BESIII Physics and Software Workshop Beihang University February 20-23, 2014 CGEM-IT project update Gianluigi Cibinetto (INFN Ferrara) on behalf of the CGEM group
Outline Introduction Mechanical development Anode readout design Electronics Software upgrade Group composition, CDR, budget and schedule 2
A CGEM based Inner Tracker The GEM concept A cylindrical triple GEM Requirements Rate capability: ~10 4 Hz/cm 2 Spatial resolution: σ xy =~100µm : σ z =~1mm Momentum resolution:: σ pt /P t =~0.5% @1GeV Efficiency = ~98% Material budget 1.5% all layers Coverage: 93% 4π Operation duration ~ 5 years Three layers of CGEM for BESIII 3
CGEM expected performance From GEANT4 simulation CGEM inner detector (wrt MDC inner detector) Ø Improves dz resolution significantly (by a factor of 2.6~6) Ø Comparable dr resolution (~5% poorer for low momentum tracks ) Ø Comparable momentum resolution (~5% better for high momentum tracks) From KLOE beam test These simulation results need to be updated with a more detailed description of the detector and of the digitization and reconstruction process. Work performed by IHEP group. Readout σ rf (µm) σ z (µm) Digital readout (Beam test @2009) 330 400 Analog readout (magnetic field effect avoided)* 80 150 * Taken as expected spa.al resolu.on 4
The MAE project Design, construction and test of a CGEM prototype and readout electronics funded by the Foreign Affairs Ministry agreement of scientific cooperation for a Joint laboratory INFN-IHEP. 360,000 euros in three years! INFN 1 st year 40000 33.3% Italian Ministry of FA 40000 33.3% Foreign institution 40000 33.3% More funds 0 1 st year project cost 120000 2014 contribution request Status of the project 2013 budget: exhausted report to MAE concerning 1 st year activities: completed March-April 2014: MAE approval of report, and reimbursement to INFN (40 keuros) April-June: expect 2014 budget available 5
The path toward a CGEM-IT To go from one layer to the complete IT there s a long way to walk R&D program (Jun 2013 Jun 2014) in progress First layer funded under the MAE agreement design (Sep-Nov 2013) completed! construction (May 2014 Jul 2015) starting soon! Review of the CDR by the BESIII collaboration for the final approval of the project (June 2014) Second layer design construction (Feb-Nov 2015) Third layer design construction (Jul 2015 Mar 2016) Test and integration (Jan-May 2016) Ready for installation (Jan 1 st 2017) 6
Detector mechanical design Each detector layer is composed by five cylindrical elements: one cathode (conversion/drift) three GEM (amplification) one anode (signal collection) To assemble each element then many other components are needed: aluminum molds fiberglass supporting rings cathode, GEM or anode foils plus small parts, connectors, etc Fiberglass rings for detector support HV connectors Cathode internal shield Gas inlets Anode external shield Even small modifications to one element can have fallout on the overall design. Fronte card locatio 7
Molds for layer 2 construction (solid model) Cathode mold Cathode foil Each of the five detector parts (cathode + 3 GEMs + anode) is pre-assembled on an aluminum mold. Aluminum rings for correct positioning during assembly Durostone rings for detector support GEM foil Aluminum ring for assembly GEM mold 8
Molds for layer 2 construction Executive drawings have been prepared, validated and given to the mechanical factory for the production. Molds will be ready by May for the beginning of the construction. A huge amount of work have been done in the last few months in order to prepare and validate all the cathode and GEM mechanical parts and the assembly procedure. 9
Schedule for the first layer construction today Technical design Construction tooling GEM foils anode other material Cathode construction GEM assembly anode construction full detector assembly material procurement test 10
Detector construction The detector will be constructed in two places: assembly tooling in the LNF clean room - INFN Ferrara: cathode and anode construction - INFN Frascati: GEM and full detector assembly in the clean room construction area @ INFN Ferrara G. Cibinetto BESIII Physics and Software Workshop Beihang University February 20-23, 2014 11
The readout plane For technical reasons the CERN group is no longer providing a KLOE-like readout plane. We go for a Compass-like anode. 570 µm 130 µm 650 µm 650 µm with stereo angle ranging from ~30 to 45 deg Due to diffusion the charge cloud collected on the readout plane is bigger than the strip width and a weighting method is used to improve the track position measurement. analog readout 12
Readout plane main issues Mechanically, the anode plane is not easy to design 1. About 3 mm will be the distance between the readout plane and the ground plane need to assemble ourselves the readout and ground planes in a robust structure. need to merge the ground and the signals in a single connector. 2. Lack of space in z direction In addition the BESIII anode will be substantially different from the one used in KLOE2 or Compass Charge sharing, capacitive couplings and geometry have to be studied and optimized before taking the final decision. Simulation and tests with a small planar prototype will lead to the final design. 13
Planar prototype Cosmic telescope is in place @ LNF.. The test chamber has been built. Gas flowing in the telescope and test chambers. Interlock system to be implemented. High voltage system operational. Readout for the telescope ready. Amplifiers and readout for the test chamber to be completed 10x10 cm2 planar prototype Test area in Frascati G. Cibinetto BESIII Physics and Software Workshop Beihang University February 20-23, 2014 14
Anode and GEM simulation Maxwell simulation of the anode plane to extract coupling capacitance and to study different strip configurations. The GEM simulation is used to calculate the electric field used by Garfield for the charge sharing studies. Simulation results must be tuned with the planar prototype data. G. Cibinetto BESIII Physics and Software Workshop Beihang University February 20-23, 2014 15
Frontend Electronics kickoff meeting The analog readout will be performed by an ASIC chip designed by INFN Turin adapting an existing chip (new fronted, same backend) We had a sort of kickoff meeting in Turin one week ago to start this activity. Ø basic requirements and features of the ASIC chip that will be used for the readout Ø overall dimension and concept of the PCB that will host the chip. Ø manpower and time schedule Another meeting today in Frascati to start the work on OFF detector electronics. 16
ASIC chip main features and requirements UMC 110 nm technology (limited power consumption, to be tested for radiation tolerance) Input charge: 0.5-60 fc Sensor capacitance ~100 pf Input rate (single strip): 3 khz x 5 (safety factor) Time and Charge measurements by independent TDCs Time resolution: 1 ns r.m.s. Double threshold discrimination. Time over Threshold (ToT) to measure the charge Maximum power consumption 5-10 mw p/channel G. Cibinetto BESIII Physics and Software Workshop Beihang University February 20-23, 2014 17
Software upgrade at IHEP New CGEM layout has been added to the BESIII GEANT4 model. Reconstruction and tracking algorithm are under development. Digitization of the event is very preliminary and will be finalized with the studies of the planar prototype. Strong interaction between Italian and IHEP groups to complete the upgrade. 18
The CGEM group Together with INFN (Ferrara, Frascati and Turin) and IHEP, now Mainz and Uppsala are officially part of the project. Main responsibilities of the different institutions are: INFN: design and construction of the detector and electronics IHEP: gas system, slow control and all the software developments needed to readout and integrate the detector into the DAQ Mainz: high voltage system and participation to the ASIC foundry cost. Uppsala: data concentrator 19
CDR preparation 1. Introduction 1. The present BESIII Inner Tracker 2. Luminosity Issues 1. Present and expected backgrounds 3. Inner Tracker Upgrade Requirements 2. Detector design 1. Operating principle of a triple Cylindrical GEM detector 1. The KLOE2 Inner Tracker: know-how and first results 2. BESIII CGEM innovations 1. Rohacell 2. Anode design 3. Analog vs. digital, expectations and measurements 3. The BESIII CGEM-IT 1. CGEM-IT vs DC-IT 2. Mechanical Design 3. Tooling and Construction 4. Simulation of Cylindrical GEM Inner Tracker 1. Parametric Simulations (Liang) 2. CGEM-IT full Offline Reconstruction 1. Pattern Recognition 2. Tracking 3. Acceptance, Resolutions and Reconstruction Efficiencies 3. Monte Carlo simulation results 1. Physics Benchmark 5. Front End Electronics 5. Requirements 5. Power Consumption 6. System Block Description 7. On-Detector Electronics 5. ASIC 8. Off-Detector Electronics 6. DAQ and Trigger 5. Requirements 6. Dead time and bandwidth 7. Possible second level trigger future upgrades 8. Storage 7. Integration of the CGEM-IT with the Spectrometer 5. Mechanical design 5. Interfacing with beam pipe 6. Interfacing with Outer DC 6. Power Dissipation and Cooling 7. Gas Systems 8. HV Systems 9. Slow Controls 8. Money, manpower, schedule, task subdivision.. 20
A CVS repository has been setup by Marco Destefanis on lxslc5 machines at IHEP. The document tree is in place and ready to be filled. CDR repository A presentation with instructions for editors will be sent out by hypernews shortly. Aiming to have a first draft by May. 21
Preliminary spending profile The full construction cost for 3 CGEM layers is about 990 k (not including manpower, integration and installation). INFN has requested an external contribution of ~200 k. + Exec. Prog. 120 keuros from IHEP for manpower 350 300 k-euro 250 200 150 100 50 0 2013 2014 2015 2016 2017 Outsource 0 16 0 0 0 Other part. 0 0 92 92 0 INFN 54 155 144 202 0 Exec. Prog. Italy 80 80 78 0 0 Total 134 251 314 294 Other Part: IHEP+Mainz+Uppsala (184 k ), missing 16 k Cost for mold increased by 50 k 22
Summary and outlook The status and the advancements in the mechanical design, simulation, R&D, electronics have been presented. The project is facing two important turning points: the Conceptual Design Report review the beginning of the construction of the first layer New groups joined the enterprise, and the budget is almost totally covered. 23
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Task 1) R&D 321d 1.1) FE - Roahcell fake cathode 25d 1.2) FE - Assembly tests with Kloe molds 51d 1.3) FE/LNF - Anode Simulation 220d 1.4) LNF - Anode finalization and design 25d 2) Layer I 707d 2.1) FE - Technical design 115d 2.2) Material procurement 321d 2.2.1) Molds 100d 2.2.2) GEM foils 115d 2.2.3) Anode 66d 2.2.4) Other material 40d 2.3) FE - Cathode construction 32d 2.4) LNF - GEM assembly 52d 2.5) Anode assembly 43d 2.6) LNF - Assembly QA and validation 25d 2.7) LNF - Full detector assembly 90d 2.8) LNF - Detector test and QA 29d 3) Layer II 563d 3.1) FE - Technical design 80d 3.2) Material procurement 244d 3.2.1) Molds 67d 3.2.2) GEM foils 67d 3.2.3) Anode 70d 3.2.4) Other material 40d 3.3) FE - Cathode construction 35d 3.4) LNF/FE - GEM and anode assembly 87d 3.5) LNF - Assembly QA and validation 25d 3.6) LNF - Full detector assembly 65d 3.7) LNF - Detector test and QA 27d 4) Layer III 583d 4.1) FE - Technical design 80d 4.2) Material procurement 290d 4.2.1) Molds 90d 4.2.2) GEM foils 90d 4.2.3) Anode 70d 4.2.4) Other material 40d 4.3) FE - Cathode construction 45d 4.4) LNF/FE - GEM and anode assembly 60d 4.5) LNF - Assembly QA and validation 20d 4.6) LNF - Full datector assembly 60d 4.7) LNF - Detector test and QA 28d Schedule for detector construction 2013 2014 2015 EffortQtr 2 Qtr 3 Qtr 4 Qtr 1 Qtr 2 Qtr 3 Qtr 4 Qtr 1 Qtr 2 Qtr 3 Qtr 4 Qtr 1 today CDR review by the BESIII collaboration R&D first layer second layer third layer 25
A tentative anode mechanical configuration Readout and ground plane are connected at the edge of the chamber. The readout board could be placed radially between layers. output connector ground plane Frontend board cooling rohacell cylindrical structure readout plane 2 mm gas gap Anode fiberglass ring GEM3 fiberglass ring signal path signal connector not in scale G. Cibinetto GEM 3 foil BESIII Physics and Software Workshop Beihang University February 20-23, 2014 HV connector 26