AVX RF Microwave Products

Transcription

1 AVX RF Microwave Products Version 16.12

2 AVX Microwave Ask The World Of Us As one of the world s broadest line multilayer ceramic chip capacitor suppliers, and a major Thin Film RF/Microwave capacitor, inductor, directional coupler and low pass filter and microwave ceramic capacitor manufacturer, it is our mission to provide First In Class Technology, Quality and Service, by establishing progressive design, manufacturing and continuous improvement programs driving toward a single goal: TOTAL CUSTOMER SATISFACTION 1

3 RF/Microwave Products Table of Contents Company Profile...4 Thin-Film RF/Microwave Capacitor Technology Accu-P Thin-Film Technology...6 Thin-Film Chip Capacitors Typical Electrical Tables Accu-P Typical Electrical Tables Accu-P Typical Electrical Tables Accu-P Typical Electrical Tables Accu-P Typical Electrical Tables Accu-P High Frequency Characteristics Environmental / Mechanical Characteristics...26 Performance Characteristics RF Power Applications...27 Application Notes Automatic Insertion Packaging...3 Thin-Film RF/Microwave Inductor Technology Accu-L L21 Tight Tolerance RF Inductor L42 Tight Tolerance RF Inductor L63 AND L85 SMD High-Q RF Inductor Accu-L Environmental Characteristics...39 Application Notes... 4 Thin-Film RF/Microwave Directional Couplers CP32/CP42/CP63/CP85 and DB63N/DB85 3dB 9 CP42W27FNTR Wide Band High Directivity CP42W27FNTR Test Jigs...44 CP32A5425ENTR / CP42Q5425ENTR / CP63Q5425ENTR High Directivity Directional Couplers For WiFi Bands CP42P High Directivity, Tight Coupling Tolerance CP42 High Directivity LGA Termination CP63 High Directivity LGA Termination CP42 / CP63 High Directivity Couplers Test Jigs...59 CP63 SMD Type Thin-Film Directional Couplers CP63 SMD Type High Directivity...63 CP85 SMD Type Thin-Film Directional Couplers CP85 and CP63 Test Jigs...69 DB63N 3dB 9º Couplers DB85 3dB 9 Couplers DB85 3dB 9 Test Jigs...99 Thin-Film RF/Microwave Harmonic Low Pass Filter LP42/LP63/LP85 LP42N Series Harmonic Low Pass Filter Lead-Free LGA Termination LP42N Series Harmonic Low Pass Filter Lead-Free LGA Termination Test Jigs...14 LP63 Lead-Free LGA Type LP63 Test Jigs...19 LP85 Type Harmonic LP85 Test Jigs High Performance LP126A512BNTR Harmonic Low Pass Filter LP126A7ANTR Low Pass Filter Thin-Film RF/Microwave Products Designer Kits Multilayer Organic (MLO TM ) Technology MLO TM Capacitors MLO TM Diplexers 63 WLAN/BT CDMA WCDMA WLAN WLAN/BT Automated SMT Assembly/SMT Reflow Profile MLO TM Inductors Tight Tolerance High Current Hi-Q Performance Characteristics Automated SMT Assembly/SMT Reflow Profile MLO TM SMT Crossovers RF-DC RF-RF Automated SMT Assembly/SMT Reflow Profile RF Inductors AL Series Air Core Inductors AS Series Square Air Core Inductors LCWC Series Wire Wound Chip Inductor RF/Microwave Capacitors RF/Microwave Multilayer Capacitors (MLC) UQ Series High Q Ultra Low ESR MLC SQ Series Ultra Low ESR MLC AQ Series MIL-PRF BG Voltage Temperature Limits (+9±2ppm/ C) CDR11BG; CDR12BG (.55" x.55") - Failure Rate Level: M, P, R, S CDR13BG; CDR14BG (.11" x.11") - Failure Rate Level: M, P, R, S Performance Curves Automatic Insertion Packaging HQ Series, High RF Power Capacitors RF/Microwave CG (NP) Capacitors Ultra Low ESR CU Series, CG (NP) Capacitors (RoHS) Ultra Low ESR U Series, CG (NP) Capacitors (RoHS) Ultra Low ESR U Series, CG (NP) Capacitors (RoHS) Automotive, AEC Q2 Qualified Ultra Low ESR U Series, CG (NP) Capacitors (Sn/Pb) RF/Microwave U Series Designer Kits

4 RF/Microwave Products Table of Contents Company Profile Thin-Film RF/Microwave Capacitor Technology Accu-P 1 Thin-Film RF/Microwave Inductor Technology Accu-L 2 Thin-Film RF/Microwave Directional Couplers CP32/CP42/CP63/CP85 and DB63N/DB85 3dB 9 3 Thin-Film RF/Microwave Harmonic Low Pass Filter LP42/LP63/LP85 LP126 High Performance 4 Thin-Film RF/Microwave Products Designer Kits Multilayer Organic (MLO TM ) Technology MLO TM Capacitors MLO TM Inductors MLO TM Diplexers MLO TM SMT Crossovers 6 RF Inductors Air Core Inductors Square Air Core Inductors Wire Wound Chip Inductors 7 RF/Microwave Capacitors RF/Microwave Multilayer Capacitors (MLC) RF/Microwave CG (NP) Capacitors RF/Microwave U Series Designer Kits 3 8

5 RF/Microwave Products Company Profile AVX Corporation is a leading manufacturer of multilayer ceramic, thin film and tantalum, as well as other passive electronic components. These products are used in virtually every electronic system today, including data processing, telecommunications, consumer electronics, automotive electronics, military and aerospace systems, and instrumentation and process controls. We continually strive to be the leader in all component segments we supply. RF/Microwave capacitors is a thrust business for us. AVX offers a broad line of RF/Microwave Chip Capacitors in a wide range of sizes, styles, and ratings. The Thin-Film Products range illustrated in this catalog represents the state-of-the-art in RF Capacitors, Inductors, Directional Couplers and Low Pass Filters. The thin-film technology provides components that exhibit excellent batch-to-batch repeatability of electrical parameters at RF frequencies. The Accu-P series of capacitors are available in ultra-tight tolerances (±.1pF) as well as non-standard capacitance values. The Accu-L series of inductors are ideally suited for applications requiring an extremely high Q and high current capability. The CP32/CP42/CP63/CP85 series of Directional Couplers cover the frequency range of 8 MHz to 6 GHz. They feature low insertion loss, high directivity and highly accurate coupling factors. The LP42/63/85 series of Low Pass Filters provide a rugged component in a small size package with excellent high frequency performance. The Multilayer Organic (MLO TM ) series of components are based on AVX s patented multilayer organic technology (US patent 6,987,37). They are low profile with frequencies well above 1GHz. Another major series of microwave capacitors consists of both multilayer porcelain and ceramic capacitors for frequencies from 1 MHz to 4.2 GHz (UQ and SQ Series). Six sizes of specially designed ultra-low ESR CG (NP) capacitors are covered for RF applications (CU and U Series). The air core and wire wound ceramic chip inductors offer high current ratings (up to 4.4A) and quality factor (>1). Ask the world of us. Call (864) Or visit our website 4

6 Thin-Film RF/Microwave Capacitor Technology Accu-P 5

7 1 Accu-P Thin-Film Technology THE IDEAL CAPACITOR The non-ideal characteristics of a real capacitor can be ignored at low frequencies. Physical size imparts inductance to the capacitor and dielectric and metal electrodes result in resistive losses, but these often are of negligible effect on the circuit. At the very high frequencies of radio communication (>1MHz) and satellite systems (>1GHz), these effects become important. Recognizing that a real capacitor will exhibit inductive and resistive impedances in addition to capacitance, the ideal capacitor for these high frequencies is an ultra low loss component which can be fully characterized in all parameters with total repeatability from unit to unit. Until recently, most high frequency/microwave capacitors were based on fired-ceramic (porcelain) technology. Layers of ceramic dielectric material and metal alloy electrode paste are interleaved and then sintered in a high temperature oven. This technology exhibits component variability in dielectric quality (losses, dielectric constant and insulation resistance), variability in electrode conductivity and variability in physical size (affecting inductance). An alternate thin-film technology has been developed which virtually eliminates these variances. It is this technology which has been fully incorporated into Accu-P and Accu-P to provide high frequency capacitors exhibiting truly ideal characteristics. The main features of Accu-P may be summarized as follows: High purity of electrodes for very low and repeatable ESR. Highly pure, low-k dielectric for high breakdown field, high insulation resistance and low losses to frequencies above 4GHz. Very tight dimensional control for uniform inductance, unit to unit. Very tight capacitance tolerances for high frequency signal applications. This accuracy sets apart these Thin-Film capacitors from ceramic capacitors so that the term Accu has been employed as the designation for this series of devices, an abbreviation for accurate. THIN-FILM TECHNOLOGY Thin-film technology is commonly used in producing semiconductor devices. In the last two decades, this technology has developed tremendously, both in performance and in process control. Today s techniques enable line definitions of below 1μm, and the controlling of thickness of layers at 1Å (1-2 μm). Applying this technology to the manufacture of capacitors has enabled the development of components where both electrical and physical properties can be tightly controlled. The thin-film production facilities at AVX consist of: Class 1 clean rooms, with working areas under laminar-flow hoods of class 1, (below 1 particles per cubic foot larger than.5μm). High vacuum metal deposition systems for high-purity electrode construction. Photolithography equipment for line definition down to 2.μm accuracy. Plasma-enhanced CVD for various dielectric depositions (CVD=Chemical Vapor Deposition). High accuracy, microprocessor-controlled dicing saws for chip separation. High speed, high accuracy sorting to ensure strict tolerance adherence. Orientation Marking Alumina (Al 2 O 3 ) Electrode Seal (SiNO) Dielectric (SiO 2 / SiNO) Electrode Alumina (Al 2 O 3 ) Terminations ACCU-P CAPACITOR STRUCTURE 6

8 Accu-P Thin-Film Chip Capacitors ACCU-P TECHNOLOGY The use of very low-loss dielectric materials, silicon dioxide and silicon oxynitride, in conjunction with highly conductive electrode metals results in low ESR and high Q. These high-frequency characteristics change at a slower rate with increasing frequency than for ceramic microwave capacitors. Because of the thin-film technology, the above-mentioned frequency characteristics are obtained without significant compromise of properties required for surface mounting. The main Accu-P properties are: Internationally agreed sizes with excellent dimensional control. Ultra small size chip capacitors (15) are available. Ultra tight capacitance tolerances. Low ESR at VHF, UHF and microwave frequencies. Enhanced RF power handling capablity. High stability with respect to time, temperature, frequency and voltage variation. Nickel/solder-coated terminations to provide excellent solderability and leach resistance. APPLICATIONS Cellular Communications CT2/PCN (Cordless Telephone/Personal Comm. Networks) Satellite TV Cable TV GPS (Global Positioning Systems) Vehicle Location Systems Vehicle Alarm Systems Paging Military Communications Radar Systems Video Switching Test & Measurements Filters VCO's Matching Networks RF Amplifiers APPROVALS ISO 91 1 ACCU-P FEATURES Accu-P meets the fast-growing demand for low-loss (high-q) capacitors for use in surface mount technology especially for the mobile communications market, such as cellular radio of 45 and 9 MHz, UHF walkie-talkies, UHF cordless telephones to 2.3 GHz, low noise blocks at GHz and for other VHF, UHF and microwave applications. Accu-P is currently unique in its ability to offer very low capacitance values (.5pF) and very tight capacitance tolerances (±.1pF). The RF power handling capability of the Accu-P allows for its usage in both small signal and RF power applications. Thin Film Technology guarantees minimal batch to batch variability of parameters at high frequency. Inspection test and quality control procedures in accordance with ISO 91, CECC, IECQ and USA MIL Standards yield products of the highest quality. Hand soldering Accu-P : Due to their construction utilizing relatively high thermal conductivity materials, Accu-P s have become the preferred device in R & D labs and production environments where hand soldering is used. 7

9 Accu-P Thin-Film Chip Capacitors for RF Signal and Power Applications 1 T L B 2 B 1 W ACCU-P (Signal and Power Type Capacitors) 15* 21* 42* 63* 85* ±.2.6±.5 1.±.1 1.6±.1 2.1±.1 3.2±.1 L (.16±.1) (.23±.2) (.39±.4) (.63±.4) (.79±.4) (.119±.4).215 ±.2.325±.5.55±.7.81± ±.1 2.5±.1 W (.85 ±.1) (.128±.2) (.22±.3) (.32±.4) (.5±.4) (.1±.4).145 ±.2.225±.5.4±.1.63±.1.93±.2.93±.2 T (.6 ±.1) (.9±.2) (.16±.4) (.25±.4) (.36±.8) (.36±.8) ± ±.15.3±.1.43±.1 B (. -. ) (.4±.4) (. -. ) (.14±.6) (.12±.4) (.17±.4).1 ±.3.15±.5.2±.1.35±.15.3±.1.43±.1 B 2 (.4 ±.1) (.6±.2) (.8±.4) (.14±.6) (.12±.4) (.17±.4) *Mount Black Side Up DIMENSIONS: millimeters (inches) HOW TO ORDER 42 3 J 4R7 A B S TR \5 Size C * Voltage 2 = 2V 1 = 1V 5 = 5V 3 = 25V Y = 16V Z = 1V Temperature Coefficient (1) J = ±3ppm/ C (-55 C to +125 C) K = ±6ppm/ C (-55 C to +125 C) Capacitance Capacitance expressed in pf. (2 significant digits + number of zeros) for values <1pF, letter R denotes decimal point. Example: 68pF = pF = 8R2 The following 3 digit capacitance codes should be used for ordering AVX Accu-P capacitors CAPACITANCE EXAMPLE CODE. to.99pf Rxx.15pF = 423JR15ABSTR 1. to 1.99pF Axx 1.55pF = 423JA55PBSTR 2. to 2.99pF Bxx 2.85pF =...B to 3.99pF Cxx 3.85pF =...C to 4.99pF Dxx 4.85pF =...D to 5.99pF Exx 5.85pF =...E to 6.99pF Fxx 6.85pF =...F to 7.99pF Gxx 7.85pF =...G to 8.99pF Hxx 8.85pF =...H to 9.99pF Jxx 9.85pF =...J to 19.9pF Kxx 13.8pF =...K to 29.9pF Lxx 22.5pF =...L to 39.9pF Mxx 33.8pF =...M to 49.9pF Nxx 43.5pF =...N35... Tolerance Specification for Code C 2.pF* B = Accu-P Z = ±.1pF technology P = ±.2pF Q = ±.3pF A = ±.5pF B = ±.1pF C = ±.25pF for C 3.pF Q = ±.3pF A = ±.5pF B = ±.1pF C = ±.25pF for C 5.6pF A = ±.5pF B = ±.1pF C = ±.25pF for 5.6pF<C<1pF B = ±.1pF C = ±.25pF D = ±.5pF for C 1pF F = ±1% G = ±2% J = ±5% Termination Code W = Nickel/Solder Coated Accu-P 42 Sn9, Pb1*** T = Nickel/High Temperature Solder Coated Accu-P 85**, 121** Sn96, Ag4 Nickel/Solder Coated Accu-P 63*** Sn63, Pb37 **S = Nickel/Lead Free Solder Coated Accu-P 15, 21, 42, 63 Sn1 **RoHS compliant *** Not RoHS Compliant Packaging Code TR = Tape & Reel LEAD-FREE COMPATIBLE COMPONENT Option For RoHS compliant products, please select correct termination style. (1) TC s shown are per EIA/IEC Specifications. * Tolerances as tight as ±.1pF are available. Please consult the factory. Engineering Kits Available see pages ELECTRICAL SPECIFICATIONS Operating and Storage Temperature Range -55 C to +125 C Temperature Coefficients (1) ± 3ppm/ C dielectric code J / ± 6ppm/ C dielectric code K Capacitance Measurement 1 MHz, 1 Vrms Insulation Resistance (IR) 1 11 Ohms ( 1 1 Ohms for 21 and 42 size) Proof Voltage 2.5 U R for 5 secs. Aging Characteristic Zero Dielectric Absorption.1% 8

10 Accu-P Signal and Power Type Capacitors Accu-P Capacitance Ranges (pf) TEMP. COEFFICIENT CODE J = ±3ppm/ C (-55 C to +125 C) (2) K = ±6ppm/ C (-55 C to +125 C) (2) Size Size Code C Voltage Cap in Cap pf (1) code.1 R1.2 R2.3 R3.4 R4.5 R5.6 R6.7 R7.8 R8.9 R9 1. 1R 1.1 1R R R R R R R R R9 2. 2R 2.1 2R R R R R R R R R9 3. 3R 3.1 3R R R R R R R R R9 4. 4R 4.1 4R R R R R R R R R R R R R R (1) For capacitance values higher than listed in table, please consult factory. (2) TC shown is per EIA/IEC Specifications. These values are produced with K temperature coefficient code only. 1 Intermediate values are available within the indicated range. 9

11 Accu-P 21 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..5 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±

12 Accu-P 21 Typical Electrical Tables Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±1% ±1% ±1% ±1% ±1% ±1% ±1% NA NA NA 17 ±1% NA NA NA 18 ±1% NA NA NA 19 ±1% NA NA NA 2 ±1% NA NA NA 22 ±1% NA NA NA 1 11

13 Accu-P 42 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..5 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±

14 Accu-P 42 Typical Electrical Tables Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% NA NA NA 27 ±1% NA NA NA 3 ±1% NA NA NA 33 ±1% NA NA NA NA NA NA 36 ±1% NA NA NA NA NA NA 39 ±1% NA NA NA NA NA NA 43 ±1% NA NA NA NA NA NA 47 ±1% NA NA NA NA NA NA 51 ±1% NA NA NA NA NA NA 56 ±1% NA NA NA NA NA NA 58 ±1% NA NA NA NA NA NA 68 ±1% NA NA NA NA NA NA 1 13

15 Accu-P 63 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..5 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±

16 Accu-P 63 Typical Electrical Tables Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±1% ±1% ±1% ±1% n/a n/a n/a 14 ±1% n/a n/a n/a 15 ±1% n/a n/a n/a 16 ±1% n/a n/a n/a 17 ±1% n/a n/a n/a 18 ±1% n/a n/a n/a 19 ±1% n/a n/a n/a n/a n/a n/a 2 ±1% n/a n/a n/a n/a n/a n/a 22 ±1% n/a n/a n/a n/a n/a n/a 24 ±1% n/a n/a n/a n/a n/a n/a 27 ±1% n/a n/a n/a n/a n/a n/a 3 ±1% n/a n/a n/a n/a n/a n/a 33 ±1% n/a n/a n/a n/a n/a n/a 36 ±1% n/a n/a n/a n/a n/a n/a 39 ±1% n/a n/a n/a n/a n/a n/a 1 15

17 Accu-P 85 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..1 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±

18 Accu-P 85 Typical Electrical Tables Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± n/a n/a n/a 1 ±1% n/a n/a n/a 11 ±1% n/a n/a n/a 12 ±1% n/a n/a n/a 13 ±1% n/a n/a n/a n/a n/a n/a 14 ±1% n/a n/a n/a n/a n/a n/a 15 ±1% n/a n/a n/a n/a n/a n/a 16 ±1% n/a n/a n/a n/a n/a n/a 17 ±1% n/a n/a n/a n/a n/a n/a 18 ±1% n/a n/a n/a n/a n/a n/a 19 ±1% n/a n/a n/a n/a n/a n/a 2 ±1% n/a n/a n/a n/a n/a n/a 22 ±1% n/a n/a n/a n/a n/a n/a 24 ±1% n/a n/a n/a n/a n/a n/a 27 ±1% n/a n/a n/a n/a n/a n/a 3 ±1% n/a n/a n/a n/a n/a n/a 33 ±1% n/a n/a n/a n/a n/a n/a 36 ±1% n/a n/a n/a n/a n/a n/a 39 ±1% n/a n/a n/a n/a n/a n/a 43 ±1% n/a n/a n/a n/a n/a n/a 47 ±1% n/a n/a n/a n/a n/a n/a 1 17

19 Accu-P 121 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..1 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±

20 Capacitance Self Q Standard Value Frequency Frequency 1MHz 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% n/a n/a n/a 2 ±1% n/a n/a n/a 22 ±1% n/a n/a n/a 24 ±1% n/a n/a n/a 27 ±1% n/a n/a n/a 3 ±1% n/a n/a n/a n/a n/a n/a 33 ±1% n/a n/a n/a n/a n/a n/a 36 ±1% n/a n/a n/a n/a n/a n/a 39 ±1% n/a n/a n/a n/a n/a n/a 43 ±1% n/a n/a n/a n/a n/a n/a 47 ±1% n/a n/a n/a n/a n/a n/a 82 ±1% n/a n/a n/a n/a n/a n/a 1 19

21 Accu-P High Frequency Characteristics 2.5 Accu-P 15 Typical SRF vs Capacitance 1 Capacitance (pf) SRF (GHz) Measured on HP872ES 1 Accu-P 15 Typical ESR vs Frequency ESR (mω) 1.5pF.8pF 1.pF 1.2pF 1.8pF Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 15 Typical Q vs Frequency Q 1 1.pF.8pF 2.4pF Frequency (MHz) Measured on Agilent 4278A/4991A 2

22 Accu-P High Frequency Characteristics 35. Accu-P 21 Typical SRF vs Capacitance Capacitance (pf) SRF (GHz) Measured on HP872ES 1 Accu-P 21 Typical ESR vs Frequency ESR (mω).8pf 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 21 Typical Q vs Frequency Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF Frequency (MHz) Measured on Agilent 4278A/4991A 21

23 Accu-P High Frequency Characteristics 3. Accu-P 42 Typical SRF vs Capacitance 1 Capacitance (pf) SRF (GHz) Measured on HP872ES 1 Accu-P 42 Typical ESR vs Frequency ESR (mω) 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 42 Typical Q vs Frequency Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF Frequency (MHz) Measured on Agilent 4278A/4991A 22

24 Accu-P High Frequency Characteristics 3. Accu-P 63 Typical SRF vs Capacitance Capacitance (pf) SRF (GHz) Measured on HP872ES 35 Accu-P 63 Typical ESR vs Frequency ESR (mω) pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 63 Typical Q vs Frequency Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF Frequency (MHz) Measured on Agilent 4278A/4991A 23

25 Accu-P High Frequency Characteristics 1 Capacitance (pf) Accu-P 85 Typical SRF vs Capacitance SRF (GHz) Measured on HP872ES 35 Accu-P 85 Typical ESR vs Frequency ESR (mω) pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 8.2pF Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 85 Typical Q vs Frequency Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 8.2pF Frequency (MHz) Measured on Agilent 4278A/4991A 24

26 Accu-P High Frequency Characteristics Capacitance (pf) Accu-P 121 Typical SRF vs Capacitance SRF (GHz) Measured on HP872ES 1 3 Accu-P 121 Typical ESR vs Frequency ESR (mω) pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF Frequency (MHz) Measured on Agilent 4278A/4991A Accu-P 121 Typical Q vs Frequency 1 Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF Frequency (MHz) Measured on Agilent 4278A/4991A 25

27 Accu-P Environmental / Mechanical Characteristics 1 ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Life (Endurance) 125 C, 2U R,1 hours No visible damage MIL-STD-22F Method 18A Δ C/C 2% for C 5pF Δ C.25pF for C<5pF Accelerated Damp 85 C, 85% RH, U R, 1 hours No visible damage Heat Steady State Δ C/C 2% for C 5pF MIL-STD-22F Method 13B Δ C.25pF for C<5pF Temperature Cycling -55 C to +125 C, 15 cycles Accu-P No visible damage MIL-STD-22F Method 17E Δ C/C 2% for C 5pF MIL-STD-883D Method 11.7 Δ C.25pF for C<5pF Resistance to Solder Heat 26 C ± 5 C for 1 secs C remains within initial limits IEC MECHANICAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Solderability Components completely immersed in a Terminations to be well tinned, minimum 95% IEC solder bath at 235 C for 2 secs. coverage Leach Resistance IEC Components completely immersed in a solder bath at 26±5 C for 6 secs. Dissolution of termination faces 15% of area Dissolution of termination edges 25% of length Adhesion MIL-STD-22F Method 211A A force of 5N applied for 1 secs. No visible damage Termination Bond Strength Tested as shown in diagram No visible damage IEC Amend. 2 D = 3mm Accu-P D = 1mm Accu-F Δ C/C 2% for C 5pF Δ C.25pF for C<5pF Robustness of Termination IEC Amend. 2 A force of 5N applied for 1 secs. No visible damage High Frequency Vibration MIL-STD-22F Method 21A, 55Hz to 2Hz, 2G No visible damage 24D (Accu-P only) Storage 12 months minimum with components Good solderability stored in as received packaging D 45mm 45mm QUALITY & RELIABILITY Accu-P is based on well established thin-film technology and materials. ON-LINE PROCESS CONTROL This program forms an integral part of the production cycle and acts as a feedback system to regulate and control production processes. The test procedures, which are integrated into the production process, were developed after long research work and are based on the highly developed semiconductor industry test procedures and equipment. These measures help AVX to produce a consistent and high yield line of products. FINAL QUALITY INSPECTION Finished parts are tested for standard electrical parameters and visual/mechanical characteristics. Each production lot is 1% evaluated for: capacitance and proof voltage at 2.5 U R. In addition, production is periodically evaluated for: Average capacitance with histogram printout for capacitance distribution; IR and Breakdown Voltage distribution; Temperature Coefficient; Solderability; Dimensional, mechanical and temperature stability. QUALITY ASSURANCE The reliability of these thin-film chip capacitors has been studied intensively for several years. Various measures have been taken to obtain the high reliability required today by the industry. Quality assurance policy is based on well established international industry standards. The reliability of the capacitors is determined by accelerated testing under the following conditions: Life (Endurance) 125 C, 2U R, 1 hours Accelerated Damp Heat Steady State 85 C, 85% RH, U R, 1 hours. 26

28 Accu-P Performance Characteristics RF Power Applications RF POWER APPLICATIONS In RF power applications capacitor losses generate heat. Two factors of particular importance to designers are: Minimizing the generation of heat. Dissipating heat as efficiently as possible. CAPACITOR HEATING The major source of heat generation in a capacitor in RF power applications is a function of RF current (I) and ESR, from the relationship: Power dissipation = I 2 RMS x ESR Accu-P capacitors are specially designed to minimize ESR and therefore RF heating. Values of ESR for Accu-P capacitors are significantly less than those of ceramic MLC components currently available. HEAT DISSIPATION Heat is dissipated from a capacitor through a variety of paths, but the key factor in the removal of heat is the thermal conductivity of the capacitor material. The higher the thermal conductivity of the capacitor, the more rapidly heat will be dissipated. The table below illustrates the importance of thermal conductivity to the performance of Accu-P in power applications. 1 Amps PRODUCT MATERIAL THERMAL CONDUCTIVITY W/mK Accu-P Alumina 18.9 Microwave MLC Magnesium Titanate 6. Power Handling Accu-P 1pF Data used in calculating the graph: Thermal impedance of capacitors: C/W C/W C/W C/W Thermal impedance measured using RF generator, amplifier and strip-line transformer. ESR of capacitors measured on Boonton 34A MHz THERMAL IMPEDANCE Thermal impedance of Accu-P chips is shown below compared with the thermal impedance of Microwave MLC s. CAPACITOR TYPE CHIP SIZE THERMAL IMPEDANCE ( C/W) Accu-P Microwave MLC ADVANTAGES OF ACCU-P IN RF POWER CIRCUITS The optimized design of Accu-P offers the designer of RF power circuits the following advantages: Reduced power losses due to the inherently low ESR of Accu-P. Increased power dissipation due to the high thermal conductivity of Accu-P. THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR APPLICATION IS ITS PERFORMANCE UNDER OPERATING CONDITIONS IN THE ACTUAL CIRCUIT. The thermal impedance expresses the temperature difference in C between chip center and termination caused by a power dissipation of 1 watt in the chip. It is expressed in C/W. PRACTICAL APPLICATION IN RF POWER CIRCUITS There is a wide variety of different experimental methods for measuring the power handling performance of a capacitor in RF power circuits. Each method has its own problems and few of them exactly reproduce the conditions present in real circuit applications. Similarly, there is a very wide range of different circuit applications, all with their unique characteristics and operating conditions which cannot possibly be covered by such theoretical testing. 27

29 1 Accu-P Application Notes GENERAL Accu-P SMD capacitors are designed for soldering to printed circuit boards or other substrates. The construction of the components is such that they will withstand the time/temperature profiles used in both wave and reflow soldering methods. CIRCUIT BOARD TYPE The circuit board types which may be used with Accu-P are as follows: All flexible types of circuit boards (eg. FR-4, G-1) and also alumina. For other circuit board materials, please consult factory. REFLOW SOLDERING PAD DIMENSIONS: millimeters (inches) HANDLING SMD capacitors should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product gives the ideal medium for direct presentation to the placement machine. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during reflow soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap.5mm beneath large components. Pad overlap about.3mm beneath small components. c. Pad extension of.5mm for reflow of large components and pad extension about.3mm for reflow of small components. Pad extension about 1.mm for wave soldering Accu-P Accu-P Accu-P Accu-P Accu-P Accu-P.22 (.9).2 (.8).17 (.7).26 (-.1) (.3) (-.1).6 (.24).85 (.33) 1. (.39) 1. (.39).26 (-.1).34 (.13) 1.7 (.68).5 (.2).6 (.24).55 (.22) 2.3 (.91).6 (.24).85 (.33).8 (.31) 3. (.118) 1. (.39) 1. (.39) 4. (.157) 2. (.79) 1.25 (.49) 1. (.39) 2.5 (.98) 28

30 Accu-P Application Notes PREHEAT & SOLDERING The rate of preheat in production should not exceed 4 C/ second and a recommended maximum is about 2 C/second. Temperature differential from preheat to soldering should not exceed 1 C. For further specific application or process advice, please consult AVX. COOLING After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 15 C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 3 watts should be used and set to not more than 26 C. CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids i-propanol, ethanol, acetylacetone, water and other standard PCB cleaning liquids. Ultrasonic conditions.. power-2w/liter max. frequency-2khz to 45kHz. Temperature C maximum (if not otherwise limited by chosen solvent system). Time minutes max. STORAGE CONDITIONS Recommended storage conditions for Accu-P prior to use are as follows: Temperature C to 35 C Humidity % Air Pressure mbar to 16mbar 1 RECOMMENDED REFLOW SOLDERING PROFILE COMPONENTS WITH SnPb TERMINATIONS RECOMMENDED REFLOW SOLDERING PROFILE LEAD FREE COMPONENTS WITH Sn1 TERMINATIONS COMPONENT LAND TEMP (DEG C) Assembly enters the preheat zone Additional soak time to allow uniform heating of the substrate Soak time 1) Activates the flux 2) Allows center of board temperatures to catch up with corners 45-6 sec. above solder melting point Assembly exits heat no forced cooldown 186 C solder melting temperature Time (mins) Temp (ºC) Peak Temperature = 26ºC : :43 1:28 2:1 2:53 3:36 4:19 5:2 5:48 6:29 Time 29

31 Accu-P Automatic Insertion Packaging 1 TAPE & REEL All tape and reel specifications are in compliance with EIA A. (equivalent to IEC 286 part 3). 8mm carrier Reeled quantities: Reels of 3, per 7" reel or 1, pieces per 13" reel 15, 21 and 42 = 5, pieces per 7" reel and 2, pieces per 13" reel REEL DIMENSIONS: millimeters (inches) A (1) B C D E F G 18± min. 13± min. 5 min. 9.6± max. (7.87±.39) (.59 min.) (.512 ±.8) (.795 min.) (1.969 min.) (.37 ±.5) (.567 max.) Metric dimensions will govern. Inch measurements rounded and for reference only. (1) 33mm (13 inch) reels are available. G MAX. B* C A D* E FULL RADIUS CARRIER DIMENSIONS: millimeters (inches) * DRIVE SPOKES OPTIONAL IF USED, ASTERISKED DIMENSIONS APPLY. A B C D E F ± ± ±.1 2. ±.5 4. ± (.315 ±.12) (.138 ±.2) (.69 ±.4) (.79 ±.2) (.157 ±.4) (.59 ) The nominal dimensions of the component compartment (W,L) are derived from the component size. F -. F E D 1 PITCHES CUMULATIVE TOLERANCE ON TAPE ±.2 TOP TAPE W B C A L P DIRECTION OF FEED CENTER LINES OF CAVITY P = 4mm for 63, 85, 121 P = 2mm for C5, 21 and 42 AVX reserves the right to change the information published herein without notice. 3

32 Thin-Film RF/Microwave Inductor Technology Accu-L 31

33 Accu-L 21 Tight Tolerance SMD RF Thin Film Tuning Inductor ACCU-L TECHNOLOGY The L21 SMD Tuning Inductor is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. 2 APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s Filters Matching Networks HOW TO ORDER L21 XXX X H S TR Inductance (nh) Tolerance Series Lead Free Termination Taped & Reeled P/N Example: L213R3BHSTR QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Lead Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. DIMENSIONS: (TOP View) millimeters (inches) Recommended Pad Layout Dimensions mm (inches) B1.26 (.1) T W.78 (.31).26 (.1) L B2.26 (.1) L W T.6±.5 (.24±.2).325±.5 (.13±.2).225±.5 (.9±.2) B1 B2.1±.1 (.4±.4).15±.5 (.6±.2).34 (.13) 32

34 Accu-L 21 Tight Tolerance SMD RF Thin Film Tuning Inductor ELECTRICAL SPECIFICATIONS 45MHz 9MHz 19MHz 24MHz SRF RDC IDC Tolerance Q Q Q Q min. max. max. L(nH) A=±.5nH, B=±.1nH, (min) (Typ) (Typ) (Typ) (GHz) ( ) (ma) C=±.2nH, D=±.5nH.33 ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH All intermediate Inductance values within the indicated range are available. 33

35 L42 Tight Tolerance RF Inductor GENERAL DESCRIPTION ITF TECHNOLOGY DIMENSIONS: (Bottom View) millimeters (inches) The L42 LGA Inductor is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. B S A 2 APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s Filters Matching Networks HOW TO ORDER L42 XXX X LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation H N TR T L W T W 1.±.1 (.39±.4).58±.7 (.23±.3).35±.1 (.14±.4) L A B S, H H.48±.5 (.19±.2).17±.5 (.7±.2).64±.5 (.3±.2) Inductance (nh) P/N Example: L423R3BHNTR Tolerance Series LGA Termination Sn1 Taped & Reeled LEAD-FREE COMPATIBLE COMPONENT QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Lead Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. MAKING AND ORIENTATION IN TAPE (Top View) Recommended Pad Layout Dimensions mm (inches).7 (.28) 1.6 (.63).6 (.24) 34

36 L42 Tight Tolerance RF Inductor ELECTRICAL SPECIFICATIONS 45MHz 9MHz 19MHz 24MHz SRF RDC IDC Tolerance Q Q Q Q Q min. max. max. L(nH) A=±.5nH, B=±.1nH, (min) (Typ) (Typ) (Typ) (Typ) (MHz) ( ) (ma) C=±.2nH, D=±.5nH.56 ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.5nH, ±.1nH, ±.2nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH Please contact factory for intermediate inductance values within the indicated range. 35

37 Accu-L SMD High-Q RF Inductor 2 1 nh Inductor (Top View) ACCU-L TECHNOLOGY The Accu-L SMD Inductor is based on thin-film mul ti lay er technology. This technology provides a level of control on the elec tri cal and physical characteristics of the com po nent which gives consistent characteristics within a lot and lot-to-lot. The original design provides small size, excellent highfrequency performance and rugged construction for re li able automatic assembly. The Accu-L inductor is particularly suited for the tele com - mu ni ca tions industry where there is a continuing trend towards miniaturization and in creas ing frequencies. The Accu-L inductor meets both the per for mance and tolerance requirements of present cellular frequencies 45MHz and 9MHz and of future fre quen cies, such as 17MHz, 19MHz and 24MHz. FEATURES High Q RF Power Capability High SRF Low DC Resistance Ultra-Tight Tolerance on Inductance Standard 63 and 85 Chip Size Low Profile Rugged Construction Taped and Reeled APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Locations Systems Filters Matching Networks DIMENSIONS: millimeters (inches) ± ±.1 L (.63±.4) (.83±.4).81±.1 1.5±.1 W (.32±.4) (.59±.4).61±.1.91±.13 T (.24±.4) (.36±.5) T top:. +.3/-..25±.15 (.+.12) (.1±.6) L B bottom:.35±.2 (.14±.8) B W Operating/Storage Temp. Range: -55 C to +125 C 36

38 Accu-L 63 and 85 SMD High-Q RF Inductor HOW TO ORDER L 85 4R7 D E S TR Product Inductor Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT Size For RoHS compliant products, please select correct termination style. Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = nH = 4R7 Tolerance for L 4.7nH, B = ±.1nH C = ±.2nH D = ±.5nH 4.7nH<L<1nH, C = ±.2nH D = ±.5nH L 1nH, G = ±2% J = ±5% Specification Code E = Accu-L 85 technology G = Accu-L 63 technology ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L 63 Termination Code W = Nickel/ solder coated (Sn 63, Pb 37) **S = Nickel/ Lead Free Solder coated (Sn1) Packaging Code TR = Tape and Reel (3,/reel) **RoHS compliant 2 Engineering Kits Available see pages MHz 9 MHz 19 MHz 24 MHz IDC max Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (ma) Inductance Available Q Q Q Q L (nh) L (nh) L (nh) (MHz) (Ω) L (nh) Inductance Tolerance Typical Typical Typical Typical (1) 1.2 ±.1, ±.2nH ±.1, ±.2nH ±.1, ±.2nH ±.1, ±.2nH ±.1, ±.2nH ±.1, ±.2, ±.5nH ±.1, ±.2, ±.5nH ±.1, ±.2, ±.5nH ±.2, ±.5nH ±.2, ±.5nH ±.2, ±.5nH ±2%, ±5% ±2%, ±5% ±2%, ±5% (1) I DC measured for 15 C rise at 25 C ambient temperature when soldered to FR-4 board. Inductance and Q measured on Agilent 4291B / 4287 using the 16196A test fixture. ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L MHz 9 MHz 17 MHz 24 MHz IDC max Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (ma) Inductance Available Q Q Q Q L (nh) L (nh) L (nh) (MHz) (Ω) T = 15 C T = 7 C L (nh) Inductance Tolerance Typical Typical Typical Typical (1) (2) 1.2 ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.5nH ±.5nH ±.5nH ±2%, ±5% ±2%, ±5% ±2%, ±5% ±2%, ±5% ±2%, ±5% (1) I DC measured for 15 C rise at 25 C ambient temperature (2) I DC measured for 7 C rise at 25 C ambient temperature L, Q, SRF measured on HP 4291A, Boonton 34A and Wiltron 36 Vector Analyzer, R DC measured on Keithley 58 micro-ohmmeter. 37

39 Accu-L 63 and 85 SMD High-Q RF Inductor 2 L63 Typical Q vs. Frequency L Q Frequency (GHz) 1.2nH 1.5nH 5.6nH 8.2nH 15nH 3 L (nh) 1 Typical Inductance vs. Frequency L63 15nH 8.2nH 1 6.8nH 4.7nH 3.3nH 2.2nH 1.8nH 1.2nH Frequency (GHz) Measured on AGILENT 4291B/4287 using the 16196A test fixture Measured on AGILENT 4291B/4287 using the 16196A test fixture L85 Typical Q vs. Frequency L85 Typical Inductance vs. Frequency L nH Q nH 1.8nH 5.6nH 1nH Inductance (nh) 1 22nH 15nH 1nH 5.6nH 15nH 2 22nH 1.8nH.1 1 Frequency (GHz) Measured on HP4291A and Boonton 34A Coaxial Line Frequency (GHz) Measured on HP4291A and Wiltron 36 Vector Analyzer Maximum Temperature Rise at 25 C ambient temperature (on FR-4) L nH 1nH 6.8nH 4.7nH 2.7nH T ( C) Current (A) Temperature rise will typically be no higher than shown by the graph 38

40 Accu-L 63 and 85 SMD High-Q RF Inductor FINAL QUALITY INSPECTION Finished parts are tested for electrical parameters and visual/ mechanical characteristics. Parts are 1% tested for inductance at 45MHz. Parts are 1% tested for R DC. Each pro duc tion lot is eval u at ed on a sample basis for: Q at test frequency Static Humidity Resistance: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours 2 ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Solderability Components completely immersed in a solder bath at 235 ± 5 C for 2 secs. Terminations to be well tinned. No visible damage. Leach Resistance Components completely immersed in Dissolution of termination faces a solder bath at 26 ±5 C for 6 secs. 15% of area. Dissolution of termination edges 25% of length. Storage 12 months minimum with components stored in as received packaging. Good solderability Shear Components mounted to a substrate. No visible damage A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Rapid Change of Temperature Components mounted to a substrate. 5 cycles -55 C to +125 C. No visible damage Tested as shown in diagram Bend Strength No visible damage 1mm deflection 45mm Temperature Component placed in + to +125 ppm/ C L Coefficient of environmental chamber (typical) TCL = 2 -L Inductance -55 C to +125 C. L T (TCL) 1 = 25 C 1 (T 2 -T 1 ) 45mm 39

41 2 Accu-L Application Notes HANDLING SMD chips should be handled with care to avoid dam age or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. CIRCUIT BOARD TYPE All flexible types of circuit boards may be used (e.g. FR-4, G-1) and also alumina. For other circuit board materials, please consult factory. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during sol der ing. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is per mis si ble to decrease this to as low as 85% of component width but it is not advisable to go be low this. b. Pad overlap about.3mm. c. Pad extension about.3mm for reflow. Pad ex ten sion about.8mm for wave soldering. REFLOW SOLDERING DIMENSIONS: millimeters (inches) 21 Accu-L.78 (.31).26 (.1).26 (.1).26 (.1).34 (.13) 42 Accu-L.6 (.24) 1.6 (.63).4 (.15).6 (.24).7 (.28) 2.3 (.91) 63 Accu-L PREHEAT & SOLDERING The rate of preheat in production should not exceed 4 C/second. It is recommended not to exceed 2 C/sec ond. Temperature differential from preheat to soldering should not exceed 15 C. For further specific application or process advice, please consult AVX..9 (.35).5 (.2).9 (.35).8 (.31) 2.8 (.11) 85 Accu-L.7 (.28) 1.4 (.55).7 (.28) 1.5 (.59) HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 1 C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a tem per a - ture controlled model not exceeding 3 watts should be used and set to not more than 26 C. Max i mum al lowed time at temperature is 1 minute. When hand sol der ing, the base side (white side) must be sol dered to the board. COOLING After soldering, the assembly should preferably be al lowed to cool naturally. In the event of assisted cool ing, similar conditions to those rec om mend ed for pre heat ing should be used. CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thor - ough ly cleaned of flux residues, especially the space be neath the device. Such residues may otherwise be come conductive and effectively offer a lossy bypass to the de vice. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids i-propanol, ethanol, acetylacetone, water, and other standard PCB cleaning liquids. Ultrasonic conditions.. power 2w/liter max. frequency 2kHz to 45kHz. Temperature C maximum (if not oth er wise limited by chosen sol vent system). Time minutes max. STORAGE CONDITIONS Recommended storage conditions for Accu-L prior to use are as follows: Temperature C to 35 C Humidity % Air Pressure mbar to 16mbar RECOMMENDED SOLDERING PROFILE For recommended soldering profile see page

42 Thin-Film RF/Microwave Directional Couplers CP32/CP42/CP63/CP85 and DB63N/DB85 3dB 9 41

43 Thin Film Directional Couplers Wide Band High Directivity CP42W27FNTR ITF TECHNOLOGY The ITF High Directivity Wide Band LGA Coupler is based on thinfilm multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The Wide Band High Directivity Coupler displays a stable coupling factor over a wide frequency band. 3 HOW TO ORDER CP 42 W Type Wide Band QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Lead Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE -4 C to +85 C POWER RATING 3W RF Continuous XXXX Frequency (MHz) X Sub- Type N LGA Termination Sn1 TR Taped & Reeled APPLICATIONS Mobile communications Satellite TV receivers GPS Vehicle location systems Wireless LAN s DIMENSIONS (Bottom View) T A W B TERMINALS (Top View).2 (.8) GND Out.31 (.12) H L LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation S L W T A B S, H Coupling Recommended Pad Layout Dimensions mm (inches) IN mm (inches) 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2).2±.5 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2).15 (.6) (.21)

44 Thin Film Directional Couplers Wide Band High Directivity CP42W27FNTR Directional Coupler Type CP42W27FNTR I. Loss Return Frequency Coupling Directivity P/N max. Loss [MHz] [db] [db] [db] [db] CP42W27FNTR 7-2,7 24± Coupling R Loss Isolation db , 1,5 2, 2,5 3, I Loss db 3 Frequency MHz 43

45 Thin Film Directional Couplers Wide Band High Directivity CP42W27FNTR Test Jigs GENERAL DESCRIPTION These jigs are designed for testing the CP42W27FNTR High Directivity Couplers using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.254mm (.1") from the microstrips. The substrate used is Neltec s NH9338ST254C1BC. The connectors are SMA type (female), Johnson Components Inc. Product P/N: Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2. Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. 3 Place the coupler on the measurement jig as follows: GND (Coupler) Connector 1 (Jig) IN (Coupler) Connector 3 (Jig) Coupling (Coupler) Connector 2 (Jig) Out (Coupler) Connector 4 (Jig) To measure I. Loss connect: Connector 3 (Jig) Port 1 (VNA) Connector 4 (Jig) Port 2 (VNA) Connector 2 (Jig) 5Ω To measure R. Loss and Coupling connect: Connector 3 (Jig) Port 1 (VNA) Connector 4 (Jig) 5Ω Connector 2 (Jig) Port 2 (VNA) To measure Isolation connect: Connector 4 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) Port 2 (VNA) Measurement Jig Calibration Jig Connector 4 OPEN HS Connector 1 (not used) TH Connector 2 Open Line Short Line to GND. OPEN HS TH Connector Johnson P/N Load & Through Connector 3 Load & Through 44

46 Thin Film Directional Couplers WiFi Band High Directivity CP32P5425ENTR / CP32A5425ENTR / CP42Q5425ENTR / CP63Q5425ENTR HIGH DIRECTIVITY DIRECTIONAL COUPLERS FOR WIFI BANDS TECHNOLOGY These High Directivity LGA Couplers are based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The WiFi Bands Couplers are offered in 32, 42 and 63 standard sizes having identical electrical performance. APPLICATIONS: WiFi PART NUMBERS CP32P5425ENTR CP32A5425ENTR CP42Q5425ENTR CP63Q5425ENTR QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance : 125 C, IR, 4 hours TERMINATION Nickel/Lead-Free Solder coating (Sn1) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE -4 C to +85 C TERMINALS (Top View) OUT 5 OHM OUT 5 OHM DIMENSIONS (Bottom View) mm (inches) T L W T A B S, H A W B H L CP32 CP42 CP63.65±.4 1.±.5 1.6±.1 (.26±.2) (.4±.2) (.63±.4).5±.4.58±.4.84±.1 (.2±.2) (.23±.2) (.33±.4).25±.5.35±.5.6±.1 (.1±.2) (.14±.2) (.24±.4).2±.5.2±.5.25±.5 (.8±.2) (.8±.2) (.1±.2).1±.4.18±.5.2±.5 (.4±.2) (.7±.2) (.8±.2).25±.25.5±.5.5±.5 (.1±.1) (.2±.2) (.2±.2) RECOMMENDED PAD LAYOUT DIMENSTIONS mm (inches) CP32.2 (.8).3 (.12) S.25 (.1) 3 IN CP32 COUPLING IN CP42 COUPLING.2 (.8) OUT 5 OHM CP42 / CP63: see pages 49 / 53 IN COUPLING CP63 45

47 Thin Film Directional Couplers WiFi Band High Directivity ELECTRICAL CHARACTERISTICS P/N CP32P5425ENTR I. Loss Return Frequency Coupling Directivity max. Loss [MHz] [db] [db] [db] [db] 2,4-2,496-2± ,9-5,95-13± P/N CP32A5425ENTR I. Loss Return Frequency Coupling Directivity max. Loss [MHz] [db] [db] [db] [db] 2,4-2,496-2± ,9-5,95-13± P/N I. Loss Return Frequency Coupling Directivity max. Loss [MHz] [db] [db] [db] [db] CP42Q5425ENTR 2,4-2,496-2± CP63Q5425ENTR 4,9-5,95-13± Coupling R Loss Isolation db I Loss db [GHz] 46

48 Thin Film Directional Coupler CP42P High Directivity, Tight Coupling Tolerance GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The CP42P Series High Directivity, Tight Coupling Tolerance LGA Coupler is based on the proprietary RFAP Thin-Film multilayer technology. The technology provides a miniature part with excellent high frequency performance and ugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. DIMENSIONS: (Bottom View) A B millimeters (inches) S APPLICATIONS Wireless communications Wireless LAN s GPS WiMAX HOW TO ORDER CP 42 LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Power Rating 3W RF Continuous P XXXX T X L W T W 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2) N A B S L.2±.5 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2) TR 3 Style Size 42 Type ±.5dB Tight Tolerance Frequency MHz Sub-Type Termination LGA Lead-Free Taped & Reeled QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINALS (Top View) OUT 5 OHM LEAD-FREE COMPATIBLE COMPONENT TERMINATION Nickel/Lead-Free Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE: -4 C to +85 C IN.2 (.8).31 (.12) COUPLING Recommended Pad Layout Dimensions mm (inches).15 (.6).53 (.21) 47

49 Thin Film Directional Coupler CP42P High Directivity, Tight Coupling Tolerance Coupler P/N CP42PxxxxAN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP42P836AN ± CP42P881AN ± GSM CP42P92AN ± CP42P947AN ± E-GSM CP42P897AN ± CP42P942AN ± PDC CP42P1441AN ± CP42P1747AN ± PCN CP42P1842AN ± PCS CP42P188AN ± CP42P196AN ± PHP CP42P197AN ± DECT CP42P189AN ± Wireless LAN CP42P2442AN ± CP42P35AN ± WiFi CP42P5AN ± CP42P55AN ± CP42P6AN ± Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP42PxxxxANTR Frequency [GHz] I Loss [db] 3 Coupler P/N CP42PxxxxBN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42P836BN ± CP42P881BN ± GSM CP42P92BN ± CP42P947BN ± E-GSM CP42P897BN ± CP42P942BN ± PDC CP42P1441BN ± PCN CP42P1747BN ± CP42P1842BN ± PCS CP42P188BN ± CP42P196BN ± PHP CP42P197BN ± DECT CP42P189BN ± Wireless LAN CP42P2442BN ± CP42P35BN ± WiFi CP42P5BN ± CP42P55BN ± CP42P6BN ± Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP42PxxxxBNTR Frequency [GHz] I Loss [db] Coupler P/N CP42PxxxxEN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42P836EN ± CP42P881EN ± GSM CP42P92EN ± CP42P947EN ± E-GSM CP42P897EN ± CP42P942EN ± PDC CP42P1441EN ± PCN CP42P1747EN ± CP42P1842EN ± PCS CP42P188EN ± CP42P196EN ± PHP CP42P197EN ± DECT CP42P189EN ± Wireless LAN CP42P2442EN ± CP42P35EN ± WiFi CP42P5EN ± CP42P55EN ± CP42P6EN ± Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss -4-5 Isolation CP42PxxxxENTR Frequency [GHz] I Loss [db] 48

50 Thin-Film Directional Couplers CP42 High Directivity LGA Termination GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF High Directivity LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP Style Directional Coupler 42 Size 42 QUALITY INSPECTION X Type Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Sn9Pb1 or Lead-Free Sn1 Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. ORIENTATION IN TAPE FEATURES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Operating/Storage Temp -4 C to +85 C Power Rating 3W RF Cont **** Frequency (MHz) DIMENSIONS: (Bottom View) T L W T X Sub Type W N LGA Termination L = LGA Sn9, Pb1 **N = LGA Sn1 TERMINALS (Top View) OUT IN.31 (.12) A 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2) B **RoHS compliant 5 OHM COUPLING Recommended Pad Layout Dimensions millimeters (inches) A B S L TR S.2±.5 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2) Packaging Code TR = Tape and Reel Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. mm (inches) 3 OUT 5 OHM OUT 5 OHM.2 (.8).15 (.6) IN CP IN CP.53 (.21) *The recommended distance to the PCB Ground Plane is.254mm (.1") 49

51 Thin-Film Directional Couplers CP42 High Directivity LGA Termination CP42 - TYPE SELECTION CHART Coupling vs. Frequency -5-1 CP42AxxxxAN CP42AxxxxBN CP42AxxxxCN CP42AxxxxDN CP42AxxxxEN 3 Coupling [db] CP42AxxxxFN Frequency [GHz] Intermediate coupling factors are readily available. Please contact factory. 5

52 Thin-Film Directional Couplers CP42 High Directivity LGA Termination Coupler P/N CP42AxxxxAN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP42A836AN CP42A881AN GSM CP42A92AN CP42A947AN E-GSM CP42A897AN CP42A942AN PDC CP42A1441AN CP42A1747AN PCN CP42A1842AN PCS CP42A188AN CP42A196AN PHP CP42A197AN DECT CP42A189AN Wireless LAN CP42A2442AN CP42A35AN WiFi CP42A5AN CP42A55AN CP42A6AN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP42AxxxxANTR Frequency [GHz] I Loss [db] Coupler P/N CP42AxxxxBN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836BN CP42A881BN GSM CP42A92BN CP42A947BN E-GSM CP42A897BN CP42A942BN PDC CP42A1441BN CP42A1747BN PCN CP42A1842BN PCS CP42A188BN CP42A196BN PHP CP42A197BN DECT CP42A189BN Wireless LAN CP42A2442BN CP42A35BN WiFi CP42A5BN CP42A55BN CP42A6BN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP42AxxxxBNTR 7.318" Frequency [GHz] I Loss [db] 3 Coupler P/N CP42AxxxxCN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836CN CP42A881CN GSM CP42A92CN CP42A947CN E-GSM CP42A897CN CP42A942CN PDC CP42A1441CN PCN CP42A1747CN CP42A1842CN PCS CP42A188CN CP42A196CN PHP CP42A197CN DECT CP42A189CN Wireless LAN CP42A2442CN CP42A35CN WiFi CP42A5CN CP42A55CN CP42A6CN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss -5 Isolation CP42AxxxxCNTR Frequency [GHz] I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 51

53 Thin-Film Directional Couplers CP42 High Directivity LGA Termination Coupler P/N CP42AxxxxDN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP42A836DN CP42A881DN GSM CP42A92DN CP42A947DN E-GSM CP42A897DN CP42A942DN PDC CP42A1441DN PCN CP42A1747DN CP42A1842DN PCS CP42A188DN CP42A196DN PHP CP42A197DN DECT CP42A189DN Wireless LAN CP42A2442DN CP42A35DN WiFi CP42A5DN CP42A55DN CP42A6DN Coupling, Return Loss, Isolation, [db] I. Loss Coupling -3 R. Loss CP42AxxxxDNTR Isolation Frequency [GHz] I Loss [db] 3 Coupler P/N CP42AxxxxEN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836EN CP42A881EN GSM CP42A92EN CP42A947EN E-GSM CP42A897EN CP42A942EN PDC CP42A1441EN PCN CP42A1747EN CP42A1842EN PCS CP42A188EN CP42A196EN PHP CP42A197EN DECT CP42A189EN Wireless LAN CP42A2442EN CP42A35EN WiFi CP42A5EN CP42A55EN CP42A6EN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP42AxxxxENTR Frequency [GHz] I Loss [db] Coupler P/N CP42AxxxxFN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836FN CP42A881FN GSM CP42A92FN CP42A947FN E-GSM CP42A897FN CP42A942FN PDC CP42A1441FN PCN CP42A1747FN CP.42A1842FN PCS CP42A188FN CP42A196FN PHP CP42A197FN DECT CP42A189FN Wireless LAN CP42A2442FN CP42A35FN WiFi CP42A5FN CP42A55FN CP42A6FN Coupling, Return Loss, Isolation, [db] I. Loss R. Loss Coupling Isolation CP42AxxxxFNTR I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 52

54 Thin-Film Directional Couplers CP63 High Directivity LGA Termination GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. DIMENSIONS: (Bottom View) A B millimeters (inches) S APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP 63 FEATURES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Operating/Storage Temp -4 C to +85 C Power Rating 3W RF Cont X **** T L W T X W 1.6±.1 (.63±.4).84±.1 (.33±.4).6±.1 (.24±.4) N A B S L.25±.5 (.1±.2).2±.5 (.8±.2).5±.5 (.2±.2) TR 3 Style Directional Coupler Size 63 Type Frequency (MHz) Sub Type Termination Code L = LGA Sn9, Pb1 **N = LGA Sn1 Packaging Code TR = Tape and Reel **RoHS compliant QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Sn9Pb1 or Lead-Free Sn1 Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. ORIENTATION IN TAPE TERMINALS (Top View) OUT IN 5 OHM COUPLING Recommended Pad Layout Dimensions Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. mm (inches) OUT IN 5 OHM CP OUT IN 5 OHM CP 1.75 (.69).5 (.2).4 (.16) 1.1 (.43) *The recommended distance to the PCB Ground Plane is.254mm (.1") 53

55 Thin-Film Directional Couplers CP63 High Directivity LGA Termination CP63 - TYPE SELECTION CHART Coupling vs. Frequency -5-1 CP63AxxxxCN CP63AxxxxHN CP63AxxxxKN CP63AxxxxAN CP63AxxxxDN CP63AxxxxBN CP63AxxxxMN CP63AxxxxEN CP63AxxxxLN -15 CP63AxxxxFN 3 db -2 CP63AxxxxGN Frequency [GHz] Intermediate coupling factors are readily available. Please contact factory. 54

56 Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxAN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836AN CP63A881AN GSM CP63A92AN CP63A947AN E-GSM CP63A897AN CP63A942AN PDC CP63A1441AN CP63A1747AN PCN CP63A1842AN PCS CP63A188AN CP63A196AN PHP CP63A197AN DECT CP63A189AN Wireless LAN CP63A2442AN CP63A35AN WiFi CP63A5AN CP63A55AN CP63A6AN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP63AxxxxANTR Frequency [GHz] I Loss [db] Coupler P/N CP63AxxxxBN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836BN CP63A881BN GSM CP63A92BN CP63A947BN E-GSM CP63A897BN CP63A942BN PDC CP63A1441BN PCN CP63A1747BN CP63A1842BN PCS CP63A188BN CP63A196BN PHP CP63A197BN DECT CP63A189BN Wireless LAN CP63A2442BN CP63A35BN WiFi CP63A5BN CP63A55BN CP63A6BN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss CP63AxxxxBNTR Isolation Frequency [GHz] I Loss [db] 3 Coupler P/N CP63AxxxxCN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836CN CP63A881CN GSM CP63A92CN CP63A947CN E-GSM CP63A897CN CP63A942CN PDC CP63A1441CN PCN CP63A1747CN CP63A1842CN PCS CP63A188CN CP63A196CN PHP CP63A197CN DECT CP63A189CN Wireless LAN CP63A2442CN CP63A35CN WiFi CP63A5CN CP63A55CN CP63A6CN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP63AxxxxCNTR Frequency [GHz] I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 55

57 Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxDN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836DN CP63A881DN GSM CP63A92DN CP63A947DN E-GSM CP63A897DN CP63A942DN PDC CP63A1441DN PCN CP63A1747DN CP63A1842DN PCS CP63A188DN CP63A196DN PHP CP63A197DN DECT CP63A189DN Wireless LAN CP63A2442DN CP63A35DN WiFi CP63A5DN CP63A55DN CP63A6DN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP63AxxxxDNTR Frequency [GHz] I Loss [db] 3 Coupler P/N CP63AxxxxEN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836EN CP63A881EN GSM CP63A92EN CP63A947EN E-GSM CP63A897EN CP63A942EN PDC CP63A1441EN PCN CP63A1747EN CP63A1842EN PCS CP63A188EN CP63A196EN PHP CP63A197EN DECT CP63A189EN Wireless LAN CP63A2442EN CP63A35EN WiFi CP63A5EN CP63A55EN CP63A6EN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP63AxxxxENTR Frequency [GHz] I Loss [db] Coupler P/N CP63AxxxxFN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836FN CP63A881FN GSM CP63A92FN CP63A947FN E-GSM CP63A897FN CP63A942FN PDC CP63A1441FN CP63A1747FN PCN CP63A1842FN PCS CP63A188FN CP63A196FN PHP CP63A197FN DECT CP63A189FN Wireless LAN CP63A2442FN CP63A35FN WiFi CP63A5FN CP63A55FN CP63A6FN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP63AxxxxFNTR Frequency [GHz] I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 56

58 Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxGN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836GN CP63A881GN GSM CP63A92GN CP63A947GN E-GSM CP63A897GN CP63A942GN PDC CP63A1441GN CP63A1747GN PCN CP63A1842GN PCS CP63A188GN CP63A196GN PHP CP63A197GN DECT CP63A189GN Wireless LAN CP63A2442GN CP63A35GN WiFi CP63A5GN CP63A55GN CP63A6GN Coupling, Return Loss, Isolation, [db] I. Loss R. Loss Coupling Isolation CP63AxxxxGNTR Frequency [GHz] I Loss [db] Coupler P/N CP63AxxxxHN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836HN CP63A881HN GSM CP63A92HN CP63A947HN E-GSM CP63A897HN CP63A942HN PDC CP63A1441HN PCN CP63A1747HN CP63A1842HN PCS CP63A188HN CP63A196HN PHP CP63A197HN DECT CP63A189HN Wireless LAN CP63A2442HN CP63A35HN WiFi CP63A5HN CP63A55HN CP63A6HN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss CP63AxxxxHNTR Isolation Frequency [GHz] I Loss [db] 3 Coupler P/N CP63AxxxxMN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836MN CP63A881MN GSM CP63A92MN CP63A947MN E-GSM CP63A897MN CP63A942MN PDC CP63A1441MN PCN CP63A1747MN CP63A1842MN PCS CP63A188MN CP63A196MN PHP CP63A197MN DECT CP63A189MN Wireless LAN CP63A2442MN CP63A35MN WiFi CP63A5MN CP63A55MN CP63A6MN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP63AxxxxMNTR Frequency [GHz] I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 57

59 Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxLN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836LN CP63A881LN GSM CP63A92LN CP63A947LN E-GSM CP63A897LN CP63A942LN PDC CP63A1441LN PCN CP63A1747LN CP63A1842LN PCS CP63A188LN CP63A196LN PHP CP63A197LN DECT CP63A189LN Wireless LAN CP63A2442LN CP63A35LN CP63A5LN WiFi CP63A55LN CP63A6LN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss Isolation CP63AxxxxLNTR Frequency [GHz] I Loss [db] 3 Coupler P/N CP63AxxxxKN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836KN CP63A881KN GSM CP63A92KN CP63A947KN E-GSM CP63A897KN CP63A942KN PDC CP63A1441KN PCN CP63A1747KN CP63A1842KN PCS CP63A188KN CP63A196KN PHP CP63A197KN DECT CP63A189KN Wireless LAN CP63A2442KN CP63A35KN WiFi CP63A5KN CP63A55KN CP63A6KN Coupling, Return Loss, Isolation, [db] I. Loss Coupling R. Loss CP63AxxxxKNTR Isolation Frequency [GHz] I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 58

60 Thin-Film Directional Couplers CP42 / CP63 High Directivity Couplers Test Jigs GENERAL DESCRIPTION These jigs are designed for testing the CP42 and CP63 High Directivity Couplers using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.254mm (.1") from the microstrips. The substrate used is Neltec s NH9338ST254C1BC. The connectors are SMA type (female), Johnson Components Inc. Product P/N: Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2. Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Place the coupler on the measurement jig as follows: Input (Coupler) Connector 1 (Jig) Termination (Coupler) Connector 3 (Jig) Output (Coupler) Connector 2 (Jig) Coupling (Coupler) Connector 4 (Jig) 3 To measure I. Loss connect: Connector 1 (Jig) Port 1 (VNA) Connector 2 (Jig) Port 2 (VNA) Connector 3 (Jig) 5Ω Connector 4 (Jig) 5Ω To measure R. Loss and Coupling connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) To measure Isolation connect: Connector 1 (Jig) 5Ω Connector 2 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) Measurement Jig Calibration Jig Connector 4 Connector 1 Connector 2 Open Line Short Line to GND. OPEN HS TH Connector Johnson P/N Load & Through Connector 3 Load & Through 59

61 Thin-Film Directional Couplers CP63 SMD Type 3 GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF SMD Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP Style Directional Coupler 63 Size 63 FEATURES Miniature Size: 63 Frequency Range: 8MHz - 3GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4ºC to +85ºC Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled X Type **** Frequency MHz DIMENSIONS: T X B1 L Sub Type B Bottom View A W 63 L 1.6±.1 (.63±.4) W.84±.1 (.33±.4) T.6±.1 (.28±.4) A.35±.15 (.14±.6) B.175±.1 (.7±.4) B1.+.1/-. (.+.4/-.) S Termination Code W = Sn9, Pb1 **S = Sn1 millimeters (inches) Top View TR Packaging Code TR = Tape and Reel **RoHS compliant QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. Recommended Pad Layout Dimensions mm (inches) 1.85 (.73).45 (.18) TERMINALS (Top View) OUT 5 OHM IN COUPLING Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style..28 (.11) 1.8 (.43) Orientation in tape 6 6

62 Thin-Film Directional Couplers CP63 SMD Type Coupler P/N CP63A****AS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836AS ±1 CP63A881AS ±1.25 GSM CP63A92AS ±1 CP63A947AS ±1 E-GSM CP63A897AS ±1 CP63A942AS ±1 PDC CP63A1441AS ±1.4 PCN CP63A1747AS ±1 1.2 CP63A1842AS ±1.6 PCS CP63A188AS ±1 CP63A196AS ±1.65 PHP CP63A197AS ±1.6 DECT CP63A189AS ±1 Wireless LAN CP63A2442AS ±1.85 Coupling, Return Loss, Isolation (db) I. Loss Coupling CP63A **** AS Isolation Return Loss Frequency (GHz) I. Loss (db) Coupler P/N CP63A****BS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836BS ±1 CP63A881BS ± GSM CP63A92BS ±1 CP63A947BS ±1 E-GSM CP63A897BS ±1 CP63A942BS ±1 PDC CP63A1441BS ±1.55 PCN CP63A1747BS ±1 1.3 CP63A1842BS ±1 PCS CP63A188BS ±1 CP63A196BS ±1.8 PHP CP63A197BS ±1 1.4 DECT CP63A189BS ±1 Wireless LAN CP63A2442BS ±1 1.1 Coupling, Return Loss, Isolation (db) I. Loss -1 Coupling CP63A **** BS Return Loss Isolation Frequency (GHz) I. Loss (db) 3 Coupler P/N CP63A****CS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836CS ±1 CP63A881CS ±1.25 GSM CP63A92CS ±1 CP63A947CS ±1 E-GSM CP63A897CS ±1 CP63A942CS ±1 PDC CP63A1441CS ± PCN CP63A1747CS ±1 CP63A1842CS ±1 PCS CP63A188CS ±1 CP63A196CS ±1.5 PHP CP63A197CS ±1 DECT CP63A189CS ±1 Wireless LAN CP63A2442CS ±1.65 Coupler P/N CP63A****DS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836DS ±1 CP63A881DS ± GSM CP63A92DS ±1 CP63A947DS ±1 E-GSM CP63A897DS ±1 CP63A942DS ±1 PDC CP63A1441DS ± PCN CP63A1747DS ±1 CP63A1842DS ±1.9 PCS CP63A188DS ±1 CP63A196DS ± PHP CP63A197DS ±1 DECT CP63A189DS ±1 Wireless LAN CP63A2442DS ±1 1.5 Important: Couplers can be used at any frequency within the indicated range. Coupling, Return Loss, Isolation (db) Coupling, Return Loss, Isolation (db) I. Loss Coupling CP63A **** CS Isolation Return Loss Frequency (GHz) CP63A **** DS I. Loss Coupling Return Loss Isolation Frequency (GHz) I. Loss (db) I. Loss (db) 61 61

63 Thin-Film Directional Couplers CP63 SMD Type Coupler P/N CP63B****AS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836AS ±1 CP63B881AS ±1 GSM CP63B92AS ±1.2 CP63B947AS ±1 E-GSM CP63B897AS ±1 CP63B942AS ±1 PDC CP63B1441AS ± CP63B1747AS ±1 PCN CP63B1842AS ±1 PCS CP63B188AS ±1 CP63B196AS ±1.3 PHP CP63B197AS ±1 DECT CP63B189AS ±1 Wireless LAN CP63B2442AS ±1.45 Coupling, Return Loss, Isolation (db) CP63B **** AS I. Loss Coupling Isolation Frequency (GHz) Return Loss I. Loss (db) 3 Coupler P/N CP63B****BS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836BS ±1 CP63B881BS ±1 GSM CP63B92BS ±1 CP63B947BS ±1.2 E-GSM CP63B897BS ±1 CP63B942BS ±1 PDC CP63B1441BS ±1 1.2 PCN CP63B1747BS ±1 CP63B1842BS ±1 PCS CP63B188BS ±1.25 CP63B196BS ±1 PHP CP63B197BS ±1 DECT CP63B189BS ±1 Wireless LAN CP63B2442BS ±1.35 Coupling, Return Loss, Isolation (db) CP63B **** BS -5 I. Loss Coupling Return Loss Isolation Frequency (GHz) I. Loss (db) Coupler P/N CP63B****CS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836CS ±1 CP63B881CS ±1 GSM CP63B92CS ±1 CP63B947CS ±1.2 E-GSM CP63B897CS ±1 CP63B942CS ±1 PDC CP63B1441CS ±1 1.2 PCN CP63B1747CS ±1 CP63B1842CS ±1 PCS CP63B188CS ±1 CP63B196CS ±1.25 PHP CP63B197CS ±1 DECT CP63B189CS ±1 Wireless LAN CP63B2442CS ± Coupling, Return Loss, Isolation (db) CP63B **** CS -5 I. Loss Coupling Return Loss Isolation Frequency (GHz) I. Loss (db) Important: Couplers can be used at any frequency within the indicated range

64 Thin-Film Directional Couplers CP63 SMD Type High Directivity Coupler P/N CP63D****AS Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] CP63D836AS AMPS CP63D881AS CP63D92AS GSM CP63D947AS E-GSM CP63D897AS CP63D942AS PDC CP63D1441AS CP63D1747AS PCN 17 CP63D1842AS CP63D188AS PCS CP63D196AS PHP CP63D197AS DECT CP63D189AS Wireless LAN CP63D2442AS Coupling, Return Loss, Isolation (db) I. Loss Coupling Return Loss CP63D **** AS Isolation Frequency (GHz) I. Loss (db) Coupler P/N CP63D****BS Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] CP63D836BS AMPS 36 CP63D881BS CP63D92BS GSM CP63D947BS CP63D897BS E-GSM CP63D942BS PDC CP63D1441BS PCN CP63D1747BS CP63D1842BS PCS CP63D188BS CP63D196BS PHP CP63D197BS DECT CP63D189BS Wireless LAN CP63D2442BS Coupling, Return Loss, Isolation (db) I. Loss Coupling Return Loss CP63D **** BS Isolation Frequency (GHz) I. Loss (db) 3 Important: Couplers can be used at any frequency within the indicated range. 63

65 Thin-Film Directional Couplers CP85 SMD Type 3 GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF SMD Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small Size: 85 Frequency Range: 8MHz - 3GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4 C to +85 C Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled HOW TO ORDER CP 85 APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s A 92 DIMENSIONS: (Top View) A T L A W B 85 L 2.3±.1 (.8±.4) W 1.55±.1 (.61±.4) T.98±.1 (.39±.4) A.56±.25 (.22±.1) B.35±.15 (.14±.6) S millimeters (inches) TR Style Directional Coupler Not RoHS Compliant Size 85 Layout Type (see layout types) Frequency MHz Sub Type (see layout sub-types) Termination Code W = Nickel/Solder (Sn/Pb) **S = Nickel / Lead Free Solder (Sn1) Packaging Code TR = Tape and Reel **RoHS compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Solder coating (Sn, Pb) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. Recommended Pad Layout Dimensions mm (inches) 2.33 (.92).6 (.24) (.89) (.26) NOTE: Components must be mounted on the board with the white (Alumina) side DOWN. 64

66 Thin-Film Directional Couplers CP85 Layout Types LAYOUT Sn1 LAYOUT LAYOUT Sn1 LAYOUT COUP Port 5 OHM (External Resistor) COUP 5 OHM COUP Port 5 OHM (External Resistor) COUP 5 OHM RF IN Port db RF OUT Port Type: A Sub-Type: A -5 I. Loss Coupling R. Loss Isolation Frequency (GHz) RF IN Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836AW ±1 CP85A881AW ±1.25 GSM CP85A92AW ±1 CP85A947AW ±1 1.2 E-GSM CP85A897AW ±1 CP85A942AW ±1 PDC CP85A1441AW ± PCN CP85A1747AW ±1.7 CP85A1842AW ±1.8 PCS CP85A188AW ±1 1.4 CP85A196AW ±1 PHP CP85A197AW ±1 DECT CP85A189AW ±1 1.6 C RF OUT I. Loss (db) RF IN Port db RF OUT Port Type: A Sub-Type: B I. Loss Coupling Isolation R. Loss RF IN Frequency (GHz) Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836BW ±1 CP85A881BW ± GSM CP85A92BW ±1 CP85A947BW ±1 E-GSM CP85A897BW ±1 CP85A942BW ±1 PDC CP85A1441BW ±1.35 PCN CP85A1747BW ±1.5 CP85A1842BW ±1 PCS CP85A188BW ±1.6 CP85A196BW ± PHP CP85A197BW ±1.6 DECT CP85A189BW ±1 Wireless LAN CP85A2442BW ± M RF OUT I. Loss (db) 3 LAYOUT Sn1 LAYOUT COUP 5 OHM COUP 5 OHM db Type: A Sub-Type: C I. Loss Coupling Isolation R. Loss Frequency (GHz) Important: Couplers can be used at any frequency within the indicated range. IN OUT RF IN Y RF OUT Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836CW ±1 CP85A881CW ±1.5 GSM CP85A92CW ±1 CP85A947CW ±1 1.4 E-GSM CP85A897CW ±1 CP85A942CW ±1 PDC CP85A1441CW ± PCN CP85A1747CW ±1 1.6 CP85A1842CW ±1 PCS CP85A188CW ± Cp85A196CW ±1 PHP CP85A197CW ±1 DECT CP85A189CW ±1 Wireless LAN CP85A2442CW ±

67 Thin-Film Directional Couplers CP85 Layout Types LAYOUT Sn1 LAYOUT LAYOUT Sn1 LAYOUT COUP 5 OHM COUP 5 OHM COUP 5 OHM COUP 5 OHM IN OUT RF IN F RF OUT IN OUT RF IN K RF OUT Type: A Sub-Type: D Type: A Sub-Type: E db I. Loss Coupling Isolation R. Loss db I. Loss Coupling Isolation I. Loss (db) Frequency (GHz) -25 R. Loss Frequency (GHz) Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836DW ±1 CP85A881DW ± GSM CP85A92DW ±1 CP85A947DW ±1 E-GSM CP85A897DW ±1 CP85A942DW ±1 PDC CP85A1441DW ± PCN CP85A1747DW ±1 CP85A1842DW ± PCS CP85A188DW ±1 Cp85A196DW ± PHP CP85A197DW ±1 DECT CP85A189DW ± Wireless LAN CP85A2442DW ± db Type: B Sub-Type: A -5 I. Loss Coupling R. Loss Isolation Frequency (GHz) Important: Couplers can be used at any frequency within the indicated range. I. Loss (db) Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836EW ±1 CP85A881EW ± GSM CP85A92EW ±1 CP85A947EW ±1 E-GSM CP85A897EW ±1 CP85A942EW ±1 PDC CP85A1441EW ± PCN CP85A1747EW ±1 CP85A1842EW ± PCS CP85A188EW ±1 Cp85A196EW ±1 PHP CP85A197EW ± DECT CP85A189EW ±1 Wireless LAN CP85A2442EW ±1 4.2 RF IN Port RF OUT Port LAYOUT COUP Port 5 OHM (External Resistor) Sn1 LAYOUT RF IN RF OUT T COUP 5 OHM Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836AW ±1 CP85B881AW ±1 GSM CP85B92AW ±1 CP85B947AW ±1.25 E-GSM CP85B897AW ±1 CP85B942AW ±1 PDC CP85B1441AW ±1 PCN CP85B1747AW ±1 1.2 Cp85B1842AW ±1.3 PCS CP85B188AW ±1 CP85B196AW ±1.4 PHP CP85B197AW ±1.3 DECT CP85B189AW ±1 Wireless LAN CP85B2442AW ±1.4 66

68 Thin-Film Directional Couplers CP85 Layout Types LAYOUT Sn1 LAYOUT LAYOUT Sn1 LAYOUT RF IN Port COUP Port RF IN COUP RF IN Port COUP Port RF IN COUP RF OUT Port db 5 OHM (External Resistor) Type: B Sub-Type: B -5 I. Loss Coupling R. Loss Isolation Frequency (GHz) RF OUT V I. Loss (db) 5 OHM RF OUT Port db 5 OHM (External Resistor) RF OUT Type: B Sub-Type: C -5 I. Loss Coupling R. Loss Isolation Frequency (GHz) L OHM I. Loss (db) 3 Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836BW ±1 CP85B881BW ±1 GSM CP85B92BW ±1 CP85B947BW ±1 E-GSM CP85B897BW ±1 CP85B942BW ±1.25 PDC CP85B1441BW ±1 PCN CP85B1747BW ±1 CP85B1842BW ±1 1.2 PCS CP85B188BW ±1 CP85B196BW ±1 PHP CP85B197BW ±1 DECT CP85B189BW ±1 Wireless LAN CP85B2442BW ±1.4 Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836CW ±1 CP85B881CW ±1 GSM CP85B92CW ±1 CP85B947CW ±1 E-GSM CP85B897CW ±1 CP85B942CW ±1.25 PDC CP85B1441CW ±1 PCN CP85B1747CW ±1 Cp85B1842CW ±1 1.2 PCS CP85B188CW ±1 Cp85B196CW ±1 PHP CP85B197CW ±1 DECT CP85B189CW ±1 Wireless LAN CP85B2442CW ±1.4 Important: Couplers can be used at any frequency within the indicated range. 67

69 Thin-Film Directional Couplers CP85 Layout Types VHF DIRECTIONAL COUPLER CP85L155ASTR Sn1 LAYOUT UHF DIRECTIONAL COUPLER CP85L436BSTR Sn1 LAYOUT IN COUP COUP 5 OHM OUT A 5 OHM IN E OUT I. Loss Frequency Coupling R. Loss Directivity P/N max [MHz] [db] [db] [db] [db] CP85L155ASTR ± I. Loss Frequency Coupling R. Loss Directivity P/N max [MHz] [db] [db] [db] [db] CP85L436BSTR ± db I. Loss Coupling R. Loss I. Loss (db) db I. Loss Coupling Isolation I. Loss (db) Isolation Frequency (MHz) -5 R. Loss Frequency (MHz) -5 Important: Couplers can be used at any frequency within the indicated range. 68

70 Thin-Film Directional Couplers CP85 and CP63 Test Jig ITF TEST JIG FOR COUPLER TYPES 85 AND 63 SMD GENERAL DESCRIPTION MEASUREMENT PROCEDURE This jig is designed for the testing of CP85 and CP63 series Directional Couplers using a vector network analyzer. It consists of a FR4 multi-layer substrate, having 5Ω microstrips as conducting lines and a ground plane in the middle layer, located at a distance of.2mm from the microstrips. The connectors are SMA type (female), Johnson Components Inc. Product P/N: The jig is designed for a full 2-port calibration. LOAD calibration can be done either by a 5Ω SMA termination, or by soldering a 5Ω chip resistor at the 5Ω ports. When measuring a component, it can be either soldered or pressed by a non-metallic stick until all four ports touch the appropriate pads. To measure the coupling (and the R. Loss) place the component on the Port 1 & Port 2 pads. Use two SMA 5Ω terminations (male) to terminate the ports, which are not connected to the network analyzer, and connect the network analyzer to the two ports. A 9 rotation of the component on its pads allows measuring a second parameter (I. Loss). Load & Thru Calibration Area Short Port 1 Coupler 85 5 Open 5 Connector (1 of 12) P/N Port 2 3 Port 1 Coupler Port 2 CP85 SERIES DIRECTIONAL COUPLERS Orientation and Tape and Reel Packaging Specification (Top View) CP85xxxxxxSTR (Sn1) (Top View) COUP RF IN 5 OHM RF OUT COUP RF IN 5 OHM RF OUT COUP RF IN C 5 OHM RF OUT COUP RF IN M 5 OHM RF OUT TYPE AA TYPE AB TYPE AA TYPE AB COUP 5 OHM COUP 5 OHM COUP 5 OHM COUP 5 OHM COUP 5 OHM COUP 5 OHM RF IN RF OUT RF IN RF OUT RF IN RF OUT RF IN Y RF OUT RF IN F RF OUT RF IN K RF OUT TYPE AC TYPE AD TYPE AE TYPE AC TYPE AD TYPE AE RF IN RF OUT COUP 5 OHM RF IN RF OUT COUP 5 OHM RF IN RF OUT TYPE BA TYPE BB TYPE BC The parts should be mounted on the PCB with White (Alumina) side down and the "dark" side up. COUP 5 OHM RF IN RF OUT T COUP 5 OHM RF IN RF OUT V COUP 5 OHM RF IN RF OUT L TYPE BA TYPE BB TYPE BC COUP 5 OHM The parts should be mounted on the PCB with printed side up. 69

71 Thin-Film Directional Couplers DB63N 3dB 9 Couplers GENERAL DESCRIPTION RFAP TECHNOLOGY The DB63N 3dB 9 Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The RFAP LGA 3dB 9 Coupler will be offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Balanced Amplifiers and Signal Distribution in Wireless Communications FEATURES Miniature 63 size Low I. Loss High Isolation Surface Mountable RoHS Compliant Supplied on T&R Power Rating: 1W RF Continuous DIMENSIONS: millimeters (inches) LAND GRID ARRAY ADVANTAGES: Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Bottom View 3 Recommended Pad Layout Dimensions.4 (.16) mm (inches) 1.1 (.43) L W T A B S 1.6±.1 (.63±.4).84±.1 (.33±.4).6±.1 (.24±.4).25±.5 (.1±.2).2±.5 (.8±.2).5±.5 (.2±.2) T W A B L S 1.75 (.69).5 (.2) ORIENTATION IN TAPE 5 OHM OUT 1 IN OUT 2 ELECTRICAL PARAMETERS Part Number Frequency Port Return Loss Isolation Insertion Loss Ampltidue Phase Balance Power MHz Impedance [db] [db] [db] Balance (Relative to 9º) Handing Ω [db] Deg Watts Min. Max. Typ. Min. Typ. Min. Typ. Typ. Max. Typ. Max. Typ. Max Max. DB63N214ANTR DB63N24ANTR DB63N26ANTR DB63N3ANTR DB63N35ANTR DB63N46ANTR DB63N55ANTR DB63N58ANTR NOTE: Additional Frequencies Available Upon Request 7

72 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 24MHz to 224MHz DB63N214ANTR -2 Return Loss - Input db Frequency (MHz) Insertion Loss db Frequency (MHz) 2 Amplitude Balance 1 db Frequency (MHz) 71

73 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 24MHz to 224MHz DB63N214ANTR Phase Balance 8 4 db Frequency (MHz) Isolation db Frequency (MHz) 72

74 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 22MHz to 26MHz DB63N24ANTR -1 Return Loss - Input db Frequency (MHz) Insertion Loss db Frequency (MHz) Amplitude Balance 2 1 db Frequency (MHz) 73

75 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 22MHz to 26MHz DB63N24ANTR 8 Phase Balance 4 db Frequency (MHz) Isolation db Frequency (MHz) 74

76 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 24MHz TO 28MHz DB63N26ANTR -1 Return Loss - Input db Frequency (MHz) 28 Insertion Loss db Frequency (MHz) 2 Amplitude Balance 1 db Frequency (MHz) 75

77 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 24MHz TO 28MHz DB63N26ANTR 8 Phase Balance 4 db Frequency (MHz) 3-2 Isolation -22 db Frequency (MHz) 76

78 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 285MHz to 315MHz DB63N3ANTR -1 Return Loss - Input db Frequency (MHz) Insertion Loss db Frequency (MHz) 2 Amplitude Balance 1 db Frequency (MHz) 77

79 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 285MHz to 315MHz DB63N3ANTR Phase Balance 8 4 db Frequency (MHz) Isolation db Frequency (MHz) 78

80 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 32MHz to 38MHz DB63N35ANTR -1 Return Loss - Input db Frequency (MHz) Insertion Loss db Frequency (MHz) 2 Amplitude Balance 1 db Frequency (MHz) 79

81 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 32MHz to 38MHz DB63N35ANTR 8 Phase Balance 4 db Frequency (MHz) Isolation db Frequency (MHz) 8

82 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 42MHz TO 5MHz DB63N46ANTR -12 Return Loss - Input -14 db Frequency (MHz) -12 Isolation 3-14 db Frequency (MHz) Insertion Loss -.2 db Frequency (MHz) 81

83 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 42MHz TO 5MHz DB63N46ANTR 1 Amplitude Balance.5 db Frequency (MHz) Phase Balance deg Frequency (MHz) 82

84 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 51MHz TO 59MHz DB63N55ANTR -12 Return Loss - Input -14 db Frequency (MHz) -1 Isolation 3-12 db Frequency (MHz) -.2 Insertion Loss -.4 db Frequency (MHz) 83

85 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 51MHz TO 59MHz DB63N55ANTR 1.5 Amplitude Balance 1 db Frequency (MHz) Phase Balance db Frequency (MHz) 84

86 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 56MHz TO 6MHz DB63N58ANTR -1 Return Loss - Input db Frequency (MHz) -12 Isolation 3-14 db Frequency (MHz) Insertion Loss db Frequency (MHz) 85

87 Thin-Film Directional Couplers DB63N 3dB 9 Couplers 56MHz TO 6MHz DB63N58ANTR 1 Amplitude Balance.5 db Frequency (MHz) Phase Balance deg Frequency (MHz) 86

88 Thin-Film Directional Couplers DB85 3dB 9 Couplers GENERAL DESCRIPTION ITF TECHNOLOGY The ITF SMD 3dB 9 Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF 3dB 9 Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. Recommended Pad Layout Dimensions 2.24 (.88).7 (.28) GROUND mm (inches) (.69) (.25) APPLICATIONS Balanced Amplifiers and Signal Distribution in Mobile Communications DIMENSIONS: millimeters (inches) L W T A B 2.3±.1 (.8±.4) 1.55±.1 (.61±.4).98±.15 (.37±.6).56±.25 (.22±.1).35±.15 (.14±.6) T FEATURES Miniature 85 size Low I. Loss High Isolation Power Handling: 1W RF CW Surface Mountable Supplied on Tape and Reel Operating Temperature -4 C to +85 C Bottom View L A B W 3.15 (.6) TYP. TERMINALS (Top View) Orientation in Tape 5 OHM IN OUT1 OUT2 5 OHM IN OUT1 OUT2 Code Letter Marking ELECTRICAL PARAMETERS* Part Number** Frequency F O I. F O Phase Balance Code Letter [MHz] [db] [deg] max. Marking DB85A88ASTR 88± Y DB85A915ASTR 915± V DB85A967ASTR 967± V DB85A135ASTR 135± C DB85A165ASTR 165± F DB85A18ASTR 18±5.3 3 F DB85A185ASTR 185±5.3 3 K DB85A19ASTR 19±5.3 3 K DB85A195ASTR 195± K DB85A214ASTR 214± L DB85A2325ASTR 2325± T *With Recommended Pad Layout ** LEAD FREE TERMINATION PART NUMBERS: DB85AxxxxASTR LEAD-FREE COMPATIBLE COMPONENT NOTE: Additional Frequencies Available Upon Request 87

89 Thin-Film Directional Couplers DB85 3dB 9 Couplers 88 ± 3MHz DB85A88ASTR I. Loss 1 db -3.4 I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 88

90 Thin-Film Directional Couplers DB85 3dB 9 Couplers 915 ± 3MHz DB85A915ASTR db -3.4 I. Loss I. Loss Frequency (MHz) db Isolation R. Loss Frequency (MHz) 89

91 Thin-Film Directional Couplers DB85 3dB 9 Couplers 967± 3MHz DB85A967ASTR db I. Loss I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 9

92 Thin-Film Directional Couplers DB85 3dB 9 Couplers 135 ± 5MHz DB85A135ASTR I. Loss 1 db -3.4 I. Loss Frequency (MHz) 3 db Isolation R. Loss Frequency (MHz) 91

93 Thin-Film Directional Couplers DB85 3dB 9 Couplers 165 ± 5MHz DB85A165ASTR I. Loss 1 db I. Loss Frequency (MHz) db Isolation R. Loss Frequency (MHz) 92

94 Thin-Film Directional Couplers DB85 3dB 9 Couplers 18 ± 5MHz DB85A18ASTR I. Loss 1 db -3.2 I. Loss Frequency (MHz) 3 db Isolation R. Loss Frequency (MHz) 93

95 Thin-Film Directional Couplers DB85 3dB 9 Couplers 185 ± 5MHz DB85A185ASTR db -3.2 I. Loss I. Loss Frequency (MHz) db R. Loss -2 Isolation Frequency (MHz) 94

96 Thin-Film Directional Couplers DB85 3dB 9 Couplers 19 ± 5MHz DB85A19ASTR -3. I. Loss db I. Loss Frequency (MHz) db Isolation R. Loss Frequency (MHz) 95

97 Thin-Film Directional Couplers DB85 3dB 9 Couplers 195 ± 5MHz DB85A195ASTR db -3.2 I. Loss 1 I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 96

98 Thin-Film Directional Couplers DB85 3dB 9 Couplers 214 ± 5MHz DB85A214ASTR db I. Loss 1 I. Loss Frequency (MHz) 3 db R. Loss Isolation Frequency (MHz) 97

99 Thin-Film Directional Couplers DB85 3dB 9 Couplers 2325 ± 5MHz DB85A2325ASTR I. Loss db I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 98

100 Thin-Film Directional Couplers DB85 3dB 9 Test Jigs GENERAL DESCRIPTION These jigs are designed for testing the DB85 3dB 9 Couplers using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.254mm from the microstrips. The substrate used is Neltec s NH9338ST254C1BC. The connectors are SMA type (female), Johnson Components Inc. Product P/N: Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2. Follow the VNA s instruction manual and use the calibration jig to perform a full 2-port calibration in the required bandwidths. Place the coupler on the measurement jig as follows: Input (Coupler) Connector 1 (Jig) Output 1 (Coupler) Connector 3 (Jig) 5Ω (Coupler) Connector 2 (Jig) Output 2 (Coupler) Connector 4 (Jig) 3 To measure R. Loss and I. Loss 1 connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) Port 2 (VNA) Connector 2 (Jig) 5Ω Connector 4 (Jig) 5Ω To measure R. Loss and I. Loss 2 connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) To measure Isolation connect: Connector 1 (Jig) 5Ω Connector 2 (Jig) 5Ω Connector 3 (Jig) Port 1 (VNA) Connector 4 (Jig) Port 2 (VNA) Measurement Jig Connector 1 Calibration Jig Load & Through Connector 2 Connector Johnson P/N Connector 4 Load & Through Short Line to GND Connector 3 Open Line 99

101 Thin-Film RF/Microwave Harmonic Low Pass Filter LP42/LP63/LP85 1

102 Thin-Film Low Pass Filter LP42N Series Harmonic Lead-Free LGA Termination RFAP TECHNOLOGY The LP42N Series Harmonic Low Pass Filter is based on the proprietary RFAP Thin-Film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The RFAP Harmonic Low Pass Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Wireless communications Wireless LAN s GPS WiMAX LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation HOW TO ORDER LP 42 N XXXX X N TR Style Size Type Frequency MHz Sub-Type Termination LGA Lead Free Taped & Reeled QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85ºC, 85% RH, 16 hours Endurance: 125ºC, IR, 4 hours TERMINATION Nickel/Lead-Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. LEAD-FREE COMPATIBLE COMPONENT 4 11

103 Thin-Film Low Pass Filter LP42N Series Harmonic Lead-Free LGA Termination DIMENSIONS: millimeters (inches) (Bottom View) TERMINALS (Top View) B S A IN GND L OUT GND T W RECOMMENDED PAD LAYOUT (mm) L W T 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2) A B S.2±.6 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2).2 (.8).3 (.12).15 (.6) 4.51 (.2) ELECTRICAL CHARACTERISTICS (Guaranteed over 4 C to +85 C Operating Temperature Range) P/N LP42N2442ANTR LP42N269ANTR LP42N35ANTR LP42N52ANTR LP42N55ANTR LP42N58ANTR 56-6 Frequency Band I. Loss R. Loss [MHz] [db] [db] NOTE: Additional Frequencies Available Upon Request.35 typ.5 max.35 typ.5 max.3 typ.5 max.2 typ.5 max.2 typ.5 max.2 typ.5 max Attenuation 3xF [db] [db]

104 Thin-Film Low Pass Filter LP42N Series Harmonic Lead-Free LGA Termination LP42N2442ANTR -5 F -1-2 S21 S11-25 (db) 3F F Frequency (GHz) LP42N58ANTR -5 F -1-2 S21 S11-25 (db) F Frequency (GHz) LP42N269ANTR LP42N35ANTR -1 S21-2 S11 (db) -3 F -1 F S21-2 3F S11 (db) -3 3F -4 2F -4 2F Frequency (GHz) Frequency (GHz) 4 LP42N55ANTR LP42N52ANTR S21 S11-25 (db) F -1 S21-2 S11 (db) -3-4 F -45 2F Frequency (GHz) Frequency (GHz) 13

105 Thin-Film Low Pass Filter LP42N Series Harmonic Lead-Free LGA Termination Test Jig TEST JIG FOR LP42 LOW PASS FILTER GENERAL DESCRIPTION These jigs are designed for testing the LP63 LGA Low Pass Filters using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.127mm from the microstrips. The substrate used is Neltec s NH9338ST127C1BC (or similar). The connectors are SMA type (female), Johnson Components Inc. Product P/N: (or similar). Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Solder the filter to the measurement jig as follows: Input Ë Connector 1 (Jig) GND (Filter) Ë GND (Jig) (Filter) Output Ë Connector 2 (Jig) GND (Filter) Ë GND (Jig) (Filter) Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2 (using an RF cable). Measurement Calibration Jig 4 Connector 1 Short line to GND Open line Connector Johnson P/N Connector 2 Load & Through Load & Through 14

106 Thin-Film Low Pass Filter LP63 Lead-Free LGA Type GENERAL DESCRIPTION The LP63 ITF (Integrated Thin Film) Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Low Pass Filters are offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Miniature Size: 63 Frequency Range: 9MHz-5.5HGz Characteristic Impedance: 5 Ohm Operating/Storage Temperature: -4 C to +85 C Power Rating: 3W Continuous Low Profile Rugged Construction Lead Free Taped and Reeled APPLICATIONS Mobile communications Satellite TV receivers GPS Vehicle location systems Wireless LANs RFID LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation HOW TO ORDER LP Style 63 Size 63 A Type A or N XXXX Frequency MHz A Sub-Type N Termination LGA **Ni/Lead Free Solder TR Taped & Reeled 4 FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, IR, 4 hours **RoHS compliant LEAD-FREE COMPATIBLE COMPONENT TERMINATION Nickel/Lead-Free Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. 15

107 Thin-Film Low Pass Filter LP63 Lead-Free LGA Type DIMENSIONS: millimeters (inches) (Bottom View) A B S TERMINALS AND ORIENTATION IN TAPE (Top View) IN GND IN GND L OUT GND OUT GND T W RECOMMENDED PAD LAYOUT (mm) L W T 1.6±.1 (.63±.4).84±.1 (.33±.4).6±.1 (.24±.4) A B S.25±.5 (.1±.2).2±.5 (.8±.2).5±.5 (.2±.2) 1.1 (.43).4 (.16) (.69).5 (.2) ELECTRICAL CHARACTERISTICS (Guaranteed over 4 C to +85 C Operating Temperature Range) P/N Frequency I. Loss VSWR Attentuation Band [MHz] [db] max typ. [db] [db] LP63A92ANTR typ (.5 max) 1.4 2xF 3xF LP63A947ANTR typ (.5 max) 1.4 2xF 3xF LP63A1747ANTR typ (.5 max) 1.4 2xF 3xF LP63A1842ANTR typ (.5 max) 1.4 2xF 3xF LP63A188ANTR typ (.5 max) 1.4 2xF 3xF LP63A195ANTR typ (.5 max) 1.4 2xF 3xF LP63A214ANTR typ (.5 max) 1.4 2xF 3xF LP63A2442ANTR typ (.5 max) 1.4 2xF 3xF LP63N35ANTR typ. -.5 max xF 3xF LP63N52ANTR typ. -.5 max xF 3xF LP63N55ANTR typ. -.5 max xF 3xF NOTE: Additional Frequencies Available Upon Request 16

108 Thin-Film Low Pass Filter LP63 Lead-Free LGA Type LP63A92ANTR LP63A947ANTR F F S21 S11 (db) -25 3F S21 S11 (db) -25 3F -38 2F -38 2F Frequency (GHz) Frequency (GHz) LP63A1747ANTR LP63A1842ANTR F F S21 S11 (db) F F Frequency (GHz) S21 S11 (db) F Frequency (GHz) 3F 4 S21 S11 (db) F LP63A188ANTR 2F Frequency (GHz) 3F S21 S11 (db) F LP63A195ANTR F Frequency (GHz) 3F 17

109 Thin-Film Low Pass Filter LP63 Lead-Free LGA Type S21 S11 (db) F LP63A214ANTR Frequency (GHz) 2F 3F S21 S11 (db) F LP63A2442ANTR F Frequency (GHz) 3F 4 S21 S11 (db) F LP63N35ANTR F Frequency (GHz) 3F S21 S11 (db) LP63N52ANTR F Frequency (GHz) 2F S21 S11 (db) LP63N55ANTR F Frequency (GHz) 2F 18

110 Thin-Film Low Pass Filter LP63 Lead-Free LGA Type Test Jig TEST JIG FOR LP63 LEAD-FREE LGA LOW PASS FILTER GENERAL DESCRIPTION These jigs are designed for testing the LP63 LGA Low Pass Filters using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.127mm from the microstrips. The substrate used is Neltec s NH9338ST127C1BC (or similar). The connectors are SMA type (female), Johnson Components Inc. Product P/N: (or similar). Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Solder the filter to the measurement jig as follows: Input Ë Connector 1 (Jig) GND (Filter) Ë GND (Jig) (Filter) Output Ë Connector 2 (Jig) GND (Filter) Ë GND (Jig) (Filter) Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2 (using an RF cable). Measurement Calibration Jig Connector 1 Short line to GND Open line 4 Connector Johnson P/N Connector 2 Load & Through Load & OUT 19

111 Thin-Film Low Pass Filter LP85 Type Harmonic 4 GENERAL DESCRIPTION The ITF (Integrated Thin-Film) SMD Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small Size: 85 Frequency Range: 8MHz - 3.5GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4 C to +85 C Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s DIMENSIONS: millimeters (inches) PAD LAYOUT See CP85 pad layout on page 64. FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual/mechanical characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R 4 hours TERMINATION Nickel/Solder coating (Sn, Pb) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. L W T A B 2.3±.1 (.8±.4) 1.55±.1 (.61±.4) 1.2±.1 (.4±.4).56±.25 (.22±.1).35±.15 (.14±.6) HOW TO ORDER LP 85A 92 AW TR Style Low Pass Size 85 Frequency MHz Termination AW= Nickel/Solder (SnPb) **AS = Nickel/ Lead Free Solder (Sn1) Packaging Code TR = Tape and Reel Not RoHS Compliant **RoHS compliant TERMINALS AND LAYOUT (Top View) Orientation in Tape LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. TYPE A TYPE D TYPE E TYPE F (Sn1) IN GND IN GND IN GND IN GND A MARKING CODE OUT GND OUT GND OUT GND OUT GND 11

112 Thin-Film Low Pass Filter LP85 Type Harmonic ELECTRICAL CHARACTERISTICS Application Part Frequency I. Loss VSWR Attenuation Layout Type Layout Type F Number Band (MHz) max max (db) Typical (SnPb) Marking Code E-GSM LP85A897AS A E LP85A942AS A F LP85A92AS A E GSM LP85A947AS A F LP85A1119AS A H AMPS LP85A836AS A A LP85A881AS A C PCN LP85A1747AS dB 1.7 2XFo D I LP85A1842AS (.3dB typ) 3xFo D J PCS LP85A188AS D K LP85A196AS D M PHP LP85A197AS D L DECT LP85A189AS D K 3G LP85A215AS D N Wireless LAN LP85A2442AS D S WLL LP85A35AS 34 ~ 36 E X Typical Electrical Performance db LP85A836ASTR Fo Fo -5 2Fo Frequency (GHz) db LP85A881ASTR Fo Fo -5 2Fo Frequency (GHz) db LP85A92ASTR Fo Fo -5 2Fo Frequency (GHz) 4 LP85A967ASTR LP85A1747ASTR LP85A1842ASTR -1 Fo -1 Fo -1 Fo db Fo 3Fo db Fo 3Fo db Fo 3Fo Frequency (GHz) Frequency (GHz) Frequency (GHz) db LP85A195ASTR Fo Fo Fo Frequency (GHz) db LP85A2442ASTR Fo Fo Fo Frequency (GHz) db LP85A35ASTR Fo Fo -5 2Fo Frequency (GHz) -1 LP85A1119ASTR Fo -1 Fo LP85A215ASTR -2-2 db Fo 3Fo db Fo 3Fo Frequency (GHz) Frequency (GHz) 111

113 Thin-Film Low Pass Filter LP85 Test Jig ITF TEST JIG FOR LOW PASS FILTER 85 GENERAL DESCRIPTION These jigs are designed for testing the LPF85 Low Pass Filters using a Vector Network Analyzer. They consist of a dielectric substrate, having 5W microstrips as conducting lines and a bottom ground plane located at a distance of.254 mm from the microstrips. The substrate used is RF-35-1-C1B17 (or similar). The connectors are SMA type (female), Johnson Components Inc. Product P/N: (or similar). Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5W SMA termination. MEASUREMENT PROCEDURE Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Solder the filter to the measurement jig as follows: Input Ë Connector 1 (Jig) GND (Filter) Ë GND (Jig) (Filter) Output Ë Connector 2 (Jig) GND (Filter) Ë GND (Jig) (Filter) Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2 (using an RF cable). Measurement Calibration Jig Connector 1 Short line to GND Open line 4 Connector Johnson P/N Connector 2 Load Through Load Through 112

114 High Performance Harmonic Low Pass Filter LP126A512BNTR ITF TECHNOLOGY The ITF LGA Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small size: 126 Frequency: 512MHz Characteristic impedance: 5Ω Operating/Storage temp: -4 C to +85 C Low profile Rugged construction Taped and reeled RoHS compliant APPLICATIONS Mobile communications Satellite TV receivers GPS Vehicle location systems Wireless LAN s DIMENSIONS (Bottom View) mm (inches) HOW TO ORDER LP 126 A Type XXXX Frequency (MHz) FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual/mechanical characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours B Sub- Type N Termination TR Taped & Reeled B H S A L T W TERMINALS (Top View) IN GND L W T A B H, S 3.1±.1 (.122±.4) 1.6±.1 (.63±.4).6±.3 (.24±.12).39±.1.15±.4.33±.1.13±.4.5±.5 (.2±.2) 4 TERMINATION Nickel/ Lead free Solder coating (Sn1) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. OUT GND Orientation Marking POWER RATING 3W RF Continuous ORIENTATION IN TAPE IN GND Recommended Pad Layout Dimensions mm (inches).7 (.28).8 (.31).6 (.24) OUT GND 1.8 (.71)

115 High Performance Harmonic Low Pass Filter LP126A512BNTR TERMINALS (Top View) Parameter Value Unit Notes Fc 512 MHz 9MHz -35 db Min. (72MHz to 2GHz) Insertion Loss.8 db Max. VSWR 2.3: 1 Max. (all ports) Power Handling 3 W Continuous Impedance 5 Ohm Operating Temp. -4 to +85 ºC Size 126 TYPICAL ELECTRICAL PERFORMANCE m m1 freq = 512 MHz S21 = -.78 db m2 freq = 72 MHz S21 = -39 db 4 S11 (db) S12 (db) m Frequency (MHz)

116 High Performance Low Pass Filter LP126A7ANTR ITF TECHNOLOGY The ITF LGA Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small size: 126 Frequency: 7MHz Characteristic impedance: 5Ω Operating/Storage temp: -4 C to +85 C Low profile Rugged construction Taped and reeled RoHS compliant APPLICATIONS Mobile communications Satellite TV receivers GPS Vehicle location systems Wireless LAN s DIMENSIONS (Bottom View) mm (inches) HOW TO ORDER LP 126 A Type XXXX Frequency (MHz) A Sub- Type N Termination FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual/mechanical characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/ Lead free Solder coating (Sn1) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. POWER RATING 3W RF Continuous ORIENTATION IN TAPE TR Taped & Reeled T A W B TERMINALS (Top View) IN OUT.7 (.28).8 (.31) H L GND GND S L W T A B H, S Orientation Marking Recommended Pad Layout Dimensions mm (inches) 3.1±.1 (.122±.4) 1.6±.1 (.63±.4).6±.3 (.24±.12).39±.1.15±.4.33±.1.13±.4.5±.5 (.2±.2).6 (.24) 4 IN OUT GND GND 1.8 (.71)

117 High Performance Low Pass Filter LP126A7ANTR TERMINALS (Top View) Parameter Value Unit Notes Fc 7 MHz 9MHz -35 db Min. (9MHz to 2GHz) Insertion Loss.9 db Max. VSWR 2.3: 1 Max. (all ports) Power Handling 3 W Continuous Impedance 5 Ohm Operating Temp. -4 to +85 ºC Size 126 TYPICAL ELECTRICAL PERFORMANCE -1 m1 m1: Frequency = 7.MHz S21 = -.8dB m2: Frequency = 9.MHz S21 = -39.5dB 4 S11 (db) S21 (db) m Frequency (GHz)

118 Thin-Film RF/Microwave Products Designer Kits Accu-P /Accu-L Kits 117

119 RF/Microwave Thin-Film Products Designer Kits (Special Kits Available Upon Request) Accu-P Designer Kit Type 17LF Order Number: Accu-P 21KITL2 Accu-P Designer Kit Type 18LF Order Number: Accu-P 21KITL3 Accu-P Designer Kit Type 13LF Order Number: Accu-P 42KITL1 Accu-P Designer Kit Type 14LF Order Number: Accu-P 42KITL2 Volts Capacitors Tolerance Value (pf).1 P.2 P 1.3 P.4 P.5 P.6 P.7 P.8 P.9 P 5 1. P 1.1 A 1.2 A 1.3 A 1.5 A 1.8 A 2. B 2.2 B 2.4 B 2.7 B 3. B B 3.6 B 3.9 B 4.7 B 5.6 B 6.8 B 7.5 B B G 12. G 6 Capacitors, 2 each of 3 values Tolerance P =.2pF A = ±.5pF B = ±.1pF G = ± 2% Volts Capacitors Tolerance Value (pf) 1. A 1.1 A 1.2 A A 1.4 A 1.5 A 1.6 A 1.7 A 1.8 A 1.9 A 2. A 2.1 B 2.2 B 2.3 B 2.4 B 2.5 B 2.6 B 2.7 B B 2.9 B 3. B 3.1 B 3.3 B 3.4 B 3.6 B 3.9 B 4.1 B 4.3 B 4.5 B 4.7 B 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF Volts Capacitors Tolerance Value (pf).1 P.2 P.3 P.4 P.5 P.6 P P P.9 P 1. P 1.1 A 1.2 A 1.5 A 1.8 A 2. A 2.2 B 2.4 B 2.7 B 3. B B 3.9 B 4.7 B 5.6 B 6.8 B 8.2 B 1. G G G 18. G G 6 Capacitors, 2 each of 3 values Tolerance P = ±.2pF A = ±.5pF B = ±.1pF G = ± 2% Volts Capacitors Tolerance Value (pf) 1. A 1.1 A 1.2 A 1.3 A A 1.5 A 1.6 A 1.7 A 1.8 A 1.9 A 2. A 2.1 B 2.2 B 2.3 B 2.4 B 2.5 B 2.6 B 2.7 B B 2.9 B 3. B 3.1 B 3.3 B 3.4 B 3.6 B 3.9 B 4.1 B 4.3 B 4.5 B 4.7 B 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF Accu-P Designer Kit Type 9LF Order Number: Accu-P 63KITL1 Accu-P Designer Kit Type 8LF Order Number: Accu-P 85KITL2 Accu-P Designer Kit Type 28LF Order Number: Accu-P 21KITL5 Accu-P Designer Kit Type 27LF Order Number: Accu-P 42KITL4 5 Volts Capacitors Tolerance Value (pf).1 A.2 A.3 A.4 B.5 B.6 B.7 B.8 B.9 B 1. B B 1.2 B 1.5 B 1.8 B 2. B 2.2 B 2.4 B 2.7 B 3. B 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B B 1. G 12. G 15. G 18. G G 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF G = ± 2% Volts Capacitors Tolerance Value (pf).1 A.2 A.3 A.4 A.5 B.7 B.8 B.9 B 1. B 1.2 B B 1.8 B 2. B 2.2 B 2.7 B 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B 8.2 B 1. G 12. G 15. G 18. G 22. G J 33. J 39. J 47. J 3 Capacitors, 1 each of 3 values Tolerance A = ±.5pF G = ± 2% B = ±.1pF J = ±5% Volts Capacitors Tolerance Value (pf).5 Z.1 Z.15 Z.2 Z Z Z.35 Z.4 Z.45 Z.5 Z.55 P.6 P.65 P.7 P.75 P.8 P.85 P.9 P 5.95 P 1. P 1.1 P 1.2 P 1.3 P 1.4 P 1.5 P 1.6 P 1.7 P 1.8 P P 2. P 6 Capacitors, 2 each of 3 values Tolerance Z = ±.1pF P = ±.2pF Volts Capacitors Tolerance Value (pf).5 Z.1 Z.15 Z.2 Z.25 Z.3 Z.35 Z.4 Z.45 Z.5 Z.55 P.6 P.65 P P P.8 P.85 P.9 P.95 P 1. P 1.1 P 1.2 P 1.3 P 1.4 P 1.5 P 1.6 P 1.7 P 1.8 P P P 6 Capacitors, 2 each of 3 values Tolerance Z = ±.1pF P = ±.2pF 118

120 RF/Microwave Thin-Film Products Designer Kits (Special Kits Available Upon Request) Accu-P Designer Kit Type 22LF Order Number: Accu-P 63KITL2 Accu-P Designer Kit Type 7 Order Number: Accu-P 121KIT2 Accu-P 15 Designer Kit Type 31LF Order Number: Accu-P C5KITL1 Volts Capacitors Tolerance Value (pf).5 P.1 P.15 P.2 P.25 P.3 P.35 P 1.4 P.45 P.5 P.55 P.6 P.65 P.7 P.75 P Volts Capacitors Tolerance Value (pf) 1. B 1.5 B 1.8 B 2.2 B 2.7 B 3.3 B 4.7 B B 6.8 B 1. G 12. G 18. G 22. G 27. G 33. G Volts Capacitors Tolerance Value (pf).5 P.1 P.2 P.3 P.4 P.5 P.6 P 16.7 P.8 P.9 P 1. Q 1.2 Q 1.5 Q 1.8 Q 2.2 Q 3 Capacitors, 2 each of 15 values Tolerance P = ±.2pF 15 Capacitors, 1 each of 15 values Tolerance B = ±.1pF G = ± 2% 75 Capacitors, 5 each of 15 values Tolerance P = ±.2pF Q = ±.3pF Accu-L 21 Designer Kit Type 32 Order Number: Accu-L 21KIT1 Inductance Value (nh) Tolerance.33 A.39 A.47 A.56 A.68 A.82 A 1. A 1.2 A 1.5 B 1.8 B 2.2 B 2.7 B 3.3 B 26 Inductors, 2 each of 13 values Tolerance A = ±.5nH B = ±.1nH Accu-L Designer Kit Type 25 Order Number: Accu-L L42KIT1 Inductance Value (nh) Tolerance.82 A 1. A 1.2 A 1.5 A 1.8 A 2.2 A 2.7 A 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B 24 Inductors, 2 each of 12 values Tolerance A = ±.5nH B = ±.1nH Accu-L Designer Kit Type 16LF Order Number: Accu-L 63KITL2 Inductance Value (nh) Tolerance 1.2 C 1.5 C 1.8 C 2.2 C 2.7 C 3.3 C 3.9 C 4.7 C 5.6 C 6.8 C 8.2 C 1 G 12 G 15 G 28 Inductors, 2 each of 14 values Tolerance C = ±.2nH G = ±2% 5 Accu-L Designer Kit Type 11LF Order Number: Accu-L 85KITL2 Inductance Value (nh) Tolerance 1.8 C 2.2 C 2.7 C 3.3 C 3.9 C 4.7 C 5.6 C 6.8 D 8.2 D 1. J 12. J 15. J 18. J 22. J 28 Inductors, 2 each of 14 values Tolerance C = ±.2nH D = ±.5nH J = ±5% 119

121 Multilayer Organic (MLO TM ) Technology MLO TM Capacitors MLO TM Diplexers MLO TM Inductors MLO TM SMT Crossovers 12

122 Multi-Layer Organic Capacitors Based on its patented multilayer low loss organic (MLO TM ) technology. These new capacitors represent a paradigm shift from traditional ceramic and thin film passive SMD components. Multilayer Organic Capacitors (MLOC) are polymer based capacitors that use high conductivity copper interconnects in a multilayer fashion. The ability to fabricate these components on large area substrates and state of the art laser direct imaging allow for improved cost benefits and tolerance control. The end result is a state of the art low ESR and high SRF low profile RF capacitor that can support frequencies well above one GHz. Additionally MLOCs are expansion matched to printed circuit boards to allow for improved reliability. FEATURES Low ESR Hi-Q High Self Resonance Tight Tolerance Low Dielectric Absorption (.15%) APPLICATIONS RF Power Amplifiers Low Noise Amplifiers Filter Networks Instrumentation HOW TO ORDER ML R8 P A T 2A AVX Style Case Size 3 = 63 Voltage Code 5 = 5V V = 25V 7 = 5V Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Failure Rate Code A = Not Applicable Packaging Code 2A = 7" Reel Unmarked R T Temperature Coefficient Code 1 = ±3ppm Capacitance Tolerance Code P = ±.2 pf A = ±.5 pf B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% Termination Style Code T = Ni, Sin W B L LEAD-FREE COMPATIBLE COMPONENT 6 MECHANICAL DIMENSIONS: inches (millimeters) Case Length (L) Width (W) Thickness (T) Band Width (B) Castellation Radius (R) ±.4 (1.6 ±.12).33 ±.4 (.838 ±.12).25 ±.4 (.635 ±.12).15 ±.5 (.381 ±.127).8 ±.2 (.23 ±.51) TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). 8mm carrier 7" reel, 3, pcs per reel 121

123 Multi-Layer Organic Capacitors ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Life (Endurance) MIL-STD-22F 125 C, 2U R, 1 hours No visible damage C/C 2% for C 5pF Method 18A C/C.25pF for C<5pF Accelerated Damp Heat Steady 85 C, 85% RH, U R, 1 hours No visible damage C/C 2% for C 5pF State MIL-STD-22F Method 13B C/C.25pF for C<5pF Temperature Cycling 55 C to +125 C, 15 cycles MLO TM No visible damage C/C 2% for C 5pF MIL-STD-22F Method 17E C/C.25pF for C<5pF MIL-STD-883D Method 11.7 Resistance to Solder Heat 26 C ± 5 C for 1 secs. C remains within initial limits IEC MECHANICAL SPECIFICATIONS TEST CONDITIONS REQUIREMENT Solderability IEC Components completely immersed in Terminations to be well tinned, minimum 95% a solder bath at 235 C for 2 secs. coverage Leach Resistance IEC Components completely immersed in Dissolution of termination faces 15% of area a solder bath at 26±5 C for 6 secs. Dissolution of termination edges 25% of length Adhesion MIL-STD-22F A force of 5N applied for 1 secs. No visible damage Method 211A Termination Bond Strength Tested as shown in diagram No visible damage C/C 2% for C 5pF IEC Amend. 2 C/C.25pF for C<5pF Robustness of Termination A force of 5N applied for 1 secs. No visible damage IEC Amend. 2 Storage 12 months minimum with components Good solderability stored in as received packaging 6 QUALITY & RELIABILITY MLO TM capacitors utilize high density interconnect wiring technology on well established low loss organic materials. FINAL QUALITY INSPECTION Finished parts are tested for standard electrical parameters and visual/mechanical characteristics. Each production lot is 1% evaluated for: capacitance and proof voltage at 2.5 U R. In addition, production is periodically evaluated for: Average capacitance with histogram printout for capacitance distribution; IR and Breakdown Voltage distribution; Temperature Coefficient; Solderability; Dimensional, mechanical and temperature stability. QUALITY ASSURANCE The reliability of these multilayer organic capacitors has been extensively studied. Various methods and standards have been used to ensure a high quality component including JEDEC, Mil Spec and IPC testing. AVX s quality assurance policy is based on well established international industry standards. The reliability of the capacitors is determined by accelerated testing under the following conditions: Life (Endurance) 125 C, 2U R, 1 hours Accelerated Damp 85 C, 85% RH, U R, Heat Steady State 1 hours. TABLE I: CASE SIZE ML3 Cap. pf Cap. Tol. WVDC.1 P, A, B 5, 25, 5.2 P, A, B 5, 25, 5.3 P, A, B 5, 25, 5.4 P, A, B 5, 25, 5.5 P, A, B, C 5, 25, 5.6 P, A, B, C 5, 25, 5.7 P, A, B, C 5, 25, 5.8 P, A, B, C 5, 25, 5.9 P, A, B, C 5, 25, 5 1. P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25, Cap. pf Cap. Tol. WVDC 1.3 P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25, 5 2. P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25, P, A, B, C 5, 25 Cap. pf Cap. Tol. WVDC 3. P, A, B, C 5, P, A, B, C 5, P, A, B, C 5, P, A, B, C 5, 25

124 Multi-Layer Organic Capacitors 1. Typical ESR vs. vs. Frequency MLO OPC TM Ohm pf.7 pf.9 pf 1.4 pf 1.7 pf 2.2 pf GHz 1 Typical Q vs. Frequency MLO TM pf Q pf 1.5 pf 1.pF.5pF Frequency (GHz) 123

125 Multi-Layer Organic Capacitors 1 Typical Typical Self Self Resonant Resonant Frequency Frequency vs. Capacitance vs Capacitance MLOOPC TM GHz pf 6 124

126 Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer HOW TO ORDER DP Type 3 Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni Au, Ni Sn and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual B Design POWER CAPACITY 4.5W Maximum Frequency (MHz) ORIENTATION IN TAPE Top View Finish 7 = Au T = NiSn MLO TM TECHNOLOGY The 63 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors, and capacitors in a multilayer stack up. The MLO diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, GSM, and BT. These diplexers are less than.5mm in height and are ideally suited for band switching for dual band systems. All diplexers are expansion matched to printed circuit boards thereby resulting in improved reliability vs. ceramic and Si components TR Packaging Tape & Reel Bottom View PART NUMBER: DP3B54257TR APPLICATIONS Multiband applications including WiFi, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics High Heat Dissipation COMPONENT DIMENSIONS AND FUNCTIONS.2±.1.3±.1.64±.5.23±.1 (.8±.4) (.12±.4) (.25±.2) (.9±.4) ±.2 (.35±.8) 1.28±.2.46±.1 (.5±.8)(.18±.4).61±.5 (.24±.2).95±.5 (.37±.2).51±.5 (.2±.2).2±.1 (.8±.4) ± ±.2 (.65±.8).4±.4 (.2±.2).6±.1 (.2±.4).25±.1 (.1±.4).15±.2 (.6±.1).44±.1 (.17±.4).45±.1 (.18±.4) Side Side View.45±.1.55±.1 (.18±.4) (.22±.4) (.83±.8) Unit: mm (inches) Terminal No. Terminal Name 1 GND 2 Common 3 GND 4 Low Frequency Port 5 GND 6 High Frequency Port Electrical 25ºC Unit: mm (inches) No. Parameter Freq. (MHz) Port Specification Typ. value Unit 1 Insertion Low.55 max.4 db 2 Loss High 1.2 max.8 db High 28 min 35 db Attenuation High 1 min 14 db Low 2 min 25 db 7 Attenuation Low 23 min 27 db Low 26 min 3 db Low-High 28 min 35 db Isolation Low-High 22 min 25 db 11 VSWR Ant 2. max VSWR Ant 2. max VSWR Low 2. max VSWR High 2. max Mechanical 25ºC Size [mm(inches)] 1.65 x.88 (.65 x.35) Height [mm(inches)].42 (.17) Volume (mm^3)

127 Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer S PARAMETER MEASUREMENTS LOW BAND PORT ATTENUATION HIGH BAND PORT ATTENUATION Low Band Attenuation Frequency Attenuation 4.8 GHz GHz GHz GHz GHz GHz GHz High Band Attenuation Frequency Attenuation.5 GHz GHz GHz GHz GHz GHz GHz LOW BAND INSERTION LOSS HIGH BAND INSERTION LOSS 6 Low Band Insertion Loss Frequency Insertion Loss 2.4 GHz GHz GHz.42 High Band Insertion Loss Frequency Insertion Loss 4.9 GHz GHz GHz

128 Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer S PARAMETER MEASUREMENTS COMMON PORT RETURN LOSS ISOLATION Common Return Loss Frequency Return Loss VSWR 2.4 GHz GHz GHz GHz GHz GHz Isolation Frequency Attenuation.5 GHz GHz GHz GHz GHz GHz GHz GHz GHz LOW BAND RETURN LOSS HIGH BAND RETURN LOSS 6 Low Band Return Loss Frequency Return Loss VSWR 2.4 GHz GHz GHz High Band Return Loss Frequency Return Loss VSWR 4.9 GHz GHz GHz

129 Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer 6 HOW TO ORDER DP Type 3 Size QUALITY INSPECTION MLO TM TECHNOLOGY Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni Au, Ni Sn and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual A Design POWER CAPACITY 4.5W Maximum Frequency (MHz) ORIENTATION IN TAPE Top View Finish 7 = Au T = NiSn The 63 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors, and capacitors in a multilayer stack up. The MLO diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, GSM, and BT. These diplexers are less than.5mm in height and are ideally suited for band switching for dual band systems. All diplexers are expansion matched to printed circuit boards thereby resulting in improved reliability vs. ceramic and Si components TR Packaging Tape & Reel Bottom View APPLICATIONS Multiband applications including WiFi, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics High Heat Dissipation COMPONENT DIMENSIONS AND FUNCTIONS.2±.1.3±.1.64±.5.23±.1 (.8±.4) (.12±.4) (.25±.2) (.9±.4) ±.2 (.35±.8) 1.28±.2.46±.1 (.5±.8)(.18±.4).61±.5 (.24±.2).95±.5 (.37±.2).51±.5 (.2±.2).2±.1 (.8±.4) ± ±.2 (.65±.8).4±.4 (.2±.2).6±.1 (.2±.4).25±.1 (.1±.4).15±.2 (.6±.1).44±.1 (.17±.4).45±.1 (.18±.4) Side Side View.45±.1.55±.1 (.18±.4) (.22±.4) (.83±.8) Unit: mm (inches) Terminal No. Terminal Name 1 Low Frequency Port 2 GND 3 High Frequency Port 4 GND 5 Common 6 GND PART NUMBER: DP3A54257TR Unit: mm (inches) Electrical 25ºC No. Parameter Freq. (MHz) Port Specification Typ. value Unit 1 Insertion Low.55 max.4 db 2 Loss High 1.2 max.8 db High 28 min 35 db Attenuation High 1 min 14 db Low 2 min 25 db 7 Attenuation Low 23 min 27 db Low 26 min 3 db Low-High 28 min 35 db Isolation Low-High 22 min 25 db 11 VSWR Ant 2. max VSWR Ant 2. max VSWR Low 2. max VSWR High 2. max Mechanical 25ºC Size [mm(inches)] 1.65 x.88 (.65 x.35) Height [mm(inches)].42 (.17) Volume (mm^3)

130 Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer S PARAMETER MEASUREMENTS LOW BAND PORT ATTENUATION HIGH BAND PORT ATTENUATION Low Band Attenuation Frequency Attenuation 4.8 GHz GHz GHz GHz GHz GHz GHz High Band Attenuation Frequency Attenuation.5 GHz GHz GHz GHz GHz GHz GHz LOW BAND INSERTION LOSS HIGH BAND INSERTION LOSS 6 Low Band Insertion Loss Frequency Insertion Loss 2.4 GHz GHz GHz.42 High Band Insertion Loss Frequency Insertion Loss 4.9 GHz GHz GHz

131 Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer S PARAMETER MEASUREMENTS COMMON PORT RETURN LOSS ISOLATION Common Return Loss Frequency Return Loss VSWR 2.4 GHz GHz GHz GHz GHz GHz Isolation Frequency Attenuation.5 GHz GHz GHz GHz GHz GHz GHz GHz GHz LOW BAND RETURN LOSS HIGH BAND RETURN LOSS 6 Low Band Return Loss Frequency Return Loss VSWR 2.4 GHz GHz GHz High Band Return Loss Frequency Return Loss VSWR 4.9 GHz GHz GHz

132 Multilayer Organic (MLO TM ) 85 CDMA Diplexer MLO TM TECHNOLOGY The 85 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO TM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed passive elements such as inductors and capacitors in a multilayer stack up. The MLO TM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, and GSM and are less than.6mm in thickness. These components are ideally suited for band switching for dual band systems. All diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. APPLICATIONS Multiband applications including WCDMA, WLAN, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Low Insertion Loss Excellent Solderability Low Parasitics Low Profile HOW TO ORDER DP 5 A TR COMPONENT DIMENSIONS AND FUNCTIONS.2±.1 (.8±.4) Bottom View.64±.5 (.25±.2) Side View Type Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC Design TERMINATION Frequency (MHz) Finish 7 = Au T = NiSn Packaging Tape & Reel TR = 3 Kpcs TR/5 = 5 pcs Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. ORIENTATION IN TAPE POWER CAPACITY 4.5W Maximum Top View ±.2 (.5±.8).95±.5 (.37±.2).2±.1 (.8±.4) 2.12±.2 (.83±.8) PART NUMBER: DP5A1927TR.4±.4 (.2±.2).25±.1 (.1±.4).44±.1 (.17±.4) Terminal No. Terminal Name 1 High Frequency Port 2 GND 3 Low Frequency Port 4 GND 5 Common Port 6 GND.55±.1 (.22±.4) Unit: mm (inches) 25ºC Size [mm(inches)] 2.12 x 1.28 (.83 x.5) Height [mm(inches)].55 (.21) Volume (mm^3) 1.5 Frequency Range (F1) (MHz) 859±35 Frequency Range (F2) (MHz) 192±7 Insertion Loss (F1, at Fc) (db) -.4 Insertion Loss (F2, at Fc) (db) -.6 Attenuation (F1) at (F2) (db) -23 Attenuation (F2) at (F1) (db) -23 VSWR F1) 1.4 VSWR F2) 1.3 VSWR F1) 1.4 VSWR F2)

133 Multilayer Organic (MLO TM ) 85 CDMA Diplexer S PARAMETER MEASUREMENTS db(s(1,1) db(s(3,1) Low Band Return Loss freq, GHz db(s(1,1) db(s(2,1) freq, GHz High Band Return Loss db(s(2,3)) Isolation freq, GHz 6 Note: Measurements were taken using an Anritsu 4 port VNA; Diplexer was mounted on a custom evaluation board. To reduce systematic errors from the VNA, the coaxial measurement cables, and evaluation board, a Short-Open-Load-Thru (SOLT) calibration was performed, using a custom fabricated calibration substrate. This is the most common coaxial calibration methods. 132

134 Multilayer Organic (MLO TM ) 85 WCDMA Diplexer MLO TM TECHNOLOGY The 85 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO TM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed passive elements such as inductors and capacitors in a multilayer stack up. The MLO TM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, and GSM and are less than.6mm in thickness. These components are ideally suited for band switching for dual band systems. All diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. APPLICATIONS Multiband applications including WCDMA, WLAN, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Low Insertion Loss Excellent Solderability Low Parasitics Low Profile HOW TO ORDER DP Type 5 Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual A Design POWER CAPACITY 4.5W Maximum Frequency (MHz) ORIENTATION IN TAPE Top View 7 Finish 7 = Au T = NiSn TR Packaging Tape & Reel TR = 3 Kpcs TR/5 = 5 pcs COMPONENT DIMENSIONS AND FUNCTIONS.2±.1 (.8±.4).2±.1 (.8±.4) 1.28±.2 (.5±.8).95±.5 (.37±.2).2±.1 (.8±.4).2±.1 (.8±.4) Bottom View.64±.5 (.25±.2) ±.2 (.83±.8) Unit: mm (inches) Terminal No. Terminal Name 1 High Frequency Port 2 GND 3 Low Frequency Port 4 GND 5 Common Port 6 GND PART NUMBER: DP5A1947TR.4±.4 (.2±.2).25±.1 (.1±.4).44±.1 (.17±.4) Side View.55±.1 (.22±.4) 25ºC Size [mm(inches)] 2.12 x 1.28 (.83 x.5) Height [mm(inches)].55 (.21) Volume (mm^3) 1.5 Frequency Range (F1) (MHz) 892±68 Frequency Range (F2) (MHz) 194±23 Insertion Loss (F1, at Fc) (db) -.4 Insertion Loss (F2, at Fc) (db) -.65 Attenuation (F1) at (F2) (db) -23 Attenuation (F2) at (F1) (db) -2 VSWR F1) 1.3 VSWR F2) 1.4 VSWR F1) 1.4 VSWR F2)

135 Multilayer Organic (MLO TM ) 85 WCDMA Diplexer S PARAMETER MEASUREMENTS db(s(1.1) db(s(3.1) Low Band -3 Return Loss freq, GHz db(s(1.1) db(s(2.1) High Band Return Loss freq, GHz -5-1 db(s(2.3)) Isolation freq, GHz 6 Note: Measurements were taken using an Anritsu 4 port VNA; Diplexer was mounted on a custom evaluation board. To reduce systematic errors from the VNA, the coaxial measurement cables, and evaluation board, a Short-Open-Load-Thru (SOLT) calibration was performed, using a custom fabricated calibration substrate. This is the most common coaxial calibration methods. 134

136 Multilayer Organic (MLO TM ) 85 WLAN Diplexer MLO TM TECHNOLOGY The 85 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO TM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors and capacitors in a multilayer stack up. The MLO TM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN and GSM. These components which are less than.6mm in thickness are ideally suited for band switching for dual band systems. All diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. APPLICATIONS Multiband applications including WiFi, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Low Insertion Loss Excellent Solderability Low Parasitics Low Profile HOW TO ORDER DP Type 5 Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual A Design POWER CAPACITY 4.5W Maximum Frequency (MHz) ORIENTATION IN TAPE Top View 7 Finish 7 = Au T = NiSn TR Packaging Tape & Reel TR = 3 Kpcs TR/5 = 5 pcs COMPONENT DIMENSIONS AND FUNCTIONS.2±.1 (.8±.4).2±.1 (.8±.4) 1.28±.2 (.5±.8).95±.5 (.37±.2).2±.1 (.8±.4).2±.1 (.8±.4) Terminal No. Bottom View.64±.5 (.25±.2) ±.2 (.83±.8) PART NUMBER: DP5A5257TR.4±.4 (.2±.2).25±.1 (.1±.4) Side View.55±.1.44±.1 (.22±.4) (.17±.4) Unit: mm (inches) Terminal Name 1 High Frequency Port 2 GND 3 Low Frequency Port 4 GND 5 Common Port 6 GND 25ºC Size [mm(inches)] 2.12 x 1.28 (.83 x.5) Height [mm(inches)].55 (.21) Volume (mm^3) 1.5 Frequency Range (F1) (MHz) 245±5 Frequency Range (F2) (MHz) 525±1 Insertion Loss (F1) (db) -.5 Insertion Loss (F2) (db) -.5 Attenuation (F1) at (F2) (db) -2 Attenuation (F2) at (F1) (db) -2 Return Loss F1) (db) -12 Return Loss F2) (db) -12 Isolation F1) (db) -25 Isolation F2) (db)

137 Multilayer Organic (MLO TM ) 85 WLAN Diplexer S PARAMETER MEASUREMENTS -5 Low Band -5 High Band -1-1 db_s11 db_s21-15 Return Loss db_s11 db_s Return Loss freq, GHz freq, GHz -5-1 db_s Isolation freq, GHz 6 136

138 Multilayer Organic (MLO TM ) 85 WLAN/BT Diplexer MLO TM TECHNOLOGY The 85 MLO TM diplexer is best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO TM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors and capacitors in a multilayer stack up. The MLO TM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN and GSM. These components which are less than.5mm in thickness are ideally suited for band switching for dual band systems. All MLO TM diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. APPLICATIONS Multiband applications including WiFi, BT, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Low Insertion Loss Excellent Solderability Low Parasitics Matched CTE to PCB HOW TO ORDER DP Type 5 Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual B Design POWER CAPACITY 4.5W Maximum Frequency (MHz) ORIENTATION IN TAPE Top View 7 Finish 7 = Au T = NiSn TR Packaging Tape & Reel TR = 3 Kpcs TR/5 = 5 pcs COMPONENT DIMENSIONS AND FUNCTIONS.2±.1 (.8±.4).2±.1 (.8±.4) 1.28±.2 (.5±.8).95±.5 (.37±.2).2±.1 (.8±.4).2±.1 (.8±.4) Bottom View.64±.5 (.25±.2) ±.2 (.83±.8) Unit: mm (inches) Terminal No. Terminal Name 1 Low Frequency Port 2 GND 3 High Frequency Port 4 GND 5 Common Port 6 GND PART NUMBER: DP5B54257TR.4±.4 (.2±.2).25±.1 (.1±.4).44±.1 (.17±.4) Side View.55±.1 (.22±.4) 25ºC Size [mm(inches)] 2.12 x 1.28 (.83 x.5) Height [mm(inches)].55 (.21) Volume (mm^3) 1.5 Pass Band Range (F1) (MHz) 245 +/-5MHz Pass Band Range (F2) (MHz) /-525MHz Insertion Loss (F1) (db) -.5 Insertion Loss (F2) (db) -1. Attenuation (F1) 48MHz - 6MHz (db) -36 Attenuation 3 x (F1) (db) -31 Attenuation (F2) 18MHz - 25MHz (db) -26 Attenuation 2 x (F2) (db) -13 Attenuation 3 x (F2) (db) -15 VSWR F1) 1.2 VSWR F2) 1.7 VSWR F1) 1.2 VSWR F2)

139 Multilayer Organic (MLO TM ) 85 WLAN/BT Diplexer S PARAMETER MEASUREMENTS 4.95 GHz db 5.45 GHz db 5.95 GHz db GHz db 1.8 GHz db db GHz db 2.5 GHz GHz db GHz db 16.3 GHz db GHz db High Band Low Band Return Loss 5.E+8 3.E+9 5.E+9 7.E+9 9.E+9 1.E+1 1.E+1 1.E+1 1.E+1 Frequency (.5-17GHz) 6 138

140 Multilayer Organic (MLO TM ) AUTOMATED SMT ASSEMBLY The following section describes the guidelines for automated SMT assembly of MLO TM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages. Control of solder and solder paste volume is critical for surface mount assembly of MLO TM RF devices onto the PCB. SMT REFLOW PROFILE Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3 C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO TM devices onto the PCB. may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Tp Ramp-up tp Critical Zone T L to Tp Temperature TL Ts max Ts min ts Preheat t L Ramp-down 25 t 25ºC to Peak Time Figure A. Typical Lead Free Profile and Parameters Profile Parameter Pb free, Convection, IR/Convection Ramp-up rate (Tsmax to Tp 3ºC/second max. Preheat temperature (Ts min to Ts max) 15ºC to 2ºC Preheat time (ts) 6 18 seconds Time above T L, 217ºC (t L ) 6 12 seconds Peak temperature (Tp) 26 C Time within 5ºC of peak temperature (tp) 1 2 seconds Ramp-down rate 4ºC/second max. Time 25ºC to peak temperature 6 minutes max

141 MLO TM Tight Tolerance Inductors The Multilayer Organic Tight Tolerance Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLO TM Tight Tolerance Inductor series of components are based on AVX s patented multilayer organic technology (US patent 6,987,37). MLO TM Tight Tolerance Inductors incorporate very low loss organic materials which allow for high Q and high stability over frequency. MLO TM Tight Tolerance Inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLO TM Tight Tolerance Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS Mobile communications Satellite Applications GPS Collision Avoidance Wireless LAN s FEATURES Tight Tolerance High Frequency High Withstanding Voltage Low DC Resistance Surface Mountable 42 Case Size RoHS Compliant Finishes Available in Tape and Reel SURFACE MOUNT ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation Expansion Matched to PCB HOW TO ORDER HL 2 XXX X T TR Style Tight Tolerance Size 2 = 42 Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = nH = 4R7 Tolerance A = ±.5nH B = ±.1nH G = ±2% Termination Sn1 Packaging 5pcs T&R 6 DIMENSIONS mm (inches) QUALITY INSPECTION.23 (.9) Finished parts are 1% tested for electrical parameters and visual characteristics..59 (.23).46 (.18) TERMINATION RoHS compliant Sn finish. 1. (.39) OPERATING TEMPERATURE -55ºC to +125ºC

142 MLO TM Tight Tolerance Inductors RECOMMENDED FOOTPRINT D1 D2 D3 D4 D5 mm (inches) Case Size D1 D2 D3 D4 D (.33).3 (.12).25 (.1).3 (.12).35 (.14) (.67).6 (.24).5 (.2).6 (.24).5 (.2) (.91).8 (.31).7 (.28).8 (.31).75 (.3) (.118) 1. (.39) 1. (.39) 1. (.39) 1.25 (.49) (.157) 1. (.39) 2. (.79) 1. (.39) 1.6 (.63) (.157) 1. (.39) 2. (.79) 1. (.39) 2.5 (.98) (.22) 1. (.39) 3.6 (.142) 1. (.39) 2. (.79) (.22) 1. (.39) 3.6 (.142) 1. (.39) 3. (.118) (.22) 1. (.39) 3.6 (.142) 1. (.39) 6.35 (.25) (.26) 1. (.39) 4.6 (.181) 1. (.39) 5. (.197) (.26) 1. (.39) 4.6 (.181) 1. (.39) 6.35 (.25) Component Pad Design Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. Pad overlap.5mm beneath component. Pad extension.5mm beyond components for relow and 1.mm to wave soldering. 42 ELECTRICAL SPECIFICATIONS Available L (nh) Inductance Tolerance Q Idc max Rdc max SRF min 45MHz A = ±.5nH, B = ±.1nH 45MHz (ma) (mω) (GHz) G = ±2%.8 ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.5nH, ±.1nH ±.1nH ±.1nH ±.1nH ±.1nH ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% Specifications based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance

143 MLO TM High Current Inductors The Multilayer Organic High Current Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. Based on AVX s patented multilayer organic technology (US patent 6,987,37), the 42 size Multilayer Organic High Current Inductor allows for much higher current handling over similar multilayer ceramic chip inductors, a 5% average increase in current handling over comparable thin film products with similar Q, and current handling approaching that of wire wound ceramic chip inductors. MLO TM High Current Inductors incorporate very low loss organic materials which allow for high Q and high stability over frequency. They are surface mountable and are expansion matched to FR4 printed wiring boards. MLO TM High Current Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS Mobile communications Satellite Applications GPS Collision Avoidance Wireless LAN s FEATURES High Q High SRF High Frequency High Current Handling Low DC Resistance Surface Mountable 42 Case Size RoHS Compliant Finishes Available in Tape and Reel SURFACE MOUNT ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation Expansion Matched to PCB HOW TO ORDER HLC 2 XXX X T TR Type HLC = High Current Size 2 = 42 Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = nH = 4R7 Tolerance B = ±.1nH C = ±.2nH D = ±.5nH G = ±2% H = ±3%. J = ±5% Termination Sn1 Packaging 5pcs T&R 6 DIMENSIONS R QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. L T TERMINATION RoHS compliant Sn finish. W mm (inches) L W T R 1.±.1.58±.75.35±.1.125±.5 (.4±.4) (.23±.3) (.14±.4) (.5±.2) OPERATING TEMPERATURE -55ºC to +125ºC 142

144 MLO TM High Current Inductors 42 ELECTRICAL SPECIFICATIONS 45 MHz 9 MHz 19 MHz 24 MHz Test Frequency Test Frequency Test Frequency Test Frequency Available SRF Min Rdc Max Idc Max Inductance Tolerance Q L (nh) Q L (nh) Q L (nh) Q (GHz) (mω) (ma) L (nh) B = ±.1nH, C = ±.2nH 45 MHz 9 MHz 9 MHz 19 MHz 19 MHz 24 MHz 24 MHz 45 MHz D = ±.5nH, G = ±2% H = ±3%, J = ±5%.8 ±.1nH, ±.2nH, ±.5nH > ±.1nH, ±.2nH, ±.5nH > ±.1nH, ±.2nH, ±.5nH > ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±2%, ±3%, ±5% ±2%, ±3%, ±5% ±2%, ±3%, ±5% ±2%, ±3%, ±5% ±2%, ±3%, ±5% ±2%, ±3%, ±5% ±2%, ±3%, ±5% n/a n/a ±2%, ±3%, ±5% n/a n/a n/a n/a ±2%, ±3%, ±5% n/a n/a n/a n/a ±2%, ±3%, ±5% n/a n/a n/a n/a Specifications based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. Idc max: Maximum 15ºC rise in component temperature over ambient

145 MLO TM Hi-Q Inductors The Multilayer Organic Hi-Q Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLO TM Hi-Q Inductor series of components are based on AVX s patented multilayer organic technology (US patent 6,987,37 and 7,439,84). MLO TM Hi-Q Inductors incorporate very low loss organic materials and low profile copper which allow for high Q and high stability over frequency. MLO TM Hi- Q Inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLO TM Hi-Q Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS Mobile communications Satellite Applications GPS Collision Avoidance Wireless LAN s FEATURES High Q High SRF High Frequency Low DC Resistance Surface Mountable 42 Case Size RoHS Compliant Finishes Available in Tape and Reel SURFACE MOUNT ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation Expansion Matched to PCB HOW TO ORDER HLQ 2 XXX X T TR Type HLQ = High Q Size 2 = 42 Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = nH = 4R7 Tolerance B = ±.1nH C = ±.2nH H = ±3% Termination Sn1 Packaging 5pcs T&R 6 DIMENSIONS R QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. L T TERMINATION RoHS compliant Sn finish. W mm (inches) L W T R 1.±.1.58±.75.35±.1.125±.5 (.4±.4) (.23±.3) (.14±.4) (.5±.2) OPERATING TEMPERATURE -55ºC to +125ºC 144

146 MLO TM Hi-Q Inductors 42 ELECTRICAL SPECIFICATIONS Available L (nh) Inductance Tolerance Q min SRF min Rdc max Idc max 45MHz B = ±.1nH, C = ±.2nH 45MHz (GHz) (mω) (ma) H = ±3%.8 ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±.1nH, ±.2nH ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% Specifications based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. Idc max: Maximum 15ºC rise in component temperature over ambient

147 MLO TM Inductors MLO TM INDUCTOR PERFORMANCE CHARACTERISTICS Q Typical Performance: 2.nH 45MHz 2.nH Max Q Frequency (GHz) SRF Inductance (nh) Q Typical Performance: 4.7nH 12 SRF Max Q 45 45MHz 4.7nH Frequency (GHz) Inductance (nh) 6 Q Typical Performance: 18.2nH Max Q 32 45MHz 18.2nH SRF Inductance (nh) Frequency (GHz) 146

148 MLO TM Inductors AUTOMATED SMT ASSEMBLY The following section describes the guidelines for automated SMT assembly of MLO TM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT packages. Control of solder and solder paste volume is critical for surface mount assembly of MLO TM RF devices onto the PCB. SMT REFLOW PROFILE Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3 C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO TM devices onto the PCB. may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Tp Ramp-up tp Critical Zone T L to Tp Temperature TL Ts max Ts min ts Preheat t L Ramp-down 25 t 25ºC to Peak Time Figure A. Typical Lead Free Profile and Parameters Profile Parameter Pb free, Convection, IR/Convection Ramp-up rate (Tsmax to Tp 3ºC/second max. Preheat temperature (Ts min to Ts max) 15ºC to 2ºC Preheat time (ts) 6 18 seconds Time above T L, 217ºC (t L ) 6 12 seconds Peak temperature (Tp) 26 C Time within 5ºC of peak temperature (tp) 1 2 seconds Ramp-down rate 4ºC/second max. Time 25ºC to peak temperature 6 minutes max

149 MLO TM RF-DC SMT Crossover GENERAL DESCRIPTION The MLO TM SMT RF-DC Crossover is a very low profile crossover that intersects an RF and DC circuit trace in an SMT package. The RF-DC Crossover is a low cost solution for applications where a critical RF circuit trace intersects a DC circuit precluding the need for an expensive multilayer printed circuit board. The SMT package can support frequencies up to 6 GHz. MLO TM crossovers have been subjected to JEDEC reliability standards and 1% electrically tested. The RF-DC crossovers are available in NiSn. FEATURES DC 6. GHz RF DC Crossover Low Loss DC Isolation Surface Mountable Tape and Reel 1% Tested APPLICATIONS Mobile communications GPS Vehicle location systems Wireless LAN s LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation TOP VIEW HOW TO ORDER X2A 22 RFDC T Series Size Type Packaging T = 1pcs T&R T/25 = 25pcs T&R B = Bulk Frequency Port Ins. Return Loss Power θjc Operating (GHz) Impedance Loss (db min) (Watts) (ºC /Watts) Temperature (ohms) (db max) (ºC) DC to to to +85 * Specification based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. 6 QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. TERMINATION NiSn compatible with automatic soldering technologies: Pb free reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE - 55ºC to +85ºC

150 MLO TM RF-DC SMT Crossover MECHANICAL OUTLINE TOP BOTTOM RF IN/OUT 4.98 ±.25 (.196 ±.1) RF IN/OUT 1.12 ±.1 (.44 ±.4).4 ±.4 (.16 ±.2) GND GND GND GND.74 ±.1 X4 (.29 ±.4 X4) 4.98 ±.25 (.196 ±.1) GND GND GND RF IN/OUT GND.99 ±.2 X4 SQ (.39 ±.8 X4 SQ).76 ±.1 X4 (.3 ±.4 X4) SIDE RF IN/OUT.4 ±.4 (.16 ±.2) X4)

151 MLO TM RF-DC SMT Crossover RF-DC SMT CROSSOVER PERFORMANCE:.3 GHZ TO 6 GHZ. RF/DC Crossover Insertion Loss -.1 Insertion Loss (db) Frequency (GHz) -1- RF/DC Crossover Return Loss -2 Return Loss (db) Frequency (GHz) 6 MOUNTING PROCEDURE MLO TM SMT crossovers require 5Ω transmission lines leading to and from all of the RF ports. Proper grounding is required in order to ensure optimal device performance. If these conditions are not met then performance parameters including insertion loss, return loss and any isolation may not meet published values. All of the MLO TM components utilize castellated interconnects which allow for high yield assembly, expansion matched and halogen free dielectric. When mounting the user must be mindful of the following: a) ensure the RF pads of the device are in contact with the circuit trace of the printed circuit board and b) the ground plane of neither the component nor the PCB is in contact with the RF signal. Parts are specifically oriented in the tape and reel. MOUNTING FOOTPRINT To ensure proper electrical and thermal performance there must be a ground plane with 1% solder connection underneath the part. 1.6 SQ TYP (.63).86 TYP (.34) 3.75 (.148) DC Line Dimensions are in mm (inches) Multiple plated thru holes to ground 5 Transmission Line

152 MLO TM RF-RF SMT Crossover GENERAL DESCRIPTION The MLO TM SMT RF-RF Crossover is a very low profile crossover that intersects an RF and RF circuit trace in an SMT package. The RF-RF Crossover is a low cost solution for applications where a critical RF circuit trace intersects a RF circuit precluding the need for an expensive multilayer printed circuit board. The SMT package can support frequencies up to 6 GHz. MLO TM crossovers have been subjected to JEDEC reliability standards and 1% electrically tested. The RF-RF crossovers are available in NiSn. FEATURES DC 6. GHz RF RF Crossover Low Loss High Isolation Surface Mountable Tape and Reel 1% Tested APPLICATIONS Mobile communications GPS Vehicle location systems Wireless LAN s LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation TOP VIEW HOW TO ORDER X2B 22 RFRF T Series Size Type Packaging T = 1pcs T&R T/25 = 25pcs T&R B = Bulk Frequency Port Ins. Return Loss Isolation Power θjc Operating (GHz) Impedance Loss (db min) (db min) (Watts) (ºC /Watts) Temperature (ohms) (db max) (ºC) DC to to to +85 * Specification based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. TERMINATION NiSn compatible with automatic soldering technologies: Pb free reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE - 55ºC to +85ºC

153 MLO TM RF-RF SMT Crossover MECHANICAL OUTLINE.552 (.22).552 (.22) TOP.74 (.29).21 (.8) BOTTOM.74 (.29).21 (.8).75 (.3).75 (.3) 2.49 (.98).462 x 4 (.18 x 4) 2.49 (.98).462 x 4 (.18 x 4) (.196) 3.5 (.138) (.196) 3.5 (.138) 2.49 (.95) 3. (.118).564 x 4 (.22 x 4) 2.49 (.95) 3. (.118).564 x 4 (.22 x 4).739 (.29).75 (.3) (.162).462 x 4 (.18 x 4).739 (.29).75 (.3) (.162).462 x 4 (.18 x 4) (.87) 2.49 (.98) (.16) (.196) (.87) 2.49 (.98) (.16) (.196) SIDE.4 ±.4 (.16 ±.2)

154 MLO TM RF-RF SMT Crossover RF-RF SMT CROSSOVER PERFORMANCE:.3 GHZ TO 6 GHZ RF/RF Crossover Insertion Loss RF/RF Crossover Return Loss Insertion Loss 2 (db) Insertion Loss 1 (db) Return Loss 2 (db) Return Loss 1 (db) Frequency (GHz) Frequency (GHz) RF/RF Crossover Isolation RF/RF Crossover Phase Balance Isolation (db) -5-6 Phase Balance (ºC) Frequency (GHz) Frequency (GHz) MOUNTING PROCEDURE MLO TM SMT crossovers require 5Ω transmission lines leading to and from all of the RF ports. Proper grounding is required in order to ensure optimal device performance. If these conditions are not met then performance parameters including insertion loss, return loss and any isolation may not meet published values. All of the MLO TM components utilize castellated interconnects which allow for high yield assembly, expansion matched and halogen free dielectric. When mounting the user must be mindful of the following: a) ensure the RF pads of the device are in contact with the circuit trace of the printed circuit board and b) the ground plane of neither the component nor the PCB is in contact with the RF signal. Parts are specifically oriented in the tape and reel MOUNTING FOOTPRINT To ensure proper electrical and thermal performance there must be a ground plane with 1% solder connection underneath the part. TYP 34) 1.6 8Q TYP (.63).86 TYP (.34) 1.7 TYP (.42) Multiple plated thru holes to ground 4 x 5 Transmission Line Dimensions are in mm (inches) 153 6

155 MLO TM SMT Crossover AUTOMATED SMT ASSEMBLY The following section describes the guidelines for automated SMT assembly of MLO TM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT packages. Control of solder and solder paste volume is critical for surface mount assembly of MLO TM RF devices onto the PCB. Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO TM devices onto the PCB. SMT REFLOW PROFILE Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3 C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below: Tp Ramp-up tp Critical Zone T L to Tp Temperature T L Ts max Ts min ts Preheat tl Ramp-down 25 t 25ºC to Peak Time 6 Profile Parameter Pb free, Convection, IR/Convection Ramp-up rate (Tsmax to Tp) 3ºC/second max. Preheat temperature (Ts min to Ts max) 15ºC to 2ºC Preheat time (ts) 6 18 seconds Time above T L, 217ºC (t L ) 6 12 seconds Peak temperature (Tp) 26 C Time within 5ºC of peak temperature (tp) 1 2 seconds Ramp-down rate 4ºC/second max. Time 25ºC to peak temperature 6 minutes max

156 RF Inductors AL Series - Air Core Inductors AS Series - Square Air Core Inductors LCWC - Wire Wound Chip Inductors 155

157 Air Core RF Inductors AL Series GENERAL DESCRIPTION AVX Air Core RF Inductors, part of the wound air core inductor family, are ideal for RF circuits, broadband I/O filtering, frequency selection, or impedance matching. The air core inductor provides better performance over solid core inductors with higher Q, and better current handling capabilities. FEATURES Air Core Construction High Q High Current Excellent SRF Many inductance values ranging from 1.65nH to 538nH APPLICATIONS RF Applications RF Circuits Broadband I/O Filtering Impedance Matching/Tuning Decoupling/Bypassing HOW TO ORDER AL 5A 2N5 G T R Air Core Inductor Size Size 5A = 65 5B = 65 12A = B = = = 2523 Inductance 2N5 = 2.5nH 12N5 = 12.5nH 13N = 13nH Tolerance G = 2% J = 5% K = 1% Termination T = Sn/Ag over Cu (96.5% Sn, 3% Ag,.5% Cu) Packaging R = 7" reel S = 13" reel* *AL16 & AL23 Only ELECTRICAL SPECIFICATIONS Technical Data All technical data related to an ambient temperature of +25 C Inductance Range 1.65nH to 538nH Inductance Tolerance 2%, 5%, 1% Rated Current 1.5A to 4.A Operating Temperature -4 C to +125 C Termination 96.5% Tin/3% Silver over.5% Copper 7 156

158 Air Core RF Inductors AL Series ELECTRICAL SPECIFICATIONS AVX P/N Turns Inductance Tolerance Q Q Test Freq. DCR max SRF Ir max (nh) (%) min. typ. (MHz) (mω) GHz (min.) Amps AL5A1N65KTR K AL5A2N55*TR J, K AL5A3N85*TR G, J, K AL5A5N45*TR G, J AL5B5N6*TR G, J AL5B7N15*TR G, J AL5B8N8*TR G, J AL5B9N85*TR G, J AL5B12N5*TR G, J AL12A2N5KTR K AL12A5N*TR 2 5 J, K AL12A8N*TR 3 8 G, J AL12A12N5*TR G, J AL12A18N5*TR G, J AL12B17N5*TR G, J AL12B22N*TR 7 22 G, J AL12B28N*TR 8 28 G, J AL12B35N5*TR G, J AL12B43N*TR 1 43 G, J AL1622N*TS 4 22 G, J AL1627N*TS 5 27 G, J AL1633N*TS 5 33 G, J AL1639N*TS 6 39 G, J AL1647N*TS 6 47 G, J AL1656N*TS 7 56 G, J AL1668N*TS 7 68 G, J AL1682N*TS 8 82 G, J AL161N*TS 9 1 G, J AL1612N*TS 9 12 G, J AL239N*TS 9 9 G, J AL23111N*TS G, J AL2313N*TS G, J AL23169N*TS G, J AL2326N*TS G, J AL23222N*TS G, J AL23246N*TS G, J AL2337N*TS G, J AL2338N*TS G, J AL23422N*TS G, J AL23491N*TS G, J AL23538N*TS G, J *Tolerance: G= ± 2%, J: ± 5%, K: ± 1% a. Test Equipment: L/Q: HP-4291B With HP16193A test fixture or equivalent. SRF: HP8753E /HP872D or equivalent. RDC: Chroma 1652 or equivalent. b. Operating temperature range: -4ºC to +125ºC. c. For Temperature Rise: 15ºC d. Storage Temp.: -4ºC to +85ºC. f. MSL: Level

159 Air Core RF Inductors AL Series PHYSICAL DIMENSIONS AL12A, AL12B, AL16, AL23 Tinned Length SIDE END TOP 18 A B D 3 E C AL5A, AL5B SIDE END TOP A F B G D 18 E C Measure Line 3 Co-Plane.1 (.4) TINNED LENGTH BETWEEN 3º AND 18º mm (inches) Part Number A B C D E F G AL5A 1.42 ± ± ± ± ± max..35 min. (.56 ±.5) (.56 ±.5) (.35 ±.1) (.87 ±.1) (.72 ±.1) (.2 max.) (.14 min.) AL5B 1.42 ± ± ± ± ±.3.51 max..35 min. (.56 ±.5) (.56 ±.5) (.35 ±.1) (.159 ±.12) (.144 ±.12).2 max..14 min. AL12A 3.5 max max..58 ± max ±.25 (.12 max.) (.125 max.) (.23 ±..15) (.145 max.) (.115 ±.1) AL12B 3.5 max max..58 ± max ±.25 (.12 max.) (.125 max.) (.23 ±.15) (.27 max.) (.23 ±.1) AL max ± max ±.39 (.15) (.165 max.) (.6 ±.15) (.19 max.) (.17 ±.15) AL max. 5.9 max. 1.2 ± max ±.51 (.25 max.) (.232 max.) (.4 ±.15) (.415 max.) (.314 ±.2) RECOMMENDED LAND PATTERNS mm (inches) 7 Part Number A B C D E AL5A (.13) (.97) (.41) (.4) (.31) AL5B (.175) (.97) (.113) (.4) (.31) AL12A (.165) (.13) (.65) (.11) (.5) AL12B (.285) (.13) (.185) (.11) (.5) AL (.228) (.23) (.112) (.13) (.58) AL (.394) (.185) (.234) (.95) (.8) d b c a e 158

160 Air Core RF Inductors AL Series PERFORMANCE SPECIFICATIONS AL5A Inductance vs. Frequency Typical Q vs. Frequency 8 2 Inductance (nh) Q nH 3.85nH 2.55nH 1.65nH Frequency (MHz) Frequency (MHz) AL5B Inductance vs. Frequency Typical Q vs. Frequency Inductance (nh) Q nH 7.15nH 8.8nH 9.85nH 12.6nH Frequency (MHz) Frequency (MHz) AL12A Inductance vs. Frequency Typical Q vs. Frequency 3 21 Inductance (nh) Q nH 5.nH 8.nH 12.5nH 18.5nH Frequency (MHz) Frequency (MHz) 7 159

161 Air Core RF Inductors AL Series PERFORMANCE SPECIFICATIONS AL12B Inductance (nh) Inductance vs. Frequency Frequency (MHz) Q Typical Q vs. Frequency Frequency (MHz) 17.5nH 22.nH 28.nH 35.5nH 43.nH Inductance (nh) Inductance vs. Frequency Frequency (MHz) AL16 Q Typical Q vs. Frequency Frequency (MHz) 22.nH 39.nH 47.nH 56.nH 68.nH 82.nH 12nH 7 Inductance (nh) Inductance vs. Frequency Frequency (MHz) AL23 Q Typical Q vs. Frequency Frequency (MHz) 9.nH 169nH 37nH 538nH 16

162 Air Core RF Inductors AL Series TYPICAL RoHS REFLOW PROFILE 3 25 Time within 5ºC of peak temperature (3 seconds) Temperature (ºC) Preheat / Soak (6 12 seconds) Ramp-Up 3ºC/sec max Reflow Time above 217ºC (6 15 seconds) Ramp-Down 6ºC/sec max Peak Temperature ºC Time (seconds) 7 161

163 Air Core RF Inductors AL Series PACKAGING SPECIFICATIONS Thickness (t).1 (.4) max Embossed Cavity The force for tearing off cover tape is 1 to 13 grams in the arrow direction Top Cover Tape 165 to 18 End Embossed Carrier Base Tape Start No Components Components 16 (6.299) min Cover Tape User Direction of Feed No Components 39 (15.354) min 56 (22.47) max CARRIER TAPE REELS DIMENSIONS OF CARRIER TAPE MATERIAL: PLASTIC G 4. ±.1 (.157 ±.4) 2. ±.1 (.79 ±.4) 1.75 ±.1 (.69 ±.4) /- ( /-) t A B N C W 5 P 5 C T mm (inches) 7 Series ITEM A B C N G T W P t AL5A DIM TOL. ±2. ±.8 ±.8 ± ±.3 ±.1 ±.5 AL5B DIM TOL. MAX ±.8 +.5/-.2 MIN +2. MAX ±.3 ±.1 ±.5 AL12A DIM TOL. ±2. ±1. ±.5 ± ±.2 ±.1 ±.5 AL12B DIM TOL. ±2. ±1. ±.5 ± ±.2 ±.1 ±.5 AL16 DIM TOL. MAX MIN ±.5 REF ±.5 ±.5 ±.3 ±.1 ±.5 AL23 DIM TOL. MAX MIN ±.5 REF ±.5 ±.5 ±.3 ±.1 ±.5 162

164 Square Air Core RF Inductors AS Series GENERAL DESCRIPTION AVX Square Air Core RF Inductors, part of the wound air core inductor family, are ideal for RF circuits, broadband I/O filtering, frequency selection, or impedance matching. The unique square cross section of the air core inductor provides better performance, and offers manufacturing advantages over toroidal coils. FEATURES Square cross section construction Available in 86, 87, and 98 sizes 2 Inducance values ranging from 5.5nH to 27.3nH High Q High Current Excellent SRF APPLICATIONS RF Applications RF Circuits Broadband I/O Filtering Impedance Matching HOW TO ORDER AS 6 5N5 J T R Air Core Inductor (Square Cross Section) Size Size 6 = 86 7 = 87 8 = 98 Inductance 5N5 =5.5nH 6N = 6.nH 12N3 = 12.3nH Tolerance G = 2% J = 5% K = 1% Termination T = Sn/Ag over Cu (96.5% Sn, 3% Ag,.5% Cu) Packaging R = 7 inch reel (2 pieces per reel) ELECTRICAL SPECIFICATIONS Technical Data All technical data related to an ambient temperature of +25 C Inductance Range 5.5nH to 27.3nH Inductance Tolerance 2%, 5%, 1% Rated Current 2.7A, 2.9A, 4.4A Operating Temperature -4 C to +125 C Termination 96.5% Tin/3% Silver over.5% Copper ELECTRICAL SPECIFICATIONS Note: AVX P/N Turns Inductance Tolerance Q Test Freq. DCR max SRF Ir max (nh) (%) min. (MHz) (mω) (GHz) (A) AS65N5*TR G, J, K AS66N*TR 3 6 G, J, K AS68N9*TR G, J, K AS612N3*TR G, J, K AS615N7*TR G, J, K AS619N4*TR G, J, K AS76N9*TR G, J, K AS71N2*TR G, J, K AS711N2*TR G, J, K AS713N7*TR G, J, K AS717N*TR 6 17 G, J, K AS722N*TR 7 22 G, J, K AS88N1*TR G, J, K AS812N1*TR G, J, K AS814N7*TR G, J, K AS816N6*TR G, J, K AS821N5*TR G, J, K AS823N*TR 6 23 G, J, K AS825N*TR 7 25 G, J, K AS827N3*TR G, J, K *Tolerance: G=±2%, J=±5%, K=±1% 2. Inductance & Q measured on the HP4291B. With HP16193A test fixture. 3. SRF measured using the HP8753E 4. Operating Temperature range: -4 C to +125 C 5. Electrical Specifications at 25 C 6. MSL: Level

165 Square Air Core RF Inductors AS Series PHYSICAL DIMENSIONS A D MAX. MIN. C E B F 7 mm (inches) Part Number A B C D E F AS65N5*TR 1.346± ± ± (.53±.4) (.72±.1) (.55±.4) (.38) (.12) (.2) AS66N*TR 1.295± ± ± (.51±.4) (.72±.1) (.55±.4) (.39) (.12) (.2) AS68N9*TR 1.626± ± ± (.64±.6) (.72±.1) (.55±.4) (.5) (.12) (.2) AS612N3*TR 1.93± ± ± (.76±.6) (.72±.1) (.55±.4) (.64) (.12) (.2) AS615N7*TR 2.286± ± ± (.9±.6) (.72±.1) (.55±.4) (.7) (.12) (.2) AS619N4*TR 2.591± ± ± (.12±.6) (.72±.1) (.55±.4) (.9) (.12) (.2) AS76N9*TR 1.295± ± ± (.51±.4) (.72±.1) (.6±.1) (.4) (.12) (.2) AS71N2*TR 1.626± ± ± (.64±.6) (.72±.1) (.6±.1) (.52) (.12) (.2) AS711N2*TR 1.549± ± ± (.61±.6) (.72±.1) (.6±.1) (.49) (.12) (.2) AS713N7*TR 1.93± ± ± (.76±.6) (.72±.1) (.6±.1) (.62) (.12) (.2) AS717N*TR 2.286± ± ± (.9±.6) (.72±.1) (.6±.1) (.76) (.12) (.2) AS722N*TR 2.591± ± ± (.12±.6) (.72±.1) (.6±.1) (.9) (.12) (.2) AS88N1*TR 1.473± ± ± (.58±.6) (.84±.6) (.72±.6) (.44) (.11) (.25) AS812N*TR 1.854± ± ± (.73±.6) (.84±.6) (.72±.6) (.57) (.11) (.25) AS814N7*TR 1.549± ± ± (.61±.6) (.84±.6) (.72±.6) (.49) (.11) (.25) AS816N6*TR 2.21± ± ± (.87±.6) (.84±.6) (.72±.6) (.72) (.11) (.25) AS821N5*TR 2.565± ± ± (.11±.6) (.84±.6) (.72±.6) (.86) (.11) (.25) AS823N*TR 2.235± ± ± (.88±.6) (.84±.6) (.72±.6) (.75) (.11) (.25) AS825N*TR 2.972± ± ± (.117±.6) (.84±.6) (.72±.6) (.11) (.11) (.25) AS827N3*TR 2.972± ± ± (.117±.6) (.84±.6) (.72±.6) (.11) (.11) (.25) 164

166 Square Air Core RF Inductors AS Series PERFORMANCE SPECIFICATIONS AS6 Inductance vs. Frequency Typical Q vs. Frequency 3 16 Inductance (nh) Q N4 15N7 8N9 5N Frequency (MHz) Frequency (MHz) AS7 Inductance vs. Frequency Typical Q vs. Frequency Inductance (nh) Q N 17N 11N2 6N Frequency (MHz) Frequency (MHz) AS8 Inductance vs. Frequency Typical Q vs. Frequency Inductance (nh) Frequency (MHz) Q Frequency (MHz) 27N3 16N6 12N1 8N

167 Square Air Core RF Inductors AS Series TYPICAL RoHS REFLOW PROFILE 3 25 Time within 5ºC of peak temperature (3 seconds) Temperature (ºC) Preheat / Soak (6 12 seconds) Ramp-Up 3ºC/sec max Reflow Time above 217ºC (6 15 seconds) Ramp-Down 6ºC/sec max Peak Temperature ºC Time (seconds) 7 166

168 Square Air Core RF Inductors AS Series PACKAGING SPECIFICATIONS Thickness (t).1 (.4) max Embossed Cavity The force for tearing off cover tape is 1 to 13 grams in the arrow direction Top Cover Tape 165 to 18 Embossed Carrier Base Tape End Start No Components Components 16 (6.299) min Cover Tape User Direction of Feed No Components 39 (15.354) min 56 (22.47) max CARRIER TAPE REELS G DIMENSIONS OF CARRIER TAPE D P2 P E t A B N C F W 5 C E T ITEM A B C G N T W E F P1 P2 P D D1 t DIM (7.8) (.984) (.591) (.492) (2.953) (.646) (.472) (.69) (.217) (.157) (.79) (.157) (.59) (.39) (.9) ±2. ±1. ± ± ±.2 ±.1 ±.1 ±.1 ±.1 ± ±.1 ±.5 TOL. (.79) (.39) (.2) (.59) (.79) (.59) (.8) (.4) (.4) (.4) (.4) (.4) (.4) (.4) (.2) D1 P1 mm (inches) 7 167

169 Wire Wound Chip Inductor LCWC Series FEATURES Ceramic base provide high SRF Ultra-compact inductors provide high Q factors Low profile, high current are available Miniature SMD chip inductor for fully automated assembly Outstanding endurance from Pull-up force, mechanical shock and pressure Tighter tolerance down to ±2% Smaller size of 42 (15) DIMENSIONS APPLICATIONS RF Products: Cellular Phone (CDMA/GSM/PHS) Cordless Phone (DECT/CT1CT2) Remote Control, Security System Wireless PDA Smart Phone WLL, Wireless LAN / Mouse / Keyboard / Earphone VCO, RF Module & Other Wireless Products CONSTRUCTION Base Station, Repeater GPS Receiver Broad Band Applications: CATV Filter, Tuner Cable Modem/ XDSL Tuner Set Top Box IT Applications: USB 2. IEEE 1394 COLOR CODING Overall B C H A F G I J Pad Layout UV Glue Color Coding E Terminal F I D Terminal Wraparound: Approx..7 inches.18 (.7) Both Ends Magnet Wire Ceramic Core Electrode (Ag/Pd+Ni+Sn) STANDARD mm (inches) Type Size A B C D Weight (g) E F G H I J (inch) Max. Max. Max. Ref. (1pcs) (.5) (.3) (.24) (.6) (.2) (.9) (.22) (.26) (.2) (.18) (.71) (.44) (.4) (.15) (.3) (.13) (.34) (.4) (.25) (.25) (.9) (.68) (.6) (.2) (.5) (.17) (.4) (.7) (.4) (.3) (.115) (.11) (.84) (.26) (.8) (.2) (.6) (.1) (.4) (.5) (.136) (.75) (.55) (.2) (.63) (.2) (.87) (.76) (.4) (.7) 4 7 LOW PROFILE mm (inches) Type Size A B C D (inch) Max. Max. Max. Ref. E F G H I J (.9) (.68) (.41) (.2) (.5) (.17) (.4) (.7) (.4) (.3) (.115) (.11) (.55) (.26) (.8) (.2) (.6) (.1) (.4) (.5) HIGH CURRENT/HIGH Q mm (inches) Type Size A B C D (inch) Max. Max. Max. Ref. E F G H I J (.71) (.44) (.4) (.15) (.3) (.13) (.34) (.4) (.25) (.25) (.9) (.68) (.6) (.2) (.5) (.17) (.4) (.7) (.4) (.3) (.115) (.11) (.8) (.26) (.8) (.2) (.6) (.1) (.4) (.5) 168

170 Wire Wound Chip Inductor LCWC Series HOW TO ORDER LC WC 42 K 11 G T A R Family LC = Chip Inductor Series WC = WW Ceramic Size Tolerance G = 2% J = 5% K = 1% Inductance 3N9 = 3.9nH 39N = 39nH R39 = 39nH 3R9 = 39nH 153 = 15nH Style G = Standard Q = High Q/ Current R = Low Profile Termination T = Sn Plate Special A = Standard Packaging R = 7" Reel STANDARD ELECTRICAL SPECIFICATIONS 42 lnductance Tolerance L Freq. Quality Factor SRF DCR ldc 9MHz 1.7GHz (nh) (MHz) Min. Factor (Ω) max. (ma) max. L Q L Q 1. ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1% ±2, ±5, ±1%

171 Wire Wound Chip Inductor LCWC Series 7 63 lnductance L Freq. Quality Factor SRF DCR ldc 9MHz 1.7GHz Color Tolerance (nh) (MHz) Min. Factor (Ω) max. (ma) max. L Q L Q Code 1.6 ±5, ±1% Blue 1.8 ±5, ±1% Black 2.2 ±5, ±1% White 2.3 ±5, ±1% > Yellow 3.3 ±2, ±5, ±1% > Red 3.6 ±2, ±5, ±1% Violet 3.9 ±2, ±5, ±1% > Brown 4.3 ±2, ±5, ±1% Orange 4.5 ±2, ±5, ±1% Gray 4.7 ±2, ±5, ±1% Violet 5.1 ±2, ±5, ±1% Green 5.6 ±2, ±5, ±1% Yellow 6.2 ±2, ±5, ±1% Black 6.3 ±2, ±5, ±1% Black 6.8 ±2, ±5, ±1% Red 7.5 ±2, ±5, ±1% Brown 8.2 ±2, ±5, ±1% Green 8.7 ±2, ±5, ±1% Yellow 9.1 ±2, ±5, ±1% Black 9.5 ±2, ±5, ±1% Blue 1 ±2, ±5, ±1% Orange 11 ±2, ±5, ±1% Gray 12 ±2, ±5, ±1% Yellow 15 ±2, ±5, ±1% Green 16 ±2, ±5, ±1% White 17 ±2, ±5, ±1% Red 18 ±2, ±5, ±1% Blue 2 ±2, ±5, ±1% Green 22 ±2, ±5, ±1% Violet 23 ±2, ±5, ±1% Orange 24 ±2, ±5, ±1% Black 27 ±2, ±5, ±1% Gray 3 ±2, ±5, ±1% Brown 33 ±2, ±5, ±1% White 36 ±2, ±5, ±1% Red 39 ±2, ±5, ±1% Black 43 ±2, ±5, ±1% Orange 47 ±2, ±5, ±1% Brown 51 ±2, ±5, ±1% Blue 56 ±2, ±5, ±1% Red 62 ±2, ±5, ±1% Gray 68 ±2, ±5, ±1% Orange 72 ±2, ±5, ±1% Yellow 82 ±2, ±5, ±1% Green 91 ±2, ±5, ±1% Brown 1 ±2, ±5, ±1% Blue 11 ±2, ±5, ±1% Violet 12 ±2, ±5, ±1% Gray 13 ±2, ±5, ±1% White 14 ±2, ±5, ±1% Blue 15 ±2, ±5, ±1% White 16 ±2, ±5, ±1% Yellow 18 ±2, ±5, ±1% Black 22 ±2, ±5, ±1% Brown 26 ±2, ±5, ±1% Violet 27 ±2, ±5, ±1% Red 28 ±2, ±5, ±1% Green 3 ±2, ±5, ±1% Orange 33 ±2, ±5, ±1% Blue 39 ±2, ±5, ±1% Yellow 47 ±2, ±5, ±1% White 17

172 Wire Wound Chip Inductor LCWC Series 85 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 2.7 ±5, ±1% 25 15MHz Brown 2.8 ±5, ±1% 25 15MHz Gray 3. ±5, ±1% 25 15MHz White 3.3 ±5, ±1% 25 15MHz Black 5.6 ±5, ±1% 25 1MHz Orange 6.2 ±5, ±1% 25 1MHz Green 6.8 ±5, ±1% 25 1MHz Brown 7.5 ±5, ±1% 25 1MHz Green 8.2 ±5, ±1% 25 1MHz Red 8.7 ±5, ±1% 25 1MHz White 1 ±2, ±5, ±1% 25 5MHz Blue 12 ±2, ±5, ±1% 25 5MHz Orange 15 ±2, ±5, ±1% 25 5MHz Yellow 18 ±2, ±5, ±1% 25 5MHz Green 22 ±2, ±5, ±1% 25 5MHz Blue 24 ±2, ±5, ±1% 25 5MHz Gray 27 ±2, ±5, ±1% 25 5MHz Violet 33 ±2, ±5, ±1% 25 5MHz Gray 36 ±2, ±5, ±1% 25 5MHz Orange 39 ±2, ±5, ±1% 25 5MHz White 43 ±2, ±5, ±1% 2 5MHz Yellow 47 ±2, ±5, ±1% 2 5MHz Black 56 ±2, ±5, ±1% 2 5MHz Brown 68 ±2, ±5, ±1% 2 5MHz Red 72 ±2, ±5, ±1% 15 5MHz Green 82 ±2, ±5, ±1% 15 5MHz Orange 91 ±2, ±5, ±1% 15 5MHz Black 1 ±2, ±5, ±1% 15 5MHz Yellow 11 ±2, ±5, ±1% 15 25MHz Brown 12 ±2, ±5, ±1% 15 25MHz Green 15 ±2, ±5, ±1% 1 25MHz Blue 18 ±2, ±5, ±1% 1 25MHz Violet 2 ±2, ±5, ±1% 1 25MHz Orange 22 ±2, ±5, ±1% 1 25MHz Gray 24 ±2, ±5, ±1% 1 25MHz Red 25 ±2, ±5, ±1% 1 25MHz Green 27 ±2, ±5, ±1% 1 25MHz White 3 ±2, ±5, ±1% 1 25MHz Yellow 33 ±2, ±5, ±1% 1 25MHz Black 36 ±2, ±5, ±1% 1 25MHz Green 39 ±2, ±5, ±1% 1 25MHz Brown 43 ±2, ±5, ±1% 5 1MHz Blue 47 ±2, ±5, ±1% 5 1MHz Red 56 ±2, ±5, ±1% 25 5MHz Orange 6 ±2, ±5, ±1% 25 5MHz White 62 ±2, ±5, ±1% 25 5MHz Yellow 68 ±2, ±5, ±1% 25 5MHz Green 75 ±2, ±5, ±1% 25 5MHz Blue 82 ±2, ±5, ±1% 25 5MHz Violet 1 ±2, ±5, ±1% 25 5MHz Gray 12 ±2, ±5, ±1% MHz White 15 ±2, ±5, ±1% MHz Black 18 ±2, ±5, ±1% MHz Brown 22 ±2, ±5, ±1% MHz Red 27 ±2, ±5, ±1% MHz Orange 33 ±2, ±5, ±1% MHz Blue 47 ±2, ±5, ±1% MHz Green 7 171

173 Wire Wound Chip Inductor LCWC Series 7 18 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code *5.6 ±5, ±1% 5 15MHz Black *1 ±2, ±5, ±1% 5 5MHz Brown *12 ±2, ±5, ±1% 5 5MHz Red *15 ±2, ±5, ±1% 5 5MHz Orange *18 ±2, ±5, ±1% 5 35MHz Yellow *22 ±2, ±5, ±1% 5 35MHz Green 24 ±2, ±5, ±1% 5 35MHz Blue *27 ±2, ±5, ±1% 5 35MHz Violet *33 ±2, ±5, ±1% 5 35MHz Gray 36 ±2, ±5, ±1% 5 35MHz Orange *39 ±2, ±5, ±1% 5 35MHz White *47 ±2, ±5, ±1% 5 35MHz Black *56 ±2, ±5, ±1% 5 35MHz Brown *62 ±2, ±5, ±1% 5 35MHz Blue *68 ±2, ±5, ±1% 5 35MHz Red 75 ±2, ±5, ±1% 5 35MHz White *82 ±2, ±5, ±1% 5 35MHz Orange 91 ±2, ±5, ±1% 5 35MHz White *1 ±2, ±5, ±1% 25 35MHz Yellow *12 ±2, ±5, ±1% 25 35MHz Green *15 ±2, ±5, ±1% 25 1MHz Blue *18 ±2, ±5, ±1% 25 1MHz Violet *22 ±2, ±5, ±1% 25 1MHz Gray *24 ±2, ±5, ±1% 25 1MHz White *27 ±2, ±5, ±1% 25 1MHz Black *3 ±2, ±5, ±1% 25 1MHz Brown *33 ±2, ±5, ±1% 25 1MHz Red *36 ±2, ±5, ±1% 25 1MHz Orange *39 ±2, ±5, ±1% 25 1MHz Yellow *43 ±2, ±5, ±1% 25 1MHz Green *47 ±2, ±5, ±1% 25 1MHz Blue *56 ±2, ±5, ±1% 25 1MHz Violet *62 ±2, ±5, ±1% 25 1MHz Gray *68 ±2, ±5, ±1% 25 1MHz White *75 ±2, ±5, ±1% 25 1MHz Black *82 ±2, ±5, ±1% 25 1MHz Brown *91 ±2, ±5, ±1% 25 5MHz Red *1 ±2, ±5, ±1% 25 5MHz Orange *12 ±2, ±5, ±1% 7.9 5MHz Yellow *15 ±2, ±5, ±1% 7.9 5MHz Green *18 ±2, ±5, ±1% 7.9 5MHz Blue *22 ±2, ±5, ±1% 7.9 5MHz Violet *27 ±2, ±5, ±1% MHz Gray *33 ±2, ±5, ±1% MHz White *39 ±2, ±5, ±1% MHz Black *47 ±2, ±5, ±1% MHz Brown 56 ±2, ±5, ±1% MHz Red 68 ±2, ±5, ±1% MHz Orange 82 ±2, ±5, ±1% MHz Yellow 1 ±2, ±5, ±1% MHz Green 12 ±2, ±5, ±1% MHz Blue 15 ±2, ±5, ±1% MHz Violet *Test Methods I Instrument: Network I Spectrum Analyzer 172

174 Wire Wound Chip Inductor LCWC Series 126 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 6.8 ±5, ±1% 1 3MHz Brown 1 ±5, ±1% 1 3MHz Red 12 ±5, ±1% 1 3MHz Orange 15 ±5, ±1% 1 3MHz Yellow 18 ±5, ±1% 1 3MHz Green 22 ±5, ±1% 1 3MHz Blue 24 ±5, ±1% 1 3MHz Red 27 ±2, ±5, ±1% 1 3MHz Violet 33 ±2, ±5, ±1% 1 3MHz Gray 39 ±2, ±5, ±1% 1 3MHz White 47 ±2, ±5, ±1% 1 3MHz Black 56 ±2, ±5, ±1% 1 3MHz Brown 62 ±2, ±5, ±1% 1 3MHz Violet 68 ±2, ±5, ±1% 1 3MHz Red 82 ±2, ±5, ±1% 1 3MHz Orange 91 ±2, ±5, ±1% 1 3MHz White 1 ±2, ±5, ±1% 1 3MHz Yellow 12 ±2, ±5, ±1% 1 3MHz Green 15 ±2, ±5, ±1% 1 3MHz Blue 18 ±2, ±5, ±1% 5 3MHz Violet 22 ±2, ±5, ±1% 5 3MHz Gray 27 ±2, ±5, ±1% 5 3MHz White 3 ±2, ±5, ±1% 5 15MHz Green 33 ±2, ±5, ±1% 5 15MHz Black 36 ±2, ±5, ±1% 5 15MHz Blue 39 ±2, ±5, ±1% 5 15MHz Brown 47 ±2, ±5, ±1% 5 15MHz Red 56 ±2, ±5, ±1% 35 15MHz Orange 62 ±2, ±5, ±1% 35 15MHz Gray 68 ±2, ±5, ±1% 35 15MHz Yellow 75 ±2, ±5, ±1% 35 15MHz White 82 ±2, ±5, ±1% 35 15MHz Green 91 ±2, ±5, ±1% 35 15MHz Green 1 ±2, ±5, ±1% 35 15MHz Blue 12 ±2, ±5, ±1% 35 15MHz Violet 7 173

175 Wire Wound Chip Inductor LCWC Series LOW PROFILE ELECTRICAL SPECIFICATIONS 85 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 1.8 ±5% 25 15MHz Black 3.9 ±5, ±1% 25 1MHz Brown 4.7 ±5, ±1% 25 1MHz Red 6.8 ±5, ±1% 25 1MHz Orange 8.2 ±5, ±1% 25 1MHz Yellow 1 ±2, ±5, ±1% 25 75MHz Green 12 ±2, ±5, ±1% 25 75MHz Blue 15 ±2, ±5, ±1% 25 5MHz Violet 18 ±2, ±5, ±1% 25 5MHz Gray 22 ±2, ±5, ±1% 25 5MHz Whit 27 ±2, ±5, ±1% 25 5MHz Black 33 ±2, ±5, ±1% 25 5MHz Brown 39 ±2, ±5, ±1% 25 5MHz Red 47 ±2, ±5, ±1% 2 5MHz Orange 56 ±2, ±5, ±1% 2 5MHz Yellow 68 ±2, ±5, ±1% 2 5MHz Green 82 ±2, ±5, ±1% 15 5MHz Blue 1 ±2, ±5, ±1% 15 5MHz Violet 12 ±2, ±5, ±1% 15 25MHz Gray 15 ±2, ±5, ±1% 15 25MHz Whit 1 ±2, ±5, ±1% 25 5MHz Black 18 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 3.3 ±5, ±1% 5 15MHz White 4.2 ±5, ±1% 5 15MHz Black 6.8 ±5, ±1% 5 15MHz Brown 8.2 ±5, ±1% 5 15MHz Red 15 ±5, ±1% 5 5MHz Orange 18 ±5, ±1% 5 35MHz Gray 2 ±5, ±1% 5 5MHz Yellow 27 ±5, ±1% 5 35MHz Green 3 ±5, ±1% 5 5MHz Blue 4 ±5, ±1% 5 5MHz Violet 5 ±2, ±5, ±1% 5 5MHz Gray 6 ±2, ±5, ±1% 5 5MHz White 7 ±2, ±5, ±1% 5 5MHz Black 8 ±2, ±5, ±1% 5 5MHz Brown 18 ±2, ±5, ±1% 5 35MHz Blue 56 ±2, ±5, ±1% 25 1MHz Red 7 174

176 Wire Wound Chip Inductor LCWC Series HIGH CURRENT ELECTRICAL SPECIFICATIONS 63 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 1.6 ±5, ±1% Black 3.6 ±5, ±1% Brown 3.9 ±5, ±1% Red 6.8 ±5, ±1% Orange 7.5 ±5, ±1% Yellow 8.2 ±5, ±1% White 1 ±2, ±5, ±1% Green 12 ±2, ±5, ±1% Blue 15 ±2, ±5, ±1% Violet 18 ±2, ±5, ±1% Gray 22 ±2, ±5, ±1% White 24 ±2, ±5, ±1% Black HIGH Q ELECTRICAL SPECIFICATIONS 85 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 2.5 ±5, ±1% 25 15MHz Black 5.6 ±5, ±1% 25 15MHz Brown 6.2 ±5, ±1% 25 1MHz Red 6.8 ±5, ±1% 25 1MHz White 8.2 ±5, ±1% 25 1MHz Gray 1 ±5, ±1% 25 1MHz Black 12 ±5, ±1% 25 1MHz Orange 15 ±2, ±5, ±1% 25 1MHz Black 16 ±2, ±5, ±1% 25 5MHz Yellow 18 ±2, ±5, ±1% 25 5MHz Green 2 ±2, ±5, ±1% 25 5MHz Blue 22 ±2, ±5, ±1% 25 5MHz Black 27 ±2, ±5, ±1% 25 5MHz Violet 3 ±2, ±5, ±1% 25 5MHz Gray 39 ±2, ±5, ±1% 25 5MHz White 48 ±2, ±5, ±1% 2 5MHz Black 51 ±2, ±5, ±1% 2 5MHz Brown 18 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 3. ±5, ±1% 5 15MHz Black 3.9 ±5, ±1% 5 15MHz White 4.1 ±5, ±1% 5 15MHz Brown 7.8 ±5, ±1% 5 5MHz Red 1 ±2, ±5, ±1% 5 5MHz Orange 12 ±2, ±5, ±1% 5 5MHz Yellow 18 ±2, ±5, ±1% 5 35MHz Green 22 ±2, ±5, ±1% 5 35MHz Blue 33 ±2, ±5, ±1% 5 35MHz Violet 39 ±2, ±5, ±1% 5 35MHz Gray 47 ±2, ±5, ±1% 5 35MHz White 56 ±2, ±5, ±1% 5 35MHz Black 68 ±2, ±5, ±1% 5 35MHz Brown 82 ±2, ±5, ±1% 5 35MHz Red 1 ±2, ±5, ±1% 5 35MHz Orange 7 175

177 Wire Wound Chip Inductor LCWC Series ENVIRONMENTAL CHARACTERISTICS MECHANICAL PERFORMANCE TEST Items Requirement Test Methods Inductance HP4286 Q HP4286 SRF Refer to standard electrical HP4287 DC Resistance RDC characteristic spec. Micro-Ohm meter (Gom-81G) Rated Current IDC Applied the current to coils, The inductance change should be less than 1% to initial value Over Load Inductors shall have no evidence of Applied 2 times of rated allowed DC current electrical and mechanical damage to inductor for a period of 5 minutes Withstanding Voltage Inductors shall be no evidence of AC voltage of 5 VAC applied between inductors electrical and mechanical damage. terminal and case for 1 min. Insulation Resistance 1M ohm min. 1 VDC applied between inductor terminal and case and case MECHANICAL PERFORMANCE TEST Items Requirement Test Methods Test device shall be soldered on the substrate Oscillation Frequency: 1 to 55 to 1Hz for 1 min. Vibration Appearance: No damage Amplitude: 1.5 mm L change: within ±5% Time: 2 hrs for each axis (X, Y &Z), total 6 hrs Q change: within ±1% Resistance to Solder Temperature: 26±5ºC Soldering Heat Immersion Time: 1±2 seconds The device should be soldered (26±5 for 1 seconds) 1 lbs. For 42 to a tinned copper subs rate. A dynamiter force gauge Component Adhesion 2 lbs. For 63 should be applied to the side of the component. The (Push Test) 3 lbs. For the rest device must with stand a minimum force of 2 or 4 pounds without a failure of adhesion on termination Dropping chip by each side and each corner. Drop No damage Drop 1 times in total Drop height: 1 cm Drop weight: 125 g Solderability 9% covered with solder Inductor shall be dipped in a melted solder bath at 245±5 for 3 seconds Resistance to Solvent No damage on appearance and marking MIL-STD22F, Method 215D 7 CLIMATIC TEST Items Requirement Test Methods Temperature Characteristic -4 ~ +125 C Temperature: 4±2 C Humidity Relative Humidity: 9 ~ 95% Time: 96±2 hrs Measured after exposure in the room condition for 2 hrs Temperature: -4±2 C Low Temperature Storage Appearance: No damage Time: 96±2 hrs L change: within ±1% Inductors are tested after 1 hour at room temperature Q change: within ±2% One cycle: Thermal Shock High Temperature Storage High Temperature Load Life Damp Heat with Load Step Temperature ( C) Time (min.) 1-25± ± ± ±2 15 Total: 5 cycles Temperature: 125±2 C Time: 96±2 hrs Measured after exposure in the room condition for 1 hour Temperature: 85±2 C Time: 1±12 hrs There should be no evidence of Load: Allowed DC current short of open circuit. Temperature: 4±2 C Relative Humidity: 9 ~ 95% Time: 1±12 hrs Load: Allowed DC current 176

178 Wire Wound Chip Inductor LCWC Series REEL DIMENSIONS AND PACKAGING QUANTITY D: 21.8 ±.8 (.858 ±.31) Label 1.2 ±.2 (.47 ±.8) Thickness (t).1 (.4) max D: 13. ±.3 (.512 ±.12) 6. ±.5 (2.362 ±.2) Embossed Cavity 2. ±.5 (.79 ±.2) 9. ±.3 (.354 ±.112) 11.4 ± 1. (.449 ±.39) Embossed Carrier PAPER TAPE SPECIFICATION AND PACKAGING QUANTITY φ 1.5 P1 P 1.75 ±.1 (.69 ±.4) B F W H A P mm (inches) Type A B H F P P P1 W ReeI (EA) LCWC (.28) (.47) (.24) (.138) (.157) (.147) (.79) (.315) 4, LCWC (.53) (.77) (.37) (.138) (.157) (.147) (.79) (.315) 4, EMBOSSED PLASTIC PAPER TAPE SPECIFICATION AND PACKAGING QUANTITY 4. ±.1 (.157 ±.4) ø1.5 G F I A E D ø1.5 C B H mm (inches) Type A B C D E F G H I ReeI (EA) LCWC85 8. ± ±.1 4. ± ± ± ±.1 2. ± ±.5.23 ±.5 (.315 ±.8) (.73 ±.73) (.157 ±.73) (.91 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.57 ±.2) (.9 ±.2) 2, LCWC85 (R) 8. ± ±.1 4. ± ± ± ±.1 2. ±.5.9 ±.5.23 ±.5 (.315 ±.8) (.71 ±.73) (.157 ±.73) (.91 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.35 ±.2) (.9 ±.2) 2, LCWC85 (Q) 8. ± ±.1 4. ± ± ± ±.1 2. ± ±.5.23 ±.5 (.315 ±.8) (.73 ±.73) (.157 ±.73) (.91 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.57 ±.2) (.9 ±.2) 2, LCWC ± ±.1 4. ± ± ± ±.1 2. ± ±.5.23 ±.5 (.315 ±.8) (.77 ±.73) (.157 ±.73) (.138 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.59 ±.2) (.9 ±.2) 2, LCWC18 8. ± ±.1 4. ± ± ± ±.1 2. ±.5 2. ±.5.23 ±.5 (.315 ±.8) (.16 ±.73) (.157 ±.73) (.11 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.79 ±.2) (.9 ±.2) 2, LCWC18 (R) 8. ± ±.1 4. ± ± ± ±.1 2. ± ±.5.23 ±.5 (.315 ±.8) (.16 ±.73) (.157 ±.73).11 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.59 ±.2) (.9 ±.2) 2, LCWC18 (Q) 8. ± ±.1 4. ± ± ± ±.1 2. ±.5 2. ±.5.23 ±.5 (.315 ±.8) (.16 ±.73) (.157 ±.73).11 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.79 ±.2) (.9 ±.2) 2, 7 177

179 RF/Microwave Capacitors RF/Microwave Multilayer Capacitors (MLC) RF/Microwave CG (NP) Capacitors RF/Microwave U Series Designer Kits 178

180 Microwave MLCs UQ Series High Q Ultra Low ESR MLC FEATURES: Ultra Low ESR High Q High Self Resonance Capacitance Range.1 pf to 1 pf APPLICATIONS: RF Power Amplifiers Low Noise Amplifiers Filter Networks MRI Systems HOW TO ORDER UQ CB 7 A 1 J A T ME AVX Style W T bw A 11J Case Size CA = 65 CB = 121 CR = 79 CL = 42 CS = 63 CF = 85 See mechanical dimensions below L Voltage Code 5 = 5V 1 = 1V E = 15V 2 = 2V V = 25V 9 = 3V 7 = 5V Temperature Coefficient Code A = ±3ppm/ C Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Capacitance Tolerance Code A = ±.5 pf B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% MECHANICAL DIMENSIONS: inches (millimeters) Failure Rate Code A = Not Applicable Termination Style Code J = Nickel Barrier Sn/Pb (6/4) **T = 1% Tin **C = Non-Magnetic Barrier/Tin **RoHS compliant Packaging Code ME = 7" Reel Marked (65, 121 & 79 only) 2A = 7" Unmarked (42, 63, & 85 only) * Vertical T&R available Case Length (L) Width (W) Thickness (T) Band Width (bw) UQCA ( ).55±.15 (1.4±.381).57 (1.45) max ( ) UQCB ( ).11±.15 (2.79±.381).12 (2.59) max..15±.1 (.381±.254) UQCR.7 ±.15 (1.78 ±.381).9±.1 (2.29±.254).115 (2.92) max ( ) UQCL.4 ±.4 (1.2 ±.1).2±.4 (.51±.1).24 (.6) max..1 ±.6 (.25 ±.15) UQCS.63 ±.6 (1.6 ±.15).32±.6 (.81±.15).35 (.89) max..14 ±.6 (.36 ±.15) UQCF.79 ±.8 (2.1 ±.2).49±.8 (1.24±.2).51 (1.3) max..2 ±.1 (.51 ±.25) TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). 8mm carrier 7" reel: UQCA = 5 or 4 pc T&R UQCL = 5, 4 or 1, pc T&R UQCB = 5 or 1 pc T&R UQCS = 5 or 4 pc T&R UQCR = 5 or 1 pc T&R UQCF = 5 or 4 pc T&R LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. Also available in: Not RoHS Compliant 179 8

181 Microwave MLCs UQ Series High Q Ultra Low ESR MLC ELECTRICAL SPECIFICATIONS Temperature Coefficient (TCC) Capacitance Range Operating Temperature Quality Factor (Q) Insulation Resistance (IR) Working Voltage (WVDC) Dielectric Withstanding Voltage (DWV) Aging Effects Piezoelectric Effects Capacitance Drift Temperature Characteristic Code A (A) ± 3 PPM/ºC (A).1 pf to 1 pf.1 pf to 1 pf: from -55ºC to +125ºC Greater than 2, at 1 MHz.1 pf to 1 pf 1 5 Megohms 25ºC at rated WVDC 1 4 Megohms 125ºC at rated WVDC See Capacitance Values table 25% of rated WVDC for 5 secs None None ± (.2% or.2 pf), whichever is greater ENVIRONMENTAL CHARACTERISTICS AVX UQ will meet and exceed the requirements of EIA-198, MIL-PRF and MIL-PRF-123 Thermal Shock Mil-STD-22, Method 17, Condition A Moisture Resistance Mil-STD-22, Method 16 Low Voltage Humidity Mil-STD-22, Method 13, condition A, with 1.5 VDC applied while subjected to an environment of 85ºC with 85% relative humidity for 24 hours Life Test Mil-STD-22, Method 18, for 2 hours at 125ºC 2% WVDC Shock Mil-STD-22, Method 213, Condition J Vibration Mil-STD-22, Method 24, Condition B Immersion Mil-STD-22, Method 14, Condition B Salt Spray Mil-STD-22, Method 11, Condition B Solderability Mil-STD-22, Method 28 Terminal Strength Mil-STD-22, Method 211 Temperature Cycling Mil-STD-22, Method 12, Condition C Barometric Pressure Mil-STD-22, Method 15, Condition B Resistance to Solder Heat Mil-STD-22, Method 21, Condition C 8 18

182 Microwave MLCs UQ Series High Q Ultra Low ESR MLC TABLE I: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 B 25.2 B 25.3 B,C 25.4 B,C 25.5 B, C, D 25.6 B, C, D 25.7 B, C, D 25.8 B, C, D 25.9 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 25 TABLE II: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 B 5.2 B 5.3 B,C 5.4 B,C 5.5 B, C, D 5.6 B, C, D 5.7 B, C, D 5.8 B, C, D 5.9 B, C, D 5 1. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 5 2. B, C, D B, C, D B, C, D B, C, D 5 3. B, C, D B, C, D 5 TABLE III: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC 1. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 5 2. B, C, D B, C, D B, C, D B, C, D B, C, D 5 Cap. pf Cap. Tol. WVDC 1.6 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 25 Cap. pf Cap. Tol. WVDC 3.6 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K 5 1 F, G, J, K, M 5 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 Cap. pf Cap. Tol. WVDC 3. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D G, J, K, M G, J, K, M G, J, K, M G, J, K, M G, J, K, M G, J, K, M 5 1 G, J, K, M 5 11 G, J, K, M 5 Case Size A Case Size B Case Size R Cap. pf Cap. Tol. WVDC 5.6 B, C, D B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K 25 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 2 F, G, J, K, M F, G, J, K, M 25 Cap. pf Cap. Tol. WVDC 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 3 12 F, G, J, K, M 3 13 F, G, J, K, M 3 15 F, G, J, K, M 3 16 F, G, J, K, M 3 18 F, G, J, K, M 3 2 F, G, J, K, M 3 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 3 F, G, J, K, M 2 33 F, G, J, K, M 2 36 F, G, J, K, M 2 39 F, G, J, K, M 2 Cap. pf Cap. Tol. WVDC 12 G, J, K, M 5 13 G, J, K, M 5 15 G, J, K, M 5 16 G, J, K, M 5 18 G, J, K, M 5 2 G, J, K, M 5 22 G, J, K, M 5 24 G, J, K, M 5 27 G, J, K, M 5 3 G, J, K, M 5 33 G, J, K, M 5 36 G, J, K, M 5 39 G, J, K, M 5 43 G, J, K, M 5 47 G, J, K, M 5 Cap. pf Cap. Tol. WVDC 24 F, G, J, K, M F, G, J, K, M 25 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 1 F, G, J, K, M 25 Cap. pf Cap. Tol. WVDC 43 F, G, J, K, M 2 47 F, G, J, K, M 2 51 F, G, J, K, M 1 56 F, G, J, K, M 1 62 F, G, J, K, M 1 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 Cap. pf Cap. Tol. WVDC 51 G, J, K, M 5 56 G, J, K, M 5 62 G, J, K, M 5 68 G, J, K, M 5 75 G, J, K, M 5 82 G, J, K, M 5 91 G, J, K, M 5 1 G, J, K, M

183 Microwave MLCs UQ Series High Q Ultra Low ESR MLC 8 TABLE IV: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 A, B 2.2 A, B 2.3 A, B, C 2.4 A, B, C 2.5 A, B, C 2.6 A, B, C 2.7 A, B, C 2.8 A, B, C 2.9 A, B, C 2 1. A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D 2 TABLE V: Cap. pf Cap. Tol. WVDC.1 A, B 25.2 A, B 25.3 A, B, C 25.4 A, B, C 25.5 A, B, C 25.6 A, B, C 25.7 A, B, C 25.8 A, B, C 25.9 A, B, C A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D 25 TABLE VI: Cap. pf Cap. Tol. WVDC.1 A, B 25.2 A, B 25.3 A, B, C 25.4 A, B, C 25.5 A, B, C 25.6 A, B, C 25.7 A, B, C 25.8 A, B, C 25.9 A, B, C A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D 25 Cap. pf Cap. Tol. WVDC 1.6 A, B, C, D A, B, C, D 2 2. A, B, C, D A, B, C, D A, B, C, D A, B, C, D 2 3. A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D 2 Cap. pf Cap. Tol. WVDC 2.7 A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K 25 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 Cap. pf Cap. Tol. WVDC 3.3 A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D A, B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K 25 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 2 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 Case Size L Case Size S Case Size F Cap. pf Cap. Tol. WVDC 6.2 A, B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K 2 1 F, G, J, K, M 2 11 F, G, J, K, M 2 12 F, G, J, K, M 2 15 F, G, J, K, M 2 18 F, G, J, K, M 2 2 F, G, J, K, M 2 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 Cap. pf Cap. Tol. WVDC 2 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 1 F, G, J, K, M 25 Cap. pf Cap. Tol. WVDC 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 2 F, G, J, K, M F, G, J, K, M F, G, J, K, M

184 Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CA ESR vs. Frequency UQ CA FSR & FPR vs. Capacitance 8 183

185 Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CB ESR vs. Frequency UQ CB FSR & FPR vs. Capacitance 8 184

186 Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CR ESR vs. Frequency UQ CR Resonance Horizontal Orientation 8 185

187 Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CL ESR vs. Frequency UQ CL Resonance Frequency 8 186

188 Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CS ESR vs. Frequency UQ CS ESR vs. Frequency 8 187

189 Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CS Q vs. Capacitance UQ CS Resonant Frequency 8 188

190 Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CF ESR vs. Frequency UQ CF Resonant Frequency 8 189

191 Microwave MLCs UQ Series High Q Ultra Low ESR MLC B A C D MOUNTING PAD DIMENSIONS CASE CA: inches (millimeters) Pad Size A min B min C min D min Vertical Mount Normal.7 (1.778).5 (1.27).3 (.762).13 (3.32) High Density.5 (1.27).3 (.762).3 (.762).9 (2.286) Horizontal Mount Normal.8 (2.32).5 (1.27).3 (.762).13 (3.32) High Density.6 (1.524).3 (.762).3 (.762).9 (2.286) MOUNTING PAD DIMENSIONS CASE CB: inches (millimeters) Cap Value Pad Size A min B min C min D min Vertical Mount.1 pf Normal.65 (1.651).5 (1.27).75 (1.95).175 (4.445) High Density.45 (1.143).3 (.762).75 (1.95).135 (3.429).2 pf Normal.9 (2.286).5 (1.27).75 (1.95).175 (4.445) High Density.7 (1.778).3 (.762).75 (1.95).135 (3.429).3 to Normal.11 (2.794).5 (1.27).75 (1.95).175 (4.445) 51 pf High Density.9 (2.286).3 (.762).75 (1.95).135 (3.429) > 51 pf Normal.12 (3.48).5 (1.27).75 (1.95).175 (4.445) High Density.1 (2.54).3 (.762).75 (1.95).135 (3.429) Horizontal Mount All Normal.13 (3.32).5 (1.27).75 (1.95).175 (4.445) Values High Density.11 (2.794).3 (.762).75 (1.95).135 (3.429) MOUNTING PAD DIMENSIONS CASE CL, CS & CF: inches (millimeters) T L W A B C B Case A min. B min. C min. D min. 42 (15).275 (.7).354 (.9).157 (.4).866 (2.2) 63 (168).393 (1.).433 (1.1).3236 (.6).11 (2.8) 85 (212).59 (1.5).512 (1.3).236 (.6).1259 (3.2) D 8 19

192 Microwave MLCs UQ Series High Q Ultra Low ESR MLC DESIGN KITS Kit # Compliance Description Cap Value Tol. (pf) KITUQ8LF KITUQ81LF KITUQ82LF KITUQ83LF KITUQ84LF KITUQ85LF KITUQ36LF KITUQ37LF KITUQ38LF KITUQ25LF KITUQ26LF KITUQ27LF KITUQ32LF KITUQ33LF KITUQ34LF KITUQ35LF LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT UQCA 55 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCA 55 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCA 55 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCB 1111 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCB 1111 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCB 1111 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCL 42 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCL 42 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCL 42 Series Ultra-Low ESR High Q Microwave Capacitors 8 different values, 15 pcs min. per value UQCS 63 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCS 63 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCS 63 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCF 85 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCF 85 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCF 85 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCF 85 Series Ultra-Low ESR High Q Microwave Capacitors 7 different values, 15 pcs min. per value.1 to to 1 pf ±.1 ±.25 ±.1 ±.25 ±5% 1 to 1 pf ±5% 1. to 1 pf ±.1 ±.25 ±5% 1 to 1 pf ±5% 1 to 1 pf.1 to to 1 ±5% ±1% ±.1 ±.25 ±.1 ±.25 ±5% 1 to 27 ±5%.1 to to 1 ±.1 ±.25 ±.1 ±.25 ±5% 1 to 1 ±5%.1 to to 1 ±.1 ±.25 ±.1 ±.25 ±5% 1 to 1 ±5% 1 to 24 ±5% 8 187

193 RF/Microwave MLC s SQ Series Ultra Low ESR MLC HOW TO ORDER SQ CA 7 FEATURES: M 1 J A Low ESR High Q High Self Resonance Capacitance Range.1 pf to 51 pf 175ºC Capability SQCB (Standard voltages only) APPLICATIONS: RF Power Amplifiers Low Noise Amplifiers Filter Networks MRI Systems T 1A AVX Style Case Size CA = 55 CB = 1111 See mechanical dimensions below Voltage Code 5 = 5V 1 = 1V E = 15V 2 = 2V V = 25V 9 = 3V 7 = 5V C = 6V A = 1V S = 15V Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Temperature Coefficient Code M = +9±2ppm/ C A = ±3ppm/ C C = 15% ( J Termination only) Capacitance Tolerance Code B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% N = ±3% Failure Rate Code A = Not Applicable Termination Style Code **T = 1% Tin J = Nickel Barrier Sn/Pb (6/4) **7 = Ag/Ni/Au H = Cu/Sn (Non-Magnetic) **RoHS compliant Packaging Code 1A = 7" Reel Unmarked 6A = Waffle Pack Unmarked ME = 7" Reel Marked WE = Waffle Pack Marked * Vertical T&R available MECHANICAL DIMENSIONS: inches (millimeters) T W bw L Case Length (L) Width (W) Thickness (T) Band Width (bw) SQCA* ( ).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) SQCB* ( ).11±.1 (2.79±.254).3/.12 (.762/2.59).15±.1 (.381±.254) 8 TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). 8mm carrier 7" reel: SQCA/SQCB = 1 pcs WAFFLE PACK SQCA 1 pcs SQCB 1 pcs Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style

194 RF/Microwave MLC s SQ Series Ultra Low ESR MLC ELECTRICAL SPECIFICATIONS Dielectric M & A C Temperature Coefficient (TCC) (M) +9 ± 2 PPM/ºC ( -55ºC to +125ºC) ±15% (-55ºC to 125ºC) (M) +9 ± 3 PPM/ºC ( +125ºC to +175ºC)* (A) ± 3 PPM/ºC Capacitance Range (M).1 pf to 1 pf.1μf to.1μf (A).1 pf to 51 pf Operating Temperature A Case: -55ºC to +125ºC* -55 C to +125 C B Case (M Dielectric):.1 pf to 33 pf: from -55ºC to +175ºC 36 pf to 51 pf: from -55ºC to +125ºC B Case (A Dielectric):.1 pf to 2 pf: from -55ºC to +175ºC 22 pf to 51 pf: from -55ºC to +125ºC Quality Factor (Q) M Dielectric A & B Case Greater than 1, at 1 MHz 1kHz A Dielectric B Case Greater than 1, at 1 MHz.1-2 pf Greater than 2, at 1 MHz 22-1 pf Greater than 2, at 1 KHz pf A Dielectric A Case Greater than 1, at 1 MHz.1-1 pf Greater than 2, at 1 MHz 11-1 pf Insulation Resistance (IR).2 pf to 47 pf 1 4 Megohms 25ºC at rated WVDC 1 6 Megohms 25ºC at rated WVDC 1 3 Megohms 125ºC at rated WVDC 1 5 Megohms 125ºC at rated WVDC 51 pf to 51 pf 1 5 Megohms 25ºC at rated WVDC 1 4 Megohms 125ºC at rated WVDC Working Voltage (WVDC) See Capacitance Values table See Capacitance Values table Dielectric Withstanding Voltage (DWV) WVDC 5V or less: 25% of rated WVDC for 5 seconds 25% of rated WVDC for 5 secs WVDC 125V or less: 15% of rated WVDC for 5 seconds WVDC > 125V: 12% of rated WVDC for 5 seconds Aging Effects None <3% per decade hour Piezoelectric Effects None None Capacitance Drift ± (.2% or.2 pf), whichever is greater Not Applicable * 175 SQCB only ENVIRONMENTAL CHARACTERISTICS AVX SQ will meet and exceed the requirements of EIA-198, MIL-PRF and MIL-PRF-123 Themal Shock Mil-STD-22, Method 17, Condition A Moisture Resistance Mil-STD-22, Method 16 Low Voltage Humidity Mil-STD-22, Method 13, condition A, with 1.5 VDC applied while subjected to an environment of 85ºC with 85% relative humidity for 24 hours Life Test Mil-STD-22, Method 18, for 2 hours at 125ºC Shock Mil-STD-22, Method 213, Condition J Vibration Mil-STD-22, Method 24, Condition B Immersion Mil-STD-22, Method 14, Condition B Salt Spray Mil-STD-22, Method 11, Condition B Solderability Mil-STD-22, Method 28 Terminal Strength Mil-STD-22, Method 211 Temperature Cycling Mil-STD-22, Method 12, Condition C Barometric Pressure Mil-STD-22, Method 15, Condition B Resistance to Solder Heat Mil-STD-22, Method 21, Condition C

195 RF/Microwave MLC s SQ Series Ultra Low ESR MLC Case Size A TABLE I: TC: M (+9±2PPM/ C) Cap. pf Cap. Tol. WVDC* STD HV.1 B B B,C B,C B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D TABLE II: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC* STD HV.1 B B B,C B,C B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D TABLE III: TC: C (±15%) Cap. pf Cap. Tol. WVDC STD 1 K, M, N 5 12 K, M, N 5 15 K, M, N 5 18 K, M, N 5 2 K, M, N 5 *STD = Standard voltage rating; HV = High voltage rating Cap. pf Cap. Tol. WVDC* STD HV 1.7 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D Cap. pf Cap. Tol. WVDC* STD HV 2.7 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K Cap. pf Cap. Tol. WVDC STD 22 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 47 K, M, N 5 Cap. pf Cap. Tol. WVDC* STD HV 6.2 B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K Cap. pf Cap. Tol. WVDC* STD HV 2 F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K 15 Cap. pf Cap. Tol. WVDC STD 51 K, M, N 5 56 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 Cap. pf Cap. Tol. WVDC* STD HV 27 F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K 15 2 Cap. pf Cap. Tol. WVDC* STD HV 15 F, G, J, K F, G, J, K F, G, J, K 15 2 F, G, J, K F, G, J, K F, G, J, K F, G, J, K 15 3 F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K 5 75 F, G, J, K 5 82 F, G, J, K 5 91 F, G, J, K 5 1 F, G, J, K

196 RF/Microwave MLC s SQ Series Ultra Low ESR MLC Case Size B TABLE IV: TC: M (+9±2PPM/ C) Cap. pf Cap. Tol. WVDC* STD HV.1 B B B,C B,C B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 5 15 TABLE V: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC* STD HV.1 B B B,C B,C B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 5 15 Cap. pf Cap. Tol. WVDC* STD HV 2.7 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K 5 15 Cap. pf Cap. Tol. WVDC* STD HV 3.9 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K B, C, J, K B, C, J, K B, C, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K 5 15 Cap. pf Cap. Tol. WVDC* STD HV 2 F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K 3 1 Cap. pf Cap. Tol. WVDC* STD HV 47 F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K 2 24 F, G, J, K 2 27 F, G, J, K 2 3 F, G, J, K 2 33 F, G, J, K 2 36 F, G, J, K 2 39 F, G, J, K 2 43 F, G, J, K 2 47 F, G, J, K 2 51 F, G, J, K 1 Cap. pf Cap. Tol. WVDC* STD HV 15 F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K F, G, J, K 5 3 Cap. pf Cap. Tol. WVDC* STD HV 56 F, G, J, K 1 62 F, G, J, K 1 68 F, G, J, K 5 75 F, G, J, K 5 82 F, G, J, K 5 91 F, G, J, K 5 1 F, G, J, K 5 11 F, G, J, K 5 12 F, G, J, K 5 13 F, G, J, K 5 15 F, G, J, K 5 16 F, G, J, K 5 18 F, G, J, K 5 2 F, G, J, K 5 22 F, G, J, K 5 24 F, G, J, K 5 27 F, G, J, K 5 3 F, G, J, K 5 33 F, G, J, K 5 36 F, G, J, K 5 39 F, G, J, K 5 43 F, G, J, K 5 47 F, G, J, K 5 5 F, G, J, K 5 51 F, G, J, K 5 TABLE VI: TC: C (±15%) Cap. pf Cap. Tol. WVDC STD 5 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 12 K, M, N 5 *STD = Standard voltage rating; HV = High voltage rating Cap. pf Cap. Tol. WVDC STD 15 K, M, N 5 18 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 Cap. pf Cap. Tol. WVDC STD 47 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N

197 RF/Microwave MLC s SQ Series Ultra Low ESR MLC 1 Typical ESR SQCA ESR (ohms) pF 4.7pF 1pF 22pF 1pF Frequency (Mhz) 1 Typical ESR SQCB ESR (ohms) pF 1pF 22pF 1pF 1pF Frequency (Mhz)

198 RF/Microwave MLC s SQ Series Ultra Low ESR MLC 1 SQCA Max Current Max Current (amps) 1.1 1pF 4.7pF 1pF 22pF 1pF Frequency (Mhz) 1 SQCB Max Current Max Current (amps) pF 1pF 22pF 1pF 1pF Frequency (Mhz)

199 SRF (Mhz) RF/Microwave MLC s SQ Series Ultra Low ESR MLC 1 Series Resonant Frequency 1 SQCA SQCB Capacitance (pf) A B C D MOUNTING PAD DIMENSIONS: inches (millimeters) Case A min B min C min D min SQCA.82 (2.83).51 (1.295).32 (.813).13 (3.32) SQCB.131 (3.327).51 (1.295).74 (1.88).177 (4.496) SQCS.38 (.965).43 (1.92).25 (.635).112 (2.845) SQCF.59 (1.499).51 (1.295).24 (.61).125 (3.175) SQCA & SQCB DESIGN KITS 8 PN Series Diel Term Range KITSQ1LF P9 1% Tin SQCA KITSQ4LF CG RoHS.1 to 2pF KITSQ2LF P9 1% Tin SQCA KITSQ5LF CG RoHS 1 to 1pF KITSQ3LF P9 1% Tin SQCA KITSQ6LF CG RoHS 1 to 1pF KITSQ7LF SQCA CG 1% Tin RoHS 1 to 1pF KITSQ8LF KITSQ11LF KITSQ9LF KITSQ12LF KITSQ1LF KITSQ13LF SQCB SQCB SQCB P9 CG P9 CG P9 CG KITSQ14LF SQCB CG 1% Tin RoHS 1% Tin RoHS 1% Tin RoHS 1% Tin RoHS 1 to 1pF 1 to 1pF 1 to 1pF 1 to 51 pf

200 Microwave MLC s SQCS (63) SQCF (85) Ultra Low ESR MLC HOW TO ORDER SQ CS V FEATURES: A 1 J A Low ESR High Q High Self Resonance Capacitance Range.1 pf to 24 pf EIA Size APPLICATIONS: RF Power Amplifiers Low Noise Amplifiers Filter Networks Point to Point Radios T 1A AVX Style Case Size CS = 63 CF = 85 Voltage Code V = 25V Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Failure Rate Code A = Not Applicable Packaging Code 1A = 7" Reel Unmarked ME = 7" Reel Marked * Vertical T&R available * 5 piece reels available Temperature Coefficient Code A = ±3ppm/ C Capacitance Tolerance Code A = ±.5 pf B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% Termination Style Code **7 = Ag/Ni/Au J = Nickel Barrier Sn/Pb (6/4) **T = 1% Tin (Standard) **RoHS compliant T W bw A 11J L MECHANICAL DIMENSIONS: inches (millimeters) Case Length (L) Width (W) Thickness (T) Band Width (bw) SQCS.63±.6.32±.6.3 Max..14±.6 (1.6±.152) (.813±.152) (.762) (.357±.152) SQCF.79±.8.49±.8.45 Max..14±.6 (2.1±.2) (1.24±.2) (1.14) (.357±.152) TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). 8mm carrier 7" reel = 4 pcs (5 piece options) Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style

201 Microwave MLC s Low ESR MLC Capacitors ELECTRICAL SPECIFICATIONS Temperature Coefficient (TCC) (A) ± 3 PPM/ºC Operating Temperature -55ºC to +125ºC Quality Factor (Q) Greater than 1, at 1 MHz Insulation Resistance (IR).1 pf to 24 pf 1 5 Megohms 25ºC at rated WVDC 1 4 Megohms 125ºC at rated WVDC Working Voltage (WVDC) See Capacitance Values table Dielectric Withstanding Voltage (DWV) 25% of rated WVDC for 5 secs Aging Effects None Piezoelectric Effects None Capacitance Drift ± (.2% or.2 pf), whichever is greater ENVIRONMENTAL CHARACTERISTICS AVX SQ will meet and exceed the requirements of EIA-198, MIL-PRF and MIL-PRF-123 Themal Shock Mil-STD-22, Method 17, Condition A Moisture Resistance Mil-STD-22, Method 16 Low Voltage Humidity Mil-STD-22, Method 13, condition A, with 1.5 VDC applied while subjected to an environment of 85ºC with 85% relative humidity for 24 hours Life Test Mil-STD-22, Method 18, for 2 hours at 125ºC Shock Mil-STD-22, Method 213, Condition J Vibration Mil-STD-22, Method 24, Condition B Immersion Mil-STD-22, Method 14, Condition B Salt Spray Mil-STD-22, Method 11, Condition B Solderability Mil-STD-22, Method 28 Terminal Strength Mil-STD-22, Method 211 Temperature Cycling Mil-STD-22, Method 12, Condition C Barometric Pressure Mil-STD-22, Method 15, Condition B Resistance to Solder Heat Mil-STD-22, Method 21, Condition C

202 Microwave MLC s SQ Series Available Capacitance/Size/WVDC/T.C. TABLE I: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 A, B 25.2 A, B 25.3 A, B 25.4 A, B 25.5 A, B, C 25.6 A, B, C 25.7 A, B, C 25.8 A, B, C 25.9 A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C 25 CASE SIZE S Cap. pf Cap. Tol. WVDC 2.4 A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C B, C, D B, C, D B, C, D B, C, D 25 1 F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J 25 Cap. pf Cap. Tol. WVDC 18 F, G, J 25 2 F, G, J F, G, J F, G, J F, G, J 25 3 F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J 25 1 F, G, J 25 TABLE II: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 A, B 25.2 A, B 25.3 A, B 25.4 A, B 25.5 A, B, C 25.6 A, B, C 25.7 A, B, C 25.8 A, B, C 25.9 A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C 25 CASE SIZE F Cap. pf Cap. Tol. WVDC 2.4 A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C A, B, C B, C, D B, C, D B, C, D B, C, D 25 1 F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J 25 Cap. pf Cap. Tol. WVDC 18 F, G, J 25 2 F, G, J F, G, J F, G, J F, G, J 25 3 F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J F, G, J 25 1 F, G, J F, G, J F, G, J 25 Cap. pf Cap. Tol. WVDC 15 F, G, J F, G, J 25 2 F, G, J F, G, J F, G, J

203 Microwave MLC s SQCS (63) SQCF (85) Ultra Low ESR MLC 1 Typical ESR SQCS ESR (ohms).1 1pF 4.7pF 1pF 22pF 1pF Frequency (Mhz) 1 Typical ESR SQCF ESR (ohms) Frequency (Mhz) 1pF 4.7pF 1pF 1pF 24pF

204 Microwave MLC s SQCS (63) SQCF (85) Ultra Low ESR MLC 1 Max Current SQCS Max Current (amps) 1 1 1pF 4.7pF 1pF 22pF 1pF Frequency (Mhz) 1 Max Current SQCF Max Current (amps) Frequency (Mhz) 1pF 4.7pF 1pF 1pF 24pF

205 SRF (Mhz) Microwave MLC s SQCS (63) SQCF (85) Ultra Low ESR MLC 1 Series Resonant Frequency 1 1 SQCS SQCF Capacitance (pf) A B C D MOUNTING PAD DIMENSIONS: inches (millimeters) Case A min B min C min D min SQCA.82 (2.83).51 (1.295).32 (.813).13 (3.32) SQCB.131 (3.327).51 (1.295).74 (1.88).177 (4.496) SQCS.38 (.965).43 (1.92).25 (.635).112 (2.845) SQCF.59 (1.499).51 (1.295).24 (.61).125 (3.175) SQCS & SQCF ENGINEERING KITS PN Series Diel Term Range Kit SQ18LF 1% Tin.1 to 1pF SQCF CG Kit SQ19LF RoHS 1 to 24pF Kit SQ15LF 1%Tin.1 to 1pF SQCS CG Kit SQ16LF RoHS 1 to 1pF Tolerance per PF: B from.1 to 3.3 J from 1 to 24 C from 3.9 to

206 Microwave MLC s AQ Series These porcelain and ceramic dielectric multilayer capacitor (MLC) chips are best suited for RF/ Microwave applications typically ranging from 1 MHz to 4.2 GHz. Characteristic is a fine grained, high density, high purity dielectric material impervious to moisture with heavy internal palladium electrodes. These characteristics lend well to applications requiring: 1) high current carrying capabilities; 2) high quality factors; 3) very low equivalent series resistance; 4) very high series resonance; 5) excellent stability under stresses of changing voltage, frequency, time and temperature. MECHANICAL DIMENSIONS: inches (millimeters) T W bw A 11J L Case Length (L) Width (W) Thickness (T) Band Width (bw) AQ11.55±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) AQ ( ).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) AQ13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) AQ ( ).11±.1 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) HOW TO ORDER AQ 11 E M 1 J A 1 ME AVX Style AQ11, AQ12, AQ13, AQ14 Case Size (See Chart) Voltage Code 5 = 5V 1 = 1V E = 15V 2 = 2V 9 = 3V 7 = 5V Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Temperature Coefficient Code M = +9±2ppm/ C (AQ11/12/13/14) A = ±3ppm/ C (AQ11/12/13/14) C = 15% ( J Termination only) (AQ12/14) PACKAGING Standard Packaging = Waffle Pack (maximum quantity is 8) Capacitance Tolerance Code B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% N = ±3% Failure Rate Code A = Not Applicable Termination Style Code 7 = Ag/Ni/Au (AQ11/13 only) J = Nickel Barrier Sn/Pb (6/4) - (AQ12/14 only) T = 1% Tin (AQ12/14 only) Packaging* Code 3A = 13" Reel Unmarked ME = 7" Reel Marked RE = 13" Reel Marked WE = Waffle Pack Marked BE = Bulk Marked Not RoHS Compliant TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). Sizes SQCA through SQCB, CDR11/12 through 13/14. 8mm carrier 7" reel:.4" thickness = 2 pcs.75" thickness = 2 pcs 13" reel:.75" thickness = 1, pcs LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. 25 8

207 Microwave MLC s AQ Series ELECTRICAL SPECIFICATIONS AQ11, AQ12, AQ13, AQ14 M & A C Temperature Coefficient (TCC) (M) +9 ± 2 PPM/ºC ( -55ºC to +125ºC) ±15% (-55ºC to 125ºC) (M) +9 ± 3 PPM/ºC ( +125ºC to +175ºC) (A) ± 3 PPM/ºC Capacitance Range (M).1 pf to 1 pf.1μf to.1μf (A).1 pf to 51 pf Operating Temperature.1 pf to 33 pf: from -55ºC to +175ºC -55 C to +125 C 36 pf to 51 pf: from -55ºC to +125ºC Quality Factor (Q) M Dielectric A & B Case Greater than 1, at 1 MHz 1kHz A Dielectric B Case Greater than 1, at 1 MHz.1-2 pf Greater than 2, at 1 MHz 22-1 pf Greater than 2, at 1 KHz pf A Dielectric A Case Greater than 1, at 1 MHz.1-1 pf Greater than 2, at 1 MHz 11-1 pf Insulation Resistance (IR).1 pf to 47 pf 1 4 Megohms 25ºC at rated WVDC 1 6 Megohms 25ºC at rated WVDC 1 3 Megohms 125ºC at rated WVDC 1 5 Megohms 125ºC at rated WVDC 51 pf to 51 pf 1 5 Megohms 25ºC at rated WVDC 1 4 Megohms 125ºC at rated WVDC Working Voltage (WVDC) See Capacitance Values table See Capacitance Values table Dielectric Withstanding Voltage (DWV) 25% of rated WVDC for 5 secs 25% of rated WVDC for 5 secs (for 5V rated 15% of rated voltage) Aging Effects None <3% per decade hour Piezoelectric Effects None None Capacitance Drift ± (.2% or.2 pf), whichever is greater Not Applicable ENVIRONMENTAL CHARACTERISTICS AVX SQLB will meet and exceed the requirements of EIA-198, MIL-PRF and MIL-PRF-123 Themal Shock Mil-STD-22, Method 17, Condition A Moisture Resistance Mil-STD-22, Method 16 Low Voltage Humidity Mil-STD-22, Method 13, condition A, with 1.5 VDC applied while subjected to an environment of 85ºC with 85% relative humidity for 24 hours Life Test Mil-STD-22, Method 18, for 2 hours at 125ºC Shock Mil-STD-22, Method 213, Condition J Vibration Mil-STD-22, Method 24, Condition B Immersion Mil-STD-22, Method 14, Condition B Salt Spray Mil-STD-22, Method 11, Condition B Solderability Mil-STD-22, Method 28 Terminal Strength Mil-STD-22, Method 211 Temperature Cycling Mil-STD-22, Method 12, Condition C Barometric Pressure Mil-STD-22, Method 15, Condition B Resistance to Solder Heat Mil-STD-22, Method 21, Condition C

208 Microwave MLC s AQ Series Available Capacitance/Size/WVDC/T.C. TABLE I: TC: M (+9±2PPM/ C) CASE SIZE 11, 12, 13 & 14 DIMENSIONS: inches (millimeters) Case Length Width Thickness Band Width Avail. Term ±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) 1 & ±.25 (1.4±.635).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) J 13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) 1 & ( ).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) J Case: AQ11, AQ12 Cap. pf Cap. Tol. WVDC.1 B 15.2 B 15.3 B,C 15.4 B,C 15.5 B, C, D 15.6 B, C, D 15.7 B, C, D 15.8 B, C, D 15.9 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 15 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 2 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 1 F, G, J, K, M 15 Cap. pf Cap. Tol. WVDC.1 B 5.2 B 5.3 B,C 5.4 B,C 5.5 B, C, D 5.6 B, C, D 5.7 B, C, D 5.8 B, C, D 5.9 B, C, D 5 1. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 5 2. B, C, D B, C, D B, C, D B, C, D 5 3. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 Case: AQ13, AQ14 Cap. pf Cap. Tol. WVDC 1 F, G, J, K, M 5 11 F, G, J, K, M 3 12 F, G, J, K, M 3 13 F, G, J, K, M 3 15 F, G, J, K, M 3 16 F, G, J, K, M 3 18 F, G, J, K, M 3 2 F, G, J, K, M 3 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 3 F, G, J, K, M 2 33 F, G, J, K, M 2 36 F, G, J, K, M 2 39 F, G, J, K, M 2 43 F, G, J, K, M 2 47 F, G, J, K, M 2 51 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 1 F, G, J, K, M

209 Microwave MLC s AQ Series Available Capacitance/Size/WVDC/T.C. TABLE II: TC: A (±3PPM/ C) CASE SIZE 11, 12, 13 & 14 DIMENSIONS: inches (millimeters) Case Length Width Thickness Band Width Avail. Term ±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) 1 & ±.25 (1.4±.635).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) J 13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) 1 & ( ).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) J Cap. pf Cap. Tol. WVDC.1 B 15.2 B 15.3 B,C 15.4 B,C 15.5 B, C, D 15.6 B, C, D 15.7 B, C, D 15.8 B, C, D 15.9 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 15 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 2 F, G, J, K, M F, G, J, K, M 15 Case: AQ11, AQ12 Cap. pf Cap. Tol. WVDC 24 F, G, J, K, M F, G, J, K, M 15 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 1 F, G, J, K, M F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 Cap. pf Cap. Tol. WVDC.1 B 5.2 B 5.3 B,C 5.4 B,C 5.5 B, C, D 5.6 B, C, D 5.7 B, C, D 5.8 B, C, D 5.9 B, C, D 5 1. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 5 2. B, C, D B, C, D B, C, D B, C, D 5 3. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 Case: AQ13, AQ14 Cap. pf Cap. Tol. WVDC 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 3 12 F, G, J, K, M 3 13 F, G, J, K, M 3 15 F, G, J, K, M 3 16 F, G, J, K, M 3 18 F, G, J, K, M 3 2 F, G, J, K, M 3 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 3 F, G, J, K, M 2 33 F, G, J, K, M 2 36 F, G, J, K, M 2 39 F, G, J, K, M 2 43 F, G, J, K, M 2 47 F, G, J, K, M 2 51 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 1 F, G, J, K, M F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 5 F, G, J, K, M 5 51 F, G, J, K, M 5 8 TABLE III: TC: C (±15%) CASE SIZE 12 & 14 Case: AQ12 Cap. pf Cap. Tol. WVDC 1 K, M, N 5 12 K, M, N 5 15 K, M, N 5 18 K, M, N 5 2 K, M, N 5 Cap. pf Cap. Tol. WVDC 22 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 47 K, M, N 5 Cap. pf Cap. Tol. WVDC 51 K, M, N 5 56 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 Cap. pf Cap. Tol. WVDC 5 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 12 K, M, N 5 Case: AQ14 Cap. pf Cap. Tol. WVDC 15 K, M, N 5 18 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 Cap. pf Cap. Tol. WVDC 47 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N

210 Microwave MLC s CDR Series MIL-PRF (RF/Microwave Chips) MILITARY DESIGNATION PER MIL-PRF W L T W 1J L T A 47J bw bw CDR11/12 CDR13/14 CROSS REFERENCE: AVX/MIL-PRF Per MIL-C AVX Length (L) Width (W) Thickness (T) Termination Band (bw) Style Max Min Max Min CDR11 CDR12 CDR13 CDR14 AQ11 AQ12 AQ13 AQ14.55±.15.55± (1.4±.381) (1.4±.381) (1.45) (.58) (.58) (.127).55±.25.55± (1.4±.635) (1.4±.381) (1.45) (.58) (.58) (.127).11±.2.11± (2.79±.58) (2.79±.58) (2.59) (.762) (.635) (.127) ± ( ) (2.79±.58) (2.59) (.762) (.635) (.127) HOW TO ORDER CDR12 BG 11 A K U S MIL Style CDR11, CDR12, CDR13, CDR14 Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Voltage Temperature Limits BG = +9±2 ppm/ C with and without rated voltage from -55 C to C BP = ±3ppm/ C with and without rated voltage from -55 C to +125 C PACKAGING Standard Packaging Quanity CDR11-12 = 1 pcs per waffle pack CDR13-14 = 8 pcs per waffle pack Rated Voltage Code A = 5V B = 1V C = 2V D = 3V E = 5V Capacitance Tolerance Code B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% Termination Finish (Military Designations) Code Failure Rate Level M = 1.% P =.1% R =.1% S =.1% M = Palladium silver N = Silver-nickel-gold S = Solder coated final with a minimum of 4 percent lead T = Silver U = Base metallization-barrier metal-solder coated (tin/lead alloy, with a minimum of 4 percent lead) W = Base metallization-barrier metal-tinned (tin or tin/lead alloy) Y = Base metallization-barrier metal-tin (1 percent) Z = Base metallization-barrier metal-tinned (tin/lead alloy, with a minimum of 4 percent lead) *See MIL-PRF Specification for more details TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). Sizes SQCA through SQCB, CDR11/12 through 13/14. 8mm carrier 7" reel:.4" thickness = 2 pcs.75" thickness = 2 pcs 13" reel:.75" thickness = 1, pcs Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. 29 8

211 Microwave MLC s CDR Series MIL-PRF (RF/Microwave Chips) TABLE I: STYLES CDR11 AND CDR12 CAPACITOR CHARACTERISTICS Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-R1AB--.1 B BG, BP 5 CDR1 -B-R2AB--.2 B BG, BP 5 CDR1 -B-R3A---.3 B, C BG, BP 5 CDR1 -B-R4A---.4 B, C BG, BP 5 CDR1 -B-R5A---.5 B, C, D BG, BP 5 CDR1 -B-R6A---.6 B, C, D BG, BP 5 CDR1 -B-R7A---.7 B, C, D BG, BP 5 CDR1 -B-R8A---.8 B, C, D BG, BP 5 CDR1 -B-R9A---.9 B, C, D BG, BP 5 CDR1 -B-1RA B, C, D BG, BP 5 CDR1 -B-1R1A B, C, D BG, BP 5 CDR1 -B-1R2A B, C, D BG, BP 5 CDR1 -B-1R3A B, C, D BG, BP 5 CDR1 -B-1R4A B, C, D BG, BP 5 CDR1 -B-1R5A B, C, D BG, BP 5 CDR1 -B-1R6A B, C, D BG, BP 5 CDR1 -B-1R7A B, C, D BG, BP 5 CDR1 -B-1R8A B, C, D BG, BP 5 CDR1 -B-1R9A B, C, D BG, BP 5 CDR1 -B-2RA B, C, D BG, BP 5 CDR1 -B-2R1A B, C, D BG, BP 5 CDR1 -B-2R2A B, C, D BG, BP 5 CDR1 -B-2R4A B, C, D BG, BP 5 CDR1 -B-2R7A B, C, D BG, BP 5 CDR1 -B-3RA B, C, D BG, BP 5 CDR1 -B-3R3A B, C, D BG, BP 5 CDR1 -B-3R6A B, C, D BG, BP 5 CDR1 -B-3R9A B, C, D BG, BP 5 CDR1 -B-4R3A B, C, D BG, BP 5 CDR1 -B-4R7A B, C, D BG, BP 5 CDR1 -B-5R1A B, C, D BG, BP 5 CDR1 -B-5R6A B, C, D BG, BP 5 CDR1 -B-6R2A B, C, D BG, BP 5 CDR1 -B-6R8A B, C, J, K, M BG, BP 5 CDR1 -B-7R5A B, C, J, K, M BG, BP 5 CDR1 -B-8R2A B, C, J, K, M BG, BP 5 CDR1 -B-9R1A B, C, J, K, M BG, BP 5 CDR1 -B-1A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-11A F, G, J, K, M BG, BP 5 CDR1 -B-12A F, G, J, K, M BG, BP 5 CDR1 -B-13A F, G, J, K, M BG, BP 5 CDR1 -B-15A F, G, J, K, M BG, BP 5 CDR1 -B-16A F, G, J, K, M BG, BP 5 CDR1 -B-18A F, G, J, K, M BG, BP 5 CDR1 -B-2A--- 2 F, G, J, K, M BG, BP 5 CDR1 -B-22A F, G, J, K, M BG, BP 5 CDR1 -B-24A F, G, J, K, M BG, BP 5 CDR1 -B-27A F, G, J, K, M BG, BP 5 Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-3A--- 3 F, G, J, K, M BG, BP 5 CDR1 -B-33A F, G, J, K, M BG, BP 5 CDR1 -B-36A F, G, J, K, M BG, BP 5 CDR1 -B-39A F, G, J, K, M BG, BP 5 CDR1 -B-43A F, G, J, K, M BG, BP 5 CDR1 -B-47A F, G, J, K, M BG, BP 5 CDR1 -B-51A F, G, J, K, M BG, BP 5 CDR1 -B-56A F, G, J, K, M BG, BP 5 CDR1 -B-62A F, G, J, K, M BG, BP 5 CDR1 -B-68A F, G, J, K, M BG, BP 5 CDR1 -B-75A F, G, J, K, M BG, BP 5 CDR1 -B-82A F, G, J, K, M BG, BP 5 CDR1 -B-91A F, G, J, K, M BG, BP 5 CDR1 -B-11A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-111A F, G, J, K, M BP 5 CDR1 -B-121A F, G, J, K, M BP 5 CDR1 -B-131A F, G, J, K, M BP 5 CDR1 -B-151A F, G, J, K, M BP 5 CDR1 -B-161A F, G, J, K, M BP 5 CDR1 -B-181A F, G, J, K, M BP 5 CDR1 -B-21A--- 2 F, G, J, K, M BP 5 CDR1 -B-221A F, G, J, K, M BP 5 CDR1 -B-241A F, G, J, K, M BP 5 CDR1 -B-271A F, G, J, K, M BP 5 CDR1 -B-31A--- 3 F, G, J, K, M BP 5 CDR1 -B-331A F, G, J, K, M BP 5 CDR1 -B-361A F, G, J, K, M BP 5 CDR1 -B-391A F, G, J, K, M BP 5 CDR1 -B-431A F, G, J, K, M BP 5 CDR1 -B-471A F, G, J, K, M BP 5 CDR1 -B-511A F, G, J, K, M BP 5 CDR1 -B-561A F, G, J, K, M BP 5 CDR1 -B-621A F, G, J, K, M BP 5 CDR1 -B-681A F, G, J, K, M BP 5 CDR1 -B-751A F, G, J, K, M BP 5 CDR1 -B-821A F, G, J, K, M BP 5 CDR1 -B-911A F, G, J, K, M BP 5 CDR1 -B-12A--- 1 F, G, J, K, M BP 5 1/Complete type designation will include additional symbols to indicate style, voltage-temperature limits, capacitance tolerance (where applicable), termination finish ( M or N for style CDR11, and S, U, W, Y or Z for style CDR12) and failure rate level. 8 21

212 Microwave MLC s CDR Series MIL-PRF (RF/Microwave Chips) TABLE II: STYLES CDR13 AND CDR14 CAPACITOR CHARACTERISTICS Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-R1*B--.1 B BG, BP 2/5 CDR1 -B-R2*B--.2 B BG, BP 2/5 CDR1 -B-R3*---.3 B, C BG, BP 2/5 CDR1 -B-R4*---.4 B, C BG, BP 2/5 CDR1 -B-R5*---.5 B, C, D BG, BP 2/5 CDR1 -B-R6*---.6 B, C, D BG, BP 2/5 CDR1 -B-R7*--.7 B, C, D BG, BP 2/5 CDR1 -B-R8*---.8 B, C, D BG, BP 2/5 CDR1 -B-R9*---.9 B, C, D BG, BP 2/5 CDR1 -B-1R* B, C, D BG, BP 2/5 CDR1 -B-1R1* B, C, D BG, BP 2/5 CDR1 -B-1R2* B, C, D BG, BP 2/5 CDR1 -B-1R3* B, C, D BG, BP 2/5 CDR1 -B-1R4* B, C, D BG, BP 2/5 CDR1 -B-1R5* B, C, D BG, BP 2/5 CDR1 -B-1R6* B, C, D BG, BP 2/5 CDR1 -B-1R7* B, C, D BG, BP 2/5 CDR1 -B-1R8* B, C, D BG, BP 2/5 CDR1 -B-1R9* B, C, D BG, BP 2/5 CDR1 -B-2R* B, C, D BG, BP 2/5 CDR1 -B-2R1* B, C, D BG, BP 2/5 CDR1 -B-2R2* B, C, D BG, BP 2/5 CDR1 -B-2R4* B, C, D BG, BP 2/5 CDR1 -B-2R7* B, C, D BG, BP 2/5 CDR1 -B-3R* B, C, D BG, BP 2/5 CDR1 -B-3R3* B, C, D BG, BP 2/5 CDR1 -B-3R6* B, C, D BG, BP 2/5 CDR1 -B-3R9* B, C, D BG, BP 2/5 CDR1 -B-4R3* B, C, D BG, BP 2/5 CDR1 -B-4R7* B, C, D BG, BP 2/5 CDR1 -B-5R1* B, C, D BG, BP 2/5 CDR1 -B-5R6* B, C, D BG, BP 2/5 CDR1 -B-6R2* B, C, D BG, BP 2/5 CDR1 -B-6R8* B, C, J, K, M BG, BP 2/5 CDR1 -B-7R5* B, C, J, K, M BG, BP 2/5 CDR1 -B-8R2* B, C, J, K, M BG, BP 2/5 CDR1 -B-9R1* B, C, J, K, M BG, BP 2/5 CDR1 -B-1*--- 1 F, G, J, K, M BG, BP 2/5 CDR1 -B-11* F, G, J, K, M BG, BP 2/5 CDR1 -B-12* F, G, J, K, M BG, BP 2/5 CDR1 -B-13* F, G, J, K, M BG, BP 2/5 CDR1 -B-15* F, G, J, K, M BG, BP 2/5 CDR1 -B-16* F, G, J, K, M BG, BP 2/5 CDR1 -B-18* F, G, J, K, M BG, BP 2/5 CDR1 -B-2*--- 2 F, G, J, K, M BG, BP 2/5 CDR1 -B-22* F, G, J, K, M BG, BP 2/5 CDR1 -B-24* F, G, J, K, M BG, BP 2/5 CDR1 -B-27* F, G, J, K, M BG, BP 2/5 CDR1 -B-3*--- 3 F, G, J, K, M BG, BP 2/5 CDR1 -B-33* F, G, J, K, M BG, BP 2/5 CDR1 -B-36* F, G, J, K, M BG, BP 2/5 CDR1 -B-39* F, G, J, K, M BG, BP 2/5 CDR1 -B-43* F, G, J, K, M BG, BP 2/5 CDR1 -B-47* F, G, J, K, M BG, BP 2/5 CDR1 -B-51* F, G, J, K, M BG, BP 2/5 Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-56* F, G, J, K, M BG, BP 2/5 CDR1 -B-62* F, G, J, K, M BG, BP 2/5 CDR1 -B-68* F, G, J, K, M BG, BP 2/5 CDR1 -B-75* F, G, J, K, M BG, BP 2/5 CDR1 -B-82* F, G, J, K, M BG, BP 2/5 CDR1 -B-91* F, G, J, K, M BG, BP 2/5 CDR1 -B-11*--- 1 F, G, J, K, M BG, BP 2/5 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B-221C F, G, J, K, M BG, BP 2 CDR1 -B-241C F, G, J, K, M BG, BP 2 CDR1 -B-271C F, G, J, K, M BG, BP 2 CDR1 -B-31C--- 3 F, G, J, K, M BG, BP 2 CDR1 -B-331C F, G, J, K, M BG, BP 2 CDR1 -B-361C F, G, J, K, M BG, BP 2 CDR1 -B-391C F, G, J, K, M BG, BP 2 CDR1 -B-431C F, G, J, K, M BG, BP 2 CDR1 -B-471C F, G, J, K, M BG, BP 2 CDR1 -B-511B F, G, J, K, M BG, BP 1 CDR1 -B-561B F, G, J, K, M BG, BP 1 CDR1 -B-621B F, G, J, K, M BG, BP 1 CDR1 -B-681A F, G, J, K, M BG, BP 5 CDR1 -B-751A F, G, J, K, M BG, BP 5 CDR1 -B-821A F, G, J, K, M BG, BP 5 CDR1 -B-911A F, G, J, K, M BG, BP 5 CDR1 -B-12A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-112A F, G, J, K, M BP 5 CDR1 -B-122A F, G, J, K, M BP 5 CDR1 -B-132A F, G, J, K, M BP 5 CDR1 -B-152A F, G, J, K, M BP 5 CDR1 -B-162A F, G, J, K, M BP 5 CDR1 -B-182A F, G, J, K, M BP 5 CDR1 -B-22A--- 2 F, G, J, K, M BP 5 CDR1 -B-222A F, G, J, K, M BP 5 CDR1 -B-242A F, G, J, K, M BP 5 CDR1 -B-272A F, G, J, K, M BP 5 CDR1 -B-32A--- 3 F, G, J, K, M BP 5 CDR1 -B-332A F, G, J, K, M BP 5 CDR1 -B-362A F, G, J, K, M BP 5 CDR1 -B-392A F, G, J, K, M BP 5 CDR1 -B-432A F, G, J, K, M BP 5 CDR1 -B-472A F, G, J, K, M BP 5 CDR1 -B-52A--- 5 F, G, J, K, M BP 5 CDR1 -B-512A F, G, J, K, M BP 5 1/Complete type designation will include additional symbols to indicate style, voltage-temperature limits, capacitance tolerance (where applicable), termination finish ( M or N for style CDR13, and S, U, W, Y or Z for style CDR14) and failure rate level. *C=2V; E=5V. C=2V; D=3V

213 Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 Q ESR (ohms) Frequency (MHz) AVX CORPORATION 1 Picofarad 1 Picofarad 1 Picofarad Frequency (MHz) AVX CORPORATION 3.3 Picofarad 1 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 Q ESR (ohms) Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 212

214 Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BG STANDARD - M 1 Q ESR (ohms) Frequency (MHz) AVX CORPORATION 1 Picofarad 1 Picofarad 47 Picofarad 33 Picofarad Frequency (MHz) AVX CORPORATION 1 Picofarad 15 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BG STANDARD - M TYPICAL ESR vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BG STANDARD - M 1 1 Q ESR (ohms) Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 8 213

215 Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 Q ESR (ohms) Frequency (MHz) Frequency (MHz) AVX CORPORATION 1 Picofarad 15 Picofarad 1 Picofarad 15 Picofarad AVX CORPORATION 47 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BP STANDARD - A TYPICAL ESR vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BP STANDARD - A 1 1 Q ESR (ohms) Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 214

216 Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 Q ESR (ohms) Frequency (MHz) Frequency (MHz) AVX CORPORATION 2 Picofarad 15 Picofarad 1 Picofarad 15 Picofarad AVX CORPORATION 47 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 Q ESR (ohms) Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 8 215

217 Microwave MLC s Performance Curves 1 TYPICAL RESONANT FREQUENCY vs. CAPACITANCE AVX AQ11-14 (CDR11-14) AQ13/14 AQ11/12 AQ11/12 Parallel Resonant Frequency Frequency (GHz) 1. AQ13/14 Series Resonant Frequency Capacitance (pf) 1 TYPICAL RESONANT FREQUENCY vs. CAPACITANCE AVX 63 Frequency (GHz) 1. Parallel Resonant Frequency Series Resonant Frequency Capacitance (pf) 8 216

218 Microwave MLC s Automatic Insertion Packaging TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). Sizes SQCA through SQCB, CDR11/12 through 13/14. 8mm carrier 7" reel:.4" thickness = 2 pcs.75" thickness = 2 pcs 13" reel:.75" thickness = 1, pcs REEL DIMENSIONS: millimeters (inches) U Series - 42/63/85/121 Size Chips 8mm carrier 7" reel: 42 = 1, pcs 63 & 85.4" thickness = 4 pcs 85..4" thickness & 121 = 2 pcs 13" reel:.75" thickness = 1, pcs Tape A B* C D* N W W 2 Size (1) Max. Min. Min. Min. 1 Max. W Min. 8mm (.311) +.6 ( ) (.567) 1.9 Max ± (.429) (12.992) (.59) (.512±.8) (.795) (1.969) 11.9 Min. 12mm (.469) ( ) (.724) 15.4 Max. (.67) EMBOSSED CARRIER CONFIGURATION 8 & 12 MM TAPE ONLY CONSTANT DIMENSIONS Tape D E P P2 T T1 G1 G2 Size Max. 8mm ±.1 4. ±.1 2. ± and +.4 ( ) (.69 ±.4) (.157 ±.4) (.79 ±.2) (.24) (.4) (.3) (.3) 12mm Max. Min. Min. VARIABLE DIMENSIONS Metric dimensions will govern. English measurements rounded and for reference only. (1) For tape sizes 16mm and 24mm (used with chip size 364) consult EIA RS-481 latest revision. See See Note 3 Note 4 Tape Size B1 D1 F P1 R T2 W ABK Max. Min. Min. See Note 6 See Note 5 See Note mm ±.5 4. ± Max (.179) (.39) (.138 ±.2) (.157 ±.4) (.984) (.98) ( ) See Note 1 12mm ±.5 4. ± Max 12. ±.3 (.323) (.59) (.217 ±.2) (.157 ±.4) (1.181) (.256) (.472 ±.12) See Note 1 NOTES: 1. A, B, and K are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A, B, and K) must be within.5 mm (.2) min. and.5 mm (.2) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 2 degrees (see sketches C & D). 2. Tape with components shall pass around radius R without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12mm embossed tape for reels with hub diameters approaching N min. (Table 4). 3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. 4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. 5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 6. B1 dimension is a reference dimension for tape feeder clearance only

219 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications PRODUCT OFFERING Hi-Q, high RF power, surface mount MLC capacitors from AVX Corporation are characterized with ultra-low ESR and dissipation factor at high frequencies. They are designed to handle high power and high voltage levels for applications in RF power amplifiers, inductive heating, high magnetic field environments (MRI coils), medical and industrial electronics. HOW TO ORDER HQCC A A 271 J A T 1A AVX Style HQCC HQCE HQLC HQLE Voltage 3V = 9 5V = 7 8V = U 1V = A 15V = S 25V = W 3V = H 36V = J 5V = K 72V = M Temperature Coefficient CG = A P9 = M Capacitance Code (2 significant digits + no. of zeros) Examples: 4.7 pf = 4R7 1 pf = 1 1 pf = 11 1, pf = 12 Capacitance Tolerance B =.1pf (<8.2pF) C = ±.25pF (<8.2pF) D = ±.5pF (<8.2pF) F = ±1% ( 1pF) G = ±2% J = ±5% K = ±1% M = ±2% Test Level A = Standard Termination* T = Plated Ni and Sn (RoHS Compliant) J = 5% Min Pb 7 = Plated Ni and Au A = Axial Ribbon M = Microstrip H = Cu/Sn (Non-Magnetic) 4 = Axial Ribbon (Non-Magnetic) 5 = Microstrip (Non-Magnetic) Packaging 1A = 7" Reel* 6A = Waffle Pack *HQCC & HQCE only DIMENSIONS MICROSTRIP L L T L W L W L L W T T AXIAL RIBBON L L T L t W L L W T 8 STYLE HQCC HQCE (L) Length ( ) ( ) (W) Width 6.35 ± ±.25 (.25 ±.15) (.38 ±.1) (T) Thickness 3.68 (.145) max. for Max. capacitance values 68pF 4.19 (.165) max. for 4.32 (.17) max. capacitance values > 68pF (t) Overlap 1.2 (.4) max. 1.2 (.4) max. Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. mm (inches) mm (inches) STYLE HQLC HQLE (L) Length 6.22 ± (.245 ±.25) ( ) (W) Width 6.35 ± ±.25 (.25 ±.15) (.38 ±.1) (T) Thickness 3.68 (.145) max. for Max. capacitance values 68pF 4.19 (.165) max. for 4.32 (.17) max. capacitance values 68pF (L L ) Lead 12.7 min Length (.5) (.75) (W L ) Lead 6.1 ± ±.25 Width (.24 ±.5) (.35 ±.1) (T L ) Lead.12 ± ±.13 Thickness (.4 ±.1) (.1 ±.5) Lead High Purity Silver Leads High Purity Silver Leads Material Leads are attached with Leads are attached with High Temperature Solder High Temperature Solder

220 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications MOUNTING DIMENSIONS B B A C D HQCC mm (inches) Mounting Layout Orientation Type A min. B min. C min. D min Normal (.28) (.5) (.2) (.3) Horizontal High Density (.26) (.3) (.2) (.26) Vertical Normal (.15) (.5) (.2) (.3) (<68pF) High Density (.13) (.3) (.2) (.26) Vertical Normal (.185) (.5) (.2) (.3) (>68pF) High Density (.165) (.3) (.2) (.26) HQCE Mounting Orientation Horizontal Vertical Layout Type mm (inches) A min. B min. C min. D min. Normal (.45) (.5) (.325) (.425) High Density (.385) (.3) (.325) (.385) Normal (.185) (.5) (.325) (.425) High Density (.165) (.3) (.325) (.385) DIELECTRIC PERFORMANCE CHARACTERISTICS Capacitance Range 1.pF to 2,7pF (25 C, 1. ±.2 Vrms at 1kHz, for 1 pf use 1MHz) Capacitance Tolerances ±.1pF, ±.25pF, ±.5pF, ±1%, ±2%, ±5%, ±1%, ±2% Dissipation Factor 25 C.1% Max (+25 C, 1. ±.2 Vrms at 1kHz, for 1 pf use 1MHz) Operating Temperature Range -55 C to +125 C Temperature Characteristic CG: ± 3 ppm/ C (-55 C to +125 C), P9: 9 ± 3 ppm/ C (-55 C to +125 C) Insulation Resistance 1K MΩ +25 C and 5VDC 1K MΩ +125 C and 5VDC Dielectric Strength 25% of WVDC for capacitors rated at 5 volts DC or less for 5 seconds. 15% of WVDC for capacitors rated at 125 volts DC or less for 5 seconds. 12% of WVDC for capacitors rated above 125 volts DC or less for 5 seconds

221 8 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications HQCC CAPACITANCE VALUES (A DIELECTRIC) Cap Cap Rated Code (pf) Tol. WVDC 1R 1. 1R R R R R7 2.7 B, C, D 25 3R R R R R8 6.8 HQCE CAPACITANCE VALUES (A DIELECTRIC) Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 1R 1. 1R R R R R7 2.7 C, D 3R R R R R R G, J, K, M HQCE CAPACITANCE VALUES (M DIELECTRIC) Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 1R 1. 1R R R R R7 2.7 B, C, D 3R R R R R R F, G, J, K, M Cap Cap Rated Code (pf) Tol. WVDC 8R2 8.2 B, C, D F, G, J K, M HQCC CAPACITANCE VALUES (M DIELECTRIC) Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 1R 1. 1R R R R R R R R R R 2. 2R R R4 2.4 B, C, D R R 3. 3R R R R R R R R R R R R1 9.1 Cap Cap Rated WVDC Code (pf) Tol. Standard Extended F, G, J K, M Cap Cap Rated WVDC Code (pf) Tol. Standard Extended G, J, K, M Cap Cap Rated WVDC Code (pf) Tol. Standard Extended F, G, J, K, M Cap Cap Rated Code (pf) Tol. WVDC F, G, J K, M Cap Cap Rated Code (pf) Tol. WVDC F, G, J K, M Cap Cap Rated WVDC Code (pf) Tol. Standard Extended F, G, J K, M Cap Cap Rated WVDC Code (pf) Tol. Standard Extended G, J, K, M NA Cap Cap Rated WVDC Code (pf) Tol. Standard Extended F, G, J, 12 1 K, M NA G, J K, M

222 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications HQCC PERFORMANCE CHARACTERISTICS (A DIELECTRIC) 1 ESR VS. CAPACITANCE HQCC 1 Q VS. CAPACITANCE HQCC ESR (Ohms) MHz 15 MHz 3 MHz Q MHz 15 MHz 1 (Typical) Capacitance (pf) 5 MHz (Typical) Capacitance (pf) 1 SERIES RESONANCE VS. CAPACITANCE HQCC 1 CURRENT RATING VS. CAPACITANCE HQCC The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 15 C/W. A power dissipation of 4W will result in a case temperature of 125 C. Frequency (MHz) 1 1 RMS Current (Amps) MHz 3 MHz 1 MHz 5 MHz (Typical) Capacitance (pf) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) Capacitance (pf) HQCC PERFORMANCE CHARACTERISTICS (M DIELECTRIC) 1 ESR VS. CAPACITANCE HQCC 1 Q VS. CAPACITANCE HQCC ESR (Ohms) MHz 15 MHz 3 MHz Q MHz 15 MHz 1 (Typical) Capacitance (pf) 5 MHz (Typical) Capacitance (pf)

223 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications 1 SERIES RESONANCE VS. CAPACITANCE HQCC 1 CURRENT RATING VS. CAPACITANCE HQCC The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 15 C/W. A power dissipation of 4W will result in a case temperature of 125 C. Frequency (MHz) 1 1 RMS Current (Amps) MHz 3 MHz 1 MHz 5 MHz (Typical) Capacitance (pf) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) Capacitance (pf) HQCE PERFORMANCE CHARACTERISTICS (A DIELECTRIC) 1 ESR VS. CAPACITANCE HQCE 1 Q VS. CAPACITANCE HQCE ESR (Ohms).1 3 MHz Q MHz (Typical) Capacitance (pf) (1. pf to 4 pf) (Typical) Capacitance (pf) (1. pf to 4 pf).1 ESR VS. CAPACITANCE HQCE 1 Q VS. CAPACITANCE HQCE ESR (Ohms).1 3 MHz Q 1 3 MHz (Typical) Capacitance (pf) (43 pf to 22 pf) (Typical) Capacitance (pf) (43 pf to 22 pf)

224 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications 1 SERIES RESONANCE VS. CAPACITANCE HQCE 1 CURRENT RATING VS. CAPACITANCE HQCE The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. Frequency (MHz) 1 1 RMS Current (Amps) MHz 1 MHz 2 MHz (Typical) Capacitance (pf) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) Capacitance (pf) (1. pf to 4 pf) 1 CURRENT RATING VS. CAPACITANCE HQCE The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. 1 CURRENT RATING VS. CAPACITANCE HQCE The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. RMS Current (Amps) 1 1 MHz 3 MHz 2 MHz RMS Current (Amps) MHz 1 MHz 2 MHz Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) Capacitance (pf) (43 pf to 22 pf) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) Capacitance (pf) (1. pf to 18 pf) HQCE PERFORMANCE CHARACTERISTICS (M DIELECTRIC) 1 ESR VS CAPACITANCE HQCE M Dielectric 1 Q VS CAPACITANCE HQCE M Dielectric ESR (Ohms).1 3 MHz Q MHz Capacitance (1. pf to 4 pf) (Typical) Capacitance (1. pf to 4 pf) (Typical)

225 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications 1 ESR VS CAPACITANCE HQCE M Dielectric 1 Q VS CAPACITANCE HQCE M Dielectric ESR (Ohms).1 3 MHz Q 1 3 MHz Capacitance (43 pf to 51 pf) (Typical) Capacitance (43 pf to 51 pf) (Typical) 1 SERIES RESONANCE VS CAPACITANCE HQCE M Dielectric 1 CURRENT RATING VS CAPACITANCE HQCE M Dielectric The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. Frequency (MHz) 1 1 RMS Current (Amps) MHz 1 MHz 2 MHz Capacitance (pf) (Typical) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) Capacitance (1. pf to 4 pf) RMS Current (Amps) 1 1 CURRENT RATING VS CAPACITANCE HQCE M Dielectric The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. 1 MHz 3 MHz 2 MHz Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) Capacitance (43 pf to 51 pf)

226 RF/Microwave CG (NP) Capacitors (RoHS) Ultra Low ESR, CU Series, CG (NP) Chip Capacitors GENERAL INFORMATION CU Series capacitors are CG (NP) chip capacitors specially designed for Ultra low ESR for applications in the communications market. Sizes available are EIA chip sizes 15 and 21. LEAD-FREE COMPATIBLE COMPONENT DIMENSIONS: A A B C B C D E D mm (inches) Size L W T g A (Length) (Width) (Max. Thickness) (min.) (Termination Min./Max.) 42.4±.2.2± /.14 (15) (.16±.8).8±.8) (.9) (.5) (.3/.6) 63.6±.3.3± /.2 (21) (.24±.1) (.12±.1) (.13) (.6) (.4/.8) HOW TO ORDER CU J A T 2 A Case Size CU1 = 15 CU1 = 21 Voltage Code 3 = 25V Y = 16V Dielectric 1 = ±3ppm CG (NP) Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Capacitance Tolerance Code A = ±.5pF B = ±.1pF C = ±.25pF D = ±.5pF G = ±2% J = ±5% Failure Rate Code A = Not Applicable Termination T = Plated Ni and Sn Packaging Code 2 = 7" Reel 4 = 13" Reel U = 7" Reel 4mm TR (15) Special A = Standard ELECTRICAL CHARACTERISTICS Capacitance Value Range: Size 15.2 to 24pF Size 21.2 to 24pF Temperature Coefficient of Capacitance (TC): ±3 ppm/ C (-55 to +125 C) Insulation Resistance (IR): 1 12 Ω 25 C and rated WVDC 1 11 Ω 125 C and rated WVDC Working Voltage (WVDC): Size Working Voltage 15-16V, 25V (.2pF-1pF), 16V (1pF-24pF) WVDC