High Performance Dynamic Hybrid Flip-Flop For Pipeline Stages with Methodical Implanted Logic

High Performance Dynamic Hybrid Flip-Flop For Pipeline Stages with Methodical Implanted Logic K.Vajida Tabasum, K.Chandra Shekhar Abstract-In this paper we introduce a new high performance dynamic hybrid flip-flop (DHFF) for pipeline stages and a new implanted logic module (DHFF-ILM). These proposed designs satisfy the low power and reduced pipeline overhead requirements. The DHFF presents less power dissipation since the node at the output which drives the output transistors is splits by which the pre-charge capacitance gets reduce. The major factor for power dissipation in flip-flops is pre-charge capacitance. So by reducing the pre-charge capacitance power dissipation is reduced in DHFF. The DHFF-ILM offers to incorporate Complex logic functions. The aim of this DHFF-ILM is to reduce the pipeline overhead in modern deep pipelined architectures. The performance comparisons made in micro-wind tool show power reduction of 30% compared to the XCFF. Index Terms- Implanted Logic, flip-flops, high performance, less power dissipation, reduced pipeline overhead. I. INTRODUCTION Low power consumption has become a highly important design concern in VLSI era and will become more and more important as we move to all pipeline architecture design. Most of the current designs are synchronous which implies that flip-flops and latches are involved in one way or another in the data and control paths. One of the challenges of low power methodologies for synchronous systems is the power consumption of these flip-flops and latches. It is important to save power in these flip-flops and latches without compromising state integrity or performance. So the extensive work has being done to improve the performance of flip-flops in past few decades. Basically the flip-flops are categorized as static flip-flop, dynamic flip-flops and semi-static flip-flops. Dynamic flip-flops and semi-static flip-flops are the high performance flip-flops. The dynamic flip-flops store the logic value at the gate capacitance of transistors instead of at the output node as in static flip-flops. The performance of static flip-flops is superior in terms of power consumption and glitch reduction to dynamic circuits when the fan-in is small. Manuscript Received July, 2014; K. Vajida Tabasum is with the Sri Sai Institute of Technology and Science, Rayachoty-516269, India. K. Chandra Shekhar is with the department of Electronics and Communication Engineering, Sri Sai Institute of Technology and Science, Rayachoty-516269, India. The semi dynamic flip-flops are also known as hybrid flip-flops. They contain the hybrid architecture that combines the advantages of both static and dynamic flip-flops. The semi dynamic flip-flops offer the reduced power, area and delay. The semi dynamic flip-flops allow incorporating the complex logic functions efficiently since it has only one transistor that is driven by the data input. This will helps in reducing the pipeline overhead in the synchronous systems. Several semi dynamic flip-flops have been proposed in the past few decades aiming at reduction of pipeline overhead, area and delay. A recent paper presents a flip-flop named Cross Charged Control Flip-flop (XCFF). XCFF works based on the principle of split dynamic node. XCFF has more advantages over the static and dynamic flip-flops. It occupies less area since makes use of 21 no. of transistors. XCFF presents less power consumption as pre-charge capacitance is reduced by splitting the dynamic node at the output which drives the output transistors. Although XCFF presents reduced area and less power dissipation it has drawbacks such as unwanted power dissipation when input data does not changes for more than one clock cycle and large hold time requirements which causes the increase in delay. XCFF does not allow to incorporate logic functions although it has single transistor driving by the input data because when the logic in implanted in XCFF it is more susceptible to charge sharing at the dynamic nodes. The aim of the proposed DHFF is to overcome the drawbacks of the XCFF such as redundant power dissipation and charge sharing problem. DHFF-ILM presents the area, power and speed efficient architecture to reduce the pipeline overhead. The performances of the existing flip-flops are compared with that of the DHFF in the micro wind tool. It shows the 30% of reduction in power dissipation. The proposed DHFF-ILM has power reduction of 27% compared to the SDFF with logic module. The rest of this paper is divided as described below: Section II describes the existing flip-flop architectures and describes the disadvantages of these existing flip-flops architectures. In Section III, the proposed DHFF architecture and its working operation is illustrated. In Section IV, describes architecture of the DHFF-ILM and its working operation. In Section V, we describe the performance comparisons of proposed flip-flops with the existing flip-flop architectures 914

Figure 1: Power PC 603 Flip- flop Figure 3: Semi dynamic Flip-flop Figure 2: Hybrid Latch Flip-flop II. ANALYSIS OF EXISTING FLIP-FLOP ARCHITECTURES Many no. of flip-flops and latches have been published in the past few decades. All these flip-flops are categorized as static flipflops, dynamic flip-flops and semi static flip-flops. Static flip-flops works based on the principle of charge regeneration. The logic value in static flip-flops gets stored at the output node. Static flip-flops are preferable only when the power is concerned because they occupy more area and also the delay is more. In synchronous systems, total delay associated with the latches or flip-flops is concerned as D-Q delay. D-Q delay is the sum of CLK-Q delay and setup time of the flip-flop. Static designs are more susceptible to large D-Q delay because of the positive setup time. Some of the high performance static flip-flop designs are Transmission gate based static flip-flop, Master-slave based flip-flop, Power PC 603.Transmission gate based static flip-flop occupies less area but the logic level at the output gets degraded. In this transmission gate static flip-flop logic level can be recovered by using the weak inverter at the output. One of the main drawbacks of transmission gate static flip-flop is the high capacitive load presented to the CLK signal. CLK load is much important since it affects the power dissipation. One approach to reduce CLK load is to make the ratioed. The next static flip-flop to be discuss is Power PC 603 flip-flop shown in fig1. Power PC 603 flip-flop is one of the fastest classical structures. Its main advantage is the short direct path and the low power feedback. It has poor data to output latency since it has the positive setup time and also it is very much affective to the clock signal slopes and data feed through. All these drawbacks make the Power PC 603 weak in performance. In spite of all these drawbacks it is consider as low power solution when the speed is not considered. Coming to the second category of flip-flops, dynamic flipflops are the high performance flip-flops designed to overcome the drawbacks of static designs such as area and speed. Dynamic flip-flops store the logic value at the gate capacitance of the transistor. They occupy less area when compared to the static flip-flops. The speed of operation of the dynamic flip-flops is better when compared to the static flip-flops. Even though the dynamic flip-flops are faster and smaller when compared to the static flip-flops they have some drawbacks such as generally, dynamic flip-flops operate in two phases 1. Pre-charge phase and evaluation phase, during the evaluation phase changes in the input data makes the flip-flop more susceptible to charge sharing problem. In dynamic flip-flops during some time period output node is connected to neither to ground nor to supply which makes the design affective to noise. Some of the mostly used dynamic flip-flops are clocked CMOS (C 2 MOS) flip-flop, True Single Phase Clock (TSPC) flip-flop. C 2 MOS shown in Fig. 4 presents the good low power features such as clock load and low power feedback. Races are just not possible since the overlaps activate either the pull-up or the pull-down networks but never both simultaneously. This is not hard to meet in practical designs, making C 2 MOS especially attractive in high speed designs where avoiding clock overlap is hard. When we consider the two phase clocking schemes in the Clocked CMOS flip-flop care must be taken in rout6ing the clock signals ensuring the non over-lapping of clock signals. The TSPC flip-flop proposed by Yuan and Svensson uses a single clock without any inverted clock as shown in Fig.5. The main advantage of the TSPC is the use of single phase clock. The disadvantage is slight increment in usage of no. of transistors when compared with the C 2 MOS.TSPC offers an additional advantage: the possibility of embedding logic functionality into the flip-flop. 915

Figure 4: Clocked CMOS Flip-flop. Figure 6: Conditional Data Mapping Flip-flop Figure 5: True Single Phase Clock flip-flop The final category of flip-flops is Semi dynamic flip-flops. Semi-dynamic flip-flops present the advantages of both static flip-flops and dynamic flip-flops. It compromises of dynamic frontend structure and static output structure. The most commonly used semi-dynamic flip-flops are SDFF (Semi Dynamic Flip-Flop) and HLFF (Hybrid Logic Flip-Flop). SDFF is fastest classical flip-flop architecture as shown in fig.3. Although the SDFF is fastest it consumes more power because of the large clock load and large pre-charge capacitance. Next is the HLFF as shown in Fig.2. HLFF is not fastest when compared to the SDFF but it presents low power dissipation. One of most important advantage of the SDFF is it allows to incorporate logic module within the flip-flop which helps in reducing the pipeline overhead. The main sources which causes the power dissipation in the semi dynamic flip-flops is the repeated data transitions and large precharge capacitance. Many researchers have been done to decrease the repeated data transitions. Conditional Data Mapping flip-flop (CDMFF) is also one of the most effective among them. It will decrease the power consumption by reducing the repeated transitions.cdmff contains three transistors in series at the output node, same as in HLFF makes the design require to have large hold time. Also, the extra transistors make the design more bulky and causes increase in power dissipation. Figure 7: Cross Charge Control Flip-flop The large Pre charge capacitance in the state-of-art designs is due to the pre charge node which needs to drive both the pull-up and pull-down transistors. This drawback considered as a main concern in design of flip-flops. As the remedy for this problem only XCFF was introduced. In XCFF pre charge node which drives the output pull-up and pull-down transistors is splits as shown in Fig.7. By splitting the dynamic node in this manner reduces the pre charge capacitance through which the power dissipation is reduced. Since only one transistor is being drive during each clock cycle the total power consumption is reduced. This XCFF also offers the low clock driving load. But, the XCFF has some drawbacks such as unwanted power dissipation during repeated at the input. When the data input has more no. of 0 s and 1 s continuously the dynamic node needs to pre charge repeatedly which causes the more power dissipation. 916

III. PROPOSED DHFF ARCHITECTURE The aim of the Proposed DHFF design is to overcome the drawbacks of XCFF. DHFF also makes use of the split dynamic node structure as that of in XCFF. This DHFF design offers the less power dissipation when compared to the XCFF. Fig. 8: Proposed DHFF discharge the node Y1 is consider to be 18 ps. The overlapping period In this pre charge capacitance is reduced to decrease the power consumption by using the split pre charge node same as in the XCFF. By splitting the pre charge node the output load gets reduced. There are some other metrics the justify the DHFF as effective flip- flop such as small clock to output delay which is defined as propagation delay from the input terminal to Q terminal. The power consumption of the DHFF strongly depends on its architecture and the input data pattern. Also, all nodes of the architecture responsible for the increase in power consumption as the total power consumption of the flip-flop can be divided as internal power consumption of flip-flop, local clock power consumption that is caused when the clock fed to the internal stages, Local data power consumption that is consumed by the implanted logic. So that only split dynamic pre charge node is used in DHFF which will reduce the output load resulting in reduced power dissipation. The DHFF operates in two phases same as the dynamic flipflops, 1) Pre charge phase when the clock is low 2) Evaluation phase when the clock is high. The data transition from the input to output takes place during 1-1 overlap of CLK and CLKB. During the pre charge i.e., when the CLK signal is at logic 0 the node y1 gets charged to VDD through p1 transistor. During the overlapping period of CLK and CLKB if data in i.e., in1 is high the charge stored at the node y1 discharges through n1, n2 and n3. This changes value at the output of inv1 to go high and output inv out to get discharge through the transistor n5. When the CLK goes low the circuit again enters into the pre charge phase. If the data input i.e., in1 is low during 1-1 overlap of CLK and CLKB then charge stored at the node y1 remains same. This makes the inv1 output switches to logic 0. This results in output inv out to get charged to the VDD through the p3 transistor. Figure 9 : Semi-dynamic flip-flop implanting NAND logic If the data is at logic0 during the overlap period, the node Y1 remains high and Y2 is pulled low through n4 as the CLK goes high. So the node inv out is charged high through p1 and n3 gets off. At the end of evaluation phase, when the CLK goes low, node Y1 remains high and Y2 stores the charge dynamically. This design presents the negative setup time because the small transparency period during the 1-1 overlap of CLK and CLKB makes the input to sampled more times The overlapping period of CLK and CLKB depends on the setup time and hold time of the flip-flop. Setup is defined as the minimum time period before the CLK edge, where the input should be stable so that the proper transition is done. Hold time is defined as the minimum time period after the CLK edge, where the input should be stable so that the proper transition is done. The proper setup time and hold time of DHFF flip-flop depends on the switching threshold of the inv1 and inv2. For proper operation the overlapping period must be greater than the time that is required to discharge the node Y1. The optimum time period that is needed to Figure 10: Dynamic Hybrid Flip-flop implanting NAND logic IV. PROPOSED DHFF-ILM The challenge has been raised to improve the flip-flop architectures which can allow the implanted logic module effectively because the idea of incorporating the logic module is not new. One of the most preferable flip-flops which allow implanting of logic module efficiently is the SDFF. Many 917

functions such as AND, OR functions, multiplexers and complex functions can also be implanted. In the positive edge SDFF to implant the N input logic function N no. of NMOS transistors are needed to be used as a result, reduced area and fast operation can be achieved. The architecture of the SDFF-ELM is shown in Fig.10.One of the most important benefit of SDFF is it allow to implant the logic easily. This implanted architecture offers a very fast and small implementation. The proposed DHFF-ILM presents less power dissipation when compared to the SDFF with implanted logic module. DHFF-ILM works same as the DHFF except that during the evaluation period, the output get switched to the logic value based on the inputs given to the inputs of the logic module during the pre charge phase. DHFF-ILM offers less power dissipation. It presents less area which helps in reducing the pipeline overhead. Any complex functions can be implemented in DDHF-ILM. The architecture of the DDHF-ILM is shown in Fig. 11. Figure 13: Simulation Results of Proposed DHFF Some of the functions that can be implanted in DHFF-ILM are shown in Fig 12. (a) (b) (c) Figure 11: Implanted logics a) NAND b) NOR c) Multiplexer V.SIMULATION RESULTS To verify the performance of the existing and proposed architectures DSCH (Digital Schematic) and Micro wind tools are used. In DSCH tool the functionality of the design can verified very comfortably and to verify the power dissipation, area and delay information Micro wind tool is the best. Figure 14: Simulation results of SDFF-ELM implanting NAND function Figure 12: Simulation Results of XCFF Fig. 16: Simulation results of DHFF-ILM implanting NAND function The simulation results shown in DSCH and Micro wind shows that the power dissipation presented by the XCFF is 918

12.27 µw. The power dissipation presented by the DHFF is 6.133µW. These results show the difference of 40%. The power dissipation in the SDFF with implanted logic is 18.068µW and the power dissipation in the DHFF-ILM is 1.048µ. All these results show that DHFF and DHFF-ILM are the high performance designs when compared to the existing designs. VI.CONCLUSION In this paper, a novel high performance DHFF and the DHFF-ILM were proposed. Many existing flip-flop architectures were discussed to get correct analysis of drawbacks on which we are concentrating in the proposed designs. Power dissipation in DHFF and DHFF-ILM is reduced by reducing the pre charge capacitance at the pre charge output node. As per the simulation results, it was proved that the DHFF and DHFF-ILM are high performance designs. K. Vajida Tabasum received the B.Tech degree in electronics and communication engineering degree from Sri Sai Institute of Technology and Science affiliated to Jawaharlal Nehru Technological University, Anantapur, India in 2012 and currently per suing M.Tech degree in VLSI system design from Sri Sai Institute of Technology and Science affiliated to Jawaharlal Nehru Technological University, Anantapur, India. K. Chandra Shekhar received the B.Tech degree in electronics and communication engineering from SCDE affiliated to Jawaharlal Nehru Technological University, Hyderabad, India and received the M.Tech degree in DECS from AITS affiliated to Jawaharlal Nehru Technological University, Anantapur, India. He has been with the department of electronics and communication engineering, Sri Sai Institute of Technology and Science, Rayachoty, since 2005, where he is currently the Head of Department. His current research includes image processing. FUTURE SCOPE: We can improve performance of the DHFF-ILM by replacing the pull-down network by the efficient logic network such as domino logic, CVSL, Clocked CMOS. REFERENCES [1] Ahamed Sayed, Hussain Al-Asaad, and Survey and Evaluation of low power Flip-Flops, In proceeding of: Circuits and Systems, 2006. MWSCAS '06. 49th IEEE International Midwest Symposium on, Volume: 1 [2] Dejan Marcovic, Borevoje Nikolic,Robert W. Borderson Analysis and design of low energy Flip-flops, In processing of Digital Circuits and Systems,2000,IEEE 18 th int. con., [3] N.Karthika, S. Jayanthi, Desihn of hybrid pulsed flip-flop featuaring embedded logic, IOSR Journal of VLSI and Signal Processing (IOSR-JVSP) Volume 4, Issue 2, Ver. I (Mar-Apr. 2014), PP 68-74. [4] J. M. Rabaey and M. Pedram, Low Power Design Methodologies, Boston: Springer, 1996. [5] N. H. E. Weste and D. Harris, CMOS VLSI Design, Third Edition, Reading, Massachusetts, Addison-Wesley, 2005 919