ADA-4789 Data Sheet Description Features Specifications Package Marking and Pin Connections 4GX Applications
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1 ADA-789 Silicon Bipolar Darlington Amplifier Data Sheet Description Avago Technologies ADA-789 is an economical, easyto-use, general purpose silicon bipolar RFIC gain block amplifiers housed in SOT-89 surface mount plastic package. The Darlington feedback structure provides inherent broad bandwidth performance, resulting in useful operating frequency up to. GHz. This is an ideal device for small-signal gain cascades or IF amplification. ADA-789 is fabricated using Avago s HP silicon bipolar process, which employs a double-diffused single poly-silicon process with self-aligned submicron emitter geometry. The process is capable of simultaneous high ft and high NPN breakdown ( GHz ft at V BVCEO). The process utilizes industry standard device oxide isolation technologies and submicron aluminum multi-layer inter-connects to achieve superior performance, high uniformity, and proven reliability. Package Marking and Pin Connections GX #1 # # RFin GND RFout Top View # # #1 RFout GND RFin Bottom View Note: Package marking provides orientation and identification G = Device Code x = Month code indicates the month of manufacture Features Small Signal Gain Amplifier Operating Frequency: DC. GHz Unconditionally Stable Ohms Input & Output Flat, Broadband Frequency Response up to 1 GHz Operating Current: 8 ma Industry Standard SOT-89 Package Single Supply VSWR < Throughput Operating Frequency Specifications 9MHz,.8V, ma (Typical) 1. db Associated Gain 17. dbm P1dB. dbm OIP. db Noise Figure 9MHz,.V, 8mA (Typical) 1.9 db Associated Gain 18.8 dbm P1dB. dbm OIP. db Noise Figure Applications Cellular/PCS/WLL Base Stations Wireless Data/WLAN Fiber-Optic Systems ISM
2 Typical Biasing Configuration RF input R C = V CC - V d I d C block Tx R c RFC V d =.8 V C block C bypass V CC = V RF output Table 1. Absolute Maximum Ratings [1] at Tc = + C Symbol Parameter Unit MaxRating I d Device Current ma 9 P diss Total Power Dissipation [] mw 7 P in max RF Input Power dbm T j Junction Temperature C T stg Storage Temperature C - to q jc Thermal Resistance [] C/W 1. Operation in excess of any one of these conditions may result in permanent damage to the device.. Ground lead temperature is C. Derate mw/ C for Tc > 11. C.. Thermal Resistance is measured from junction to board using IR method. Table. Electrical Specifications at Tc = + C Symbol Parameter and Test Condition:Id = ma, Zo = W Frequency Units Min. Typ. Max. V d Device Voltage V..8. G p Power Gain MHz 9 MHz [1,]. GHz G p Gain Flatness to 9 MHz.1 to. GHz 1. Typical value determined from a sample size of parts from wafers.. Measurement obtained using production test board described in the block diagram below.. i) MHz OIP Test Condition: F1 = MHz, F = MHz, Pin = - dbm per tone. ii)9 MHz OIP Test Condition: F1 = 9 MHz, F = 9 MHz, Pin = - dbm per tone. iii) MHz OIP Test Condition: F1 = MHz, F = MHz, Pin = - dbm per tone. db db.. FdB db Bandwidth GHz VSWR in Input Voltage Standing Wave Ratio.1 to. GHz 1.:1 VSWR out Output Voltage Standing Wave Ratio.1 to. GHz 1.:1 NF W Noise Figure MHz 9 MHz [1,]. GHz P1dB Output Power at 1dB Gain Compression MHz 9 MHz [1,]. GHz OIP Output Third Order Intercept Point MHz [] 9 MHz [1,,]. GHz [] db.1.. dbm dbm dv/dt Device Voltage Temperature Coefficient mv/ C
3 Table. Typical Electrical performance at Tc = + C, Id=8mA, Zo= Ω Symbol Parameter and Test Condition: Frequency Units Min. Typ. Max. Vd Device Voltage V.1 Gp Power Gain MHz 9 MHz [1,]. GHz NF W Noise Figure MHz 9 MHz [1,]. GHz P1dB Output Power at 1dB Gain Compression MHz 9 MHz [1,]. GHz OIP Output Third Order Intercept Point MHz [] 9 MHz [1,,]. GHz [] 1. Typical value determined from a sample size of parts from wafers.. Measurement obtained using production test board described in the block diagram below. i) MHz OIP Test Condition: F1 = MHz, F = MHz, Pin = - dbm per tone. ii) 9 MHz OIP Test Condition: F1 = 9 MHz, F = 9 MHz, Pin = - dbm per tone. iii) MHz OIP Test Condition: F1 = MHz, F = MHz, Pin = - dbm per tone. db db.1.. dbm dbm.. 9 Block Diagram Input Ohm Transmission (. db loss) DUT Ohm Transmission including Bias (. db loss) Output Block diagram of 9 MHz production test board used for Vd, Gain, P1dB, OIP, and NF measurements show in table &. Circuit losses have been de-embedded from actual measurement.
4 Product Consistency Distribution Charts at 9 MHz, Id=mA Figure 1. Vd Distribution@mA. LSL=.V, Nominal=.8V, USL=.V Figure. Gain Distribution@mA. LSL=1 db, Nominal=1. db, USL=18 db Figure. P1dB Distribution@mA LSL=1. dbm, Nominal=17.1dBm Figure. OIP Distribution@mA. LSL=7 dbm, Nominal=. dbm 1. Statistics distribution determined from a sample size of parts taken from different wafers.. Future wafers allocated to this product may have typical values anywhere between the minimum and maximum specification limits. Typical Performance Curve (at Tc= C, unless specified otherwise) 1 1 Gain (db) P1dB (dbm) 1 1 Figure. Gain vs Frequency at Id = ma. Figure. P1dB vs Frequency at Id = ma.
5 OIP (dbm) 1 NF (db) 1 Figure 7. OIP vs Frequency at Id = ma. 9 1 Figure 8. NF vs Frequency at Id = ma C C 8C 1 Vd (V) Gain (db) C C 8C 8 Figure 9. Id vs. Vd and Temperature. Figure. Gain vs. Id and Temperature at 9 MHz. P1dB (db) Figure 11. P1dB vs. Id and Temperature at 9 MHz. -C C 8C OIP (dbm) 1 -C C 8C 8 Figure 1. OIP vs. Id and Temperature at 9 MHz.
6 NF (db) 1 8 Figure 1. NF vs. Id and Temperature at 9 MHz. -C C 8C Gain (db) Figure 1. Gain vs Id and P1dB (dbm) OIP (dbm) Figure 1. P1dB vs Id and. 8 Figure 1. OIP vs Id and.. - NF (db) IRL (db) Id=mA Id=mA Id=8mA Figure 17. NF vs Id and. Figure 18. Input Return Loss vs Id and Frequency.
7 ORL (db) Gain (db) Id=mA Id=mA Id=8mA 1 Figure 19. Output Return Loss vs Id and Frequency. Figure. Gain vs Frequency at Id = 8 ma 1 P1dB (dbm) OIP (dbm) 1 1 Figure 1. P1dB vs Frequency at Id = 8 ma 1 Figure. OIP vs Frequency at Id = 8 ma NF (db) 1 Figure. NF vs Frequency at Id = 8 ma 7
8 Typical Scattering Parameters At C, Id = ma Freq. GHz S11 S1 S1 S Mag. Ang. db Mag. Ang. Mag. Ang. Mag. Ang S parameters are measured on a micro-strip line made on. inch thick alumina carrier. The input reference plane is at the end of the RFin lead. The output reference plane is at the end of the RFout lead. 8
9 Typical Scattering Parameters At C, Id = ma Freq. GHz S11 S1 S1 S Mag. Ang. db Mag. Ang. Mag. Ang. Mag. Ang S parameters are measured on a micro-strip line made on. inch thick alumina carrier. The input reference plane is at the end of the RFin lead. The output reference plane is at the end of the RFout lead. 9
10 Typical Scattering Parameters At C, Id = 8mA S11 S1 S1 S Freq. GHz Mag. Ang. db Mag. Ang. Mag. Ang. Mag. Ang S parameters are measured on a micro-strip line made on. inch thick alumina carrier. The input reference plane is at the end of the RFin lead. The output reference plane is at the end of the RFout lead.
11 Part Number Ordering Information Part Number No of devices Container ADA-789-BLKG 7 Tape/Reel ADA-789-TR1G 1 Tape/Reel SOT89 Package Dimensions D D1 D D1 POLISH E1 E OR E1 E L L S e1 e S e1 e C D 1. D E OR. HALF ETCHING DEPTH. b b1 MATTE FINISH b POLISH A b1 Dimensions in mm Dimensions in inches Symbols Minimum Nominal Maximum Minimum Nominal Maximum A L b b C D D D E E e S e
12 Device Orientation REEL CARRIER TAPE GX GX GX GX USER FEED DIRECTION COVER TAPE Tape Dimensions. ±.. ±. SEE NOTE. SEE NOTE 1 Ø /-. 8. Ø 1. MIN. A 1.7 ±. R. MAX.. ±. SEE NOTE Bo 1. ±. Ko Ao R. TYP. A SECTION A - A Ao =. Bo =.9 Ko = 1.9 DIMENSIONS IN MM NOTES: 1. SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±.. CAMBER IN COMPLIANCE WITH EIA 81. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED AS TRUE POSITION OF POCKET, NOT POCKET HOLE 1
13 Reel Dimensions 1 Reel R LOKREEL MINNEAPOLIS USA U.S PAT 7 ATTENTION Electrostatic Sensitive Devices Safe Handling Required R 1.. REF. REF 88 REF "A" 9. PS Detail "B" PS Detail "A" (MEASURED AT HUB) (MEASURED AT HUB) MAX. Ø. Dimensions in mm M IN Ø ±. For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright -1 Avago Technologies. All rights reserved. Obsoletes AV1-9EN AV-EN - November 11, 1
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FH Product Features 5 4 MHz Low Noise Figure 8 db Gain +4 dbm OIP3 + dbm PdB Single or Dual Supply Operation Lead-free/Green/RoHS-compliant SOT-89 Package MTTF > years Applications Mobile Infrastructure
More informationData Sheet. HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs
HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs Data Sheet HSMx-C11/ HSMx-C12/HSMx-C15/HSMx-C17/HSMx-C177/ HSMx-C19/HSMx-C191/HSMx-C197/HSMx-C265 Description These chip LEDs
More informationData Sheet. HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs. HSMx-C110/C120/C150/C170/ C177/C190/C191/C197/C265
HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs Data Sheet HSMx-C11/C12/C15/C17/ C177/C19/C191/C197/C265 Description These chip LEDs are designed in an industry standard
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Product Overview The is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a broad range with +45 dbm OIP3 and +28
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ASMT-CW InGaN White,.4mm Low Profile Right Angle Surface Mount ChipLED Data Sheet Description The ASMT-CW of white color chip-type LEDs is designed with the smallest footprint to achieve high density of
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HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They
More informationFeatures. Parameter Min. Typ. Max. Min. Typ. Max. Units
v. DOWNCONVERTER, - GHz Typical Applications The is ideal for: Point-to-Point and Point-to-Multi-Point Radios Military Radar, EW & ELINT Satellite Communications Maritime & Mobile Radios Features Conversion
More information50~100MHz. 100~210MHz C2 1nF. Operating Case Temperature -40 to +85 Storage Temperature -55 to +155 Junction Temperature +126 Operating Voltage
0.7~1.4GHz High IIP3 GaAs MMIC with Integrated LO AMP Device Features +31.7 dbm Input IP3 8.8dB Conversion Loss Integrated LO Driver -2 to +2dBm LO drive level Available 3.3V to 5V single voltage MSL 1,
More informationFeatures. = +25 C, As a Function of LO Drive & Vdd. IF = 1 GHz LO = -4 dbm & Vdd = +4V
v4.414 Typical Applications Features The is ideal for: Point-to-Point Radios Point-to-Multi-Point Radios & VSAT Test Equipment & Sensors Military End-Use Functional Diagram Integrated LO Amplifier: -4
More informationFeatures. Gain Variation Over Temperature db/ C
v4.3 MODULE,. - 5 GHz Features Typical Applications The Wideband PA is ideal for: Telecom Infrastructure Microwave Radio & VSAT Military & Space Test Instrumentation Fiber Optics Functional Diagram Gain:
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More informationProduct Description. Ordering Information. GaAs HBT GaAs MESFET. InGaP HBT
InGaP HBT MMIC Amplifier 5MHz to 3MHz RFGA244 InGaP HBT MMIC AMPLIFIER 5MHz TO 3MHz Package: SOT-89 Features Low Cost Broadband Gain Internally Matched Internal Active Bias No Dropping Resistor Single
More information* Notices. Operating Case Temperature -40 to +85 Storage Temperature -55 to +155 Junction Temperature +126 Operating Voltage.
1.7~2.7GHz High IIP3 GaAs MMIC with Integrated LO AMP Device Features +33.9 dbm Input IP3 8.3dB Conversion Loss Integrated LO Driver -2 to +4dBm LO drive level Available 3.3V to 5V single voltage MSL 1,
More informationData Sheet. HSMx-C280. Miniature ChipLED. Features. Description. Applications. Device Selection Guide
HSMx-C28 Miniature ChipLED Data Sheet Description The HSMx-C28 ChipLEDs are designed to 42 (1. x.5 mm) industry standard footprint. They are extremely small in size and the low.4 mm height makes them very
More informationGeneral purpose low noise wideband amplifier for frequencies between DC and 2.2 GHz
Rev. 5 29 May 2015 Product data sheet 1. Product profile 1.1 General description Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363
More informationFeatures. = +25 C, IF= 100 MHz, LO= +13 dbm* Parameter Min. Typ. Max. Min. Typ. Max. Units
Features Passive Double Balanced Topology High LO/RF Isolation: 48 db Low Conversion Loss: 7 db Wide IF Bandwidth: DC - GHz Robust 1,000V esd, Class 1C Typical Applications The is ideal for: Point-to-Point
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Linear General Purpose Amplifier RF2360 LINEAR GENERAL PURPOSE AMPLIFIER RoHS Compliant & Pb-Free Product Package Style: Standard Batwing Features 5MHz to 1500MHz Operation Internally Matched Input and
More informationGaAs, MMIC Fundamental Mixer, 2.5 GHz to 7.0 GHz HMC557A
FEATURES Conversion loss: db LO to RF isolation: db LO to IF isolation: 3 db Input third-order intercept (IP3): 1 dbm Input second-order intercept (IP2): dbm LO port return loss: dbm RF port return loss:
More informationFeatures. = +25 C, Vs = 5V, Vpd = 5V
v1.117 HMC326MS8G / 326MS8GE AMPLIFIER, 3. - 4. GHz Typical Applications The HMC326MS8G / HMC326MS8GE is ideal for: Microwave Radios Broadband Radio Systems Wireless Local Loop Driver Amplifier Functional
More informationFeatures. = +25 C, LO = 0 dbm, Vcc = Vcc1, 2, 3 = +5V, G_Bias = +2.5V *
Typical Applications The is Ideal for: Cellular/3G & LTE/WiMAX/4G Basestations & Repeaters GSM, CDMA & OFDM Transmitters and Receivers Features High Input IP3: +38 dbm 8 db Conversion Loss @ 0 dbm LO Optimized
More informationFeatures. Parameter Min. Typ. Max. Units
HMCBLPE v.. -. GHz Typical Applications The HMCBLPE is ideal for: Point-to-Point and Point-to-Multi-Point Radios Military Radar, EW & ELINT Satellite Communications Features Conversion Gain: db Image Rejection:
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DATA SHEET SKY67105-306LF: 0.6-1.1 GHz Two-Stage, High Linearity and High Gain Low-Noise Amplifier Applications GSM, CDMA, WCDMA, cellular infrastructure systems Ultra low-noise, high gain and high linearity
More information= +25 C, IF= 100 MHz, LO = +15 dbm*
v3.514 Typical Applications Features The is ideal for: Point-to-Point and Point-to-Multi-Point Radio Digital Radio VSAT Functional Diagram Wide IF Bandwidth: DC - 3.5 GHz Image Rejection: 35 db LO to RF
More informationGeneral purpose low noise wideband amplifier for frequencies between DC and 2.2 GHz
Rev. 1 20 October 2011 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin
More information= +25 C, IF= 100 MHz, LO = +15 dbm*
v3.514 HMC52LC4 6-1 GHz Typical Applications Features The HMC52LC4 is ideal for: Point-to-Point and Point-to-Multi-Point Radio Digital Radio VSAT Functional Diagram Wide IF Bandwidth: DC - 3.5 GHz Image
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PRELIMINARY Applications RF and microwave antenna signal distribution EW Systems Broadband delay-line and signal processing systems Frequency distribution systems Radar system calibration Phased array
More informationOBSOLETE HMC423MS8 / 423MS8E MIXERS - DBL-BAL - SMT. GaAs MMIC MIXER w/ INTEGRATED LO AMPLIFIER, GHz. Typical Applications.
Typical Applications The HMC423MS8 / HMC423MS8E is ideal for: Base Stations Portable Wireless CATV/DBS ISM Functional Diagram Electrical Specifications, T A = +25 C Features Integrated LO Amplifi er w/
More informationFeatures. = +25 C, IF= 100 MHz, LO= +15 dbm* Parameter Min. Typ. Max. Min. Typ. Max. Units
v3.514 MIXER, 5.5-14. GHz Typical Applications The is ideal for: Point-to-Point Radios Point-to-Multi-Point Radios Test Equipment & Sensors Military End-Use Functional Diagram Features Passive Double Balanced
More informationAnalog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
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Ultra Low Noise Amplifier ~ RLNAMG Electrical Specifications, TA = +⁰C, Vcc = +V Features Gain: db Typical Noise Figure:.dB Typical PdB Output Power: +dbm Typical Supply Voltage: +V /ma Ohm Matched Typical
More information= +25 C, IF= 100 MHz, LO = +17 dbm*
v3.514 Typical Applications Features The is ideal for: Point-to-Point Radios Point-to-Multi-Point Radios & VSAT Test Equipment & Sensors Military End-Use Functional Diagram Wide IF Bandwidth: DC - 3.5
More informationAnalog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Typical Applications The is ideal
More informationThe HSMB-C110 is a right-angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is ideal for
Surface Mount Chip LEDs Technical Data HSMB-C19/C17/C11 Features Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -3 C to +85 C Right Angle
More informationGeneral purpose low noise wideband amplifier for frequencies between DC and 750 MHz
Rev. 3 13 July 2015 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363
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