips AC coupled strips Polysilicon or implanted bias resistors Multiguardring structure to ensure stability up to 500 V Ca. 20000 needed Produced by Hamama matsu and CIS (competed, excellent quality) 12
Detectors: Radiation Hardness After irradiation: high depletion voltage Short period (10 days): annealing reduces V dep Afterwards V dep rises steadily with time (at high temperatures): Reverse annealing -> keep Si cool (-10 C) Problems in very exposed regions close to the beam or high η Reduced thickness: 285 -> 260 µm ca. 50V Oxigenated detectors: less damage and slower reverse annealing 13
SCT Electronics ABCD 128 channels bipolar frontend DMILL rad hard process Shaping time: 20ns Binary Readout (single threshold) 132 cell pipeline Production finished Low yield, need to use chips with one dead channel to complete detector (ca. 15%) 14
Barrel Modules Module Production Endcap Modules Production running at 4 locations Ca. 500 modules produced & tested Production at 7 locations Commissioning of production sites Start in October 15
Engineering Carbon cylinders for barrel support are ready Need to be equipped with services 4 of the 18 carbon disks for the endcap module support are produced Need to be equipped with services Again, high precision/low mass objects Disk flat to +- 60 µm over 2 m! 16
Testbeam Results 17
Testbeam Results Nominal specifications (after irradiation): >99% efficiency < 5x10-4 occupancy (readout bandwidth limit) @ 1 fc threshold Ok for barrel modules Endcap modules have slightly higher noise. Still possible to meet the specs tuning the threshold 18
TRT Layout Straws Radiator Barrel: axial straws, foil radiator Endcap: radial straws, foam radiator Radiator Tracking: up to 36 points with σ=170 µm improves pattern recognition, equivalent to a single point with 50 µm precision Transition radiation: e/π ~ 100 Straws 19
TRT Modules Barrel Module Production completed, being tested Endcap Module production was delayed due to problems with the front-end boards ( WEBs ), should be completed in May 2005 (still on critical path) 20
Original gas mixture: Xe(70%) CF 4 (20%) CO 2 (10%) TRT Gas Mixture However, CF 4 radicals destroyed glass wire joints (discovered in 2001, after >20% produced) 1. Use polyimide/epoxy joint... Too late 2. Change gas mixture: Xe(70%) CO 2 (27%) O 2 (3%) acceptable operation stability equivalent physics performance (but slower) Requires periodical wire cleaning with Ar/CO 2 /CF 4 to remove Si deposit, if found (demonstrated) 21 Drift-tim e accuracy, m Efficiency, % 150 140 130 120 110 100 90 85 80 75 70 65 60 55 50 45 Old Drift-time accuracy 0 5 10 15 20 Counting rate, MHz Old New 40 0 5 10 15 20 Counting rate, MHz New Efficiency
Inner Detector: System Aspects Cooling Gas system Services Structure/Supports Integration Installation e.g. patch panel to connect electrical & optical and cooling services 22
Cooling PIXEL SCT TRT Total electronics INSIDE ID VOLUME cables Thermal enclosure OUTSIDE ID VOLUME cables 12.5 kw 3 kw 1.3 kw 11 kw 39 kw 3.6 kw 6 kw 20 kw 46 kw 1 kw - 6 kw 96.5 kw 7.6 kw 7.3 kw 37 kw from PR to BPR Warm monophase to DCS to interlock and DCS Evaporative system Using C 3 F 8 ( 30 ) Heating structures Heat exchanger Filter Heater Temperature sensors on return tube Temperature sensors on modules Temperature sensor on return tube for heater control Safety temperature sensor on heating element to Heater control and power supply 23
Assembly and integration Test area Assembly area Control room A dedicated facility for ID assembly and integration is set up close to the ATLAS pit. Assembly of SCT barrel, tests of SCT endcaps, TRT assembly SCT/TRT integration and testing Pixel Detector assembly 24
Expected Performance X 0 Material in ID changed compared to initial ( TDR ) layout (increased, of course) -increased pixel sensor thickness -More realistic engineering and services Radius of inner pixel layer 4.3cm -> 5cm Some impact on momentum and impact parameter resolution Barrel Region 25
Staged Items However, because of funding and schedule problems the initial detector will not have: Middle pixel layer, at R=9 cm, Middle pixel disks, at z = +/- 58 cm TRT C wheels, at IηI > 1.7 x x x 26
Consequences Impact on: Missing pixel layers -> worse impact parameter resolution -> reduced b-tagging performance Missing TRT C-wheels -> worse momentum resolution at IηI > 1.7 27
Schedule Start assembly in SR building: April 04 SCT barrel ready: January 05 SCT endcap C ready April 05 SCT endcap A ready August 05 TRT barrel ready January 05 TRT endcap C ready October 04 TRT endcap A ready September 05 ID barrel ready for installation in ATLAS July 05 ID endcap C ready for installation November 05 ID endcap A ready for installation March 06 Staged items: 3rd pixel layer August 06 TRT C wheels July 06 28
Conclusions Most of the technical problems are resolved Production of detector modules and structures has started Preparations for detector integration started Main worry is the tight schedule and fighting delays We are confident to be ready for physics in 2007 H.-G. Moser, Max-Planck-Institut für Physik, Munich Beauty03, October 2003 29