AVX RF Microwave/Thin-Film Products A KYOCERA GROUP COMPANY

Transcription

1 AVX RF Microwave/Thin-Film Products A KYOCERA GROUP COMPANY

2 AVX Microwave Ask The World Of Us As one of the world s broadest line multilayer ceramic chip capacitor suppliers, and a major Thin Film RF/Microwave capacitor, inductor, directional coupler and low pass filter and microwave ceramic capacitor manufacturer, it is our mission to provide First In Class Technology, Quality and Service, by establishing progressive design, manufacturing and continuous improvement programs driving toward a single goal: TOTAL CUSTOMER SATISFACTION 1

3 RF/Microwave Products Table of Contents Company Profile Thin-Film RF/Microwave Technology Accu-F / Accu-P Thin-Film Technology Thin-Film Chip Capacitors Thin-Film Chip Capacitors for RF Signal and Power Applications Accu-F Accu-P Typical Electrical Tables Accu-P Typical Electrical Tables Accu-P Typical Electrical Tables Accu-F / Accu-P Typical Electrical Tables Accu-F / Accu-P Typical Electrical Tables Accu-P High Frequency Characteristics Environmental / Mechanical Characteristics Performance Characteristics RF Power Applications Application Notes Automatic Insertion Packaging Thin-Film RF/Microwave Inductor Technology Accu-L L63/L SMD High-Q RF Inductor Accu-L Environmental Characteristics Application Notes Thin-Film RF/Microwave Directional Couplers CP42/CP63/CP85/DB85 3dB CP42 High Directivity LGA Termination CP63 High Directivity LGA Termination CP42 and CP63 Test Jigs CP63 SMD Type CP63 SMD Type High Directivity CP85 Type CP85 and CP63 Test Jigs DB85 3dB 9 Couplers DB85 3dB 9 Test Jigs Thin-Film RF/Microwave Harmonic Low Pass Filter LP LP85 Test Jigs Thin-Film RF/Microwave Products Designer Kits RF/Microwave Multilayer Capacitors (MLC) Porcelain Capacitors (+9±2ppm/ C) AQ6 (.63" x.32") - Cap. Range:.1 to 12pF AQ11; AQ12 (.55" x.55") - Cap. Range:.1 to 1pF AQ13; AQ14 (.11" x.11") - Cap. Range:.1 to 1pF Hi-Q NP Capacitors (±3ppm/ C) AQ6 (.63" x.32") - Cap. Range:.1 to 12pF AQ11; AQ12 (.55" x.55") - Cap. Range:.1 to 1pF AQ13; AQ14 (.11" x.11") - Cap. Range:.1 to 51pF Hi-K RF Capacitors (±15%) AQ12 (.55" x.55") - Cap. Range:.1 to.1µf AQ14 (.11" x.11") - Cap. Range:.5 to.1µf MIL-PRF BG Voltage Temperature Limits (+9±2ppm/ C) CDR11BG; CDR12BG (.55" x.55") - Failure Rate Level: M, P, R, S CDR13BG; CDR14BG (.11" x.11") - Failure Rate Level: M, P, R, S MIL-PRF BP Voltage Temperature Limits (±3ppm/ C) CDR11BP; CDR12BP (.55" x.55") - Failure Rate Level: M, P, R, S CDR13BP; CDR14BP (.11" x.11") - Failure Rate Level: M, P, R, S Performance Curves Automatic Insertion Packaging Hi-Q High RF Power MLC Surface Mount Capacitors RF/Microwave CG (NP) Capacitors Ultra Low ESR U Series, CG (NP) 42 (.4" x.2"), 63 (.6" x.3"), 85 (.8" x.5"), 121 (.125" x.1") RF/Microwave AQ 12 & 14 and U Series Designer Kits Introduction to Microwave Capacitors

4 RF/Microwave Products Table of Contents Company Profile Thin-Film RF/Microwave Technology Accu-F / Accu-P Thin-Film RF/Microwave Technology Accu-L L63, L Thin-Film RF/Microwave Directional Couplers CP42/CP63/CP85/DB85 3dB Thin-Film RF/Microwave Harmonic Low Pass Filter LP Thin-Film RF/Microwave Products Designer Kits RF/Microwave Multilayer Capacitors (MLC) RF/Microwave CG (NP) Capacitors RF/Microwave AQ 12 & 14 and U Series Designer Kits Introduction to Microwave Capacitors

5 RF/Microwave Products Company Profile AVX Corporation is a leading manufacturer of multilayer ceramic, thin film, tantalum, and glass capacitors, as well as other passive electronic components. These products are used in virtually every variety of electronic system today, including data processing, telecommunications, consumer/automotive electronics, military and aerospace systems, and instrumentation and process controls. We continually strive to be the leader in all component segments we supply. RF/Microwave capacitors is a thrust business for us. AVX offers a broad line of RF/Microwave Chip Capacitors in a wide range of sizes, styles, and ratings. The Thin-Film Products range illustrated in this catalog represents the state-of-the-art in RF Capacitors, Inductors, Directional Couplers and Low Pass Filters. The thin-film technology provides components that exhibit excellent batch-to-batch repeatability of electrical parameters at RF frequencies. The Accu-F and Accu-P series of capacitors are available in ultratight tolerances (±.2pF) as well as non-standard capacitance values. The Accu-L series of inductors are ideally suited for applications requiring an extremely high Q and high current capability. The CP42/CP63/CP85 series of Directional Couplers cover the frequency range of 8 MHz to 6 GHz. They feature low insertion loss, high directivity and highly accurate coupling factors. The LP85 series of Low Pass Filters provide a rugged component in a small 85 size package with excellent high frequency performance. Another major series of microwave capacitors consists of both multilayer porcelain and ceramic capacitors for frequencies from 1 MHz to 4.2 GHz (AQ11-14 Series). Three sizes of specially designed ultra-low ESR CG (NP) capacitors are covered for RF applications ( U Series). Ask the world of us. Call (843) Or visit our website 4

6 1 Thin-Film Technology Accu-F / Accu-P Thin-Film RF/Microwave Capacitors 5

7 1 Accu-F / Accu-P Thin-Film Technology THE IDEAL CAPACITOR The non-ideal characteristics of a real capacitor can be ignored at low frequencies. Physical size imparts inductance to the capacitor and dielectric and metal electrodes result in resistive losses, but these often are of negligible effect on the circuit. At the very high frequencies of radio communication (>1MHz) and satellite systems (>1GHz), these effects become important. Recognizing that a real capacitor will exhibit inductive and resistive impedances in addition to capacitance, the ideal capacitor for these high frequencies is an ultra low loss component which can be fully characterized in all parameters with total repeatability from unit to unit. Until recently, most high frequency/microwave capacitors were based on fired-ceramic (porcelain) technology. Layers of ceramic dielectric material and metal alloy electrode paste are interleaved and then sintered in a high temperature oven. This technology exhibits component variability in dielectric quality (losses, dielectric constant and insulation resistance), variability in electrode conductivity and variability in physical size (affecting inductance). An alternate thin-film technology has been developed which virtually eliminates these variances. It is this technology which has been fully incorporated into Accu-F and Accu-P to provide high frequency capacitors exhibiting truly ideal characteristics. The main features of Accu-F and Accu-P may be summarized as follows: High purity of electrodes for very low and repeatable ESR. Highly pure, low-k dielectric for high breakdown field, high insulation resistance and low losses to frequencies above 4GHz. Very tight dimensional control for uniform inductance, unit to unit. Very tight capacitance tolerances for high frequency signal applications. This accuracy sets apart these Thin-Film capacitors from ceramic capacitors so that the term Accu has been employed as the designation for this series of devices, an abbreviation for accurate. THIN-FILM TECHNOLOGY Thin-film technology is commonly used in producing semiconductor devices. In the last two decades, this technology has developed tremendously, both in performance and in process control. Today s techniques enable line definitions of below 1µm, and the controlling of thickness of layers at 1Å (1-2 µm). Applying this technology to the manufacture of capacitors has enabled the development of components where both electrical and physical properties can be tightly controlled. The thin-film production facilities at AVX consist of: Class 1 clean rooms, with working areas under laminar-flow hoods of class 1, (below 1 particles per cubic foot larger than.5µm). High vacuum metal deposition systems for high-purity electrode construction. Photolithography equipment for line definition down to 2.µm accuracy. Plasma-enhanced CVD for various dielectric depositions (CVD=Chemical Vapor Deposition). High accuracy, microprocessor-controlled dicing saws for chip separation. High speed, high accuracy sorting to ensure strict tolerance adherence. TERMINATION ALUMINA ELECTRODE SEAL ELECTRODE DIELECTRIC ALUMINA ACCU-P CAPACITOR 6

8 Accu-F / Accu-P Thin-Film Chip Capacitors ACCU-F TECHNOLOGY The use of very low-loss dielectric materials, silicon dioxide and silicon oxynitride, in conjunction with highly conductive electrode metals results in low ESR and high Q. These high-frequency characteristics change at a slower rate with increasing frequency than for ceramic microwave capacitors. Because of the thin-film technology, the above-mentioned frequency characteristics are obtained without significant compromise of properties required for surface mounting. The main Accu-F properties are: Internationally agreed sizes with excellent dimensional control. Small size chip capacitors (63) are available. Tight capacitance tolerances. Low ESR at VHF, UHF and microwave frequencies. High stability with respect to time, temperature, frequency and voltage variation. Nickel/solder-coated terminations to provide excellent solderability and leach resistance. ACCU-F FEATURES Accu-F meets the fast-growing demand for low-loss (high-q) capacitors for use in surface mount technology especially for the mobile communications market, such as cellular radio of 45 and 9 MHz, UHF walkie-talkies, UHF cordless telephones to 2.3 GHz, low noise blocks at GHz and for other VHF, UHF and microwave applications. Accu-F is currently unique in its ability to offer very low capacitance values (.1pF) and very tight capacitance tolerances (±.5pF). Typically Accu-F will be used in small signal applications in VCO s, matching networks, filters, etc. Inspection test and quality control procedures in accordance with ISO 91, CECC, IECQ and USA MIL Standards yield products of the highest quality. APPLICATIONS Cellular Communications CT2/PCN (Cordless Telephone/Personal Comm. Networks) Satellite TV Cable TV GPS (Global Positioning Systems) Vehicle Location Systems Vehicle Alarm Systems Paging Military Communications Radar Systems Video Switching Test & Measurements Filters VCO s Matching Networks APPROVALS ISO 91 ACCU-P TECHNOLOGY As in the Accu-F series the use of very low-loss dielectric materials (silicon dioxide and silicon oxynitride) in conjunction with highly conductive electrode metals results in low ESR and high Q. At high frequency these characteristics change at a slower rate with increasing frequency than conventional ceramic microwave capacitors. Using thin-film technology, the above-mentioned frequency characteristics are obtained without significant compromise of properties required for surface mounting. The use of high thermal conductivity materials results in excellent RF power handling capabilities. The main Accu-P properties are: Enhanced RF power handling capability. Improved mechanical characteristics. Internationally agreed sizes with excellent dimensional control. Ultra Small size chip capacitors (21) are available. Tight capacitance tolerances. Low ESR at UHF, VHF, and microwave frequencies. High-stability with respect to time, temperature, frequency and voltage variation. High temperature nickel/solder-coated terminations as standard to provide excellent solderability and leach resistance. ACCU-P FEATURES Minimal batch to batch variability of parameters at high frequency. The Accu-P has the same unique features as the Accu-F capacitor such as low ESR, high Q, availability of very low capacitance values and very tight capacitance tolerances. The RF power handling capability of the Accu-P allows for its usage in both small signal and RF power applications. Inspection, test and quality control procedures in accordance with ISO 91, CECC, IECQ and USA MIL Standards guarantee product of the highest quality. Hand soldering Accu-P : Due to their construction utilizing relatively high thermal conductivity materials, Accu-P s have become the preferred device in R & D labs and production environments where hand soldering is used. Accu-P s are available in all sizes and are electrically identical to their Accu-F counterparts. APPLICATIONS Cellular Communications CT2/PCN (Cordless Telephone/Personal Comm. Networks) Satellite TV Cable TV GPS (Global Positioning Systems) Vehicle Location Systems Vehicle Alarm Systems Paging Military Communications Radar Systems Video Switching Test & Measurements Filters VCO's Matching Networks RF Amplifiers APPROVALS ISO

9 Accu-F */ Accu-P Thin-Film Chip Capacitors for RF Signal and Power Applications B 1 W 1 T L W T B L ACCU-F *(Signal Type Capacitors) 85 B ±.1 2.1±.1 (.63±.4) (.79±.4).81± ±.1 (.32±.4) (.5±.4).63±.1.63±.1 (.25±.4) (.25±.4).3±.1.3±.1 (.12±.4) (.12±.4) * Not recommended for new designs. Accu-P s are recommended. HOW TO ORDER 5 J DIMENSIONS: millimeters (inches) 12 ACCU-P (Signal and Power Type Capacitors) 21 42* 63* 85* 121.6±.5 1.±.1 1.6±.1 2.1±.1 3.2±.1 L (.23±.2) (.39±.4) (.63±.4) (.79±.4) (.119±.4).325±.5.55±.7.81± ±.1 2.5±.1 W (.128±.2) (.22±.3) (.32±.4) (.5±.4) (.1±.4).225±.5.4±.1.63±.1.93±.2.93±.2 T (.9±.2) (.16±.4) (.25±.4) (.36±.8) (.36±.8).1±.1.±.1/-.35±.15.3±.1.43±.1 B 1 (.4±.4) (.±.4/-) (.14±.6) (.12±.4) (.17±.4).15±.5.2±.1.35±.15.3±.1.43±.1 B 2 (.6±.2) (.8±.4) (.14±.6) (.12±.4) (.17±.4) Mount Black Side Up * G A DIMENSIONS: millimeters (inches) W TR Size 21* 42* * * Accu-P ONLY 8 Voltage 1 = 1V 5 = 5V 3 = 25V Y = 16V Z = 1V Temperature Coefficient (1) J = ±3ppm/ C (-55 C to +125 C) K = ±6ppm/ C (-55 C to +125 C) (1) TC s shown are per EIA/IEC Specifications. Capacitance Capacitance expressed in pf. (2 significant digits + number of zeros) for values <1pF, letter R denotes decimal point. Example: 68pF = pF = 8R2 ELECTRICAL SPECIFICATIONS Tolerance for C 2.pF* P = ±.2pF Q = ±.3pF A = ±.5pF B = ±.1pF C = ±.25pF for C 3.pF Q = ±.3pF A = ±.5pF B = ±.1pF C = ±.25pF for C 5.6pF A = ±.5pF B = ±.1pF C = ±.25pF for 5.6pF<C<1pF B = ±.1pF C = ±.25pF D = ±.5pF for C 1pF F = ±1% G = ±2% J = ±5% Specification Code A = Accu-F technology B = Accu-P technology Termination Code W = Nickel/ Solder Coated Accu-F Sn63, Pb37 Accu-P 21 & 42 Sn9, Pb1 T = Nickel/High Temperature Solder Coated Accu-P 63, 85, 121 Sn96, Ag4 S = Nickel/Lead Free Solder Coated Accu-P 42 Sn1 Packaging Code TR = Tape and Reel Operating and Storage Temperature Range -55 C to +125 C Temperature Coefficients (1) ± 3ppm/ C dielectric code J / ± 6ppm/ C dielectric code K Capacitance Measurement 1 MHz, 1 Vrms Insulation Resistance (IR) 1 11 Ohms ( 1 1 Ohms for 21 and 42 size) Proof Voltage 2.5 U R for 5 secs. Aging Characteristic Zero Dielectric Absorption.1% (1) TC s shown are per EIA/IEC Specifications. * Tolerances as tight as ±.1pF are available. Please consult the factory.

10 Accu-F * Signal Type Capacitors Accu-F Capacitance Ranges (pf) TEMP. COEFFICIENT CODE J = ±3ppm/ C (-55 C to +125 C) (2) Size Size Code Voltage Cap in Cap pf (1) code.1 R1.2 R2.3 R3.4 R4.5 R5.6 R6.7 R7.8 R8.9 R9 1. 1R 1.2 1R R R R R R R R R R R (1) For capacitance values higher than listed in table, please consult factory. (2) TC shown is per EIA/IEC Specifications. TEMP. COEFFICIENT CODE K = ±6ppm/ C (-55 C to +125 ) (2) Size Size Code Voltage Cap in Cap pf ((1) code.1 R1.2 R2.3 R3.4 R4.5 R5.6 R6.7 R7.8 R8.9 R9 1. 1R 1.2 1R R R R R R R R R R R (1) For capacitance values higher than listed in table, please consult factory. (2) TC shown is per EIA/IEC Specifications. 1 Intermediate values are available within the indicated range. * Not recommended for new designs. Accu-P s are recommended. 9

11 1 Accu-P Signal and Power Type Capacitors Accu-P Capacitance Ranges (pf) TEMP. COEFFICIENT CODE J = ±3ppm/ C (-55 C to +125 C) (2) Size Size Code Voltage Cap in Cap pf (1) code.1 R1.2 R2.3 R3.4 R4.5 R5.6 R6.7 R7.8 R8.9 R9 1. 1R 1.1 1R R R R R R R R R9 2. 2R 2.1 2R R R R R R R R R9 3. 3R 3.1 3R R R R R R R R R9 4. 4R 4.1 4R R R R R R R R R R R R R R (1) For capacitance values higher than listed in table, please consult factory. (2) TC shown is per EIA/IEC Specifications. These values are produced with K temperature coefficient code only. TEMP. COEFFICIENT CODE K = ±6ppm/ C (-55 C to +125 C) (2) Size Size Code Voltage (3) Cap in Cap pf (1) code.1 R1.2 R2.3 R3.4 R4.5 R5.6 R6.7 R7.8 R8.9 R9 1. 1R 1.1 1R R R R R R R R R9 2. 2R 2.1 2R R R R R R R R R9 3. 3R 3.1 3R R R R R R R R R9 4. 4R 4.1 4R R R R R R R R R R R R R R (1) For capacitance values higher than listed in table, please consult factory. (2) TC shown is per EIA/IEC Specifications. (3) For 5 volt range, please consult factory. Intermediate values are available within the indicated range. 1

12 Accu-P 21 Typical Electrical Tables Self Capacitance Resonance 25MHz 5MHz 75MHz 1MHz 1 MHz Frequency Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. (pf) (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typical (pf) ( Ω) (pf) ( Ω) (pf) ( Ω) (pf) ( Ω) (pf) ( Ω) Capacitance Self Resonance 15MHz 175MHz 225MHz 25MHz 1 MHz Frequency Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ. (pf) (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typical (pf) ( Ω) (pf) ( Ω) (pf) ( Ω) (pf) M ( Ω) (pf) ( Ω)

13 Accu-P 42 Typical Electrical Tables 1 Capacitance Self & Tolerance* Resonance Ref Typ. Typ. Typ. Ref Typ. Typ. Typ. Ref Typ. Typ. Typ. Ref Typ. Typ. Typ. Ref Typ. Typ. 1 MHz Frequency Freq C(eff) Q ESR Freq C(eff) Q ESR Freq C(eff) Q ESR Freq C(eff) Q ESR Freq C(eff) Q ESR (pf) (GHz) (MHz) (pf) (Ω) (MHz) (pf) (Ω) (MHz) (pf) (Ω) (MHz) (pf) (Ω) (MHz) (pf) (Ω) Typical.1± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.2± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.3± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.4± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.5± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.6± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.7± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.8± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.9± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a 1.± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% * Other tolerances are available, see page 8 12

14 Accu-P 42 Typical Electrical Tables Capacitance Self & Tolerance* Resonance Ref Typ. Typ. Typ. Ref Typ. Typ. Typ. Ref Typ. Typ. Typ. Ref Typ. Typ. Typ. Ref Typ. Typ. 1 MHz Frequency Freq C(eff) Q ESR Freq C(eff) Q ESR Freq C(eff) Q ESR Freq C(eff) Q ESR Freq C(eff) Q ESR (pf) (GHz) (MHz) (pf) (Ω) (MHz) (pf) (Ω) (MHz) (pf) (Ω) (MHz) (pf) (Ω) (MHz) (pf) (Ω) Typical.1± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.2± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.3± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.4± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.5± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.6± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.7± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.8± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a.9± n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a 1.± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% ±1% * Other tolerances are available, see page

15 Accu-F / Accu-P 63 Typical Electrical Tables 1 Capacitance Self Ref Effective Max Ref Effective Max Ref Effective Max Ref Effective Max & Tolerance* Resonance Freq. Capacitance ESR Freq. Capacitance ESR Freq. Capacitance ESR Freq. Capacitance 1 MHz Frequency MHz Max/Min (Ω) MHz Max/Min (Ω) MHz Max/Min (Ω) MHz Max/Min (Ω) (pf) (GHz) (pf) (pf) (pf) (pf).1± N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.2± N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.3± N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.4±.5 9. N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.5± N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.6± N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.7± N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.8± N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.9±.1 6. N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 1.± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ±5% / / / / ±5% / / / / ±5% / / / / ±5% / / / / ±5% / / / / ±5% / / / / ±5% / / / / ±5% / / / / ±5% / / / / ±5% / / N/A.1 95 N/A.12 27±5% / / N/A.1 95 N/A.12 3±5% / / N/A.1 94 N/A.12 33±5% / / N/A.1 94 N/A.12 * Other tolerances are available, see page 8 14

16 Accu-F / Accu-P 85 Typical Electrical Tables Capacitance Self Ref Effective Max Ref Effective Max Ref Effective Max Ref Effective Max & Tolerance* Resonance Freq. Capacitance ESR Freq. Capacitance ESR Freq. Capacitance ESR Freq. Capacitance 1 MHz Frequency MHz Max/Min (Ω) MHz Max/Min (Ω) MHz Max/Min (Ω) MHz Max/Min (Ω) (pf) (GHz) (pf) (pf) (pf) (pf).1±.5 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.2±.5 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.3±.5 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.4±.5 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.5±.5 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.6±.1 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.7±.1 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.8±.1 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A.9±.1 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 1.± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ±5% / / / / ±5% / / / / ±5% / / / N/A.14 13±5% / / / N/A.14 14±5% / / / N/A.14 15±5% / / / N/A.13 16±5% / / / N/A.13 18±5% / / / N/A.13 2±5% / / / N/A.13 22±5% / / / N/A.13 24±5% / / N/A.9 97 N/A.13 27±5% / / N/A.9 96 N/A.13 3±5% / / N/A.9 95 N/A.13 33±5% / / N/A.9 94 N/A.12 36±5% / / N/A.9 93 N/A.12 39±5% / / N/A.9 92 N/A.12 43±5% / / N/A.9 91 N/A.12 47±5% / / N/A.9 9 N/A.11 1 * Other tolerances are available, see page 8 15

17 Accu-P 121 Typical Electrical Tables 1 Capacitance Self Ref Effective Max Ref Effective Max Ref Effective Max Ref Effective Max & Tolerance* Resonance Freq. Capacitance ESR Freq. Capacitance ESR Freq. Capacitance ESR Freq. Capacitance 1 MHz Frequency (MHz) Max/Min (Ω) (MHz) Max/Min (Ω) (MHz) Max/Min (Ω) (MHz) Max/Min (Ω) (pf) (GHz) (pf) (pf) (pf) (pf) 1.± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ± / / / / ±5% / / / / ±5% / / / N/A.13 12±5% / / / N/A.12 13±5% / / / N/A.12 14±5% / / / N/A.12 15±5% / / / N/A.11 16±5% / / / N/A.11 18±5% / / / N/A.11 2±5% / / / N/A.11 22±5% / / / N/A.11 24±5% / / N/A.8 97 N/A.11 25±5% / / N/A.8 97 N/A.11 27±5% / / N/A.8 96 N/A.11 28±5% / / N/A.8 96 N/A.11 3±5% / / N/A.8 95 N/A.11 32±5% / / N/A.8 95 N/A.11 33±5% / / N/A.8 95 N/A.11 34±5% / / N/A.8 94 N/A.11 36±5% / / N/A.7 94 N/A.11 39±5% / / N/A.7 94 N/A.11 43±5% / / N/A.7 94 N/A.11 47±5% / / N/A.7 93 N/A.11 * Other tolerances are available, see page 8 16

18 Accu-F / Accu-P High Frequency Characteristics ESR (mω) pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF Typical ESR vs. Frequency Accu-P Frequency (MHz) Capacitance (pf) Typical SRF vs. Capacitance Accu-P SRF (GHz) Typical Q vs. Frequency Accu-P 21 1 Q 1.8pF 1.8pF 3.9pF 4.7pF 6.8pF Frequency (MHz) 17

19 Accu-F / Accu-P High Frequency Characteristics 1 ESR (Ohms).25 1.pF.2 2.2pF pF.1 1pF.5 Typical ESR vs. Frequency Accu-P 42 Ohm pF 1pF 22pF Typical ESR vs. Frequency Accu-F /Accu-P Frequency (MHz) Measured on Boonton 34A GHz Measured on Boonton 34-A (34-A limits measurements to 3GHz) 1 Typical Q vs. Frequency Accu-P 42 1 Typical Q vs. Frequency Accu-F /Accu-P 63 Q (Logarithmic Scale) Frequency (MHz) 1 pf 2.2 pf 4.7 pf 1 pf pF 1pF 2.7pF GHz Measured on Boonton 34-A (34-A limits measurements to 3GHz) Typical Self Resonant Frequency vs. Capacitance Accu-P 42 Typical Self Resonant Frequency vs. Capacitance Accu-F /Accu-P 63 GHz 1 SRF (GHz) CAPACITANCE (pf) Measured on Wiltron 36 Vector Analyzer pf L (self inductance)~.78 nh NOTE L and SRF are obtained from the measured increase in effective capacitance as the frequency is increased Measured on the Boonton 34-A 18

20 Accu-F / Accu-P High Frequency Characteristics 1 Typical ESR vs. Frequency Accu-F /Accu-P 85 1 Typical ESR vs. Frequency Accu-P 121 Ohm.1 1pF 3.3pF Ohm.1 1pF 3.3pF 1pF 1 33pF 33pF GHz Measured on Boonton 34-A (34-A limits measurements to 3GHz) GHz Measured on Boonton 34-A (34-A limits measurements to 3GHz) 1 Typical Q vs. Frequency Accu-F /Accu-P 85 1 Typical Q vs. Frequency Accu-P pF 3.3pF 33pF 1pF GHz Measured on Boonton 34-A (34-A limits measurements to 3GHz) 1 1pF 1pF 3.3pF 33pF GHz Measured on Boonton 34-A (34-A limits measurements to 3GHz) Typical Self Resonant Frequency vs. Capacitance Accu-F /Accu-P 85 GHz 1 Typical Self Resonant Frequency vs. Capacitance Accu-P 121 GHz pf L (self inductance)~.82 nh NOTE L and SRF are obtained from the measured increase in effective capacitance as the frequency is increased Measured on the Boonton 34-A pf L (self inductance)~ 1.2 nh NOTE L and SRF are obtained from the measured increase in effective capacitance as the frequency is increased Measured on the Boonton 34-A 19

21 Accu-F / Accu-P Environmental / Mechanical Characteristics 1 ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Life (Endurance) 125 C, 2U R,1 hours No visible damage MIL-STD-22F Method 18A C/C 2% for C 5pF C.25pF for C<5pF Accelerated Damp 85 C, 85% RH, U R, 1 hours No visible damage Heat Steady State C/C 2% for C 5pF MIL-STD-22F Method 13B C.25pF for C<5pF Temperature Cycling -55 C to +125 C, 15 cycles Accu-P No visible damage MIL-STD-22F Method 17E -55 C to +125 C, 5 cycles Accu-F C/C 2% for C 5pF MIL-STD-883D Method 11.7 C.25pF for C<5pF Resistance to Solder Heat 26 C ± 5 C for 1 secs C remains within initial limits IEC MECHANICAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Solderability Components completely immersed in a Terminations to be well tinned, minimum 95% IEC solder bath at 235 C for 2 secs. coverage Leach Resistance IEC Components completely immersed in a solder bath at 26±5 C for 6 secs. Dissolution of termination faces 15% of area Dissolution of termination edges 25% of length Adhesion MIL-STD-22F Method 211A A force of 5N applied for 1 secs. No visible damage Termination Bond Strength Tested as shown in diagram No visible damage IEC Amend. 2 D = 3mm Accu-P D = 1mm Accu-F C/C 2% for C 5pF C.25pF for C<5pF Robustness of Termination IEC Amend. 2 A force of 5N applied for 1 secs. No visible damage High Frequency Vibration MIL-STD-22F Method 21A, 55Hz to 2Hz, 2G No visible damage 24D (Accu-P only) Storage 12 months minimum with components stored in as received packaging Good solderability D 45mm 45mm QUALITY & RELIABILITY Accu-P is based on well established thin-film technology and materials. ON-LINE PROCESS CONTROL This program forms an integral part of the production cycle and acts as a feedback system to regulate and control production processes. The test procedures, which are integrated into the production process, were developed after long research work and are based on the highly developed semiconductor industry test procedures and equipment. These measures help AVX to produce a consistent and high yield line of products. FINAL QUALITY INSPECTION Finished parts are tested for standard electrical parameters and visual/mechanical characteristics. Each production lot is 1% evaluated for: capacitance and proof voltage at 2.5 U R. In addition, production is periodically evaluated for: Average capacitance with histogram printout for capacitance distribution; IR and Breakdown Voltage distribution; Temperature Coefficient; Solderability; Dimensional, mechanical and temperature stability. QUALITY ASSURANCE The reliability of these thin-film chip capacitors has been studied intensively for several years. Various measures have been taken to obtain the high reliability required today by the industry. Quality assurance policy is based on well established international industry standards. The reliability of the capacitors is determined by accelerated testing under the following conditions: Life (Endurance) 125 C, 2U R, 1 hours Accelerated Damp Heat Steady State 85 C, 85% RH, U R, 1 hours. 2

22 Accu-F / Accu-P Performance Characteristics RF Power Applications RF POWER APPLICATIONS In RF power applications capacitor losses generate heat. Two factors of particular importance to designers are: Minimizing the generation of heat. Dissipating heat as efficiently as possible. CAPACITOR HEATING The major source of heat generation in a capacitor in RF power applications is a function of RF current (I) and ESR, from the relationship: Power dissipation = I 2 RMS x ESR Accu-P capacitors are specially designed to minimize ESR and therefore RF heating. Values of ESR for Accu-P capacitors are significantly less than those of ceramic MLC components currently available. HEAT DISSIPATION Heat is dissipated from a capacitor through a variety of paths, but the key factor in the removal of heat is the thermal conductivity of the capacitor material. The higher the thermal conductivity of the capacitor, the more rapidly heat will be dissipated. The table below illustrates the importance of thermal conductivity to the performance of Accu-P in power applications. 1 Amps PRODUCT MATERIAL THERMAL CONDUCTIVITY W/mK Accu-P Alumina 18.9 Microwave MLC Magnesium Titanate 6. Power Handling Accu-P 1pF Data used in calculating the graph: Thermal impedance of capacitors: C/W C/W C/W C/W Thermal impedance measured using RF generator, amplifier and strip-line transformer. ESR of capacitors measured on Boonton 34A MHz THERMAL IMPEDANCE Thermal impedance of Accu-P chips is shown below compared with the thermal impedance of Microwave MLC s. CAPACITOR TYPE CHIP SIZE THERMAL IMPEDANCE ( C/W) Accu-P Microwave MLC ADVANTAGES OF ACCU-P IN RF POWER CIRCUITS The optimized design of Accu-P offers the designer of RF power circuits the following advantages: Reduced power losses due to the inherently low ESR of Accu-P. Increased power dissipation due to the high thermal conductivity of Accu-P. THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR APPLICATION IS ITS PERFORMANCE UNDER OPERATING CONDITIONS IN THE ACTUAL CIRCUIT. The thermal impedance expresses the temperature difference in C between chip center and termination caused by a power dissipation of 1 watt in the chip. It is expressed in C/W. PRACTICAL APPLICATION IN RF POWER CIRCUITS There is a wide variety of different experimental methods for measuring the power handling performance of a capacitor in RF power circuits. Each method has its own problems and few of them exactly reproduce the conditions present in real circuit applications. Similarly, there is a very wide range of different circuit applications, all with their unique characteristics and operating conditions which cannot possibly be covered by such theoretical testing. 21

23 1 Accu-F / Accu-P Application Notes GENERAL Accu-F and Accu-P SMD capacitors are designed for soldering to printed circuit boards or other substrates. The construction of the components is such that they will withstand the time/temperature profiles used in both wave and reflow soldering methods. CIRCUIT BOARD TYPE The circuit board types which may be used with Accu-F and Accu-P are as follows: Accu-F : All flexible types of circuit boards (eg. FR-4, G-1). Accu-P : All flexible types of circuit boards (eg. FR-4, G-1) and also alumina. For other circuit board materials, please consult factory. WAVE SOLDERING DIMENSIONS: millimeters (inches) HANDLING SMD capacitors should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product gives the ideal medium for direct presentation to the placement machine. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during reflow soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap.5mm beneath large components. Pad overlap about.3mm beneath small components. c. Pad extension of.5mm for reflow of large components and pad extension about.3mm for reflow of small components. Pad extension about 1.mm for wave soldering. 1.5 (.59) 1.5 (.59) 1.6 (.42).4 (.16).4 (.16).26 (.1).34 (.13) 2.1 (.83).8 (.31).8 (.31).5 (.2).55 (.22) 3.1 (.122) 1.2 (.47) 1.2 (.47).7 (.28).8 (.31) 3.1 (.122) 1.25 (.49) 1.25 (.49).6 (.24).8 (.31) 4. (.157) 1. (.39) Accu-P Accu-P Accu-F Accu-P Accu-F Accu-P REFLOW SOLDERING DIMENSIONS: millimeters (inches) 1.5 (.59) 1.25 (.49) 5. (.197) 2. (.79) 1.5 (.59) 1. (.39) 2.5 (.98) 121 Accu-P.78 (.3).26 (.1).26 (.1).26 (.1).34 (.13) 1.7 (.68).6 (.24).6 (.24).5 (.2).55 (.22) 2.3 (.91).8 (.31).7 (.28).8 (.31).8 (.31) 2.3 (.91).85 (.33).6 (.24).85 (.33).8 (.31) 1. (.39) 3. (.118) 1. (.39) 1. (.39) 1.25 (.49) 4. (.157) 2. (.79) 1. (.39) 2.5 (.98) 21 Accu-P 42 Accu-P Accu-F Accu-P Accu-F Accu-P 121 Accu-P 22

24 Accu-F / Accu-P Application Notes PREHEAT & SOLDERING The rate of preheat in production should not exceed 4 C/ second and a recommended maximum is about 2 C/second. Temperature differential from preheat to soldering should not exceed 1 C. For further specific application or process advice, please consult AVX. COOLING After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 15 C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 3 watts should be used and set to not more than 26 C. RECOMMENDED SOLDERING PROFILE IR REFLOW COMPONENT LAND TEMP (DEG C) Assembly enters the preheat zone Additional soak time to allow uniform heating of the substrate Soak time 1) Activates the flux 2) Allows center of board temperatures to catch up with corners 45-6 sec. above solder melting point Assembly exits heat no forced cooldown 186 C solder melting temperature Time (mins) CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids i-propanol, ethanol, acetylacetone, water and other standard PCB cleaning liquids. Ultrasonic conditions.. power-2w/liter max. frequency-2khz to 45kHz. Temperature C maximum (if not otherwise limited by chosen solvent system). Time minutes max. STORAGE CONDITIONS Recommended storage conditions for Accu-F and Accu-P prior to use are as follows: Temperature C to 35 C Humidity % Air Pressure mbar to 16mbar WAVE SOLDERING TEMPERATURE C C Time (seconds) 3 5 seconds Enter Wave Natural Cooling 1 VAPOR PHASE 215 C 2 TEMPERATURE C Preheat Transfer from preheat with min. delay & temp. loss 215 C Enter Vapor Reflow Duration varies with thermal mass of assembly 1 6 secs typical Natural Cooling Time (minutes) Time (seconds) 23

25 Accu-F /Accu-P Automatic Insertion Packaging 1 TAPE & REEL All tape and reel specifications are in compliance with EIA A. (equivalent to IEC 286 part 3). 8mm carrier Reeled quantities: Reels of 3, per 7" reel or 1, pieces per 13" reel 21 and 42 = 5, pieces per 7" reel and 2, pieces per 13" reel REEL DIMENSIONS: millimeters (inches) A (1) B C D E F G 18± min. 13± min. 5 min. 9.6± max. (7.87±.39) (.59 min.) (.512 ±.8) (.795 min.) (1.969 min.) (.37 ±.5) (.567 max.) Metric dimensions will govern. Inch measurements rounded and for reference only. (1) 33mm (13 inch) reels are available. G MAX. B* C A D* E FULL RADIUS CARRIER DIMENSIONS: millimeters (inches) * DRIVE SPOKES OPTIONAL IF USED, ASTERISKED DIMENSIONS APPLY. F A B C D E F ± ± ±.1 2. ±.5 4. ± (.315 ±.12) (.138 ±.2) (.69 ±.4) (.79 ±.2) (.157 ±.4) (.59 ) NOTE: The nominal dimensions of the component compartment (W,L) are derived from the component size. -. F E D 1 PITCHES CUMULATIVE TOLERANCE ON TAPE ±.2 TOP TAPE W B C A L P DIRECTION OF FEED CENTER LINES OF CAVITY P = 4mm except 21 and 42 where P = 2mm NOTE: AVX reserves the right to change the information published herein without notice. 24

26 Thin-Film Technology 2 Accu-L L63/L85 Thin-Film RF/Microwave Inductors 25

27 Accu-L SMD High-Q RF Inductor 2 1 nh Inductor (Top View) ACCU-L TECHNOLOGY The Accu-L SMD Inductor is based on thin-film multilayer technology. This technology provides a level of control on the electrical and physical characteristics of the component which gives consistent characteristics within a lot and lot-to-lot. The original design provides small size, excellent highfrequency performance and rugged construction for reliable automatic assembly. The Accu-L inductor is particularly suited for the telecommunications industry where there is a continuing trend towards miniaturization and increasing frequencies. The Accu-L inductor meets both the performance and tolerance requirements of present cellular frequencies 45MHz and 9MHz and of future frequencies, such as 17MHz, 19MHz and 24MHz. FEATURES High Q RF Power Capability High SRF Low DC Resistance Ultra-Tight Tolerance on Inductance Standard 63 and 85 Chip Size Low Profile Rugged Construction Taped and Reeled APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Locations Systems Filters Matching Networks 26

28 Accu-L 63 and 85 SMD High-Q RF Inductor DIMENSIONS: millimeters (inches) L 1.6±.1 (.63±.4) 2.11±.1 (.83±.4) W.81±.1 (.32±.4) 1.5±.1 (.59±.4) T.61±.1 (.24±.4).91±.13 (.36±.5) T top:. +.3/-..25±.15 (.+.12) (.1±.6) L B bottom:.35±.2 (.14±.8) HOW TO ORDER L Product Inductor 85 Size R7 Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = nH = 4R7 B W L 4.7nH, B = ±.1nH C = ±.2nH D = ±.5nH D Tolerance for 4.7nH<L<1nH, C = ±.2nH D = ±.5nH L 1nH, G = ±2% J = ±5% E Specification Code E = Accu-L 85 technology G = Accu-L 63 technology W Termination Code W = Nickel/ solder coated (Sn 63, Pb 37) Operating/Storage Temp. Range: -55 C to +125 C TR Packaging Code TR = Tape and Reel (3,/reel) 2 ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L MHz 9 MHz 19 MHz 24 MHz IDC max Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (ma) Inductance Available Q Q Q Q L (nh) L (nh) L (nh) (MHz) (Ω) L (nh) Inductance Tolerance Typical Typical Typical Typical (1) 1.2 ±.1, ±.2nH ±.1, ±.2nH ±.1, ±.2nH ±.1, ±.2nH ±.1, ±.2nH ±.1, ±.2, ±.5nH ±.1, ±.2, ±.5nH ±.1, ±.2, ±.5nH ±.2, ±.5nH ±.2, ±.5nH ±.2, ±.5nH ±2%, ±5% ±2%, ±5% ±2%, ±5% (1) I DC measured for 15 C rise at 25 C ambient temperature when soldered to FR-4 board. Inductance and Q measured on Agilent 4291B / 4287 using the 16196A test fixture. ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L MHz 9 MHz 17 MHz 24 MHz IDC max Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (ma) Inductance Available Q Q Q Q L (nh) L (nh) L (nh) (MHz) (Ω) T = 15 C T = 7 C L (nh) Inductance Tolerance Typical Typical Typical Typical (1) (2) 1.2 ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.1nH, ±.2nH, ±.5nH ±.5nH ±.5nH ±.5nH ±2%, ±5% ±2%, ±5% ±2%, ±5% ±2%, ±5% ±2%, ±5% (1) I DC measured for 15 C rise at 25 C ambient temperature (2) I DC measured for 7 C rise at 25 C ambient temperature L, Q, SRF measured on HP 4291A, Boonton 34A and Wiltron 36 Vector Analyzer, R DC measured on Keithley 58 micro-ohmmeter. 27

29 Accu-L 63 and 85 SMD High-Q RF Inductor 2 L63 Typical Q vs. Frequency L Q Frequency (GHz) 1.2nH 1.5nH 5.6nH 8.2nH 15nH Measured on AGILENT 4291B/4287 using the 16196A test fixture 3 L (nh) 1 Typical Inductance vs. Frequency L63 15nH 8.2nH 1 6.8nH 4.7nH 3.3nH 2.2nH 1.8nH 1.2nH Frequency (GHz) Measured on AGILENT 4291B/4287 using the 16196A test fixture L85 Typical Q vs. Frequency L85 Typical Inductance vs. Frequency L nH Q nH 1.8nH 5.6nH 1nH Inductance (nh) 1 22nH 15nH 1nH 5.6nH 15nH 2 22nH 1.8nH.1 1 Frequency (GHz) Measured on HP4291A and Boonton 34A Coaxial Line Frequency (GHz) Measured on HP4291A and Wiltron 36 Vector Analyzer Maximum Temperature Rise at 25 C ambient temperature (on FR-4) L nH 1nH 6.8nH 4.7nH 2.7nH T ( C) Current (A) Temperature rise will typically be no higher than shown by the graph 28

30 Accu-L 63 and 85 SMD High-Q RF Inductor FINAL QUALITY INSPECTION Finished parts are tested for electrical parameters and visual/ mechanical characteristics. Parts are 1% tested for inductance at 45MHz. Parts are 1% tested for R DC. Each production lot is evaluated on a sample basis for: Q at test frequency Static Humidity Resistance: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours 2 ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Solderability Components completely immersed in a solder bath at 235 ± 5 C for 2 secs. Terminations to be well tinned. No visible damage. Leach Resistance Components completely immersed in Dissolution of termination faces a solder bath at 26 ±5 C for 6 secs. 15% of area. Dissolution of termination edges 25% of length. Storage 12 months minimum with components stored in as received packaging. Good solderability Shear Components mounted to a substrate. No visible damage A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Rapid Change of Temperature Components mounted to a substrate. 5 cycles -55 C to +125 C. No visible damage Tested as shown in diagram Bend Strength No visible damage 1mm deflection 45mm Temperature Component placed in + to +125 ppm/ C Coefficient of environmental chamber (typical) TCL = L 2-L Inductance -55 C to +125 C. L T 1 = 25 C 1 (T 2 -T 1 ) (TCL) 45mm 29

31 Accu-L 85 Application Notes 2 HANDLING SMD chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. CIRCUIT BOARD TYPE All flexible types of circuit boards may be used (e.g. FR-4, G-1) and also alumina. For other circuit board materials, please consult factory. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap about.3mm. c. Pad extension about.3mm for reflow. Pad extension about.8mm for wave soldering. WAVE SOLDERING DIMENSIONS: millimeters (inches) REFLOW SOLDERING DIMENSIONS: millimeters (inches) 2.3 (.91) 3.1 (.122).9 (.35).5 (.2) 1.3 (.51).5 (.2) 1.3 (.51).8 (.31) 63 Accu-L 3.8 (.15) 2.8 (.11) 1.2 (.47) 1.4 (.55) 1.2 (.47).7 (.28) 1.4 (.55) 1.5 (.59) 85 Accu-L PREHEAT & SOLDERING The rate of preheat in production should not exceed 4 C/second. It is recommended not to exceed 2 C/ second. Temperature differential from preheat to soldering should not exceed 15 C. For further specific application or process advice, please consult AVX. HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 1 C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 3 watts should be used and set to not more than 26 C. Maximum allowed time at temperature is 1 minute. When hand soldering, the base side (white side) must be soldered to the board. COOLING After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids i-propanol, ethanol, acetylacetone, water, and other standard PCB cleaning liquids. Ultrasonic conditions.. power 2w/liter max. frequency 2kHz to 45kHz. Temperature C maximum (if not otherwise limited by chosen solvent system). Time minutes max. STORAGE CONDITIONS Recommended storage conditions for Accu-L prior to use are as follows: Temperature C to 35 C Humidity % Air Pressure mbar to 16mbar.9 (.35).8 (.31) 63 Accu-L.7 (.28) 1.5 (.59) 85 Accu-L RECOMMENDED SOLDERING PROFILE For recommended soldering profile see page 23 3

32 Thin-Film Technology CP42/CP63/CP85 and DB85 3dB 9 Thin-Film RF/Microwave Directional Couplers 3 31

33 Thin-Film Directional Couplers CP42 High Directivity LGA Termination GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF High Directivity LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. DIMENSIONS: (Bottom View) A B millimeters (inches) S 3 APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP Style Directional Coupler 42 Size 42 QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION FEATURES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Operating/Storage Temp -4 C to +85 C Power Rating 3W RF Cont Sn9Pb1 or Lead-Free Sn1 Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. X Type **** Frequency (MHz) T L W T X Sub Type W 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2) TERMINALS (Top View) OUT IN L LGA Termination L = LGA Sn9, Pb1 N = LGA Sn1 A B S 5 OHM L.2±.5 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2) TR Packaging Code TR = Tape and Reel COUPLING ORIENTATION IN TAPE Recommended Pad Layout Dimensions mm (inches).6 (.24) OUT 5 OHM OUT 5 OHM.2 (.8) IN CP IN CP 1. (.39).3 (.12) *The recommended distance to the PCB Ground Plane is.254mm (.1") 32

34 Thin-Film Directional Couplers CP42 High Directivity LGA Termination COUPLER TYPE SELECTION GRAPH Coupling vs. Frequency -5-1 CP42A**** AL CP42A**** BL CP42A**** CL CP42A**** DL CP42A**** EL CP42A**** FL db Frequency (GHz) Intermediate coupling factors are readily available. Please contact factory. 33

35 Thin-Film Directional Couplers CP42 High Directivity LGA Termination Coupler P/N CP42AxxxxAL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836AL CP42A881AL GSM CP42A92AL CP42A947AL E-GSM CP42A897AL CP42A942AL PDC CP42A1441AL PCN CP42A1747AL CP42A1842AL CP42A188AL PCS.5 CP42A196AL PHP CP42A197AL DECT CP42A189AL Wireless LAN CP42A2442AL Coupling, Return Loss, Isolation (db) CP42AxxxxALTR I. Loss Coupling R. Loss Isolation Frequency (GHz) I Loss (db) 3 Coupler P/N CP42AxxxxBL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836BL CP42A881BL GSM CP42A92BL CP42A947BL CP42A897BL E-GSM CP42A942BL PDC CP42A1441BL CP42A1747BL PCN CP42A1842BL CP42A188BL PCS CP42A196BL PHP CP42A197BL DECT CP42A189BL Wireless LAN CP42A2442BL Coupling, Return Loss, Isolation (db) CP42AxxxxBLTR I. Loss Coupling R. Loss Isolation Frequency (GHz) I Loss (db) Coupler P/N CP42AxxxxCL Frequency Coupling I. Loss Return Directivity P/N Application Band [db] max. Loss [db] Examples [MHz] [db] [db] CP42A836CL AMPS 33 CP42A881CL CP42A92CL GSM.2 CP42A947CL CP42A897CL E-GSM CP42A942CL PDC CP42A1441CL CP42A1747CL PCN CP42A1842CL CP42A188CL PCS CP42A196CL PHP CP42A197CL DECT CP42A189CL Wireless LAN CP42A2442CL Coupling, Return Loss, Isolation (db) CP42AxxxxCLTR I. Loss Coupling R. Loss Isolation Frequency (GHz) I Loss (db) Important: Couplers can be used at any frequency within the indicated range. 34

36 Thin-Film Directional Couplers CP42 High Directivity LGA Termination Coupler P/N CP42AxxxxDL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836DL CP42A881DL CP42A92DL GSM CP42A947DL CP42A897DL E-GSM CP42A942DL PDC CP42A1441DL PCN CP42A1747DL CP42A1842DL PCS CP42A188DL CP42A196DL PHP CP42A197DL DECT CP42A189DL Wireless LAN CP42A2442DL Coupling, Return Loss, Isolation (db) CP42AxxxxDLTR I. Loss Coupling R. Loss Isolation Frequency (GHz) I Loss (db) Coupler P/N CP42AxxxxEL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836EL CP42A881EL GSM CP42A92EL CP42A947EL E-GSM CP42A897EL CP42A942EL PDC CP42A1441EL PCN CP42A1747EL CP42A1842EL CP42A188EL PCS CP42A196EL PHP CP42A197EL DECT CP42A189EL Wireless LAN CP42A2442EL Coupling, Return Loss, Isolation (db) CP42AxxxxELTR I. Loss Coupling R. Loss Isolation Frequency (GHz) I Loss (db) 3 Coupler P/N CP42AxxxxFL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836FL CP42A881FL GSM CP42A92FL CP42A947FL E-GSM CP42A897FL CP42A942FL PDC CP42A1441FL PCN CP42A1747FL CP42A1842FL PCS CP42A188FL CP42A196FL PHP CP42A197FL DECT CP42A189FL Wireless LAN CP42A2442FL Coupling, Return Loss, Isolation (db) I. Loss -1. Coupling -2. R. Loss Isolation -5. CP42AxxxxFLTR Frequency (GHz) I Loss (db) Important: Couplers can be used at any frequency within the indicated range. 35

37 Thin-Film Directional Couplers CP63 High Directivity LGA Termination GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY DIMENSIONS: (Bottom View) millimeters (inches) The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. A B S 3 APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP 63 FEATURES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Operating/Storage Temp -4 C to +85 C Power Rating 3W RF Cont X **** T L W T X W 1.6±.1 (.63±.4).84±.1 (.33±.4).6±.1 (.24±.4) L A B S L.25±.5 (.1±.2).2±.5 (.8±.2).5±.5 (.2±.2) TR Style Directional Coupler Size 63 Type Frequency (MHz) Sub Type Termination Code L = LGA Sn9, Pb1 N = LGA Sn1 Packaging Code TR = Tape and Reel QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Sn9Pb1 or Lead-Free Sn1 Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. ORIENTATION IN TAPE TERMINALS (Top View) OUT IN Recommended Pad Layout Dimensions 5 OHM COUPLING mm (inches) OUT 5 OHM OUT 5 OHM 1.1 (.43) IN CP IN CP.4 (.16) 1.75 (.69).5 (.2) *The recommended distance to the PCB Ground Plane is.254mm (.1") 36

38 Thin-Film Directional Couplers CP63 High Directivity LGA Termination COUPLER TYPE SELECTION GRAPH Coupling vs. Frequency db CP63A**** CL CP63A**** HL CP63A**** AL CP63A**** DL CP63A**** BL CP63A**** ML CP63A**** EL CP63A**** FL CP63A**** GL Frequency (GHz) Intermediate coupling factors are readily available. Please contact factory. 37

39 Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxAL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836AL CP63A881AL GSM CP63A92AL CP63A947AL E-GSM CP63A897AL CP63A942AL PDC CP63A1441AL PCN CP63A1747AL CP63A1842AL PCS CP63A188AL CP63A196AL PHP CP63A197AL DECT CP63A189AL Wireless LAN CP63A2442AL Coupling, Return Loss, Isolation (db) I. Loss Coupling R. Loss Isolation CP63AxxxxALTR Frequency (GHz) I Loss (db) 3 Coupler P/N CP63AxxxxBL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836BL CP63A881BL GSM CP63A92BL CP63A947BL E-GSM CP63A897BL CP63A942BL PDC CP63A1441BL PCN CP63A1747BL CP63A1842BL PCS CP63A188BL CP63A196BL PHP CP63A197BL DECT CP63A189BL Wireless LAN CP63A2442BL Coupling, Return Loss, Isolation (db) I. Loss -1. Coupling -2. R. Loss -3. Isolation CP63AxxxxBLTR Frequency (GHz) I Loss (db) Coupler P/N CP63AxxxxCL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836CL CP63A881CL GSM CP63A92CL CP63A947CL E-GSM CP63A897CL CP63A942CL PDC CP63A1441CL CP63A1747CL PCN CP63A1842CL CP63A188CL PCS CP63A196CL PHP CP63A197CL DECT CP63A189CL Wireless LAN CP63A2442CL Coupling, Return Loss, Isolation (db) I. Loss -1. Coupling -2. R. Loss -3. Isolation CP63AxxxxCLTR Frequency (GHz) I Loss (db) Important: Couplers can be used at any frequency within the indicated range. 38

40 Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxDL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836DL CP63A881DL GSM CP63A92DL CP63A947DL E-GSM CP63A897DL CP63A942DL PDC CP63A1441DL PCN CP63A1747DL CP63A1842DL CP63A188DL PCS CP63A196DL PHP CP63A197DL DECT CP63A189DL Wireless LAN CP63A2442DL Coupling, Return Loss, Isolation (db) I. Loss -1. Coupling -2. R. Loss -3. Isolation CP63AxxxxDLTR Frequency (GHz) I Loss (db) Coupler P/N CP63AxxxxEL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836EL CP63A881EL GSM CP63A92EL CP63A947EL E-GSM CP63A897EL CP63A942EL PDC CP63A1441EL PCN CP63A1747EL CP63A1842EL PCS CP63A188EL CP63A196EL PHP CP63A197EL DECT CP63A189EL Wireless LAN CP63A2442EL Coupling, Return Loss, Isolation (db) I. Loss -1. Coupling -2. R. Loss -3. Isolation CP63AxxxxELTR Frequency (GHz) I Loss (db) 3 Coupler P/N CP63AxxxxFL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836FL CP63A881FL GSM CP63A92FL CP63A947FL E-GSM CP63A897FL CP63A942FL PDC CP63A1441FL PCN CP63A1747FL CP63A1842FL PCS CP63A188FL CP63A196FL PHP CP63A197FL DECT CP63A189FL Wireless LAN CP63A2442FL Coupling, Return Loss, Isolation (db) CP63AxxxxFLTR I. Loss Coupling R. Loss Isolation Frequency (GHz) I Loss (db) Important: Couplers can be used at any frequency within the indicated range. 39

41 Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxGL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836GL CP63A881GL GSM CP63A92GL CP63A947GL E-GSM CP63A897GL CP63A942GL PDC CP63A1441GL PCN CP63A1747GL CP63A1842GL PCS CP63A188GL CP63A196GL PHP CP63A197GL DECT CP63A189GL Wireless LAN CP63A2442GL Coupling, Return Loss, Isolation (db) I. Loss Coupling -3. R. Loss -4. Isolation -5. CP63AxxxxGLTR Frequency (GHz) I Loss (db) 3 Coupler P/N CP63AxxxxHL Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836HL CP63A881HL GSM CP63A92HL CP63A947HL E-GSM CP63A897HL CP63A942HL PDC CP63A1441HL PCN CP63A1747HL CP63A1842HL CP63A188HL PCS CP63A196HL PHP CP63A197HL DECT CP63A189HL Wireless LAN CP63A2442HL Coupling, Return Loss, Isolation (db) I. Loss -1. Coupling -2. R. Loss -3. Isolation CP63AxxxxHLTR Frequency (GHz) I Loss (db) Coupler P/N CP63AxxxxML Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP63A836ML CP63A881ML GSM CP63A92ML CP63A947ML E-GSM CP63A897ML CP63A942ML PDC CP63A1441ML PCN CP63A1747ML CP63A1842ML PCS CP63A188ML CP63A196ML PHP CP63A197ML DECT CP63A189ML Wireless LAN CP63A2442ML Coupling, Return Loss, Isolation (db) I. Loss -1. Coupling -2. R. Loss -3. Isolation CP63AxxxxMLTR Frequency (GHz) I Loss (db) Important: Couplers can be used at any frequency within the indicated range. 4

42 Thin-Film Directional Couplers CP42 / CP63 High Directivity Couplers Test Jigs GENERAL DESCRIPTION These jigs are designed for testing the CP42 and CP63 High Directivity Couplers using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.254mm (.1") from the microstrips. The substrate used is Neltec s NH9338ST254C1BC. The connectors are SMA type (female), Johnson Components Inc. Product P/N: Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2. Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Place the coupler on the measurement jig as follows: Input (Coupler) Connector 1 (Jig) Termination (Coupler) Connector 3 (Jig) Output (Coupler) Connector 2 (Jig) Coupling (Coupler) Connector 4 (Jig) 3 To measure I. Loss connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) Port 2 (VNA) Connector 4 (Jig) 5Ω To measure R. Loss and Coupling connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) To measure Isolation connect: Connector 1 (Jig) 5Ω Connector 3 (Jig) 5Ω Connector 2 (Jig) Port 1 (VNA) Connector 4 (Jig) Port 2 (VNA) Measurement Jig Calibration Jig Connector 4 Connector 1 Connector 2 Open Line Short Line to GND. OPEN HS TH Connector Johnson P/N Load & Through Connector 3 Load & Through 41

43 Thin-Film Directional Couplers CP63 SMD Type 3 GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF SMD Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP Style Directional Coupler 63 Size 63 QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION FEATURES Miniature Size: 63 Frequency Range: 8MHz - 3GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4ºC to +85ºC Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. X Type **** Frequency MHz DIMENSIONS: T X B1 TERMINALS (Top View) L Sub Type OUT IN B Bottom View A W 63 L 1.6±.1 (.63±.4) W.84±.1 (.33±.4) T.6±.1 (.28±.4) A.35±.15 (.14±.6) B.175±.1 (.7±.4) B1.+.1/-. (.+.4/-.) W Termination Code W = Sn9, Pb1 S = Sn1 millimeters (inches) 5 OHM COUPLING Top View TR Packaging Code TR = Tape and Reel Recommended Pad Layout Dimensions mm (inches) 1.85 (.73).45 (.18).28 (.11) 1.8 (.43) Orientation in tape 42

44 Thin-Film Directional Couplers CP63 SMD Type Coupler P/N CP63A****AW Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836AW ±1 CP63A881AW ±1.25 GSM CP63A92AW ±1 CP63A947AW ±1 E-GSM CP63A897AW ±1 CP63A942AW ±1 PDC CP63A1441AW ±1.4 PCN CP63A1747AW ±1 1.2 CP63A1842AW ±1.6 PCS CP63A188AW ±1 CP63A196AW ±1.65 PHP CP63A197AW ±1.6 DECT CP63A189AW ±1 Wireless LAN CP63A2442AW ±1.85 Coupling, Return Loss, Isolation (db) I. Loss Coupling P/N CP63A****AW Isolation Return Loss Frequency (GHz) I. Loss (db) Coupler P/N CP63A****BW Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836BW ±1 CP63A881BW ± GSM CP63A92BW ±1 CP63A947BW ±1 E-GSM CP63A897BW ±1 CP63A942BW ±1 PDC CP63A1441BW ±1.55 PCN CP63A1747BW ±1 1.3 CP63A1842BW ±1 PCS CP63A188BW ±1 CP63A196BW ±1.8 PHP CP63A197BW ±1 1.4 DECT CP63A189BW ±1 Wireless LAN CP63A2442BW ±1 1.1 Coupling, Return Loss, Isolation (db) I. Loss -1 Coupling CP63A****BW Return Loss Isolation Frequency (GHz) I. Loss (db) 3 Coupler P/N CP63A****CW Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836CW ±1 CP63A881CW ±1.25 GSM CP63A92CW ±1 CP63A947CW ±1 E-GSM CP63A897CW ±1 CP63A942CW ±1 PDC CP63A1441CW ± PCN CP63A1747CW ±1 CP63A1842CW ±1 PCS CP63A188CW ±1 CP63A196CW ±1.5 PHP CP63A197CW ±1 DECT CP63A189CW ±1 Wireless LAN CP63A2442CW ±1.65 Coupling, Return Loss, Isolation (db) I. Loss Coupling CP63A****CW Isolation Return Loss Frequency (GHz) I. Loss (db) Coupler P/N CP63A****DW Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836DW ±1 CP63A881DW ± GSM CP63A92DW ±1 CP63A947DW ±1 E-GSM CP63A897DW ±1 CP63A942DW ±1 PDC CP63A1441DW ± PCN CP63A1747DW ±1 CP63A1842DW ±1.9 PCS CP63A188DW ±1 CP63A196DW ± PHP CP63A197DW ±1 DECT CP63A189DW ±1 Wireless LAN CP63A2442DW ±1 1.5 Important: Couplers can be used at any frequency within the indicated range. Coupling, Return Loss, Isolation (db) CP63A****DW I. Loss Coupling Return Loss Isolation Frequency (GHz) I. Loss (db) 43

45 Thin-Film Directional Couplers CP63 SMD Type Coupler P/N CP63B****AW Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836AW ±1 CP63B881AW ±1 GSM CP63B92AW ±1.2 CP63B947AW ±1 E-GSM CP63B897AW ±1 CP63B942AW ±1 PDC CP63B1441AW ± CP63B1747AW ±1 PCN CP63B1842AW ±1 PCS CP63B188AW ±1 CP63B196AW ±1.3 PHP CP63B197AW ±1 DECT CP63B189AW ±1 Wireless LAN CP63B2442AW ±1.45 Coupling, Return Loss, Isolation (db) CP63B****AW I. Loss Coupling Frequency (GHz) Isolation Return Loss I. Loss (db) 3 Coupler P/N CP63B****BW Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836BW ±1 CP63B881BW ±1 GSM CP63B92BW ±1 CP63B947BW ±1.2 E-GSM CP63B897BW ±1 CP63B942BW ±1 PDC CP63B1441BW ±1 1.2 PCN CP63B1747BW ±1 CP63B1842BW ±1 PCS CP63B188BW ±1.25 CP63B196BW ±1 PHP CP63B197BW ±1 DECT CP63B189BW ±1 Wireless LAN CP63B2442BW ±1.35 Coupling, Return Loss, Isolation (db) CP63B****BW -5 I. Loss Coupling Return Loss Isolation Frequency (GHz) I. Loss (db) Coupler P/N CP63B****CW Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836CW ±1 CP63B881CW ±1 GSM CP63B92CW ±1 CP63B947CW ±1.2 E-GSM CP63B897CW ±1 CP63B942CW ±1 PDC CP63B1441CW ±1 1.2 PCN CP63B1747CW ±1 CP63B1842CW ±1 PCS CP63B188CW ±1 CP63B196CW ±1.25 PHP CP63B197CW ±1 DECT CP63B189CW ±1 Wireless LAN CP63B2442CW ± Coupling, Return Loss, Isolation (db) CP63B****CW -5 I. Loss Coupling Return Loss Isolation Frequency (GHz) I. Loss (db) Important: Couplers can be used at any frequency within the indicated range. 44

46 Thin-Film Directional Couplers CP63 SMD Type High Directivity Coupler P/N CP63D****AW Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] CP63D836AW AMPS CP63D881AW CP63D92AW GSM CP63D947AW E-GSM CP63D897AW CP63D942AW PDC CP63D1441AW CP63D1747AW PCN 17 CP63D1842AW CP63D188AW PCS CP63D196AW PHP CP63D197AW DECT CP63D189AW Wireless LAN CP63D2442AW Coupling, Return Loss, Isolation (db) I. Loss Coupling CP63D****AW Isolation Return Loss Frequency (GHz) Insertion Loss (db) Coupler P/N CP63D****BW Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] CP63D836BW AMPS 36 CP63D881BW CP63D92BW GSM CP63D947BW CP63D897BW E-GSM CP63D942BW PDC CP63D1441BW PCN CP63D1747BW CP63D1842BW PCS CP63D188BW CP63D196BW PHP CP63D197BW DECT CP63D189BW Wireless LAN CP63D2442BW Coupling, Return Loss, Isolation (db) CP63D****BW -5 I. Loss Coupling Return Loss Isolation Frequency (GHz) Insertion Loss (db) 3 Important: Couplers can be used at any frequency within the indicated range. 45

47 Thin-Film Directional Couplers CP85 Type 3 GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF SMD Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small Size: 85 Frequency Range: 8MHz - 3GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4 C to +85 C Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s DIMENSIONS: (Top View) T L A millimeters (inches) W B 85 L 2.3±.1 (.8±.4) W 1.55±.1 (.61±.4) T.98±.1 (.39±.4) A.56±.25 (.22±.1) B.35±.15 (.14±.6) HOW TO ORDER CP 85 A 92 A W TR Style Directional Coupler Size 85 Layout Type (see layout types) Frequency MHz Sub Type (see layout sub-types) Termination Code W = Nickel/Solder (Sn/Pb) Packaging Code TR = Tape and Reel QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Solder coating (Sn, Pb) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. Recommended Pad Layout Dimensions mm (inches) 2.33 (.92).6 (.24) (.89) (.26) NOTE: Components must be mounted on the board with the white (Alumina) side DOWN. 46

48 Thin-Film Directional Couplers CP85 Layout Types LAYOUT LAYOUT COUP Port 5 OHM (External Resistor) COUP Port 5 OHM (External Resistor) db -5 I. Loss RF IN Port Type: A Sub-Type: A Coupling R. Loss Isolation Frequency (GHz) RF OUT Port Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836AW ±1 CP85A881AW ±1.25 GSM CP85A92AW ±1 CP85A947AW ±1 1.2 E-GSM CP85A897AW ±1 CP85A942AW ±1 PDC CP85A1441AW ± PCN CP85A1747AW ±1.7 CP85A1842AW ±1.8 PCS CP85A188AW ±1 1.4 CP85A196AW ±1 PHP CP85A197AW ±1 DECT CP85A189AW ± I. Loss (db) db RF IN Port Type: A Sub-Type: B I. Loss Coupling Isolation R. Loss Frequency (GHz) RF OUT Port Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836BW ±1 CP85A881BW ± GSM CP85A92BW ±1 CP85A947BW ±1 E-GSM CP85A897BW ±1 CP85A942BW ±1 PDC CP85A1441BW ±1.35 PCN CP85A1747BW ±1.5 CP85A1842BW ±1 PCS CP85A188BW ±1.6 CP85A196BW ± PHP CP85A197BW ±1.6 DECT CP85A189BW ±1 Wireless LAN CP85A2442BW ±1.9 LAYOUT I. Loss (db) 3 COUP 5 OHM db Type: A Sub-Type: C I. Loss Coupling Isolation R. Loss Frequency (GHz) Important: Couplers can be used at any frequency within the indicated range. IN OUT Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836CW ±1 CP85A881CW ±1.5 GSM CP85A92CW ±1 CP85A947CW ±1 1.4 E-GSM CP85A897CW ±1 CP85A942CW ±1 PDC CP85A1441CW ± PCN CP85A1747CW ±1 1.6 CP85A1842CW ±1 PCS CP85A188CW ± Cp85A196CW ±1 PHP CP85A197CW ±1 DECT CP85A189CW ±1 Wireless LAN CP85A2442CW ±

49 Thin-Film Directional Couplers CP85 Layout Types LAYOUT LAYOUT COUP 5 OHM COUP 5 OHM IN OUT IN OUT Type: A Sub-Type: D Type: A Sub-Type: E 3 db I. Loss Coupling Isolation R. Loss Frequency (GHz) db I. Loss -5 Coupling Isolation -25 R. Loss Frequency (GHz) I. Loss (db) Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836DW ±1 CP85A881DW ± GSM CP85A92DW ±1 CP85A947DW ±1 E-GSM CP85A897DW ±1 CP85A942DW ±1 PDC CP85A1441DW ± PCN CP85A1747DW ±1 CP85A1842DW ± PCS CP85A188DW ±1 Cp85A196DW ± PHP CP85A197DW ±1 DECT CP85A189DW ± Wireless LAN CP85A2442DW ± db Type: B Sub-Type: A -5 I. Loss Coupling R. Loss Isolation Frequency (GHz) Important: Couplers can be used at any frequency within the indicated range. I. Loss (db) Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836EW ±1 CP85A881EW ± GSM CP85A92EW ±1 CP85A947EW ±1 E-GSM CP85A897EW ±1 CP85A942EW ±1 PDC CP85A1441EW ± PCN CP85A1747EW ±1 CP85A1842EW ± PCS CP85A188EW ±1 Cp85A196EW ±1 PHP CP85A197EW ± DECT CP85A189EW ±1 Wireless LAN CP85A2442EW ±1 4.2 RF IN Port RF OUT Port LAYOUT COUP Port 5 OHM (External Resistor) Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836AW ±1 CP85B881AW ±1 GSM CP85B92AW ±1 CP85B947AW ±1.25 E-GSM CP85B897AW ±1 CP85B942AW ±1 PDC CP85B1441AW ±1 PCN CP85B1747AW ±1 1.2 Cp85B1842AW ±1.3 PCS CP85B188AW ±1 CP85B196AW ±1.4 PHP CP85B197AW ±1.3 DECT CP85B189AW ±1 Wireless LAN CP85B2442AW ±1.4 48

50 Thin-Film Directional Couplers CP85 Layout Types RF IN Port LAYOUT COUP Port RF IN Port LAYOUT COUP Port db RF OUT Port Type: B Sub-Type: B -5 I. Loss Coupling R. Loss Isolation Frequency (GHz) 5 OHM (External Resistor) I. Loss (db) db RF OUT Port Type: B Sub-Type: C -5 I. Loss Coupling R. Loss Isolation Frequency (GHz) 5 OHM (External Resistor) I. Loss (db) 3 Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836BW ±1 CP85B881BW ±1 GSM CP85B92BW ±1 CP85B947BW ±1 E-GSM CP85B897BW ±1 CP85B942BW ±1.25 PDC CP85B1441BW ±1 PCN CP85B1747BW ±1 CP85B1842BW ±1 1.2 PCS CP85B188BW ±1 CP85B196BW ±1 PHP CP85B197BW ±1 DECT CP85B189BW ±1 Wireless LAN CP85B2442BW ±1.4 Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836CW ±1 CP85B881CW ±1 GSM CP85B92CW ±1 CP85B947CW ±1 E-GSM CP85B897CW ±1 CP85B942CW ±1.25 PDC CP85B1441CW ±1 PCN CP85B1747CW ±1 Cp85B1842CW ±1 1.2 PCS CP85B188CW ±1 Cp85B196CW ±1 PHP CP85B197CW ±1 DECT CP85B189CW ±1 Wireless LAN CP85B2442CW ±1.4 Important: Couplers can be used at any frequency within the indicated range. 49

51 Thin-Film Directional Couplers CP85 and CP63 Test Jig ITF TEST JIG FOR COUPLER TYPES 85 AND 63 SMD GENERAL DESCRIPTION This jig is designed for the testing of CP85 and CP63 series Directional Couplers using a vector network analyzer. It consists of a FR4 multi-layer substrate, having 5Ω microstrips as conducting lines and a ground plane in the middle layer, located at a distance of.2mm from the microstrips. The connectors are SMA type (female), Johnson Components Inc. Product P/N: The jig is designed for a full 2-port calibration. LOAD calibration can be done either by a 5Ω SMA termination, or by soldering a 5Ω chip resistor at the 5Ω ports. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed by a non-metallic stick until all four ports touch the appropriate pads. To measure the coupling (and the R. Loss) place the component on the Port 1 & Port 2 pads. Use two SMA 5Ω terminations (male) to terminate the ports, which are not connected to the network analyzer, and connect the network analyzer to the two ports. A 9 rotation of the component on its pads allows measuring a second parameter (I. Loss). 3 Load & Thru Calibration Area Short Open Connector (1 of 12) P/N Port 1 Port 2 Coupler 85 5Ω 5Ω Port 1 Coupler 63 5Ω 5Ω Port 2 CP85 SERIES DIRECTIONAL COUPLERS Orientation and Tape and Reel Packaging Specification (Top View) COUP 5 OHM COUP 5 OHM RF IN RF OUT RF IN RF OUT TYPE AA TYPE AB COUP 5 OHM COUP 5 OHM COUP 5 OHM RF IN RF OUT RF IN RF OUT RF IN RF OUT TYPE AC TYPE AD TYPE AE RF IN COUP RF IN COUP RF IN COUP RF OUT 5 OHM RF OUT 5 OHM RF OUT 5 OHM TYPE BA TYPE BB TYPE BC The parts should be mounted on the PCB with White (Alumina) side down and the "dark" side up. 5

52 Thin-Film Directional Couplers DB85 3dB 9 Couplers GENERAL DESCRIPTION ITF TECHNOLOGY The ITF SMD 3dB 9 Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF 3dB 9 Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. Recommended Pad Layout Dimensions 2.24 (.88).7 (.28) GROUND mm (inches) (.69) (.25) APPLICATIONS Balanced Amplifiers and Signal Distribution in Mobile Communications DIMENSIONS: millimeters (inches) L W T A B 2.3±.1 (.8±.4) 1.55±.1 (.61±.4).98±.15 (.37±.6).56±.25 (.22±.1).35±.15 (.14±.6) T FEATURES Miniature 85 size Low I. Loss High Isolation Power Handling: 1W RF CW Surface Mountable Supplied on Tape and Reel Operating Temperature -4 C to +85 C Bottom View L A B W 3 TERMINALS (Top View) Orientation in Tape.15 (.6) TYP. 5 OHM IN OUT1 OUT2 5 OHM IN OUT1 OUT2 Code Letter Marking ELECTRICAL PARAMETERS* Part Number Frequency F O I. F O Phase Balance Code Letter [MHz] [db] [deg] max. Marking DB85A88AWTR 88± Y DB85A915AWTR 915± V DB85A967AWTR 967± V DB85A135AWTR 135± C DB85A165AWTR 165± F DB85A18AWTR 18±5.3 3 F DB85A185AWTR 185±5.3 3 K DB85A19AWTR 19±5.3 3 K DB85A195AWTR 195± K DB85A214AWTR 214± L DB85A2325AWTR 2325± T *With Recommended Pad Layout Important: All intermediate frequencies within the indicated range are readily available. 51

53 Thin-Film Directional Couplers DB85 3dB 9 Couplers 88 ± 3MHz DB85A88AWTR I. Loss 1 db -3.4 I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 52

54 Thin-Film Directional Couplers DB85 3dB 9 Couplers 915 ± 3MHz DB85A915AWTR db -3.4 I. Loss I. Loss Frequency (MHz) db Isolation R. Loss Frequency (MHz) 53

55 Thin-Film Directional Couplers DB85 3dB 9 Couplers 967± 3MHz DB85A967AWTR db I. Loss I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 54

56 Thin-Film Directional Couplers DB85 3dB 9 Couplers 135 ± 5MHz DB85A135AWTR I. Loss 1 db -3.4 I. Loss Frequency (MHz) 3 db Isolation R. Loss Frequency (MHz) 55

57 Thin-Film Directional Couplers DB85 3dB 9 Couplers 165 ± 5MHz DB85A165AWTR I. Loss 1 db I. Loss Frequency (MHz) db Isolation R. Loss Frequency (MHz) 56

58 Thin-Film Directional Couplers DB85 3dB 9 Couplers 18 ± 5MHz DB85A18AWTR I. Loss 1 db -3.2 I. Loss Frequency (MHz) db Isolation R. Loss Frequency (MHz) 57

59 Thin-Film Directional Couplers DB85 3dB 9 Couplers 185 ± 5MHz DB85A185AWTR db -3.2 I. Loss I. Loss Frequency (MHz) db R. Loss -2 Isolation Frequency (MHz) 58

60 Thin-Film Directional Couplers DB85 3dB 9 Couplers 19 ± 5MHz DB85A19AWTR -3. I. Loss db I. Loss Frequency (MHz) db Isolation R. Loss Frequency (MHz) 59

61 Thin-Film Directional Couplers DB85 3dB 9 Couplers 195 ± 5MHz DB85A195AWTR db -3.2 I. Loss 1 I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 6

62 Thin-Film Directional Couplers DB85 3dB 9 Couplers 214 ± 5MHz DB85A214AWTR db -3.2 I. Loss I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 61

63 Thin-Film Directional Couplers DB85 3dB 9 Couplers 2325 ± 5MHz DB85A2325AWTR I. Loss db I. Loss Frequency (MHz) db R. Loss Isolation Frequency (MHz) 62

64 Thin-Film Directional Couplers DB85 3dB 9 Test Jigs GENERAL DESCRIPTION These jigs are designed for testing the DB85 3dB 9 Couplers using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.254mm from the microstrips. The substrate used is Neltec s NH9338ST254C1BC. The connectors are SMA type (female), Johnson Components Inc. Product P/N: Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2. Follow the VNA s instruction manual and use the calibration jig to perform a full 2-port calibration in the required bandwidths. Place the coupler on the measurement jig as follows: Input (Coupler) Connector 1 (Jig) Output 1 (Coupler) Connector 3 (Jig) 5Ω (Coupler) Connector 2 (Jig) Output 2 (Coupler) Connector 4 (Jig) 3 To measure R. Loss and I. Loss 1 connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) Port 2 (VNA) Connector 2 (Jig) 5Ω Connector 4 (Jig) 5Ω To measure R. Loss and I. Loss 2 connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) To measure Isolation connect: Connector 1 (Jig) 5Ω Connector 3 (Jig) Port 1 (VNA) Connector 2 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) Measurement Jig Connector 1 Calibration Jig Load & Through Connector 2 Connector Johnson P/N Connector 4 Load & Through Short Line to GND Connector 3 Open Line 63

65 Thin-Film Technology Low Pass Filter 4 Integrated Thin-Film SMD Filter 64

66 Thin-Film Low Pass Filter LP85 Type Harmonic GENERAL DESCRIPTION The ITF (Integrated Thin-Film) SMD Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small Size: 85 Frequency Range: 8MHz - 3.5GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4 C to +85 C Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s DIMENSIONS: millimeters (inches) FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual/mechanical characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R 4 hours TERMINATION Nickel/Solder coating (Sn, Pb) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. L W T A B 2.3±.1 (.8±.4) 1.55±.1 (.61±.4) 1.2±.1 (.4±.4).56±.25 (.22±.1).35±.15 (.14±.6) 4 HOW TO ORDER LP 85A 92 AW TR Style Low Pass Size 85 Frequency MHz Termination Nickel/Solder (Sn/Pb) Packaging Code TR = Tape and Reel TERMINALS AND LAYOUT (Top View) Orientation in Tape TYPE A TYPE B TYPE C TYPE D IN GND IN GND IN GND IN GND OUT GND OUT GND OUT GND OUT GND 65

67 Thin-Film Low Pass Filter LP85 Type Harmonic ELECTRICAL CHARACTERISTICS Application Part Frequency I. Loss VSWR Attenuation Layout Number Band (MHz) max max (db) Typical Type E-GSM LP85A897AW A LP85A942AW A GSM LP85A92AW A LP85A947AW A LP85A1119AW A AMPS LP85A836AW A LP85A881AW A PCN LP85A1747AW dB 1.7 2XFo D LP85A1842AW (.3dB typ) 3xFo D PCS LP85A188AW D LP85A196AW D PHP LP85A197AW D DECT LP85A189AW D 3G LP85A215AW B Wireless LAN LP85A2442AW B WLL LP85A35AW 34 ~ 36 C Typical Electrical Performance 4 db LP85A836AWTR Fo 3Fo 2Fo db Fo LP85A881AWTR 2Fo 3Fo db LP85A92AWTR Fo 3Fo 2Fo Frequency (GHz) Frequency (GHz) Frequency (GHz) db Fo LP85A947AWTR 2Fo 3Fo db Fo LP85A1747AWTR 2Fo 3Fo db Fo LP85A1842AWTR 2Fo 3Fo db Frequency (GHz) LP85A196AWTR Fo 3Fo 2Fo Frequency (GHz) db Frequency (GHz) LP85A2442AWTR Fo Fo Fo Frequency (GHz) db Frequency (GHz) LP85A35AWTR Fo 3Fo 2Fo Frequency (GHz) -1 LP85A1119AWTR Fo -1 Fo LP85A215AWTR -2-2 db Fo 3Fo db Fo 3Fo Frequency (GHz) Frequency (GHz)

68 Thin-Film Low Pass Filter LP85 Test Jig ITF TEST JIG FOR LOW PASS FILTER 85 GENERAL DESCRIPTION This jig is designed for the testing of the 85 Low Pass Filter using a vector network analyzer. It consists of a FR4 multi-layer substrate, having 5Ω microstrips as conducting lines and a ground plane in the middle layer, located at a distance of.2mm from the microstrips. The connectors are SMA type (female), Johnson Components Inc. Product P/N: CALIBRATION AND MEASUREMENT PROCEDURE The jig is designed for a full 2-port calibration. LOAD calibration is carried out using a 5Ω SMA termination. To measure a component, it can be either soldered or pressed down by a non-metallic stick until all four ports touch the appropriate pads. Calibration Measurement Short 4 Thru/Load Open Open OUT IN Connector p/n (6x) GND Connector p/n (6x) 67

69 Thin-Film Products Designer Kits Accu-P /Accu-L Kits 5 68

70 RF/Microwave Thin-Film Products Designer Kits (Special Kits Available Upon Request) Accu-P Designer Kit Type 17 Order Number: Accu-P 21KIT2 Volts Capacitors Tolerance Value pf.1 A.2 A.3 A.4 B.5 B.6 B.7 B.8 B.9 B B 1.1 B 1.2 B 1.3 B 1.5 B 1.8 B 2. B 2.2 B 2.4 B 2.7 B 3. B B 3.6 B 3.9 B 4.7 B 5.6 B 6.8 B B 8.2 B 1. G 12. G 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF G = ± 2% Accu-P Designer Kit Type 14 Order Number: Accu-P 42KIT2 Volts Capacitors Tolerance Value pf 1. A 1.1 A 1.2 A 1.3 A 1.4 A 1.5 A 1.6 A 1.7 A 1.8 A 1.9 A 2. A 2.1 B 2.2 B B 2.4 B 2.5 B 2.6 B 2.7 B 2.8 B 2.9 B 3. B 3.1 B 3.3 B 3.4 B 3.6 B 3.9 B 4.1 B 4.3 B 4.5 B 4.7 B 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF Accu-P Designer Kit Type 18 Order Number: Accu-P 21KIT3 Volts Capacitors Tolerance Value pf 1. A 1.1 A 1.2 A 1.3 A 1.4 A 1.5 A 1.6 A 1.7 A A 1.9 A 2. A 2.1 B 2.2 B 2.3 B 2.4 B 2.5 B 2.6 B 2.7 B 2.8 B 2.9 B 3. B 3.1 B B 3.4 B 3.6 B 3.9 B 4.1 B B B 4.7 B 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF Accu-P Designer Kit Type 9 Order Number: Accu-P 63KIT1 Volts Capacitors Tolerance Value pf.1 A.2 A.3 A.4 B.5 B.6 B.7 B.8 B.9 B 1. B 1.1 B 1.2 B 1.5 B B 2. B 2.2 B 2.4 B 2.7 B 3. B 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B 8.2 B 1. G 12. G 15. G G 22. G 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF G = ± 2% Accu-P Designer Kit Type 13 Order Number: Accu-P 42KIT1 Volts Capacitors Tolerance Value pf.1 A.2 A.3 A.4 B.5 B.6 B.7 B.8 B.9 B 1. B 1.1 B B 1.5 B 1.8 B 2. B 2.2 B 2.4 B 2.7 B 3. B 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B B G 12. G G 18. G 22. G 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF G = ± 2% Accu-P Designer Kit Type 8 Order Number: Accu-P 85KIT2 Volts Capacitors Tolerance Value pf.1 A.2 A.3 A.4 A.5 B.7 B.8 B.9 B 1. B 1.2 B B 1.8 B 2. B 2.2 B 2.7 B 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B 8.2 B 1. G 12. G G 18. G 22. G 27. J J J 47. J 3 Capacitors, 1 each of 3 values Tolerance A = ±.5pF G = ± 2% B = ±.1pF J = ±5% 5 69

71 RF/Microwave Thin-Film Products Designer Kits (Special Kits Available Upon Request) Accu-P Designer Kit Type 7 Order Number: Accu-P 121KIT2 Volts Capacitors Tolerance Value pf 1. B 1.5 B 1.8 B 2.2 B 2.7 B 3.3 B 4.7 B B 6.8 B 1. G 12. G 18. G 22. G 27. G 33. G 15 Capacitors, 1 each of 15 values Tolerance B = ±.1pF G = ± 2% Accu-P Designer Kit Type 21 Order Number: Accu-P 42KIT3 Volts Capacitors Tolerance Value pf.5 P.1 P.15 P.2 P.25 P.3 P.35 P 25.4 P.45 P.5 P.55 P.6 P.65 P.7 P.75 P 3 Capacitors, 2 each of 15 values Tolerance P = ±.2pF 5 Accu-P Designer Kit Type 22 Order Number: Accu-P 63KIT2 Volts Capacitors Tolerance Value pf.5 P.1 P.15 P.2 P.25 P.3 P.35 P 5.4 P.45 P.5 P.55 P.6 P.65 P.7 P.75 P 3 Capacitors, 2 each of 15 values Tolerance P = ±.2pF Accu-P Designer Kit Type 2 Order Number: Accu-P 21KIT4 Volts Capacitors Tolerance Value pf.5 P.1 P.15 P.2 P.25 P.3 P.35 P 25.4 P.45 P.5 P.55 P.6 P.65 P.7 P.75 P 3 Capacitors, 2 each of 15 values Tolerance P = ±.2pF Accu-L Designer Kit Type 16 Order Number: Accu-L 63KIT2 Inductance Value (nh) Tolerance 1.2 C 1.5 C 1.8 C 2.2 C 2.7 C 3.3 C 3.9 C 4.7 C 5.6 C 6.8 C 8.2 C 1 G 12 G 15 G 28 Inductors, 2 each of 14 values Tolerance C = ±.2nH G = ±2% Accu-L Designer Kit Type 11 Order Number: Accu-L 85KIT2 Inductance Value (nh) Tolerance 1.8 C 2.2 C 2.7 C 3.3 C 3.9 C 4.7 C 5.6 C 6.8 D 8.2 D 1. J 12. J 15. J 18. J 22. J 28 Inductors, 2 each of 14 values Tolerance C = ±.2nH D = ±.5nH J = ±5% 7

72 RF/Microwave MLC s AQ Series CDR Series Porcelain and Ceramic RF/Microwave Multilayer Capacitors High Voltage RF Power Capacitors 6 71

73 Microwave MLC s AQ Series W T bw Approx. L x W x T L =.63"/1.6mm W =.32"/.813mm T =.35"/.889mm max. AQ6 L T W bw 1R5 Approx. L x W x T L =.55"/1.4mm W =.55"/1.4mm T =.57"/1.45mm max. L AQ11/12 T W bw A 11J L Approx. L x W x T L =.11"/2.8mm W =.11"/2.8mm T =.12"/2.59mm max. AQ13/14 These porcelain and ceramic dielectric multilayer capacitor (MLC) chips are best suited for RF/ Microwave applications typically ranging from 1 MHz to 4.2 GHz. Characteristic is a fine grained, high density, high purity dielectric material impervious to moisture with heavy internal palladium electrodes. These characteristics lend well to applications requiring: 1) high current carrying capabilities; 2) high quality factors; 3) very low equivalent series resistance; 4) very high series resonance; 5) excellent stability under stresses of changing voltage, frequency, time and temperature. MECHANICAL DIMENSIONS: inches (millimeters) Case Length (L) Width (W) Thickness (T) Band Width (bw) AQ6.63±.6 (1.6±.152).32±.6 (.813±.152).35 Max. (.889).14±.6 ( ) AQ11.55±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) AQ ( ).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) AQ13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) AQ ( ).11±.1 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) *For Tape and Reel packaging details see page 84 6 HOW TO ORDER AQ 11 AVX Style AQ6, AQ11, AQ12, AQ13, AQ14 PACKAGING Case Size (See Chart) E Voltage Code 5 = 5V 1 = 1V E = 15V 2 = 2V V = 25V 9 = 3V 7 = 5V Standard Packaging = Waffle Pack (for T&R packaging see page 84) AQ11/12 maximum quantity per waffle pack is 1. AQ13/14 maximum quantity is 8. M 1 J A Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Temperature Coefficient Code M = +9±2ppm/ C (AQ6/11/12/13/14) A = ±3ppm/ C (AQ11/12/13/14) C = 15% ( J Termination only) (AQ12/14) Capacitance Tolerance Code A = ±.5 pf B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% N = ±3% Failure Rate Code A = Not Applicable 1 Termination Style Code 1 = Pd/Ag (AQ11/13 only) 7 = Ag/Ni/Au (AQ11/13 only) J = Nickel Barrier Sn/Pb (6/4) - (AQ6/12/14 only) ME Packaging* Code 3A = 13" Reel (AQ6 only) 6A = Waffle Pack (AQ6 only) ME = 7" Reel RE = 13" Reel WE = Waffle Pack 1A = 7" Reel (AQ6 only) 72

74 Microwave MLC s AQ Series ELECTRICAL SPECIFICATIONS AQ6, AQ11, AQ12, AQ13, AQ14 M & A C Temperature Coefficient (M) +9 ±2PPM/ C and ±15% (A) ±3PPM/ C Capacitance Range.1 pf to 51 pf.1µf to.1µf Capacitance Tolerance ±.1 pf to ±2% ±1%, ±2%, ±3% Operating Temperature -55 C C -55 C to +125 C Quality Factor or Dissipation Factor Per MIL-PRF-55681/4 1kHz Insulation Resistance Per MIL-PRF megohm to C 1 4 megohm 25 C & R VDC 1 5 megohm to C 1 3 megohm 25 C & R VDC 1 5 megohm above C 1 4 megohm above C Aging None <3% per decade hour Piezoelectric Effects None None Dielectric Withstanding Voltage 2.5 x rated voltage 2.5 x rated voltage (for 5V rated 1.5 x rated voltage) (for 5V rated 1.5 x rated voltage) ENVIRONMENTAL CHARACTERISTICS Will meet or exceed performance characteristics as outlined in MIL-PRF-55681/4. REQUIREMENT MIL-STD-22 METHOD Life 18, Condition F Shock 213, Condition J Vibration 24, Condition B Immersion 14, Condition B Salt Spray 11, Condition B Solderability 28 Thermal Shock 17, Condition B Terminal Strength 211 Temperature Cycling 12, Condition C Moisture Resistance 16 Barometric Pressure 15, Condition B Resistance to Soldering Heat 21, Condition C QUALITY FACTOR vs. FREQUENCY (Typical) MHz 1 pf pf pf pf pf CAPACITANCE AND SIZE vs. SERIES SELF RESONANT FREQUENCY (Typical) DIMENSIONS: inches (millimeters) Case Size (Nominal) 1 pf 1 pf 5 pf 1 pf AQ6 AQ11/12 AQ13/14.63 x.32 x.35 (1.6 x.813 x.889).55 x.55 x.57 (1.4 x 1.4 x 1.45).11 x.11 x.12 (2.79 x 2.79 x 2.59) 9.6 GHz 3.2 GHz 1.5 GHz 1. GHz 9.6 GHz 3.2 GHz 1.5 GHz 1. GHz 6.4 GHz 2.2 GHz 1. GHz.7 GHz 73

75 Microwave MLC s AQ Series Available Capacitance/Size/WVDC/T.C. 6 TABLE I: TC: M (+9±2PPM/ C) CASE SIZE 6, 11, 12, 13 & 14 DIMENSIONS: inches (millimeters) Case Length Width Thickness Band Width Avail. Term. 6.63±.6 (1.6±.152).32±.6 (.813±.152).35 Max. (.889).14±.6 ( ) J 11.55±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) 1 & ±.25 (1.4±.635).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) J 13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) 1 & ( ).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) J Case: AQ6 Case: AQ11, AQ12 Case: AQ13, AQ14 Cap. pf Cap. Tol. WVDC.1 B 25.2 B 25.3 B,C 25.4 B,C 25.5 B, C, D 25.6 B, C, D 25.7 B, C, D 25.8 B, C, D 25.9 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 25 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 2 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 12 F, G J K M 5 Cap. pf Cap. Tol. WVDC.1 B 15.2 B 15.3 B,C 15.4 B,C 15.5 B, C, D 15.6 B, C, D 15.7 B, C, D 15.8 B, C, D 15.9 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 15 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 2 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 1 F, G, J, K, M 15 Cap. pf Cap. Tol. WVDC.1 B 5.2 B 5.3 B,C 5.4 B,C 5.5 B, C, D 5.6 B, C, D 5.7 B, C, D 5.8 B, C, D 5.9 B, C, D 5 1. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 5 2. B, C, D B, C, D B, C, D B, C, D 5 3. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 Cap. pf Cap. Tol. WVDC 1 F, G, J, K, M 5 11 F, G, J, K, M 3 12 F, G, J, K, M 3 13 F, G, J, K, M 3 15 F, G, J, K, M 3 16 F, G, J, K, M 3 18 F, G, J, K, M 3 2 F, G, J, K, M 3 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 3 F, G, J, K, M 2 33 F, G, J, K, M 2 36 F, G, J, K, M 2 39 F, G, J, K, M 2 43 F, G, J, K, M 2 47 F, G, J, K, M 2 51 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 1 F, G, J, K, M 15 74

76 Microwave MLC s AQ Series Available Capacitance/Size/WVDC/T.C. TABLE II: TC: A (±3PPM/ C) CASE SIZE 6, 11, 12, 13 & 14 DIMENSIONS: inches (millimeters) Case Length Width Thickness Band Width Avail. Term. 6.63±.6 (1.6±.152).32±.6 (.813±.152).35 Max. (.889).14±.6 ( ) J 11.55±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) 1 & ±.25 (1.4±.635).55±.15 (1.4±.381).2/.57 (.58/1.45) ( ) J 13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) 1 & ( ).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) J Case: AQ6 Case: AQ11, AQ12 Case: AQ13, AQ14 Cap. pf Cap. Tol. WVDC.1 B 25.2 B 25.3 B,C 25.4 B,C 25.5 B, C, D 25.6 B, C, D 25.7 B, C, D 25.8 B, C, D 25.9 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 25 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 2 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 25 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 12 F, G J K M 5 Cap. pf Cap. Tol. WVDC.1 B 15.2 B 15.3 B,C 15.4 B,C 15.5 B, C, D 15.6 B, C, D 15.7 B, C, D 15.8 B, C, D 15.9 B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 15 1 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 2 F, G, J, K, M F, G, J, K, M 15 Cap. pf Cap. Tol. WVDC 24 F, G, J, K, M F, G, J, K, M 15 3 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 1 F, G, J, K, M F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 TABLE III: TC: C (±15%) CASE SIZE 12 & 14 Case: AQ12 Cap. pf Cap. Tol. WVDC 1 K, M, N 5 12 K, M, N 5 15 K, M, N 5 18 K, M, N 5 2 K, M, N 5 Cap. pf Cap. Tol. WVDC 22 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 47 K, M, N 5 Cap. pf Cap. Tol. WVDC 51 K, M, N 5 56 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 Cap. pf Cap. Tol. WVDC 5 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 12 K, M, N 5 Cap. pf Cap. Tol. WVDC.1 B 5.2 B 5.3 B,C 5.4 B,C 5.5 B, C, D 5.6 B, C, D 5.7 B, C, D 5.8 B, C, D 5.9 B, C, D 5 1. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D 5 2. B, C, D B, C, D B, C, D B, C, D 5 3. B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, D B, C, J, K, M B, C, J, K, M B, C, J, K, M B, C, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 Case: AQ14 Cap. pf Cap. Tol. WVDC 15 K, M, N 5 18 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 Cap. pf Cap. Tol. WVDC 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 3 12 F, G, J, K, M 3 13 F, G, J, K, M 3 15 F, G, J, K, M 3 16 F, G, J, K, M 3 18 F, G, J, K, M 3 2 F, G, J, K, M 3 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 3 F, G, J, K, M 2 33 F, G, J, K, M 2 36 F, G, J, K, M 2 39 F, G, J, K, M 2 43 F, G, J, K, M 2 47 F, G, J, K, M 2 51 F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M F, G, J, K, M 15 1 F, G, J, K, M F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 5 F, G, J, K, M 5 51 F, G, J, K, M 5 Cap. pf Cap. Tol. WVDC 47 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N

77 Microwave MLC s CDR Series MIL-PRF (RF/Microwave Chips) MILITARY DESIGNATION PER MIL-PRF W L T W 1J L T A 47J bw bw CDR11/12 CDR13/14 CROSS REFERENCE: AVX/MIL-PRF Per MIL-C AVX Length (L) Width (W) Thickness (T) Termination Band (bw) Style Max Min Max Min CDR11 CDR12 CDR13 CDR14 AQ11 AQ12 AQ13 AQ14.55±.15.55± (1.4±.381) (1.4±.381) (1.45) (.58) (.58) (.127).55±.25.55± (1.4±.635) (1.4±.381) (1.45) (.58) (.58) (.127).11±.2.11± (2.79±.58) (2.79±.58) (2.59) (.762) (.635) (.127) ± ( ) (2.79±.58) (2.59) (.762) (.635) (.127) HOW TO ORDER CDR12 BG 11 A K U S 6 MIL Style CDR11, CDR12, CDR13, CDR14 PACKAGING Voltage Temperature Limits BG = +9±2 ppm/ C with and without rated voltage from -55 C to C BP = ±3ppm/ C with and without rated voltage from -55 C to +125 C Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Rated Voltage Code A = 5V B = 1V C = 2V D = 3V E = 5V Standard Packaging = Waffle Pack (for T&R packaging see page 84) AQ11/12 maximum quantity per waffle pack is 1. AQ13/14 maximum quantity is 8. Capacitance Tolerance Code B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% Termination Finish (Military Designations) Code Failure Rate Level M = 1.% P =.1% R =.1% S =.1% M = Palladium/Silver (CDR11 & 13 only) N = Silver, Nickel, Gold (CDR11 & 13 only) S = Solder Coated, Final (CDR12 & 14 only) U = Base Metallization, Barrier Metal, Solder Coated. (Solder M.P. 2 C or less) (CDR12 & 14 only) W = Base Metallization, Barrier Metal, Tinned (Tin or Tin/Lead Alloy) (CDR12 & 14 only) Y = 1% Tin Z = Base Metallization, Barrier Metal (TIn Lead Alloy With 4% Lead Min.) 76

78 Microwave MLC s CDR Series MIL-PRF (RF/Microwave Chips) TABLE I: STYLES CDR11 AND CDR12 CAPACITOR CHARACTERISTICS Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-R1AB--.1 B BG, BP 5 CDR1 -B-R2AB--.2 B BG, BP 5 CDR1 -B-R3A---.3 B, C BG, BP 5 CDR1 -B-R4A---.4 B, C BG, BP 5 CDR1 -B-R5A---.5 B, C, D BG, BP 5 CDR1 -B-R6A---.6 B, C, D BG, BP 5 CDR1 -B-R7A---.7 B, C, D BG, BP 5 CDR1 -B-R8A---.8 B, C, D BG, BP 5 CDR1 -B-R9A---.9 B, C, D BG, BP 5 CDR1 -B-1RA B, C, D BG, BP 5 CDR1 -B-1R1A B, C, D BG, BP 5 CDR1 -B-1R2A B, C, D BG, BP 5 CDR1 -B-1R3A B, C, D BG, BP 5 CDR1 -B-1R4A B, C, D BG, BP 5 CDR1 -B-1R5A B, C, D BG, BP 5 CDR1 -B-1R6A B, C, D BG, BP 5 CDR1 -B-1R7A B, C, D BG, BP 5 CDR1 -B-1R8A B, C, D BG, BP 5 CDR1 -B-1R9A B, C, D BG, BP 5 CDR1 -B-2RA B, C, D BG, BP 5 CDR1 -B-2R1A B, C, D BG, BP 5 CDR1 -B-2R2A B, C, D BG, BP 5 CDR1 -B-2R4A B, C, D BG, BP 5 CDR1 -B-2R7A B, C, D BG, BP 5 CDR1 -B-3RA B, C, D BG, BP 5 CDR1 -B-3R3A B, C, D BG, BP 5 CDR1 -B-3R6A B, C, D BG, BP 5 CDR1 -B-3R9A B, C, D BG, BP 5 CDR1 -B-4R3A B, C, D BG, BP 5 CDR1 -B-4R7A B, C, D BG, BP 5 CDR1 -B-5R1A B, C, D BG, BP 5 CDR1 -B-5R6A B, C, D BG, BP 5 CDR1 -B-6R2A B, C, D BG, BP 5 CDR1 -B-6R8A B, C, J, K, M BG, BP 5 CDR1 -B-7R5A B, C, J, K, M BG, BP 5 CDR1 -B-8R2A B, C, J, K, M BG, BP 5 CDR1 -B-9R1A B, C, J, K, M BG, BP 5 CDR1 -B-1A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-11A F, G, J, K, M BG, BP 5 CDR1 -B-12A F, G, J, K, M BG, BP 5 CDR1 -B-13A F, G, J, K, M BG, BP 5 CDR1 -B-15A F, G, J, K, M BG, BP 5 CDR1 -B-16A F, G, J, K, M BG, BP 5 CDR1 -B-18A F, G, J, K, M BG, BP 5 CDR1 -B-2A--- 2 F, G, J, K, M BG, BP 5 CDR1 -B-22A F, G, J, K, M BG, BP 5 CDR1 -B-24A F, G, J, K, M BG, BP 5 CDR1 -B-27A F, G, J, K, M BG, BP 5 Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-3A--- 3 F, G, J, K, M BG, BP 5 CDR1 -B-33A F, G, J, K, M BG, BP 5 CDR1 -B-36A F, G, J, K, M BG, BP 5 CDR1 -B-39A F, G, J, K, M BG, BP 5 CDR1 -B-43A F, G, J, K, M BG, BP 5 CDR1 -B-47A F, G, J, K, M BG, BP 5 CDR1 -B-51A F, G, J, K, M BG, BP 5 CDR1 -B-56A F, G, J, K, M BG, BP 5 CDR1 -B-62A F, G, J, K, M BG, BP 5 CDR1 -B-68A F, G, J, K, M BG, BP 5 CDR1 -B-75A F, G, J, K, M BG, BP 5 CDR1 -B-82A F, G, J, K, M BG, BP 5 CDR1 -B-91A F, G, J, K, M BG, BP 5 CDR1 -B-11A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-111A F, G, J, K, M BP 5 CDR1 -B-121A F, G, J, K, M BP 5 CDR1 -B-131A F, G, J, K, M BP 5 CDR1 -B-151A F, G, J, K, M BP 5 CDR1 -B-161A F, G, J, K, M BP 5 CDR1 -B-181A F, G, J, K, M BP 5 CDR1 -B-21A--- 2 F, G, J, K, M BP 5 CDR1 -B-221A F, G, J, K, M BP 5 CDR1 -B-241A F, G, J, K, M BP 5 CDR1 -B-271A F, G, J, K, M BP 5 CDR1 -B-31A--- 3 F, G, J, K, M BP 5 CDR1 -B-331A F, G, J, K, M BP 5 CDR1 -B-361A F, G, J, K, M BP 5 CDR1 -B-391A F, G, J, K, M BP 5 CDR1 -B-431A F, G, J, K, M BP 5 CDR1 -B-471A F, G, J, K, M BP 5 CDR1 -B-511A F, G, J, K, M BP 5 CDR1 -B-561A F, G, J, K, M BP 5 CDR1 -B-621A F, G, J, K, M BP 5 CDR1 -B-681A F, G, J, K, M BP 5 CDR1 -B-751A F, G, J, K, M BP 5 CDR1 -B-821A F, G, J, K, M BP 5 CDR1 -B-911A F, G, J, K, M BP 5 CDR1 -B-12A--- 1 F, G, J, K, M BP 5 1/Complete type designation will include additional symbols to indicate style, voltage-temperature limits, capacitance tolerance (where applicable), termination finish ( M or N for style CDR11, and S, U or W for style CDR12) and failure rate level. 6 77

79 Microwave MLC s CDR Series MIL-PRF (RF/Microwave Chips) TABLE II: STYLES CDR13 AND CDR14 CAPACITOR CHARACTERISTICS 6 Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-R1*B--.1 B BG, BP 2/5 CDR1 -B-R2*B--.2 B BG, BP 2/5 CDR1 -B-R3*---.3 B, C BG, BP 2/5 CDR1 -B-R4*---.4 B, C BG, BP 2/5 CDR1 -B-R5*---.5 B, C, D BG, BP 2/5 CDR1 -B-R6*---.6 B, C, D BG, BP 2/5 CDR1 -B-R7*--.7 B, C, D BG, BP 2/5 CDR1 -B-R8*---.8 B, C, D BG, BP 2/5 CDR1 -B-R9*---.9 B, C, D BG, BP 2/5 CDR1 -B-1R* B, C, D BG, BP 2/5 CDR1 -B-1R1* B, C, D BG, BP 2/5 CDR1 -B-1R2* B, C, D BG, BP 2/5 CDR1 -B-1R3* B, C, D BG, BP 2/5 CDR1 -B-1R4* B, C, D BG, BP 2/5 CDR1 -B-1R5* B, C, D BG, BP 2/5 CDR1 -B-1R6* B, C, D BG, BP 2/5 CDR1 -B-1R7* B, C, D BG, BP 2/5 CDR1 -B-1R8* B, C, D BG, BP 2/5 CDR1 -B-1R9* B, C, D BG, BP 2/5 CDR1 -B-2R* B, C, D BG, BP 2/5 CDR1 -B-2R1* B, C, D BG, BP 2/5 CDR1 -B-2R2* B, C, D BG, BP 2/5 CDR1 -B-2R4* B, C, D BG, BP 2/5 CDR1 -B-2R7* B, C, D BG, BP 2/5 CDR1 -B-3R* B, C, D BG, BP 2/5 CDR1 -B-3R3* B, C, D BG, BP 2/5 CDR1 -B-3R6* B, C, D BG, BP 2/5 CDR1 -B-3R9* B, C, D BG, BP 2/5 CDR1 -B-4R3* B, C, D BG, BP 2/5 CDR1 -B-4R7* B, C, D BG, BP 2/5 CDR1 -B-5R1* B, C, D BG, BP 2/5 CDR1 -B-5R6* B, C, D BG, BP 2/5 CDR1 -B-6R2* B, C, D BG, BP 2/5 CDR1 -B-6R8* B, C, J, K, M BG, BP 2/5 CDR1 -B-7R5* B, C, J, K, M BG, BP 2/5 CDR1 -B-8R2* B, C, J, K, M BG, BP 2/5 CDR1 -B-9R1* B, C, J, K, M BG, BP 2/5 CDR1 -B-1*--- 1 F, G, J, K, M BG, BP 2/5 CDR1 -B-11* F, G, J, K, M BG, BP 2/5 CDR1 -B-12* F, G, J, K, M BG, BP 2/5 CDR1 -B-13* F, G, J, K, M BG, BP 2/5 CDR1 -B-15* F, G, J, K, M BG, BP 2/5 CDR1 -B-16* F, G, J, K, M BG, BP 2/5 CDR1 -B-18* F, G, J, K, M BG, BP 2/5 CDR1 -B-2*--- 2 F, G, J, K, M BG, BP 2/5 CDR1 -B-22* F, G, J, K, M BG, BP 2/5 CDR1 -B-24* F, G, J, K, M BG, BP 2/5 CDR1 -B-27* F, G, J, K, M BG, BP 2/5 CDR1 -B-3*--- 3 F, G, J, K, M BG, BP 2/5 CDR1 -B-33* F, G, J, K, M BG, BP 2/5 CDR1 -B-36* F, G, J, K, M BG, BP 2/5 CDR1 -B-39* F, G, J, K, M BG, BP 2/5 CDR1 -B-43* F, G, J, K, M BG, BP 2/5 CDR1 -B-47* F, G, J, K, M BG, BP 2/5 CDR1 -B-51* F, G, J, K, M BG, BP 2/5 Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-56* F, G, J, K, M BG, BP 2/5 CDR1 -B-62* F, G, J, K, M BG, BP 2/5 CDR1 -B-68* F, G, J, K, M BG, BP 2/5 CDR1 -B-75* F, G, J, K, M BG, BP 2/5 CDR1 -B-82* F, G, J, K, M BG, BP 2/5 CDR1 -B-91* F, G, J, K, M BG, BP 2/5 CDR1 -B-11*--- 1 F, G, J, K, M BG, BP 2/5 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B F, G, J, K, M BG, BP 2/3 CDR1 -B-221C F, G, J, K, M BG, BP 2 CDR1 -B-241C F, G, J, K, M BG, BP 2 CDR1 -B-271C F, G, J, K, M BG, BP 2 CDR1 -B-31C--- 3 F, G, J, K, M BG, BP 2 CDR1 -B-331C F, G, J, K, M BG, BP 2 CDR1 -B-361C F, G, J, K, M BG, BP 2 CDR1 -B-391C F, G, J, K, M BG, BP 2 CDR1 -B-431C F, G, J, K, M BG, BP 2 CDR1 -B-471C F, G, J, K, M BG, BP 2 CDR1 -B-511B F, G, J, K, M BG, BP 1 CDR1 -B-561B F, G, J, K, M BG, BP 1 CDR1 -B-621B F, G, J, K, M BG, BP 1 CDR1 -B-681A F, G, J, K, M BG, BP 5 CDR1 -B-751A F, G, J, K, M BG, BP 5 CDR1 -B-821A F, G, J, K, M BG, BP 5 CDR1 -B-911A F, G, J, K, M BG, BP 5 CDR1 -B-12A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-112A F, G, J, K, M BP 5 CDR1 -B-122A F, G, J, K, M BP 5 CDR1 -B-132A F, G, J, K, M BP 5 CDR1 -B-152A F, G, J, K, M BP 5 CDR1 -B-162A F, G, J, K, M BP 5 CDR1 -B-182A F, G, J, K, M BP 5 CDR1 -B-22A--- 2 F, G, J, K, M BP 5 CDR1 -B-222A F, G, J, K, M BP 5 CDR1 -B-242A F, G, J, K, M BP 5 CDR1 -B-272A F, G, J, K, M BP 5 CDR1 -B-32A--- 3 F, G, J, K, M BP 5 CDR1 -B-332A F, G, J, K, M BP 5 CDR1 -B-362A F, G, J, K, M BP 5 CDR1 -B-392A F, G, J, K, M BP 5 CDR1 -B-432A F, G, J, K, M BP 5 CDR1 -B-472A F, G, J, K, M BP 5 CDR1 -B-52A--- 5 F, G, J, K, M BP 5 CDR1 -B-512A F, G, J, K, M BP 5 1/Complete type designation will include additional symbols to indicate style, voltage-temperature limits, capacitance tolerance (where applicable), termination finish ( M or N for style CDR13, and S, U or W for style CDR14) and failure rate level. *C=2V; E=5V. C=2V; D=3V. 78

80 Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 Q ESR (ohms) Frequency (MHz) Frequency (MHz) AVX CORPORATION 1 Picofarad 1 Picofarad 1 Picofarad 3.3 Picofarad AVX CORPORATION 1 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BG STANDARD - M 6 1 Q ESR (ohms) Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 79

81 Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BG STANDARD - M 1 Q ESR (ohms) Frequency (MHz) AVX CORPORATION 1 Picofarad 1 Picofarad 47 Picofarad 33 Picofarad Frequency (MHz) AVX CORPORATION 1 Picofarad 15 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BG STANDARD - M TYPICAL ESR vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BG STANDARD - M Q ESR (ohms) Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 8

82 Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BP STANDARD - A 1 Q ESR (ohms) Frequency (MHz) Frequency (MHz) AVX CORPORATION 1 Picofarad 15 Picofarad 1 Picofarad 1 Picofarad AVX CORPORATION 15 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BP STANDARD - A TYPICAL ESR vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BP STANDARD - A Q ESR (ohms) Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 81

83 Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 Q ESR (ohms) Frequency (MHz) Frequency (MHz) AVX CORPORATION 2 Picofarad 15 Picofarad 1 Picofarad 15 Picofarad AVX CORPORATION 47 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BP STANDARD - A 6 1 Q ESR (ohms) Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 82

84 Microwave MLC s Performance Curves TYPICAL RESONANT FREQUENCY vs. CAPACITANCE AVX AQ11-14 (CDR11-14) 1 AQ11/12 AQ13/14 Parallel Resonant Frequency AQ11/12 AQ13/14 1. Series Resonant Frequency Capacitance (pf) TYPICAL RESONANT FREQUENCY vs. CAPACITANCE AVX 63 1 Parallel Resonant Frequency 1. Series Resonant Frequency Capacitance (pf) 6 Frequency (GHz) Frequency (GHz) 83

85 Microwave MLC s Automatic Insertion Packaging TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). Sizes AQ11/12 through 13/14, CDR11/12 through 13/14. 8mm carrier 7" reel:.4" thickness = 2 pcs.75" thickness = 2 pcs 13" reel:.75" thickness = 1, pcs U Series - 63/85/121 Size Chips 8mm carrier 7" reel: 63 & 85.4" thickness = 4 pcs 85..4" thickness & 121= 2 pcs 13" reel:.75" thickness = 1, pcs REEL DIMENSIONS: millimeters (inches) Tape A B* C D* N W W 2 Size (1) Max. Min. Min. Min. 1 Max. W Min. 8mm (.311) +.6 ( ) (.567) 1.9 Max ± (.429) (12.992) (.59) (.512±.8) (.795) (1.969) 11.9 Min. 12mm (.469) ( ) (.724) 15.4 Max. (.67) Metric dimensions will govern. English measurements rounded and for reference only. (1) For tape sizes 16mm and 24mm (used with chip size 364) consult EIA RS-481 latest revision. EMBOSSED CARRIER CONFIGURATION 8 & 12 MM TAPE ONLY CONSTANT DIMENSIONS 6 Tape D E P P2 T T1 G1 G2 Size Max. 8mm ±.1 4. ±.1 2. ± and +.4 ( ) (.69 ±.4) (.157 ±.4) (.79 ±.2) (.24) (.4) (.3) (.3) 12mm Max. Min. Min. VARIABLE DIMENSIONS See See Note 3 Note 4 Tape Size B1 D1 F P1 R T2 W ABK Max. Min. Min. See Note 6 See Note 5 See Note mm ±.5 4. ± Max (.179) (.39) (.138 ±.2) (.157 ±.4) (.984) (.98) ( ) See Note 1 12mm ±.5 4. ± Max 12. ±.3 (.323) (.59) (.217 ±.2) (.157 ±.4) (1.181) (.256) (.472 ±.12) See Note 1 NOTES: 1. A, B, and K are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A, B, and K) must be within.5 mm (.2) min. and.5 mm (.2) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 2 degrees (see sketches C & D). 2. Tape with components shall pass around radius R without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12mm embossed tape for reels with hub diameters approaching N min. (Table 4). 3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. 4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. 5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 6. B1 dimension is a reference dimension for tape feeder clearance only. 84

86 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 4V Application PRODUCT OFFERING Hi-Q, high RF power, surface mount MLC capacitors from AVX Corporation are characterized with ultra-low ESR and dissipation factor at high frequencies. They are designed to handle high power and high voltage levels for applications in RF power amplifiers, inductive heating, high magnetic field environments (MRI coils), medical and industrial electronics. HOW TO ORDER HQCC A A 271 J A T 1 A AVX Voltage Temperature Capacitance Code Capacitance Test Termination Style 6V = C Coefficient (2 significant digits Tolerance Level 1 = Pd/Ag HQCC 1V = A CG = A + no. of zeros) F = ±1% A = Standard T = Solderable HQCE 15V = S Examples: G = ±2% Plate 2V = G 1 pf = 1 J = ±5% 25V = W 1 pf = 11 K = ±1% 3V = H 1, pf = 12 M = ±2% 4V = J 22, pf = 223 Packaging 1 = 7" Reel 3 = 13" Reel 9 = Bulk Special Code A = Standard DIMENSIONS millimeters (inches) STYLE HQCC HQCE (L) Length 5.84 ± ±.51 (.23 ±.2) (.37 ±.2) (W) Width 6.35 ± ±.51 (.25 ±.2) (.39 ±.2) (T) Thickness 3.3 max. 3.3 max. Max. (.13 max.) (.13 max.) (t) terminal.64 ± ±.38 (.25 ±.15) (.25 ±.15) T W t L DIELECTRIC PERFORMANCE CHARACTERISTICS Capacitance Range 1pF to 6,8pF (25 C, 1. ±.2 Vrms at 1kHz, for 1 pf use 1MHz) Capacitance Tolerances ±1%, ±2%, ±5%, ±1%, ±2% Dissipation Factor 25 C.1% Max (+25 C, 1. ±.2 Vrms at 1kHz, for 1 pf use 1MHz) Operating Temperature Range -55 C to +125 C Temperature Characteristic CG: ± 3 ppm/ C (-55 C to +125 C) Voltage Ratings 6, 1, 15, 2, 25, 3, 4VDC Insulation Resistance 1K MΩ +25 C and 5VDC 1K MΩ +125 C and 5VDC Dielectric Strength 12% of rated WVDC 6 HIGH VOLTAGE CAPACITANCE VALUES (pf) Style WDC WVDC WVDC WVDC WVDC WVDC WVDC min./max. min./max. min./max. min./max. min./max. min./max. min./max. HQCC 2,2-2,7 1,5-1,8 82-1, HQCE 5,6-6,8 3,3-4,7 2,2-2,7 1,2-1,8 82-1,