SONY. CXA 1145P/M. RGB Encoder. oc oc mw (CXA 1145P) mw (CXA 1145MI. Description Packa e Outline Unit: mm. Features. Functions CXA1145M 24 pin SOP

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1 SONY. CXA 1145P/M RGB Encoder Description Packa e Outline Unit: mm The CXA 1145P/M encoder converts an analog.rgb signal to a composite video signal. CXA 1145P 24 pin DIP With its built-in circuit various pulses required for an encoder, composite video outputs are obtained just by inputting the composite sync and analog RGB signal. Features Single power supply 5 V Low power consumption ( 11 mwi Compatible both with NTSC and PAL systems Built-in 75 driver (RGB output, composite video output, composite sync output) Built-in oscillator for subcarrier External input of subcarrier is also possible. Built-in audio buffer circuit DIP-24P-1 Functions CXA1145M 24 pin SOP MTX circuit R-Y, B-Y MOD circuit Y/C MIX circuit 75 driver for RGB, composite video and composite sync outputs PAL AL T circuit BF generator Half H killer circuit Subcarrier oscillator Audio buffer circuit Structure Bipolar silicon monolithic IC " Absolute Maximum Ratings (Ta = 25 C) Supply voltage Vee Operating temperature Topr Storage temperature Tstg Allowable power dissipation Po Recommended Operating Condition Supply voltage Vee 1-2 to to ±.25 v oc oc mw (CXA 1145P) mw (CXA 1145MI v SOP 24P-L1-18- SONY reserves the right to change products and specifications without notice. This Information does not convey any license under patent rights of SONY corporation or others TO

2 SONY.. Block Diagram and Pin Configuration C SYNC CHROMA C SYNC y AUDIO CHROMA AUDIO y NTSC/PAL C VIDEO B B G G R R 19-

3 CXA1146P/M SONY., Pin Description No. Symbol Equivalent circuit Description 1 GND 1 2 R 3 G 4 B 2 ' l k )-, r/r GND pin for circuits other than otputs of RGB and composite video. Connect with GND 2 using an impedance as low as possible. Input pin for the analog RGB signal. Input with 1% = 1 Vp-p. It is necessary to input with an impedance as low as possible to minimize the clamp error allowance. 6 XO 5 t 6 XO 6 Ji'>r 1 Pin for the x'tal OSC. For inner oscillation. a crystal oscillator is con nected. For external oscillation, Input to pin 6 XO through a coupling capacitor. Input with the sub-carrier Input level at 4 mvp-p to 1, mvp-p. For external oscillation, input a sine wave with enough less distortion. With much distortion, the chroma signal's phase property may de teriorate. " + +. j J Switching pin between NTSC and PAL mode. 7 NTSC/PAL. J Vee NTSC 7 I GND PAL,...,. I I 11-

4 SONY.. No. Symbol Equivalent circuit Description 8 AUDIO 8 J J Input pin for the audio buffer circuit. I The input impedance is about 25 kq ;;7 ;;7 9 AUlD 9 Output pin for the audio buffer circuit. r,7 Input pin for the composite sync signal. 1 C SYNC Input with the TTL level. 1 L (;;>.8 V): Sync. H ( 2. V) 7j 11 C SYNC Output pin for the composite sync signal. Capable of driving a 75 load direct. 11 r 7i'7 12 Vee 1 Power supply pin for circuits other than RGB and composite video output circuits

5 SONY., No. Symbol Equivalent circuit Description 13 I REF 13 r (' Pin to determine the inner reference current. Connect to GND via a 27 ko resistor. 14 VREF 14 7i'T I Pin for the inner reference voltage. Connect to GND with 1,.F. 15 C 16 Y ;;'r T. 1r- Chroma signal output pin. Connect a Band Pass 15 Filter (BPF) between this pin and pin 17 (C ). 7i'T 16 ;;'r 1r- Y -- I signal output pin. Connect a delay line between this pin and pin 18 (Y). 17 C J 17 l Input pin for the chroma signal without harmon- ic distortion after BPF. 7i 7tT -112-

6 SONY No. Symbol Equivalent circuit Description 18 Y 18 Input pin for the Y signal with delay after the delay line.,,. + Power supply pin for RG8 and composite video output circuits. 19 Vcc2 Decouple with a large enough capacity as a massive current flows. Output pin for the Y/C MIX circuit. The compo- 2 C V site video signal is output. This output can 19 drive a 75 load direct. l... :r.lr Output pin for the analog RG8 signal..) 22 G 1 Capable of driving a 75 load drive :7 '"" GND pin for RG8 and composite output circuits. 24 GND2 Connect with GND 1 using low impedance as possible

7 SONY., Electrical Characteristics Ta = 25 C, Vee= 5V, See the Electrical Characteristics Test Circuit Item Symbol Conditions Test point Min. Typ. Max. Unit Consumption current 1 lcc1 S1 S2 S3 ON rna Consumption current 2 lcc2 SG5 DC=2. OV I rna VoiR) R = 1 Vp-p, f = 2 khz, Fig. 1 F RGB output voltage Vo(G) G=1Vp-p,!=2kHz, Fig. 1 E Vp-p VoiB) B= 1 Vp-p, f =2kHz, Fig, 1 D fcir) F Frequency when an output be- RGB output frequency response fcig) comes -3 db with the output of E 5. MHz - f = 2 khz in Fig. 1 set to db. fcib) D Composite video output: Sync level R 1%: Y level G 1%: Y level B 1%: Y level White 1%: Y level Vo ICS) Vo IYR) 56 ON, Fig. 2 c Vp-p S1 S6 ON, Fig. 2 c v Vo S2 S6 ON, Fig. 2 c v IYG) Vo IYB) S3 S6 ON, Fig. 2 c v Vo S1 S2 S3 S6 ON, Fig. 2 c v (YW) y GviY) S6 ON, Fig. 3 c Voltage gain db M c GviC) 56 ON, Fig. 3 c I X y fciy) S6 ON, Fig. 3 c Frequency response 5. MHz c fcic) S6 ON, Fig. 3 c A M Differential gain DG S5 S6 ON, Fig. 4 c 3. % p Differential phase DP S5 S6 ON, Fig. 4 c 3. deg Burst level R chroma ratio Vo IBN) R/BN Fig. 6 c Vp-p Level ratio between R and burst In c Fig. 5 R phase OR R phase In Fig. 5 c deg G chroma ratio G/BN Level ratio between G and burst in c Fig. 5 G phase OG G phase In Fig. 5 c deg B chroma ratio B/BN Level ratio between B and burst in c Fig. 5 B phase OB B phase In Fig. 5 c deg PAL burst level ratio K(BPI Burst level ratio between S4 ON, c PAL and PAL in Fig

8 SONY., PAL burst phase Item Symbol Conditions Test point Min. Typ. Max. Unit IIPAL 8PAL Burst phase of S4 ON, PAL in c Fig. 5 Burst phase of S4 ON, PAL in c Fig. 5 Burst width tw(b) Fig. 5 c l's Burst position tdib) Fig. 5 c l's Carrier leakage VL Fig. 5 c 2 mvp-p Composite sync output voltage Vo(S) Fig. 7 B Vp-p " < Distortion factor THO V=1.Vp-p, f=1khz, Fig % deg Electrical Characteristics Test Circuit 2.V I Voltage gain Gv(A) V=1.Vp-p, f=1khz, Fig db Frequency when an output be-.c " Frequency response fc{a) comes -3 db with the output of A 3 khz.2 -c f=1 khz in Fig. 6 set to db

9 SONYe Test Signal SG5j r--- 2.V CSYNC U U -= I co:=_: O.BV 4. / /iS OV SGl-31 n-;-; R L j L_jVp p G!=2kHz B Point@ l IT,;: R L j L_jo G OJJT B Fig. 1 SG52.V C S 1 NC ::.--.:V SG6, 7 C ---t======r--rr= 2.25V Y Point.5Vp p!=2khz c VIDEO --t======f--frt;tij Gv<c = Vo<c> Fig. 3 rn_o,c o. 5 or Vom Gvm= Vom.5 SG5ir--2.V C SYNC U U O.BV OV SG6 G SG , R _j L_j L J OVp p SG 2 r---1 It," G.:. j L jovp-p sg3 n n n n n1 B j U U U L 1 U l.ovp p Point C VIDEO SG5 I r-- 2.V C SYNC U U... O.BV ov SG 5 I r-- 2.V C SYNC U U.. O.BV OV SG 6 [L C --f------l--f-rn;h-3vp p II II IT SGI R j L j L j L l.ovp p SG2 G j r---1 L j_ 'I l.ovp p SG 3 B' Point C VIDEO _jljlju1_jti 1 vp-p Fig. 5 R/BN = VOICRI Vo<BN> G/BN= VO<CGI Vmn> B/BN= VOICRI V<HDl Point C VIDEO Fig. 4 SG 4 AUDIO! IJV = l.ov1 -P f=lkhz Point, , AUDIO Fig. 6 Ivow Gvw= Vow VIS SG 5 I r V C SYNC U U. O.BV OV Point -, r--} C SYNC U U _ Vms> Fig

10 SONY Burst Signal CXA 1145P/M generates the burst signal in the timings below following an input composite sync. C SYNC (TIL level) l Ll j CVIDEO C SYNC C VIDEO ODD llilfljltirruuuuuummllj11j EVEN L'lllmllruuuuuunn-n1nr11 ODD EVEN trtrhk: - Sync Burst lhlffihtuuuuuurtnhir1j--.j -117-

11 SONY11 Application Circuit (NTSC mode) R G 8 V1DEO {)Wv <How to supply subcarrier externally> When a subcarrier is added externally, this section will be as follows: To.1" 6 S WAVE T2 4 to 1 mvp-p < How to adjust the oscillation level> Regulating the trimmer capacitor, set XO out level between 4 to 1 mvp-p. fo ADJ R G 8 ALQIO AWIO C SYNC C SYI\C JN Application Circuit (PAL mode) r o * Metal film resistor ± 1 % BPF: Toko H287BSJS-318HWD DL: Matsushita ELB-5F2N <How to... > When a subcarrier is added externally, this section will be as follows: - TQ.1)J 6 S WAVE T2 4 to 1 mvp-p < How to adjust the oscillation level> Regulating the timmer capacitor, set XO out level between 4 to 1 mvp-p. R G 8 ALK> AUDIO C SYNC C SYNC * Metal film resistor ± 1 % BPF: Toko H287BSJS-318HWD DL: Matsushita ELB-5F2N '<How to set to NTSC/PAL modes> To set to NTSC/PAL modes, connect CXA 1145P's pin 7 to 9 either Vee (supply pin) or GND. Connection to Vee produces NTSC mode, and to GND PAL mode. This is executed by connecting the jumper line of the desired mode on the evaluation board

12 SONY.. CXA 1145P Evaluation Board Pins Description Symbol Description R G B SC AUDIO AUDIO C SYNC C SYNC R G B VIDEO Vee GND Input pin of the analog RGB signal Pin for the external sypply of the subcarrier. For the connection in this case. See the subcarrier external supplying method. SC = 4 mvp p to 1 mvp-p Input pin of the audio buffer amplifier Output pin of the audio buffer amplifier Input pin of the composite sync signal C SYNC = TTL level (L;;;O.BV, Hs:;2.V) Output pin of the composite sync signal Output pin of the analog RGM signal Output pin of the composite video signal Supply Vee = 5V GND pin -119-

13 SONY., CXA 1145P EVALUATION BOARD SONY MADE JAPAN Parts arrangement diagram (parts side) Pattern diagram (reverse side) -12-

14 SONY.. RGB output voltage temperature characteristics Burst signal level temperature characteristics c. Ql Ol:> 1 - g 5;; e...: o.7 ::1 o-;: co> <!I a:g > R.G.B I-- R1s, Gn<, '" :. 1 V [! P!=2kHz Ta - Ambient temperature (DC) Chrome ratio temperature characteristics. -.4,.g! ro o.3 c: Ol 'iii () i!.2 ::l co z.1 co Ta -Ambient temperature (DC) Composite sync signal output voltage temperature characteristics p t t L_=$=$:: E e cj _ 2 f-+--f----lf-+--+,r_ s_, G+'-"-' B,_'_" -+:_1 V-.:'p+ :_P --1.! il-+--l i..4 ) u; c o c: Ql.3 g> Ql 1;1 g....2 O.::l ge u 5.1 C SYNC : TTL LEVEL -m o m w 8 8 Ta -Ambient temperature (DC) VD(CB) Vo(CR) Vo(CG) B/BN=-- R/BN=-- G/BN--- Vo(BN) VD(BN) -Vo(BN) Audio buffer amplifier distortion factor temperature characteristics Ta - Ambient temperature (DC) Audio buffer amplifier voltage gain temperature characteristics ( c: e...., Q J: t- 3 2 AUDIO : IVp-p I I I f=lkhz Load resistance : lok o Ta - Ambient temperature (DC) - > (!) AUDIO : IVp-p I I I f=,ikl\z _ Load resistance :!Ok o -m o m w 8 8 Ta - Ambient temperature (DC) -121-

15 SONY&.!2... e c k Audio buffer amplifier frequency characteristics Ill I IIIII Load resistance : 1 k Q AUDIO :!Vp p 5k 1M 5 M!OM Frequency (Hz) 1 ::g.;::; e - I 5-2 c. 5-3 RGB output frequency characteristics II II II I RI. Cf', BI: I Vp p, DC2.V T\ I \! II. 5k I M 5M!OM Frequency (Hz) T 5M Note) For details refer to the test signals in the Electrical Characteristics Test Circuits. -122