Effortless handling of height and position values

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1 Newsletter No /2017 Editorial Volker Pape Dr. Martin Heuser Dear Readers, Have you already found out about the topic of digital transformation? Or are Optimal optical 3D solder joint measurement from Viscom you engaged with the topic Industry Effortless handling of height and position values 4.0? However you prefer to call the direction in any event, stay on the ball. Since we work in a branch in which these topics are at least obvious, most of us are already on the way. And we With a combination of intelligent soft- fy height and position values. Users can also understand the aids very well. This ware and the high-performance camera easily interpret these intuitive values in is why today, with the Quality Uplink module XMplus, Viscom AG is perfect- practice. package, the Big Data concept and the ing automatic optical inspection (AOI), open interface for communication with which also includes optimal 3D solder systems from other manufacturers, joint measurement. As a result, users Viscom already has a few tools in the receive definite and easy-to-interpret kit to advance production and process information and, with it, the best pos- for all its customers. In the future, we sible quality assurance for electronic will also offer you a few cost-effective components. solutions that realize cutting-edge concepts in the service and support area Exact and efficient and help you work faster and more ef- Solder joint measurement using 3D AOI ficiently in your daily business. Be ready is a central component of this year s for surprises from our ideas. spring release of vvision and SI. The access via the new software versions Best regards, continued on page 2 Contents Technical Article n Optimum 3D solder joint measurement Products n S3088 ultra gold at ELRAD Page 2 n Viscom Open Interface 4.0 Page 3 n 3D AXI system X7056-II for high-end production Page 4-5 n New camera module XM Bond HR to exact measuring results helps users to Company create 3D AOI inspection programs and n DELTEC relies on networked thus ensures a high efficiency. Page 1-3 3D inspection Page 5 Page 6 n Viscom Technology Forum Volker Pape Executive Board Viscom AG Dr. Martin Heuser Executive Board Viscom AG The three-dimensional measurement with the high-speed Viscom XMplus camera module produces easy-to-classi- on June 21 and 22 Page 7 n Viscom Service order processing team visits Bosch Page 7

2 Technical Article continued from page 1 Quality of the data is extremely important for accurate, reliable measurement. To evaluate a solder joint with 3D AOI from Viscom, several height profiles are measured at the solder meniscus with a high resolution of 10 µm. The XMplus camera module is optimally suited for this sophisticated task. Its angled cameras ensure the best panorama view of components and their solder joints from all eight directions. The high-performance software used also guarantees maximum speeds throughout the measurement and inspection process. Unequivocal back calculation Calculating the position and height of any point on the electronic assembly requires the unequivocal back calculation of projected patterns (fringe projection method). One or several projectors map the printed circuit board through an overlaid pattern of stripes in grayscale values. To obtain distinct average values, three phase shifts of the projected pattern must be acquired from each of at least The better the 3D signal quality, the more exact the 3D measurement will be two perspectives. The more perspectives are used, the more reliable are the measurements, for example, because shadowing from tall components no longer has a disruptive influence. Projection of the stripes, or pattern, takes various forms. Numerous narrow stripes serve to improve the resolution of the depicted object. In turn, wide stripes enlarge the possible measurement area. The exact spatial positions of the individually measured points are determined by means of a triangulation process. Results easy to interpret The measured profiles of a solder joint are evaluated using a mathematical procedure and presented in an easily interpreted overall result. An additional advantage: This improved evaluation results in fewer Highly advanced 3D measurement S3088 ultra gold asserts itself at ELRAD After an intensive 3D-AOI benchmark, the Slovenian company ELRAD International d. o. o. has decided on the S3088 ultra gold. The photo shows from left to right AOI process specialist Martin Znidaric and head of technology Simon Jug from ELRAD together with sales engineer Nikola Vujanovic from Stepan GmbH, who processed the sale of the Viscom system. A well-known 3D AOI supplier also took part in ELRAD s benchmark. After intensive tests and comprehensive evaluations, the 3D AOI solution from Viscom clearly asserted its strengths. Better resolution and top reliability were the primary convincing features of the S3088 ultra gold. The Viscom system also scored points with its highly advanced possibilities for 3D measurement. In the company s Slovenian factory in Gornja Radgona, the S3088 ultra gold employed by ELRAD inspects electronic assemblies populated with LEDs, which are used in vehicle headlights and taillights. 2

3 Technical Article false calls and thus increases production efficiency. This combination of intelligent software and very powerful hardware offers customers options for efficient use. Besides evaluating solder joints, exact detection of component orientation is also an increasingly important application. For example, in the ever-smaller LEDs that are increasingly being installed in vehicle lamps and headlights, even minimal tilting is a defect. Exact measurement values are needed for a final quality evaluation, and these are ensured with a Viscom 3D AOI. Networked use of 3D AOI At Viscom, solder joint measurement is embedded in a broad concept of the optimal use of 3D AOI. The possibilities range from the linking of relevant 3D SPI, 3D AOI and 3D AXI/MXI data to bundled verification of inspection results from different sites and the effective use of the smartphone. Viscom Download Optimum 3D application in automatic optical inspection: Viscom Open Interface 4.0 Ultra-modern data exchange in production Printer 3D SPI Placement machine 3D AOI Quality Uplink 3D AOI/3D AXI Verification 3D MXI Combination of the inspection results with the Viscom Quality Uplink Viscom AG inspection systems meet two important requirements of Industry 4.0: Within the framework of big data they have long provided large amounts of information for external evaluations, which are used especially in combinations of several Viscom systems, and now they also integrate systems from other suppliers into their interlinked processes. Embedded SPI system These options are bundled under a new product name: Viscom Open Interface 4.0. For the time being, it is available for the software platform SI and consists of two components. The first is an open interface to SPI systems from any manufacturer. The second provides users large amounts of information from inspection processes for a wide variety of evaluations. Above all, the open SPI interface makes it possible to merge results from Viscom automatic optical inspection (AOI) and X-ray inspection (AXI/ MXI) with the SPI data of another system manufacturer, and to do it so well that the user hardly notices the difference in origin. Users can call up SPI image data on the verification station and link them there with SPI inspection results and measurement values as well as different Viscom inspection data. If the SPI system classifies solder deposits as defective, it also can call for additional images from the Viscom systems interlinked with it. For these functions, Viscom provides, in standardized form, a dynamic program library and function calls that enable other 3 suppliers of SPI systems to connect their software to the Viscom interface. The second component of the Viscom Open Interface 4.0 is very powerful interfaces for big data. The background: Production processes today provide a wide array of information that can be used in companies for process-related evaluations. For exactly this purpose, Viscom inspection systems can provide information amounts per printed circuit board in the megabyte range. These include inspection results and component names, among others. If other systems use the customer s database in a similar way, cross-references that would otherwise remain hidden can be made based on the component name, for example.

4 Products New 3D X-ray system from Viscom Extremely fast handling coupled with high inspection depth The newest automatic 3D X-ray solution from Viscom is extremely gratifying: Very short handling times in combination with outstanding image quality and expanded inspection depth predestine the inspection system X7056-II for use in high-end electronics production. 3D AXI with vvision The X7056-II system with automatic X-ray inspection (AXI) in the 3D variant guarantees high inspected product quality. Special highlights are the fast transport xfastflow and 3D AXI with the vvision operating software. The X7056-II offers an extraordinarily high 3D image quality that shows interfering structures considerably reduced. Together with fast handling, the X7056-II is the optimal solution for sophisticated 3D inline X-ray applications. Based on FastFlow, the fast handling option for Viscom AOI systems, a fast concept for handling is now available for X-ray inspection: With xfastflow, the system is ideally suited for use in produc- The new Viscom 3D X-ray inspection system X7056-II tion lines that require high throughput selectively, can be expanded to cover far despite extensive inspection of hidden more than just individual components. solder joints. Through use of xfastflow, By taking advantage of the third dimension, users have the benefit of an unshad- the time needed for component infeed and outfeed is cut by more than half, and owed view of components and hidden up to three boards can be in the system solder joints. The X7056-II, with the help simultaneously. Due to the time saved, of the planar CT, can automatically resolve any covered areas on double-sided 3D inspections, which used to be done printed circuit boards to clearly reveal important defect features and allow exact evaluations. During periods of high packaging and placement densities, this results in fewer false calls and so more efficient production. This also makes program generation simpler. Slice image of a printed circuit board section with BGA (ball grid array) Combined inspections The hardware components of such a system must be selected carefully. A powerful flat panel detector, movable on an 4

5 Products familiar, rigid detector solutions is the ability to employ 2D and 3D inspections on a component, both selectively and combined. In particular, the optimized image acquisition positioning results in a further increase in speed or optionally an even better image quality. The system, like its predecessors, can be expanded to an AOI/AXI combination system. As with optical inspection, 3D is an important factor in X-ray inspection as well; here is an example with a BGA xy-table, ensures first-class 3D image quality. As the number of acquisitions increases, the precision of the required calculations also rises. This is flexibly determined according to the type of main application to achieve an optimal compromise between cycle time and inspection quality. A big advantage over Successful combination Electronics manufacturers will be convinced: The combination of fast programming, extremely high 3D image quality and intuitive operating concept makes the X7056-II a successful system advance in the area of 3D X-ray inspection. Viscom presents new camera module XM Bond HR High resolution for in-line wire bond inspection Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. Premium quality components With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden. Improved image acquisition quality A focus area optimally adjustable to the object height is ensured by an integrated z-axis with 20 mm travel. And Viscom has also further improved optical compensation of height differences for greater image acquisition quality. At the same time, the possibilities of purposeful illumination for different specific applications have been expanded. The XM Bond HR is especially suited for the in-line systems S6053BO-V and S6056BO from Viscom which, among other features, are distinguished by versatilely configurable transport and handling. This camera technology is controlled through the SI software platform with the same familiar ease operators know from other Viscom solutions. Consequently, production lines can now be equipped with even better technology for wire bond inspection that stands up to the highest demands for throughput, cycle time and inspection depth. 5

6 Company Networked 3D inspection from Viscom at DELTEC Strong partners on the entire line The paste inspection with 3D also has proven its worth at DELTEC: With this inspection technology, we are handed information about volume, paste height and other aspects and suddenly see, there are actually differences between one and another of the components which could not be determined in any other way, states Thomas Fischer, manager of production and process technology at DELTEC. The company deploys the automatic data exchange from Viscom (Closed Loop) between the Viscom S3088 SPI solder paste inspection systems and the Panasonic SP18 stencil taillights are foremost. One essential criterion at DELTEC is the quality of solder joints on modern LED types. In many cases, they can only be inspected with X-ray. If defects such as air inclusions or solder beads are then identified, the result of the paste inspection system is extremely important. This is where DELTEC employees use the possibilities provided by the user-friendly data connection from Viscom. Merging the information with the help of the Viscom Uplink Process Analyzer (VUPA) software tool makes fast optimization of production processes a reality. Thomas Fischer, production and process technology manager at DELTEC, Harry Kuckelkorn, general manager at DELTEC, and account manager Walter Schneider from Viscom in front of the S3088 SPI For solder paste inspection (SPI), automatic optical inspection (AOI) and automatic and manual X-ray inspection (AXI/MXI) technologies, DELTEC Automotive GmbH & Co. KG in Furth im Wald, Bavaria, Germany, relies on 3D systems from Viscom AG. Their user-friendly advantages are clearly evident. In the AOI area, DELTEC uses 3D inspection especially for detecting SOT (small-outline transistor) component bodies because this inspection technology has been proven to be the best for this task. The company uses the 3D AOI systems S3088 ultra and S3088 ultra gold from Viscom in its production lines. 3D SPI for more information printers in their lines. Depending on the solder paste offset values determined by the 3D SPI system, the print offset is automatically corrected over several printed circuit boards. With this approach, instead of in one single step, an offset is corrected in several intermediate steps. This method achieves the optimum result. Components from DELTEC are found, for example, in vehicles from the best-known European automotive manufacturers. In addition to ignition and control electronics, window control systems, sensors and USB charging adapters, headlights and DELTEC had a Viscom X7056RS equipped with its AOI and AXI functions so they could run a combined inspection in cases where the automatic optical inspection comes up against its limits, due to shadowing or other hindrances. Additionally, the company uses the Viscom X8011 PCB plus for manual X-ray inspection. Statistics and evaluations Statistical process control (SPC) from Viscom is used for evaluating real defects. Each production line is equipped with an SPC monitor. For example, when a real defect is classified on the AOI system, the corresponding display promptly appears on the line and the operator receives justin-time information indicating whether the specified limits are maintained or intervention is called for. Viscom Download You will find an in-depth case study about the company DELTEC under: 6

7 Invitation to Hanover-Badenstedt Viscom Technology Forum starts June 21 there were also tutorials, which were directed primarily towards newcomers. This multi-faceted arrangement has proven itself and so remains unchanged this year. Value takes center stage Value to our visitors very clearly takes center stage, emphasizes Martina Engelhardt, Head of Marketing at Viscom Impressions from Viscom Technology Forum 2016 Up-to-date industry information as well of products in the SMT process. And the positive experiences with the inno- as a host of opportunities for guests there will also be no shortage of system vations in 2016, Viscom will tailor the and inspection experts to share expe- demonstrations and presentations that individual formats even more closely to riences are waiting for participants in allow visitors to broaden their horizons. participants needs. 21 and 22. This year s topics will include, At last year s Technology Forum, Viscom in particular, practical solutions in the customers could choose between in- realm of Industry 4.0, such as standard- formative presentations, user-oriented ization between workshops and opportunities to speak Registration and responsible for the event. Based on machines or intelligent identification with experts on specific topics and this year s Technology Forum on June of communication Viscom Technology Forum June 21 22, 2017 /TF-EN-03 Viscom Service order processing team visits Bosch Experiencing electronic assembly production at first hand ing last January. Bosch engineer Juergen understand it. Robert Bosch Elektronik Hoeren (right in image) explained the Salzgitter employs the Viscom systems product range at the location and guided X7056RS and S6056 in its lines and has the visitors through production. Susanne realized important technical upgrades Rettschlag, Ann-Kristin Gerholz, industri- through the Service unit at Viscom. al clerk trainee Dirk Schulz and Myriam The process from bare printed circuit Dörner (left to right) experienced more Among the current Service offerings for about today s engine control units for ve- Viscom customers in the automatic X-ray hicles and their manufacture. inspection area, Henning Obloch highlights the replacement of the image inten- board to finished electronic device is complex, but also very exciting and inter- The photo was taken by Henning Obloch, sifiers on X7056RS systems by flat panel esting. The Viscom Service order process- Vice President of Business Unit Service detectors (FPD), with or without cross ta- ing team was certainly convinced of this at Viscom, who stated: The team could ble. Furthermore, he mentions the S6056 after their visit to Robert Bosch Elektronik also see the environment our inspec- AOI systems that can be retrofit with mod- GmbH in Salzgitter, Germany, one morn- tion systems work in and come to better ern XM 3D camera technology. 7

8 Imprint Publisher: Viscom AG Carl-Buderus-Straße Hanover Germany Tel.: Fax: Editor: Olaf Szarlan Tel.: Graphics and Layout: Johannes Strohmeier #Viscom_NL_37_04/2017 _EN