News in Photodetectors
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1 15th International Workshop on Next generation Nucleon Decay and Neutrino Detectors APC laboratory, Paris, November 6 th 2014 News in Photodetectors Véronique PUILL
2 Outline Brief overview of the news concerning the: SiPMs (Digital SiPM in the backup slides) PMTs MCP-PMTs Just a few examples (20 mn ) Véronique V. PUILL,,,, Photodetectors Nov
3 SiPM Producers in the word ZECOTEK KETEK CPTA Mephi MPI Philips JINR HAMAMATSU RMD NDL A lot of R&D these last 10 years sensl AdvanSiD STMicroelectronics Improvement of all the characteristics of this device, some examples 3 V. PUILL,, Photodetectors
4 Gain of SiPM HAMAMATSU S C SiPM KETEK W12 T. Okubo, ATHIC 2012 SiPM CPTA 857 E. Van der Kraaij, AIDA 2013 MPPC 1 mm² 10 5 < gain< 10 6 linear increase of the gain with Vbias Gain independent of the temperature at fixed V J. Cvach, arxiv: v1] H. Tajima, 2013 CTA SiPM meeting 4 V. PUILL,, Photodetectors
5 PDE of SiPMs in the visible range Y. Musienko, INSTR14 F.Wiest AIDA 2012 Y. Musienko, INSTR14 HAMAMATSU High PDE: in the blue region: % in the green region : % V. Chaumat, PoS (PhotoDet 2012) 058 Wavelength [nm] 5 V. PUILL,, Photodetectors
6 A. Ferri, NIMA 718 (2013) NUV and VUV SiPMs D. Kaneko at al, IEEE NSS 2013 Proceedings FBK NUV-SiPM Excelitas NUV-SiPM Designs available: 1x1, 2x2, 3x3, 4x4mm 2 PDE (350 nm) = 20 % DCR = 4 20 C ( V = 5V) 1x1mm 2 50x50 µm 2 cell 1 1 mm² (cell size = 100 µm) PDE (350 nm) = 50 % DCR = C ( V = 4V) E. Popova, NDIP2011 HAMAMATSU Deep UV-SiPM sensor size: 12 12mm² (cell size = 50 µm PDE (175 nm) = 17 % (best sample) Gain K DCR = 165 K decay time ns = 175 nm 6 V. PUILL,, Photodetectors
7 New low Dark Count rate (DCR) Average frequency of the thermally generated avalanches breakdown process that result in a current pulse indistinguishable from a pulse produced by the detection of a photon. Few 100kHz/mm² < DCR < 1 MHz/mm² till room temperature DCR of most recent devices few 10 khz/mm² Best way to decrease the DCR : operate the SiPM at lower voltage cooling (factor 2 reduction of the dark counts every 8 C) Y.Uchiyama et al, IEEE NSS V. PUILL,, Photodetectors
8 Afterpulses (%) After-pulses improvement Breakdown production of a large number of charge carriers some of them are trapped in deep trap levels These carriers may be released at some time and trigger a new breakdown avalanche event : afterpulse (described in term of probability) Impurities (Iron, Gold) and defects (point, dislocation) create deep levels in the band gap before after Minimization of the amount of impurities in the avalanche region employing pure Si wafers and new process conditions >20% :Conventional MPPC :New MPPC <3% After-pulse proba < 10 % for most of the SiPMs on the market K. Sato, VCI 2013 Overvoltage (V) 8 V. PUILL,, Photodetectors
9 Cross-talk enhancement Y.Uchiyama et al, IEEE NSS 2013 avalanche in one cell probability than 1 carrier emits photons with E > 1.12 ev A. Lacaita, et al., IEEE Trans. Electron Devices ED-40 (1993) 577 these photons ( 30 for a gain of 10 6 ) can trigger another avalanche in a neighboring cell without delay A. Ferri, IPRD13 One solution to decrease the optical isolation between the cells: etching trenches filled with opaque material D. McNally, G-APD workshop (2009) less than 15 % of crosstalk for low overvoltage which is at least a factor 2 better than with the old geometries V. PUILL,, Photodetectors
10 (Sigma) Timing resolution G. Collazuol, NIM A 581 (2007) SPTR as a function of the temperature V. Puill, NIMA 695, 2012 Timing resolution as a function of the incident number of photons FBK P.W Cattaneo, arxiv: v1 40 ps < SPTR ( ) < 60 ps 10 V. PUILL,, Photodetectors
11 A. Rychter, Proc. of SPIE Vol High density SiPM high linearity Y. Musienko, NDIP-2011 HAMAMATSU 1 mm² 4489 cells cell size : 15 µm gain = 2x10 5 : 15um New : 15um Conventional KETEK MP15 V6 W8: 1.2x1.2 mm², 15 µm cells 15 µm 20 µm MP20 V4 W12: 3x3 mm², 20 µm cells E. van der Kraaij, LCD ECAL meeting 2014 ZECOTEK MAPD-3N 3 x 3 mm² cells (15000/mm²) gain = 10 5 slow cell recovery time : 80 ns /pulse!!!! V. PUILL,, Photodetectors
12 Radiation-hardness of SiPMs 150 mv protons / neutrons bulk damages caused by lattice defects γ rays, X-rays creation of trapped charges near the Si insulator interface increase of the dark current and the DCR change of the breakdown voltage change of the gain and PDE dependence as a function of bias voltage High neutron fluences high dark noise large size cells (we need them for high PDE!!) are permanently fired V-VB approaches 0 significant drop of the SiPM PDE and gain SiPM has low PDE, gain and it is useless as a photodetector for the calorimetry (Y. Musienko, NDIP14) DCR DCR Before irradiation 4 mv 5 x 10 9 neq/cm² 70 mv W. Baldini, TIPP 2014 Wander Baldini, TIPP V. PUILL,, Photodetectors
13 Y. Musienko, NDIP 2014 Good resistance to neutron irradiation HAMAMATSU, FBK, NDL, ZECOTEK, KETEK developed devices with improved radiation hardness HAMAMATSU, KETEK and FBK SiPMs survive n/cm² 1 MeV equivalent neutron flux (it was 10 8 n/cm² 3 years ago) At high neutron fluence a decrease of the Gain*PDE is observe can be recovered by bias voltage increase. 13 V. PUILL,, Photodetectors
14 Large SiPMs Large SiPMs: large sensitive area but high DCR Excelitas C ASD-SiPM4S sensl C-series HAMAMATSU S10985 KETEK PM6060 STMicroelectronics Producer Reference Area (mm²) PDE 25 C * Dark Count Rate max 25 C * Gain * EXCELITAS C x nm FBK - AdvanSiD ASD-SiPM4S 4 x nm HAMAMATSU S C 6 x nm (includes afterpulses & crosstalk) SensL C-series 6 x nm ( 21 C) KETEK PM x nm STMicrolectronics SPM35AN 3,5 x 3,5 420 nm * datasheet data 14 V. PUILL,, Photodetectors
15 Matrixes: SiPMs discrete and monolithic arrays Segmentation of the light detection + need of larger active area SiPM matrix FBK ASD-SiPM4S-P-4 4T-50 HAMAMATSU S Zecotek 4x4 channels 1 channel = 4x4 mm² 6400 cells (50 x 50 μm²) /channel ASD-RGB1.5S-P-8x8A MONOLITHIC 8 x 8 channels 4 sides tileable 4x4 channels 1 channel= 3 x 3 mm² cells (25 x 25 μm²) /channel S MONOLITHIC 4x4 channels 1 channel = 3x3 mm² 3600 cells (50x50 μm²)/channel 3 sides tileable 8x8 channels 1 channel = 3x3 mm² cells /channel Sensl ArrayB-600XX-64P 8x8 channels 1 channel= 6 x 6 mm² Through Silicon Via Technology + high precision assembly Discrete Array like monolithic array! S PA cells /channel new surface mount package 8x8 channels 15 V. PUILL,, Photodetectors
16 Progress in PMT & MCP-PMT developments 80 years of existence and still in R&D! some examples Pour plus de modèles : Modèles Powerpoint PPT gratuits Page 16 Véronique PUILL,, Nov
17 Improvement of Q for large PMT and for UV light Y. Yoshizawa, Photodet 2012 Large water Cherenkov and scintillator detectors for long baseline neutrino oscillations, proton decay, supernova and solar neutrinos experiments Need for PMT with: R11780 (12-inch) large-area high Q in UV Y. Yoshizawa, Photodet 2012 J. Brack, arxiv: v2 Scintillation detector for Dark Matter experiments (scintillation light from Xe nuclear recoil resulting from the scattering of WIMPs*) need for Ultra low background PMT working at low temp 3- inch metal bulb PMT 76 mm Extremely low radioactivity (radiopure composition) Low temp: Liquid Ar (- 186 C) more info: talk of G. Fiorillo * WIMP: weakly Interacting Massive Particles 17 V. PUILL,, Photodetectors
18 Improvement of the timing response Fast time response PMTs are interesting for HEP and PET application Need of PMTs with quite large photocathode and good TTS R&D in the structure of the PMT: accelerating electrode Better TTS: from 550 ps to 270 ps HPK, private communication 18 V. PUILL,, Photodetectors
19 Decrease of the after-pulse Another R&D in the structure of the PMT: dynode Lower after-pulse old new HPK, private communication 19 V. PUILL,, Photodetectors
20 Latest MaPMT developments MaPMT with SBA, UBA and extended green Bialkali photocathode Extended green bialkali PC (Q = nm) 2 x 2 multianode 4 x 4 multianode 8 x 8 multianode Compact packaging multianode «flat» PMTs 20 V. PUILL,, Photodetectors
21 Latest MaPMT developments H12700 MaPMT With optimized dynode structure: higher collection efficiency better SPE resolution enhanced cathode sensitivity slighter lower gain modest increase of dark current M. Contalbrigo, NDIP14 C. Pauly, RICH V. PUILL,, Photodetectors
22 MCP-PMT gain & quantum efficiency A. Lehmann, RICH 2013 Examples of MCP-PMT Photonis BURLE BINP HAMAMATSU Q 20 % (in blue) 10 6 < gain< 10 8 BINP A. Lehmann, RICH 2013 M.Barnyakov, AFAD V. PUILL,, Photodetectors
23 MCP-PMT aging High photon rate aging problem technical developments to solve it: Improve vacuum quality Make more robust photocathodes Investigate alternative MCP materials Implement ion barrier film: 5-10 nm Al 2 O 3 on MCPin with 40% reduction of collection efficiency between MCPs PHOTEK L. Castillo García, NDIP14 F. Uhlig, NDIP14 23 V. PUILL,, Photodetectors
24 MCP-PMT time response J. Vavra, SLAC-Pub high electric field between PC and MCPin and MCPout and anode negligible effect of the angle distribution of the p.e PHOTEK PMT110 Single Photoelectron Timing resolution SL nm 3.5 kv e- transit time in the secondary multiplication process very short very good TTS ps ( ) J. Milnes, PHOTEK L. Burmistrov, LAL BINP A. Yu. Barnyakov, NIMA V. PUILL,, Photodetectors
25 New MCP-PMT developments Chinese R&D more info: talk of M. Sanchez S. Quian, NDIP14 25 V. PUILL,, Photodetectors
26 Conclusion 26 Véronique V. PUILL,,,, Photodetectors Nov
27 Summary of the photodetectors characteristics (max value) PMT MCP- PMT High gain (10 6 ) with V Low noise High quantum efficiency (35 % in blue) Large area (> mm²) Large number of configurations Commercial products since 70 years High gain (10 7 ) High quantum efficiency (20 %) Very good timing properties (SPTR = 30 ps) Non linearity Response uniformity Affected by magnetic field Long-term stability Fragility Only 2 producers on the market Affected by magnetic field Fragility Cost SiPM High gain ( ) with low voltage (< 100 V) Single photo detection Good timing resolution (SPTR = 50 ps) Insensitivity to magnetic field (up to 7 T) High photon detection efficiency (50 % in blue) Mechanically robust A lot of R&D and different producers Low cost mass production possible (ex: T2K) High dark count room temperature for large device ( 9 mm²) High temperature dependence of the breakdown voltage, the gain Small devices Few geometrical configurations available 27 V. PUILL,, Photodetectors
28 Documentary sources and for more explanations Lectures and Revues : IEEE NSS 2012: Vacuum based photodetector, Katsushi Arisaka PhotoDet 2012 workshop, LAL Orsay: The SiPM Physics and Technology - a Review, Gianmaria Collazuol Summer School INFIERI 2013, Oxford: Intelligent PMTs versus SiPMs, Véronique Puill RICH 2013: Status and Perspectives of Solid State Photo-Detector, Gianmaria Collazuol NDIP14: MCPs and Vacuum Detectors Review, Thierry. Gys Reference articles: Photomultipliers from S.Donati Silicon Photomultiplier - New Era of Photon Detection from Valeri Saveliev Advances in solid state photon detectors from D. Renker and E. Lorenz Silicon Photo Multipliers Detectors Operating in Geiger Regime: an Unlimited Device for Future Applications from G. Barbarino, R. de Asmundis, G.a De Rosa, C. M Mollo, S. Russo and D. Vivolo Books: Hamamatsu PMT Handbook Burle PMT book Articles and presentations: All quoted under the figures and plots of this presentation (my apologies if I forgot some of them) 28 V. PUILL,, Photodetectors
29 Backup material Pour plus de modèles : Modèles Powerpoint PPT gratuits Page 29 Véronique PUILL,, Nov
30 Noise sources of a SiPM After-pulses carriers trapped during the avalanche can produce delayed secondary pulses Cross-talk : amplitude = 2 p.e avalanche in one cell proba that a photon triggers another avalanche in a neighboring cell without delay Dark counts pulses triggered by non-photogenerated carriers (thermal / tunneling generation in the bulk or in the surface depleted region around the junction) 30 V. PUILL,, Photodetectors
31 T. Nagano, IEEE NSS 2013 Signal pulse shape Dinu, IEEE NSS 2010 Fast rise time: hundreds of ps T R = R S C D Recovery time: tens to hundreds of ns Time to recharge a cell after a breakdown : =R Q C D C D =Cpxl Polysilicon are temperature dependent strong dependence of the recovery time with the temperature Solution: Metal Quenching Resistor (MQR) MQR with high transmittance directly on the photosensitive surface higher fill factor 31 V. PUILL,, Photodetectors
32 Photo Detection Efficiency (PDE - Q ) PDE = Q P trig geom Q : carrier Photo-generation. probability for a photon to generate a carrier that reaches the high field region in a cell fraction of the photon flux absorbed in the depleted layer Qε = 1 R [1 e αd ] (sensitive region). The device should have a sufficiently large effect of reflection at the surface of the device. value d to maximize this factor. reflection can be reduced by the use of antireflection coatings fraction of e-/h pairs that successfully avoid recombination at the material surface and contribute to the useful photocurrent R : reflection Frenell coefficient = 0,3 for Si V. PUILL,, Photodetectors
33 X-ray irradiation HAMAMATSU C. Xu, arxiv: v2, 2014 E. Garutti, IPRD13 33 V. PUILL,, Photodetectors
34 Annealing Proposal to Test Improved Radiation Tolerant Silicon Photomultipliers F. Barbosa, J. McKisson, J. McKisson, Y. Qiang, E. Smith, D. Weisenberger, C. Zorn Jefferson Laboratory How to Extend the Lifetime? SiPMs cooled to 5 C during the beam reduction of the dark noise by a factor 3 and minimization of the effects of neutron irradiation Beam down period : SiPMs heated to ~40 C (post-irradiation annealing ) bring the noise down to a residual level At 25 C, annealing requires at least 5 days Heating to above 40 C can reduce the annealing time to less than 24 hours 34 V. PUILL,, Photodetectors
35 Discret array with TSV technology K. Sato, IEEE NSS 2013 HAMAMATSU development: another way to improve the fill factor and therefore the PDE Through Silicon Via Technology: each anode is connected by the shortest distance possible to the substrate 16x16 channels array with wire bonding (traces to the bonding pads) with TSV ( No traces ) + high precision assembly Discrete Array like monolithic array! S PA 8x8 channels array 4 side tileable configuration with very narrow gap between neighboring active areas (200 µm) equivalent to the gap in traditional monolithic type devices KETEK & PHILIPS are going to use TSV as well N. Otte, NDIP14 35 V. PUILL,, Photodetectors
36 The Digital SiPM by Philips Array of G-APDs integrated in a standard CMOS process. The signal from each cell is digitized and the information is processed on chip: time of first fired cell is measured number of fired cells is counted active control is used to recharge fired cells York Hämisch, TIPP 2011 time energy digitization immediately after the signal generation digital sum of the detected photons Example of a matrix of DPC 32 mm 32 mm DLS x8 channels 1 channel = 3.9 x 3.2 mm²l Electronics embedded 36 V. PUILL,, Photodetectors
37 Example: The Digital SiPM by Philips - DPC Early Designs in 2005 DLS cells 59 x 64 μm² cell size 78% fill-factor T. Frach, 2012 JINST 7 C01112 T. Frach, Hereaus seminar 2013 afterpulsing ~ 18% (20 C) DCR = 200 khz/mm² (20 C) temperature sensitivity ~ 0.33 %/ C timing resolution (SPTR) = 140 ps (FWHM) recovery time : 5 40 ns Drawback: requires a dedicated readout provided by Philips Radiation hardness? still working for n/cm² (data to be published soon) 37 V. PUILL,, Photodetectors
38 Digital SiPM: other developments FBK ST micro Edimburg University Faculty of Electrical Engineering, TU Delft Area of the chip: 22.1 mm2 with a sensitive area of 3.2 x 3.2 mm² L. H. C. Braga, IEEE Journal of solid state circuit vol. 49, S. Mandai, 2013 JINST P V. PUILL,, Photodetectors
39 Micro PMT Silicon PMT HPK, private communication 39 V. PUILL,, Photodetectors
40 Micro Channel Plates PMT: MCP-PMT Photodetector multiplication chain = Micro Channel Plate photon Faceplate Photocathode Dual MCP Photoelectron V ~ 200V V ~ 2000V Gain ~ 10 6 V ~ 200V Anode array of holes ( mm diameter) in a glass plate high gain: 10 6 with 2 MCP stages single photon sensitivity very fast time response: signal rise time = ns TTS < 50 ps low dark count rate quantum efficiency comparable to that of standard PMT multi-anode available lifetime (QE drops) price 40 V. PUILL,, Photodetectors
41 High photon rate aging problem MCP-PMT aging travel back toward the photocathode 2 3 ion bombardment damages the photocathode reduces the Q 1 ionisation of atoms of residual gas 4 production of secondary pulses Different ways of improvement (depending on the producer): Protection layer on the photocathode Improvement of the vacuum Treatment of the MCP surfaces (atomic layer deposition) New photo cathode 41 V. PUILL,, Photodetectors
42 Operation of PMT and MCP-PMT in magnetic field earth magnetic field = mt B curves the trajectory of charges particles separate the particles reduce the detector size easier analysis reduce the detector price PMT MCP-PMT PMT HAMAMATSU PMT book PMT very sensitive to magnetic field shielding required (µ metal) Albert Lehmann RICH V. PUILL,, Photodetectors
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