BIPOLAR ANALOG INTEGRATED CIRCUIT

Transcription

1 DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT SILICON MMIC 2. GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER DESCRIPTION The is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC s 3 GHz fmax. UHS (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conventional µpc86tb, but operates at higher frequency, higher gain and lower distortion. Consequently this IC is suitable for mobile communications. FEATURES Recommended operating frequency : frfout =.8 to 2. GHz Higher IP3 : CG = 9. db TYP., OIP3 = +7. dbm frfout =.9 GHz High-density surface mounting : 6-pin super minimold package Supply voltage : VCC = 2.7 to 3.3 V APPLICATIONS PCS9M 2.4 GHz band transmitter/receiver system (wireless LAN etc.) ORDERING INFORMATION Part Number Package Marking Supplying Form -E3 6-pin super minimold C3A Embossed tape 8 mm wide. Pin, 2, 3 face the tape perforation side. Qty 3 kpcs/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: ) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P4729EJ2VDS (2nd edition) Date Published September 2 N CP(K) Printed in Japan The mark shows major revised points. 2

2 PIN CONNECTIONS (Top View) (Bottom View) Pin No. Pin Name IFinput 3 2 C3A GND 3 LOinput 4 PS VCC 6 RFoutput SERIES PRODUCTS (TA = +2 C, VCC = VRFout = 3. V, ZS = ZL = Ω) Part Number ICC (ma) frfout CG (db) GHz 2.4 GHz 9.8 to µpc86tb 9.4 to µpc89tb.4 to µpc863tb 6..8 to Part Number PO(sat) (dbm) OIP3 GHz 2.4 GHz 2.4 GHz µpc86tb µpc89tb µpc863tb Note frfout =.83 µpc863tb Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. To know the associated product, please refer to each latest data sheet. BLOCK DIAGRAM (FOR THE ) (Top View) LOinput PS GND VCC IFinput RFoutput 2 Data Sheet P4729EJ2VDS

3 SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM) Wireless Transceiver Low Noise Tr. RX DEMOD. I Q SW VCO N PLL PLL I TX PA Phase shifter 9 Q To know the associated products, please refer to each latest data sheet. Data Sheet P4729EJ2VDS 3

4 CONTENTS. PIN EXPLANATION ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY TEST CIRCUIT TEST CIRCUIT (frfout = 9 MHz) TEST CIRCUIT 2 (frfout =.9 GHz) TEST CIRCUIT 3 (frfout = 2.4 GHz) TYPICAL CHARACTERISTICS PACKAGE DIMENSIONS NOTE ON CORRECT USE RECOMMENDED SOLDERING CONDITIONS Data Sheet P4729EJ2VDS

5 . PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage Function and Explanation Equivalent Circuit (V) Note IFinput.4 This pin is IF input to double balanced mixer (DBM). The input is designed as high impedance. The circuit contributes to suppress spurious signal. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. For above reason, double balanced mixer is adopted. 2 GND GND GND pin. Ground pattern on the board should be formed as wide as possible. Track Length should be kept as short as possible to minimize ground impedance. 3 LOinput 2.3 Local input pin. Recommendable input level is to dbm. VCC 2.7 to 3.3 Supply voltage pin RFoutput Same bias as VCC through external inductor This pin is RF output from DBM. This pin is designed as open collector. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. 4 PS VCC/GND Power save control pin. Bias controls operation as follows. VCC VCC Pin bias Control Operation 4 GND Power Save GND 2 Note Each pin voltage is measured with VCC = VPS = VRFout = 3. V. Data Sheet P4729EJ2VDS

6 2. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Rating Unit Supply Voltage VCC TA = +2 C 3.6 V PS pin Input Voltage VPS TA = +2 C 3.6 V Power Dissipation of Package PD Mounted on double-side copperclad.6 mm epoxy glass PWB (TA = +8 C) 27 mw Operating Ambient Temperature TA 4 to +8 C Storage Temperature Tstg to + C Input Power Pin + dbm 3. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Supply Voltage VCC The same voltage should be applied to pin and V Operating Ambient Temperature TA C Local Input Level PLOin ZS = Ω (without matching) dbm RF Output Frequency frfout With external matching circuit.8 2. GHz IF Input Frequency fifin 4 MHz 4. ELECTRICAL CHARACTERISTICS (TA = +2 C, VCC = VRFout = 3. V, fifin = 24 MHz, PLOin = dbm, and VPS 2.7 V unless otherwise specified) Parameter Symbol Test Conditions Note MIN. TYP. MAX. Unit Circuit Current ICC No Signal ma Circuit Current In Power Save Mode Conversion Gain ICC(PS) VPS = V 2 µa CG frfout =.9 GHz, PIFin = 3 dbm db CG2 frfout =.9 GHz, PIFin = 3 dbm. 8.. db CG3 frfout = 2.4 GHz, PIFin = 3 dbm 8.. db Saturated RF Output Power PO(sat) frfout =.9 GHz, PIFin = dbm dbm PO(sat)2 frfout =.9 GHz, PIFin = dbm 3. dbm PO(sat)3 frfout = 2.4 GHz, PIFin = dbm 4. dbm Note frfout < frfout =.9 GHz floin < frfout =.9 GHz/2.4 GHz 6 Data Sheet P4729EJ2VDS

7 . OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +2 C, VCC = VRFout = 3. V, PLOin = dbm, and VPS 2.7 V unless otherwise specified) Parameter Symbol Test Conditions Note Data Unit Output Third-Order Distortion Intercept Point Input Third-Order Distortion Intercept Point SSB Noise Figure OIP3 frfout =.9 GHz +7. dbm OIP32 frfout =.9 GHz fifin = 24 MHz fifin2 = 24 MHz +6. dbm OIP33 frfout = 2.4 GHz +4. dbm IIP3 frfout =.9 GHz 2. dbm IIP32 frfout =.9 GHz fifin = 24 MHz fifin2 = 24 MHz 2. dbm IIP33 frfout = 2.4 GHz 4. dbm SSB NF frfout =.9 GHz, fifin = 24 MHz 9. db SSB NF2 frfout =.9 GHz, fifin = 24 MHz.4 db SSB NF3 frfout = 2.4 GHz, fifin = 24 MHz.6 db Power Save Response Time Rise time TPS(rise) VPS: GND VCC µs Fall time TPS(fall) VPS: VCC GND. µs Note frfout < frfout =.9 GHz floin < frfout =.9 GHz/2.4 GHz Data Sheet P4729EJ2VDS 7

8 C8 6. TEST CIRCUIT 6. TEST CIRCUIT (frfout = 9 MHz) Strip Line Spectrum Analyzer Ω pf pf C3 C8 L nh 6 RFoutput IFinput pf C Signal Generator Ω VCC pf C C7 C6 C4 pf 4 VCC PS GND LOinput 2 3 pf C2 Signal Generator Ω µ F 68 pf µ F EXAMPLE OF TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD LOinput C2 C4 PS bias PS GND VCC C C7 C6 L Voltage Supply IFinput C C3 RFoutput COMPONENT LIST Form Symbol Value Chip capacitor C, C2, C3 pf C4 pf C, C6 µf C7 C8 68 pf pf Chip inductor L nh Note Note nh: LL68-FHN (TOKO Co., Ltd.) ( ) mm polyimide board, double-sided copper clad ( 2) Ground pattern on rear of the board ( 3) Solder plated patterns ( 4) : Through holes 8 Data Sheet P4729EJ2VDS

9 6.2 TEST CIRCUIT 2 (frfout =.9 GHz) Strip Line Spectrum Analyzer Ω pf 2.7 pf C3 pf C8 VCC C C7 C6 C4 L 47 nh pf 6 4 RFoutput IFinput GND VCC PS LOinput 2 3 pf C pf C2 Signal Generator Ω Signal Generator Ω µ F 3 pf µ F EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD LOinput C2 C4 PS bias PS GND L VCC C C7 C6 Voltage Supply IFinput C C3 C8 RFoutput COMPONENT LIST Form Symbol Value Chip capacitor C, C2, C3 pf C4 pf C, C6 µf C7 C8 3 pf 2.7 pf Chip inductor L 47 nh Note Note 47 nh: LL22-FR47 (TOKO Co., Ltd.) ( ) mm polyimide board, double-sided copper clad ( 2) Ground pattern on rear of the board ( 3) Solder plated patterns ( 4) : Through holes Data Sheet P4729EJ2VDS 9

10 6.3 TEST CIRCUIT 3 (frfout = 2.4 GHz) Strip Line Spectrum Analyzer Ω pf C3 pf.7 pf C8 VCC C C7 C6 C4 L 47 nh pf 6 RFoutput IFinput 4 VCC PS GND LOinput 2 3 pf C pf C2 Signal Generator Ω Signal Generator Ω µ F pf µ F EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD LOinput C2 C4 PS bias PS GND L VCC C C7 C6 Voltage Supply IFinput C C8 C3 RFoutput COMPONENT LIST Form Symbol Value Chip capacitor C, C2, C3 pf C4 pf C, C6 µf C7 C8 pf.7 pf Chip inductor L 47 nh Note Note 47 nh: LL22-FR47 (TOKO Co., Ltd.) ( ) mm polyimide board, double-sided copper clad ( 2) Ground pattern on rear of the board ( 3) Solder plated patterns ( 4) : Through holes Data Sheet P4729EJ2VDS

11 Caution The test circuits and board pattern on data sheet are for performance evaluation use only (They are not recommended circuits). In the case of actual design-in, matching circuit should be determined using S-parameter of desired frequency in accordance to actual mounting pattern. Data Sheet P4729EJ2VDS

12 7. TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +2 C, VCC = VRFout) Circuit Current ICC (ma) CIRCUIT CURRENT vs. SUPPLY VOLTAGE TA = +8 C TA = +2 C TA = 4 C no signal Circuit Current ICC (ma) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE VCC = 2.7 V VCC = 3.3 V VCC = 3. V no signal VCC = VPS VCC = VPS Supply Voltage VCC (V) Operating Ambient Temperature TA ( C) CIRCUIT CURRENT vs. PS PIN INPUT VOLTAGE 2 Circuit Current ICC (ma) VCC = 3. V PS Pin Input Voltage VPS (V) PS PIN CONTROL RESPONSE TIME REF LVL = dbm ATT = db db/div (Vertical axis) CENTER =.9 GHz SPAN = Hz RBW = 3 MHz VBW = 3 MHz SWP = µ sec µ sec/div (Horizontal axis) 2 Data Sheet P4729EJ2VDS

13 S-PARAMETERS FOR EACH PORT (VCC = VPS = VRFout = 3. V) (The parameters are monitored at DUT pins) LO port S Z REF. Units 2. munits/ 2.62 Ω 9.48 Ω hp MARKER. GHz MARKER 2.6 GHz MARKER 3 2. GHz RF port (without matching) S22 Z REF. Units 2. munits/ 7. Ω Ω hp MARKER 9. MHz MARKER 2.9 GHz MARKER 3 2. GHz START.4 GHz STOP 2. GHz START STOP.4 GHz 2. GHz IF port S Z REF. Units 2. munits/ Ω 6.34 Ω hp MARKER 24. MHz START STOP. GHz. GHz Data Sheet P4729EJ2VDS 3

14 S-PARAMETERS FOR MATCHED RF OUTPUT (VCC = VPS = VRFout = 3. V) ON EVALUATION BOARD (S22 data are monitored at RF connector on board) 9 MHz (matched in test circuit ) S22 Z REF. Units 2. munits/.6 Ω Ω hp C MARKER 9. MHz D.9 GHz (matched in test circuit 2) S22 Z REF. Units 2. munits/ Ω Ω hp C MARKER.9 GHz D START.4 GHz STOP.4 GHz START STOP.4 GHz 2.4 GHz S22 log MAG. REF. db. db/ db hp C MARKER 9. MHz D C D S22 log MAG. REF. db. db/ 8.96 db hp MARKER.9 GHz START STOP.4 GHz.4 GHz START STOP.4 GHz 2.4 GHz 4 Data Sheet P4729EJ2VDS

15 S-PARAMETERS FOR MATCHED RF OUTPUT (VCC = VPS = VRFout = 3. V) ON EVALUATION BOARD (S22 data are monitored at RF connector on board) 2.4 GHz (matched in test circuit 3) S22 Z REF. Units 2. munits/ Ω 7.3 Ω hp C MARKER 2.4 GHz D START.9 GHz STOP 2.9 GHz C D S22 log MAG. REF. db. db/ db hp MARKER 2.4 GHz START.9 GHz STOP 2.9 GHz Data Sheet P4729EJ2VDS

16 Conversion Gain CG (db) CONVERSION GAIN vs. LOCAL INPUT LEVEL VCC = 3.3 V VCC = 3. V Local Input Level PLOin (dbm) VCC = 2.7 V frfout = 9 MHz floin = 4 MHz PIFin = 3 dbm VCC = VPS RF Output Level PRFout (dbm) 2 RF OUTPUT LEVEL vs. IF INPUT LEVEL VCC = 3.3 V VCC = 3. V VCC = 2.7 V frfout = 9 MHz floin = 4 MHz PLOin = dbm VCC = VPS CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL Conversion Gain CG (db) TA = 4 C TA = +8 C TA = +2 C frfout = 9 MHz floin = 4 MHz PIFin = 3 dbm VCC = VPS = 3. V Local Input Level PLOin (dbm) RF Output Level PRFout (dbm) TA = 4 C TA = +8 C frfout TA = +2 C = 9 MHz floin = 4 MHz 2 PLOin = dbm VCC = VPS = 3. V Data Sheet P4729EJ2VDS

17 Conversion Gain CG (db) CONVERSION GAIN vs. LOCAL INPUT LEVEL VCC = 3.3 V VCC = 3. V VCC = 2.7 V frfout =.9 GHz floin = 66 MHz PIFin = 3 dbm RF Output Level PRFout (dbm) 2 RF OUTPUT LEVEL vs. IF INPUT LEVEL VCC = 3.3 V VCC = 3. V VCC = 2.7 V frfout =.9 GHz floin = 66 MHz PLOin = dbm VCC = VPS VCC = VPS Local Input Level PLOin (dbm) CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL Conversion Gain CG (db) TA = 4 C TA = +2 C TA = +8 C frfout =.9 GHz floin = 66 MHz PIFin = 3 dbm VCC = VPS = 3. V RF Output Level PRFout (dbm) TA = 4 C TA = +2 C frfout =.9 GHz TA = +8 C floin = 66 MHz 2 PLOin = dbm VCC = VPS = 3. V Local Input Level PLOin (dbm) Data Sheet P4729EJ2VDS 7

18 Conversion Gain CG (db) CONVERSION GAIN vs. LOCAL INPUT LEVEL VCC = 3. V VCC = 2.7 V Local Input Level PLOin (dbm) VCC = 3.3 V frfout = 2.4 GHz floin = 2 6 MHz PIFin = 3 dbm VCC = VPS RF Output Level PRFout (dbm) 2 RF OUTPUT LEVEL vs. IF INPUT LEVEL VCC = 3. V VCC = 2.7 V VCC = 3.3 V frfout = 2.4 GHz floin = 2 6 MHz PLOin = dbm VCC = VPS CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL Conversion Gain CG (db) TA = 4 C TA = +2 C TA = +8 C frfout = 2.4 GHz TA = +8 C frfout = 2.4 GHz floin = 2 6 MHz floin = 2 6 MHz 2 PIFin = 3 dbm PLOin = dbm VCC = VPS = 3. V VCC = VPS = 3. V Local Input Level PLOin (dbm) RF Output Level PRFout (dbm) TA = 4 C TA = +2 C 8 Data Sheet P4729EJ2VDS

19 TA = +2 C VCC = VPS = 2.7 V frfout = 9 MHz 4 6 fifin = 24 MHz fifin2 = 24 MHz 6 7 floin = 4 MHz 7 PLOin = dbm TA = 4 C VCC = VPS = 3. V frfout = 9 MHz fifin = 24 MHz fifin2 = 24 MHz floin = 4 MHz PLOin = dbm TA = +2 C 4 TA = +2 C VCC = VPS = 3. V VCC = VPS = 3. V frfout = 9 MHz frfout = 9 MHz 6 fifin = 24 MHz 6 fifin = 24 MHz fifin2 = 24 MHz fifin2 = 24 MHz 7 floin = 4 MHz 7 floin = 4 MHz PLOin = dbm PLOin = dbm TA = +2 C VCC = VPS = 3.3 V frfout = 9 MHz 4 6 fifin = 24 MHz fifin2 = 24 MHz 6 7 floin = 4 MHz 7 PLOin = dbm TA = +8 C VCC = VPS = 3. V frfout = 9 MHz fifin = 24 MHz fifin2 = 24 MHz floin = 4 MHz PLOin = dbm Data Sheet P4729EJ2VDS 9

20 TA = +2 C VCC = VPS = 2.7 V frfout =.9 GHz 4 6 fifin = 24 MHz fifin2 = 24 MHz 6 7 floin = 66 MHz 7 PLOin = dbm TA = 4 C VCC = VPS = 3. V frfout =.9 GHz fifin = 24 MHz fifin2 = 24 MHz floin = 66 MHz PLOin = dbm TA = +2 C 4 TA = +2 C VCC = VPS = 3. V VCC = VPS = 3. V frfout =.9 GHz frfout =.9 GHz 6 fifin = 24 MHz 6 fifin = 24 MHz fifin2 = 24 MHz fifin2 = 24 MHz 7 floin = 66 MHz 7 floin = 66 MHz PLOin = dbm PLOin = dbm TA = +2 C VCC = VPS = 3.3 V frfout =.9 GHz 4 6 fifin = 24 MHz fifin2 = 24 MHz 6 7 floin = 66 MHz 7 PLOin = dbm TA = +8 C VCC = VPS = 3. V frfout =.9 GHz fifin = 24 MHz fifin2 = 24 MHz floin = 66 MHz PLOin = dbm 2 Data Sheet P4729EJ2VDS

21 TA = +2 C VCC = VPS = 2.7 V frfout = 2.4 GHz 4 6 fifin = 24 MHz fifin2 = 24 MHz 6 7 floin = 2 6 MHz 7 PLOin = dbm TA = 4 C VCC = VPS = 3. V frfout = 2.4 GHz fifin = 24 MHz fifin2 = 24 MHz floin = 2 6 MHz PLOin = dbm TA = +2 C 4 TA = +2 C VCC = VPS = 3. V VCC = VPS = 3. V frfout = 2.4 GHz frfout = 2.4 GHz 6 fifin = 24 MHz 6 fifin = 24 MHz fifin2 = 24 MHz fifin2 = 24 MHz 7 floin = 2 6 MHz 7 floin = 2 6 MHz PLOin = dbm PLOin = dbm TA = +2 C VCC = VPS = 3.3 V frfout = 2.4 GHz 4 6 fifin = 24 MHz fifin2 = 24 MHz 6 7 floin = 2 6 MHz 7 PLOin = dbm TA = +8 C VCC = VPS = 3. V frfout = 2.4 GHz fifin = 24 MHz fifin2 = 24 MHz floin = 2 6 MHz PLOin = dbm Data Sheet P4729EJ2VDS 2

22 LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY Local Leakage at IF Pin LOif (dbm) frfout = 9 MHz 4 frfout =.9 GHz PLOin = dbm PLOin = dbm VCC = VPS = 3. V VCC = VPS = 3. V Local Input Frequency floin (GHz) Local Leakage at IF Pin LOif (dbm) 2 3 Local Input Frequency floin (GHz) LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY Local Leakage at RF Pin LOrf (dbm) frfout = 9 MHz 4 frfout =.9 GHz PLOin = dbm PLOin = dbm VCC = VPS = 3. V VCC = VPS = 3. V Local Input Frequency floin (GHz) Local Leakage at RF Pin LOrf (dbm) 2 3 Local Input Frequency floin (GHz) IF Leakage at RF Pin IFrf (dbm) IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY frfout = 9 MHz 9 floin = 4 MHz 4 PLOin = dbm VCC = VPS = 3. V IF Input Frequency fifin (MHz) IF Leakage at RF Pin IFrf (dbm) 2 3 IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY frfout =.9 GHz floin = 66 MHz PLOin = dbm VCC = VPS = 3. V IF Input Frequency fifin (MHz) 22 Data Sheet P4729EJ2VDS

23 LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY Local Leakage at IF Pin LOif (dbm) frfout = 2.4 GHz PLOin = dbm VCC = VPS = 3. V Local Leakage at RF Pin LOrf (dbm) frfout = 2.4 GHz PLOin = dbm VCC = VPS = 3. V Local Input Frequency floin (GHz) Local Input Frequency floin (GHz) IF Leakage at RF Pin IFrf (dbm) frfout = 2.4 GHz floin = 2 6 MHz PLOin = dbm VCC = VPS = 3. V IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY IF Input Frequency fifin (MHz) Remark The graphs indicate nominal characteristics. Data Sheet P4729EJ2VDS 23

24 8. PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.±..2±..9±..7 to ± MIN. 24 Data Sheet P4729EJ2VDS

25 9. NOTE ON CORRECT USE () Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) Connect a bypass capacitor (example: pf) to the VCC pin. (4) Connect a matching circuit to the RF output pin. () The DC cut capacitor must be each attached to the input and output pins.. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow VPS Wave Soldering Package peak temperature: 23 C or below Time: 3 seconds or less (at 2 C) Count: 3, Exposure limit: None Note Package peak temperature: 2 C or below Time: 4 seconds or less (at 2 C) Count: 3, Exposure limit: None Note Soldering bath temperature: 26 C or below Time: seconds or less Count:, Exposure limit: None Note IR3--3 VP--3 WS6-- Partial Heating Pin temperature: 3 C Time: 3 seconds or less (per side of device) Exposure limit: None Note Note After opening the dry pack, keep it in a place below 2 C and 6% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C3E). Data Sheet P4729EJ2VDS 2

26 [MEMO] 26 Data Sheet P4729EJ2VDS

27 [MEMO] Data Sheet P4729EJ2VDS 27

28 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES The information in this document is current as of September, 2. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) () "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E. 4