InGaAs PIN photodiode arrays

Similar documents
Effective photosensitive area. Photosensitive area size

Short wavelength type APD. Effective photosensitive area (mm) Effective photosensitive area size* 2

InAsSb photovoltaic detectors

Photosensitive area size (mm) Reverse voltage VR max (V) R to +60

InAsSb photovoltaic detector

Effective photosensitive area (mm) Photosensitive area size

Low bias operation, for 800 nm band

Peak emission wavelength: 3.9 μm

These Si photodiodes have sensitivity in the UV to near IR range. They are suitable for low-light-level detection in analysis and the like.

Parameter Symbol Specification Unit Photosensitive area - ɸ0.8 mm Package mm

Effective photosensitive area (mm)

Between elements measure. Photosensitive area (per 1 element)

Si PIN photodiodes. High-speed detectors with plastic package. Structure. Absolute maximum ratings

Si PIN photodiodes. High-speed detectors with plastic package. Structure. Absolute maximum ratings

InAsSb photovoltaic detector

Suppressed IR sensitivity

InAsSb photovoltaic detectors

Applications. Photosensitive area size. Storage temperature Tstg (mm) (mm 2 ) (V) ( C) ( C) S

Parameter Specification Unit Photosensitive area mm Package Glass epoxy - Seal material Silicone resin -

Effective photosensitive* 2 area size. Storage temperature Tstg (mm) ( C) ( C) S φ0.2 φ0.5 S φ to to +100 S9075

Reverse voltage VR max. Electrical and optical characteristics (Typ. Ta=25 C, unless otherwise noted) Short. Temp. S coefficient (A/W) of

Infrared detector modules with preamp

Optics modules. Absorbance measurement module with built-in photodiode array, optical elements, current-tovoltage. C13398 series.

MPPC modules. MPPC array modules for very-low-level light detection, 16 ch analog output. C13368/C13369 series (Analog output type)

Peak emission wavelength: 4.3 μm

MCT photoconductive detectors

RGB color sensor. Effective photosensitive area. Green, Red: 2.25 Blue : 4.5

Photosensor with front-end IC

PbSe photoconductive detectors

MPPC (Multi-Pixel Photon Counter)

M=100, RL=50 Ω λ=800 nm, -3 db

Application OCT. Dimensions (mm) Weight (g) Operating temperature* 1 Storage temperature* 1 λ=1.55 μm (V) (mw)

Parameter Specification Unit Photosensitive area mm Package Glass epoxy - Seal material Epoxy resin -

1-D PSD with small plastic package

MPPC (multi-pixel photon counter)

Photon counting module

16-element Si photodiode arrays

Si photodiode. Applicable to lead-free solder reflow and wide temperature range. S9674. Absolute maximum ratings

Photo IC diode. Plastic package shaped the same as metal package. S SB. Features. Applications

16-element Si photodiode arrays

MCT photoconductive detectors

High-speed photodiodes (S5973 series: 1 GHz)

APD modules. Operates an APD with single 5 V supply (standard type, short-wavelength type) C12702 series.

Accessories for infrared detector

Signal processing circuit for 2-D PSD

Non-discrete position sensors utilizing photodiode surface resistance

Photo IC diode. Plastic package shaped the same as metal package. S SB. Absolute maximum ratings (Ta=25 C)

Peak sensitivity wavelength λp (nm) Photosensitive area (mm)

Signal processing circuit for 1-D PSD

Photodiode modules. C10439 series. Integrates photodiode for precision photometry with low-noise amp.

Photo IC diode. Wide operating temperature: -40 to +105 C. S MT. Absolute maximum ratings (Ta=25 C)

APD modules. APD module integrated with peripheral circuits. C12703 series. Selection guide. Block diagram

Driver circuit for MPPC

16-element Si photodiode arrays

Photosensitive area (mm) 4 4. Peak sensitivity wavelength (nm) Supply voltage Dark state. Max. Vcc max. Tstg Min. Max. (ma) (V)

Driver circuit for InGaAs linear image sensor

MPPC (Multi-Pixel Photon Counter)

Power supply for MPPC

Driver circuit for InGaAs linear image sensor

Signal processing circuit for 2-D PSD

Signal processing circuit for 1-D PSD

NMOS linear image sensor

Photo IC diode. COB (chip on board) type, small package. S CT. Absolute maximum ratings

Reduced color temperature errors

Driver circuit for CCD linear image sensor

Driver circuit for CMOS linear image sensor

APD module. Variable gain, stable detection even at high gain. C Applications. Features. Sensitivity vs.

16-element Si photodiode arrays

Mini-spectrometer. SMD series C14384MA-01. High sensitivity in the near infrared region (to 1050 nm), ultra-compact grating type spectrometer

InGaAs linear image sensors

CMOS linear image sensors

Power supply for MPPC

Photo IC for optical switch

Driver circuit for CMOS linear image sensor

InGaAs multichannel detector head

MPPC (Multi-Pixel Photon Counter) arrays

S P. Ultra-miniature, high performance Electromagnetically driven laser scanning MEMS mirror. Features.

Applications. Number of terminals. Supply voltage (op amp) Vcc

Driver circuits for CCD image sensor

InGaAs linear image sensors

InGaAs linear image sensors

Near infrared image sensor (0.9 to 1.7 µm) with high-speed data rate

Driver circuit for CCD linear image sensor

InGaAs linear image sensors

Distance linear image sensor

Driver circuits for photodiode array with amplifier

Applications. l Image input devices l Optical sensing devices

Variable gain and stable detection even at high gains

12-bit digital output

CMOS linear image sensor

Driver circuit for CCD linear image sensor

InGaAs linear image sensors

CMOS linear image sensors

CMOS linear image sensor

CMOS linear image sensor

TM series TM-UV/VIS-MOS

Artisan Technology Group is your source for quality new and certified-used/pre-owned equipment

InGaAs linear image sensors

mini-spectrometer TG series Long-wavelength type (to 2.55 μm) nearinfrared C11118GA Optical characteristics (Ta=25 C)

InGaAs multichannel detector head

Transcription:

16/32/46 element InGaAs array for near IR detection The is one-dimensional InGaAs PIN photodiode array in a ceramic DIP (dual inline package). It can be used to perform simple spectroscopic analysis. Features 16, 32, or 46 element array Designed for simple measurement Large photosensitive area size Applications NIR spectrophotometers Structure Parameter G12430-032D G12430-046D Unit Cooling Room temperature type - Number of elements 16 32 46 elements Elements size 0.45 1 0.2 1 mm Element pitch 0.5 0.25 mm Package 18-pin ceramic DIP 40-pin ceramic DIP 48-pin ceramic DIP - Window material Borosilicate glass - Details of photosensitive area V Number of elements x H Unit 16 0.45 0.5 32 1 mm 0.2 0.25 46 V x H KIRDC0118EB Static electricity can damage or degrade the. Use caution when handling. www.hamamatsu.com 1

Absolute maximum ratings (Ta=25 C) Parameter Symbol Value Unit Reverse voltage VR max. 5 V Operating temperature Topr -20 to +70* C Storage temperature Tstg -20 to +85* C Soldering conditions - 260 C or less, within 5 s - * No dew condensation When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 C, per element) Parameter Symbol Condition G12430-032D G12430-046D Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Spectral response range λ - 0.9 to 1.7 - - 0.9 to 1.7 - - 0.9 to 1.7 - µm Peak sensitivity wavelength λp - 1.55 - - 1.55 - - 1.55 - µm Photosensitivity S λ=λp 0.85 0.95-0.85 0.95-0.85 0.95 - A/W Dark current ID VR=1 V - 500 2500-250 1250-250 1250 pa Dark current temperature coefficient ΔTID VR= mv - 1.1 - - 1.1 - - 1.1 - times/ C Cutoff frequency fc VR=1 V, RL=50 Ω λ=1.3 µm, -3 db 15 30-25 60-25 60 - MHz Terminal capacitance Ct VR=1 V, f=1 MHz - 60-35 60-35 60 pf Shunt resistance Rsh VR= mv 20-40 200-40 200 - MΩ Detectivity D* λ=λp 1 12 5 12-1 12 5 12-1 12 5 12 - cm Hz 1/2 /W Noise equivalent power NEP λ=λp - 2-14 4-14 - 1-14 3-14 - 1-14 3-14 W/Hz 1/2 Spectral response Spectral transmittance of window material 1.0 0.8 Photosensitivity (A/W) 0.6 0.4 Transmittance (%) 95 90 0.2 0 0.8 1.0 1.2 1.4 1.6 1.8 85 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 Wavelength (µm) Wavelength (µm) KIRDB0565EA KIRDB0566EB 2

Photosensitivity temperature characteristics Linearity Temperature coefficient of sensitivity (%/ C) 2.5 2.0 1.5 1.0 0.5 0-0.5-1.0 0.8 (Typ., Vr=0 V) 1.0 1.2 1.4 1.6 1.8 Relative sensitivity (%) 98 96 94 92 90 0 (Typ. Ta=25 C, λ=1.55 μm, light spot size:ϕ50 μm) G12430-032D /-046D VR=0 V VR=1 V 1 2 3 4 5 6 7 8 9 Wavelength (µm) Incident light level (mw) KIRDB0636EA KIRDB0567EA Cross-talk characteristics (Typ. Ta=25 C, λ=1.55 μm, VR=0 V, light spot size: approx. ϕ μm) (Typ. Ta=25 C, λ=1.55 μm, VR=0 V, light spot size: approx. ϕ μm) Relative sensitivity (%) 1 0.1 Relative sensitivity (%) 1 0.1 0.01-1.0-0.5 0 0.5 1.0 0.01-0.5-0.25 0 0.25 0.5 Position on photosensitive area (mm) Position on photosensitive area (mm) KIRDB0568EA KIRDB0569EA 3

Dark current vs. reverse voltage Terminal capacitance vs. reverse voltage 0 Dark current (pa) Terminal capacitance (pf) 0.01 0.1 1 Reverse voltage (V) KIRDB0570EA 0.1 1 Reverse voltage (V) KIRDB0572EA Shunt resistance vs. ambient temperature GΩ (Typ.) GΩ Shunt resistance 1 GΩ MΩ MΩ 1 MΩ -30-20 - 0 20 30 40 50 60 70 80 Ambient temperature ( C) KIRDB0571EA 4

Dimensional outlines (unit: mm) 22.86 ± 0.25 20.7 ± 0.1 1.65 ± 0.2 Window 0.25 ± 0.05 7.87 ± 0.25 7.49 ± 0.2 6.7 ± 0.1 Photosensitive surface 7.62 ± 0.25 Index mark 1 ch Photosensitive area 2.16 ± 0.25 4.0 min. 0.5 ± 0.05 1.37 ± 0.2 2.54 ± 0.15 0.46 ± 0.05 20.32 ± 0.15 0.89 ± 0.25 Package material: Ceramic Lead treatment: Ni/Au plating Lead material: FeNi alloy Reflective index of window material: 1.47 Window thickness: 0.5 ± 0.05 AR coat: None Window sealing method: Resin sealing Position accuracy of photosensitive area center: -0.3 X +0.3-0.3 Y +0.3 Position accuracy of photosensitive area inclination: -5 θ +5 KIRDA0237EA G12430-032D 4039 50.8 ± 0.51 22.8 ± 0.35 2221 1.30 ± 0.15 Window 0.25 ± 0.05 15.49 ± 0.25 15.11 ± 0.25 8.5 ± 0.35 Photosensitive surface 15.24 ± 0.25 1 2 1920 Index mark 1 ch Photosensitive area 3.0 ± 0.3 4.0 min. 1.27 ± 0.25 2.54 ± 0.13 0.46 ± 0.05 48.26 ± 0.2 Package material: Ceramic Lead treatment: Ni/Au plating Lead material: FeNi alloy Reflective index of window material: 1.47 Window thickness: 0.75 ± 0.05 AR coat: None Window sealing method: Resin sealing Position accuracy of photosensitive area center: -0.3 X +0.3-0.3 Y +0.3 Position accuracy of photosensitive area inclination: -5 θ +5 KIRDA0238EA 5

G12430-046D 48 47 65.0 ± 0.65 22.8 ± 0.35 26 25 1.3 ± 0.15 Window 0.25 ± 0.05 15.49 ± 0.25 15.11 ± 0.25 8.5 ± 0.35 Photosensitive surface 15.24 ± 0.25 1 2 23 24 Index mark 1 ch Photosensitive area 3.0 ± 0.3 4 ± 1 2.54 ± 0.13 58.42 ± 0.2 0.46 ± 0.05 Package material: Ceramic Lead treatment: Ni/Au plating Lead material: FeNi alloy Reflective index of window material: 1.47 Window thickness: 0.75 ± 0.05 AR coat: None Window sealing method: Resin sealing Position accuracy of photosensitive area center: -0.3 X +0.3-0.3 Y +0.3 Position accuracy of photosensitive area inclination: -5 θ +5 KIRDA0239EA Pin connections Pin no. G12430-032D G12430-046D Pin no. G12430-032D G12430-046D 1 KC KC KC 25-27 KC 2 2 NC 2 26-25 45 3 4 2 4 27-23 43 4 6 4 6 28-21 41 5 8 6 8 29-19 39 6 8 30-17 37 7 12 12 31-15 35 8 14 12 14 32-13 33 9 16 14 16 33-11 31 KC 16 18 34-9 29 11 15 18 20 35-7 27 12 13 20 22 36-5 25 13 11 22 24 37-3 23 14 9 24 26 38-1 21 15 7 26 28 39 - NC 19 16 5 28 30 40 - NC 17 17 3 30 32 41 - - 15 18 1 32 34 42 - - 13 19 - NC 36 43 - - 11 20 - NC 38 44 - - 9 21 - KC 40 45 - - 7 22 - NC 42 46 - - 5 23-31 44 47 - - 3 24-29 46 48 - - 1 6

Operating circuit In the most generally used circuit, op amplifiers are connected to each channel to read the output in real time. The output of an op amplifier is of low impedance and thus can be easily multiplexed. Photodiode array Multiplex KMPDC0001EA Related information www.hamamatsu.com/sp/ssd/doc_ ja.html Precautions Disclaimer Safety consideration Metal, ceramic, plastic package products / Precautions Technical information Infrared detector / Technical information Information described in this material is current as of September 2017. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184 U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J. 08807, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218, E-mail: usa@hamamatsu.com Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr., D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8, E-mail: info@hamamatsu.de France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71, E-mail: infos@hamamatsu.fr United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777, E-mail: info@hamamatsu.co.uk North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509 031 00, Fax: (46)8-509 031 01, E-mail: info@hamamatsu.se Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-93 58 17 33, Fax: (39)02-93 58 17 41, E-mail: info@hamamatsu.it China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 020, China, Telephone: (86) -6586-6006, Fax: (86) -6586-2866, E-mail: hpc@hamamatsu.com.cn Taiwan: Hamamatsu Photonics Taiwan Co., Ltd.: 8F-3, No. 158, Section2, Gongdao 5th Road, East District, Hsinchu, 300, Taiwan R.O.C. Telephone: (886)03-659-0080, Fax: (886)03-659-0081, E-mail: info@tw.hpk.co.jp Cat. No. KIRD1124E04 Sep. 2017 DN 7