COCKPIT SYSTEM OF SMART CAR & MARKET/ TECHNICAL TREND OF ADAS

Transcription

1 COCKPIT SYSTEM OF SMART CAR & MARKET/ TECHNICAL TREND OF ADAS 4/7/2016 MATTE HO 何吉哲 MB: AUTOMOTIVE INFORMATION SYSTEM BUSINESS RENESAS ELECTRONICS CORPORATION AISM-AA

2 SPECIALLY WE TALK ABOUT CAR BUILD-IN SYSTEMS! Not these ones: Page 2

3 EXAMPLES OF STANDARD CAR INFOTAINMENT SYSTEMS VW/Golf: with BT/HF Telefone Renault: with Audio Processing Renault: with Internet+Apps Renault: with Body Control I/F Page 3

4 EXAMPLES FOR CLUSTER, ADAS, NAVIGATION Page 4

5 RENESAS S INTEGRATED COCKPIT Providing comfort, secure and safety to drivers, Human-friendly interface Quickly display the information needed at the timing desired, all through the cockpit Renesas Integrated Cockpit Comfort, secure, safety No.1 No.1 Dashboard Infotainment Driving assist Renesas s Integrated Cockpit Demo (Drive simulator) Page 5

6 SYSTEM EVOLUTION TO INTEGRATED COCKPIT Migration from Modular system to Integrated system for user- friendly and cost optimization CY2015~2017 Modular ECU system by Tier1 CY2018~21 Integrated ECU system by OEM Radio Module Multimedia Module Increasing demand to optimize BOM cost like software module Surround View Display ECU Connectivity Security Radio/Audio Multimedia Navi/GPS Cluster Cockpit Platform Connectivity Instruments Cluster Navi/GPS Module Page 6

7 SYSTEM REQUIREMENT AND KEY TECHNOLOGIES Integrated Cockpit system must operate many functions simultaneously Powerful Processor for rich HMI Audio DSP for High Quality Audio Digital Radio Latest Graphics technology High Definition Video codec Fast boot camera and Surround view Apps Apps EthernetAVB for Sound routing and Camera Secure Architecture Multi OS Virtualization OS OS Hyper Visor HW Page 7

8 R-CAR ROADMAP FOR NEXT COCKPIT Multi screen, Cluster, Hypervisor, Ethernet ADAS integration Cluster integration Generation 3 (16nm) Generation 4 R-Car YY R-Car YY Performance Smart phone connectivity Car Play, Google Auto Generation 1 (40nm) R-Car M1A R-Car H1 Generation 2 (28nm) R-Car H2 R-Car M2 Quad core in Automotive with big.little TM R-Car E2 Production start R-Car H3 R-Car E2X Developing R-Car XX R-Car XX Developing Planning Performance Scalability Software compatibility R-Car E x Year Page 8

9 TOP PERFORMANCE IN THE MARKET Today s high-end performance available tomorrow main stream. Continuously improve performance by Generation. H2 4x Cortex A15 4x Cortex A7 SH-4A Automotive, 28nm CA15 CA15 21K DMIPS CA15 CA15 G6400 Graphics CA7 CA7 CA7 CA7 VCP3 FullHD codec IMP Image Ethernet AVB USB3.0 H1 12K DMIPS 4x Cortex A9 Automotive, 45nm M2 2x Cortex A15 SH-4A Automotive, 28nm CA15 10K DMIPS CA15 SGX544MP2 Graphics VCP3 FullHD codec Ethernet AVB USB3.0 M1A 3K DMIPS Cortex A9 Automotive, 45nm E1 1.3K DMIPS E2 2x Cortex A7 SH-4A Automotive, 28nm 3.8K DMIPS SGX540 Graphics CA7 CA7 VCP3 FullHD codec Ethernet AVB USB2.0 Cortex A9 Automotive, 45nm Page 9

10 R-CAR PLATFORM IS SCALABLE AND FLEXIBLE Scalable platform Open environment Flexible platform Premium Class R-Car H Customer s applications Middle Class R-Car M Entry Class (Emerging Countries) R-Car E S/W Platform H/W Platform Page 10

11 R-Car E2X

12 INFOTAINMENT SYSTEM FORECAST Display system ratio will be more standard in Low-end cars [Background of Market boom] Car production(w/w) High Mid Entry Page 12

13 R-CAR E2X POSITIONING AND VALUE Performance Preliminary Same performance level Gen.1 R-Car H1 R-Car M1 R-Car E1 Gen.2 R-Car H2* R-Car M2W* R-Car M2N* R-Car E2* R-Car E2x* Gen.3 R-Car H3** High/ Premium Mid-range R-Car M3** R-Car E3** Entry * Under Development 1. BOM Cost Reduction No need for additional analogue I/Fs CVBS IN/Out, LVDS Out 2 Package Variation Supports 6 layer or 4 layer trough hole PCB Reduced SOC cost: Applied lower cost Silicon process 2. Connectivity - Suitable CPU and DDR bandwidth Android Auto, Miracast 1. 2x Cortex-A7 (1GHz) :3800DMIPS 2. x32 DDR Software Flexibility Can start TODAY with R-Car E2 1. HW IPs: Reused from Gen2 2. SW(M/W, Drivers): Reused from Gen2 Supports various kinds of OS Linux, Android, QNX CarPlay, Page 13

14 R-CAR E2X PACKAGE 1 (6 LAYER THROUGH HOLE VERSION) System DMAC INTC SYSC(System ctrl.) CPG(Clock gen.) Secure Boot CryptCore Timers 2xCMT0 8xCMT1 7x PWM 4xTPU 1x WDT Sec.Timer/WDT Audio IPs 6x Async SRC 10x SSIU Audio Router Package: 501pin FCBGA, 21x21 0.8mm pitch Supports 6 Layer Through Hole PCB CPUs 2x ARM Cortex-A7 1GHz 2xVFP 2xNeon SH4A 260MHz 2x CVBS Input (selectable) Graphic/Display IPs SGX531 2D/3D GPU 260MHz, 21Mpoly/s VSP Video Processor 2x Digital Video In L2 Cache 512Kbyte VCP3 Video codecs Engine FullHD enc/dec 2x Display Unit 1x FDP TCON 2x Display Out 1x TCON Out 1x CVBS output 1x LVDS output Upgrade from E2 Memory Interfaces 32bit DDR bit ExtBus(BSC) 2x S-Flash 2x SDHI(SDR104/50) 1x SDHI (SDR104 w/mmc mode) Standard Interfaces 6x SCIF(UART) 3x MSIOF(SPI) 6x I 2 C 2x CAN2.0B 1xTSIF 1x Ethernet I/F 1x Ethernet AVB 1x DigitalRadio I/F 1x PCI Express 2x USB2.0 Host/Function GPIOs Page 14

15 R-CAR E2X PACKAGE 2 (4 LAYER THROUGH HOLE VERSION) System DMAC INTC SYSC(System ctrl.) CPG(Clock gen.) Secure Boot CryptCore Timers 2xCMT0 8xCMT1 7x PWM 4xTPU 1x WDT Sec.Timer/WDT Audio IPs 6x Async SRC 10x SSIU Audio Router Package: 501pin FCBGA, 21x21 0.8mm pitch Supports 4 Layer Through Hole PCB CPUs 2x ARM Cortex-A7 1GHz SH4A 260MHz Graphic/Display IPs SGX531 2D/3D GPU 260MHz, 21Mpoly/s VSP Video Processor 2x Digital Video In 2x CVBS Input (selectable) 2xVFP 2xNeon L2 Cache 512Kbyte VCP3 Video codecs Engine FullHD enc/dec 2x Display Unit 1x FDP TCON 2x Display Out 1x TCON Out 1x CVBS output 1x LVDS output Upgrade from E2 Memory Interfaces 32bit DDR bit ExtBus(BSC) 2x S-Flash 2x SDHI(SDR104/50) 1x SDHI (SDR104 w/mmc mode) Standard Interfaces 6x SCIF(UART) 3x MSIOF(SPI) 6x I 2 C 2x CAN2.0B 1xTSIF 1x Ethernet I/F 1x Ethernet AVB 1x DigitalRadio I/F 2x USB2.0 Host/Function GPIOs Page 15

16 BOM COST REDUCTION - REDUCES EXTERNAL PARTS COST Low-end Display Audio System Configuration BT/WiFi Combo Module (802.11ac) S-Flash S-Flash (2ch) 2ch: Enables Fast boot USB I/F SDIO or PCIe IF I2S SCI QSPI Multi I/O USB HS Host/Func x1 Host/Func x1 I2S SCI $1-2 LVDS SerDes Tuner Audio DSP I2C System control RL78 LVDS Out Power AMP Power Circuit CAN Bus LCD w/touch panel Key Remocon IC GPIO R-Car E2X I2C CVBS Enc $1-2 CVBS Out Touch Screen Controller Rear Sheet Monitor CD/DVD Deck Back Camera Analogue Video In (selector) HDMI HDMI IF IC CVBS Dec $1-2 BT.601 Digital Video IN SDIF emmc I/F (SDIO) DDR I/F SD Card emmc Supports emmc Boot DDR3 Smart Phone APP: DA HMI, MediaPlayer, CarPlay, etc. M/W: AV Codecs, GFX, BT/Wifi stack etc. Page 16

17 R-CAR E2X EVALUATION BOARD (ALE6 & ALE4) ALE6 main feature PCB : 6-layer through-hole PCB SoC : R-Car E2X (w/pcie) ARM Cortex-A7 Dual 1.0GHz RAM : DDR3-SDRAM 1000MHz 1GB x2 Display : HDMI, LVDS, CVBS output Video in : CVBS input Audio : Audio output, Microphone input Storage : SPI Flash emmc x1, SDHI x2, USB2.0 x2 Network : Ethernet, EtherAVB, PCIE Debugger : 20-pin JTAG connector P/N (Part Number) Nick name Part Number Mounted R-Car E2X Status ALE6 RTP0RC77945SEB0010S R-Car E2X Package 1 (support 6-layer TH PCB) ALE4 RTP0RC77946SEB0010S R-Car E2X Package 2 (support 4-layer TH PCB) ALE6 Deliverable* E2X Deliverable in April * * TAT is 2 3 months. Page 17

18 R-CAR GEN3 Note: The given information are very preliminary as these products are still under specification! Details may change without any notice!

19 R CAR GEN3 THE NEXT GENERATION R-Car Gen 3 is under specification, first silicon planned for Q3/2015 Continue the Big.LITTLE concept with newest ARM Cortex A57 and A53 Highest embedded memory performance with LPDDR at 128bit = 51,2GB/s Use the most modern 16nm Si process (FinFET+) to reduce the power consumption and increase the performance Offer the scalability concept of R-Car Gen2 with R-Car-H3 R-Car-M3 R-Car-E3 Page 19

20 R-CAR H3 BLOCK DIAGRAM System Interrupt Controller System/Power ctrl. Clock/PLL Boot ROM Thermal Sensor 2x CryptoCore (option) JTAG Debug (Coresight) XXch DMA ctrl. Timers 4x 3ch 32bit Timer 10x 32bit Interval 7x PWM WDT Audio IPs 24bit A-DSP (Tensilica) XXch Async/SyncSRC 10ch I²S (6ch TDM possible) Audio Router XXch Audio DMA ctrl. Note: some modules are optional! Package: xxx pin FCBGA, 31x31, 0.8pitch CPUs ( =38.500DMIPS) 4x ARM Cortex-A MHz 4x ARM Cortex-A MHz (opt) ARM Cortex-R7 800MHz (opt) RAM0: 72KB SECRAM: 256KB 4x DisplayOut 1x Digital out; 1x LVDS; 2xHDMI (4K resolution) 5x VideoIn 4x MIPI-CSI2; 1x Digital PowerVR G6650 2D/3D GPU 550MHz System$ Memory RAM1: 4KB MERAM/L3$: xmb Graphic/Display IPs 4K Video Codec (or 4x HD Video Codec) VideoProcessor VSP1 JPEG Codec Unit JPU 2x Image Renderer IMR Image Processor IMP (option) Page 20 Memory Interfaces 4x 32bit LPDDR bit ExtBus/SRAM (65MHz, P-ATA mux) 2x Quad-SPI Hyperflash 4x SDIO (SDR104) emmc (5.0, HS200) Standard Interfaces 11x SCIF (UART) 4x SPI 4x I 2 C Xx CAN2.0B 3pin MLB (MOST50) EthernetAVB (1Gbps) 2x PCIe (Rev2.0, 1 lane) SATA (Rev3.2) 2x USB3.0 (Host) 4x USB2.0 (Host/function) xxx GPIOs

21 R-CAR SCALABILITY R-Car M2 R-Car M3 R-Car H2 R-Car H3 CPU 2x CA15 2x CA57, 4x CA15, 4x CA57, CPU, Drawing, Mem band width performance scaling 2x CA53, 1x R7 4x CA7 4x CA53, 1x R7 CPU max freq (MHz) /1200/ (overdrive, A57 only)* Total DMIPS (overdrive) L2$ (KB) 1024 (CA15 dual) 1024 (CA57 dual) 256 (CA53 dual) 1400/ /1200/ (overdrive, A57 only)* (overdrive) 2048 (CA15 quad) 512 (CA7 quad) 1024 (CA57 quad) 256 (CA53 quad) S3$(KB) -- tbd 2000 tbd DDR Mem (GB/s) 12,8 25,6 12,8 51,2 freq (MHz) (overdrive)* 3D Gfx (Polygon/s) 173M 275M 325M (overdrive) 3D Gfx (Pixel/s) 5200M 2200M 2600M (overdrive) 3D Gfx FP32 (FLOPS/s) 33G 70G 83G (overdrive) (overdrive)* 260M 4160M 166G 275M 325M (overdrive) 6600M 7800M (overdrive) 211G 250G (overdrive) Display resolution 150MHz (LVDS) 150MHz (LVDS) 150MHz (LVDS) 250MHz (HDMI) HD Video (H.264) 1080p30 x p30 x p60 x 2 4Kp30 x 1 *Note: Overdrive frequencies for max. 10% of key-on-time (tentative) Page 21

22 R-CAR ADAS SOLUTION

23 SYSTEM ARCHITECTURE Page 23

24 多合一 ADAS 功能多功能 3D AVM 車道偏移系統 (LDWS) 智慧型行車紀錄器 前方防撞系統 (FCWS) 速限標誌偵測與警示 車側盲區偵測系統 (BSD) 頭燈遠近光自動切換 環景視訊 (AVM) 動態倒車軌跡 後方防撞系統 (BCWS) 後車廂自動開啟 頭燈自動啟閉 依車輛大小可搭配 度魚眼鏡頭 可搭配任何 Distortion 分布之魚眼鏡頭 CANbus 介面擷取時速 方向盤角度 方向燈等訊號, 即時顯示動態倒車軌跡 AVM 主機單鍵量產系統校正技術 540 度 3D 自由視角變換 高畫質之亮度與彩度一致化 AVM 畫面 Page 24

25