Microwave Laboratory
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1 TENDER FOR Item No. 2 Microwave Laboratory (UGC) FOR Department of Electronics and Telecommunication Engineering Dr. BABASAHEB AMBEDKAR TECHNOLOGICAL UNIVERSITY, LONERE TAL. MANGAON, DIST. RAIGAD (Maharashtra)
2 Microwave Laboratory Technical Specifications Satellite Communication Trainer Uplink Transmitter Transmit three signals simultaneously at each up-linking frequency MHz up-linking frequencies selectable by Frequency selection switch and LED indication 4 MHz clock frequency Wide band RF amplifier. No manual matching required PIC6F84-8 Bit RISC processor based PLL 6 MHz Bandwidth Frequency select switch and LED indication FM Modulation of Audio and Video 5/5.5 MHz Audio and 8MHzVideo Modulation Detachable Dish Antenna Radiated Power output 25mW (approx.) with power control Transmit Audio, Video, Digital/Analog data, PC data, Tone, Voice, function generator waveforms etc Separate terminals provided for different inputs Power Supply : 220 V ±0 %, 50 Hz Satellite Link: Transponder with selectable frequency conversion Choice of 2 downlink frequencies MHz Rotary Switch for selecting Uplink frequency Link Fail operation Detachable Dish Antennas Radiated power 25mW (approx.) with Variable gain control Power Supply : 220 V ±0 %, 50 Hz Power Consumption : 2.5 VA (approx.) Downlink Receiver: Receives and demodulate three signals simultaneously Intermediate Frequency MHz (approx) MHz fix frequency tuning -60 dbm sensitivity at tuner input Built in speaker for audio and video output Detachable Dish Antenna Power Supply : 220 V ±0 %, 50 Power Consumption : 2.5 VA (approx.)
3 Radar Trainer Transmitter Frequency : 0 GHz Output Power: 0 to 5 mw Operating V Antenna: Horn IF Output: Audio range Power Supply: 230 V ±0%, 50 Hz Interfacing Real time Software Oscilloscope: Real time/storage mode with FFT analysis Display: Peak to Peak Voltage Time domain window: Display the Doppler Frequency in Time domain Frequency domain window: Display the Doppler Frequency in Frequency domain NI s AWR Microwave Office It shall include the following capabilities. Schematic/layout design entry 2. Linear and nonlinear circuit simulation 3. EM analysis 4. Synthesis, optimization, and yield analysis 5. Design rule checking/layout vs. schematic (DRC/LVS) It shall include the following application modules:. Microwave Integrated circuits (MICs) 2. Monolithic MICs (MMICs) (small signal and RF power) 3. RF printed circuit boards (PCBs) Integrated microwave assemblies Microwave Test Bench Microcontroller Based High Precision DC Stepper Motor, Automatic Zero Point setting, Built-in DC Power Supply, Instant Plotting radiation Pattern, RS232 data link to PC, Compatible Software for PC connectivity, PC Based Motorized Unit. Microwave Input : From Gunn/ Klystron source, Detector :With BNC output, Antenna Rotation :360 degree Resolution),Power Supply:23DV ±0 %, 50 Hz, Radiation Pattern Plotting Software Accessories: CoaxialWIG Adaptor, Cooling Fan, Detector mount, Dielectric antenna, E and H horn, Direct readout frequency meter, Klystron mount, Isolator, Parabolic dish, Radiation pattern turn table, Solid state Klystron power supply, Variable attenuator, VSWR meter, waveguide stand, Waveguide twist, BNC-BNC cable.
4 Agilent ADS (Lifetime license) Integrated 3D EM modeling and simulation, Complete schematic capture and layout environment, 3D planar and full 3D EM field solvers, EDA and design flow integration with other companies such as Cadence, Mentor. S-parameter linear frequency-domain simulator, Harmonic balance nonlinear frequency domain Simulator, Circuit envelope hybrid time-/frequency domain nonlinear simulator, Transient/convolution time-domain simulator, Momentum 3D planar EM simulator, Finite Element full 3D EM simulator, X-parameter generator simulator, Signal Integrity Channel simulator, Agilent Ptolemy system simulator, Post processing with Data Display, Optimization of design, Finite element method simulator, RF and Microwave design flows, MMIC design, RF Module Design and RF Board Design. Synopsys T-CAD CMOS simulation Tool Lifetime License Technology Computer-Aided Design (TCAD) should support a broad range of applications such as CMOS, power, memory, image sensors, solar cells, analog/rf devices, interconnect modeling and extraction. It should provide critical parasitic information for optimizing chip performance. It should support. Computer simulations to develop and optimize semiconductor processing technologies and devices. 2. GUI-driven simulation environment for managing simulation tasks and analyzing simulation results. 3. Broad range of applications such as CMOS, power, memory, image sensors, solar cells, and analog/rf devices. In addition, Interconnect modeling and extraction tool which provides critical parasitic information for optimizing chip performance
5 SCHEDULE - B Serial No. Name of the Equipment Quantity Required Rate Remarks Satellite Communication Trainer 2 Radar Trainer 3 NI s AWR Microwave Office 4 Microwave Test Bench 5 Agilent ADS 6 Synopsys T-CAD CMOS simulation Tool Seal & Signature of Supplier NOTE: 0. The Rates quoted must be in accordance with detailed technical specifications. 02. The rates quoted are inclusive of all taxes, packing and forwarding charges and freight charges etc.
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