Agilent HSMx-C660 Right Angle Surface Mount Chip LEDs Data Sheet
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1 Agilent HSMx-C66 Right Angle Surface Mount Chip LEDs Data Sheet Features Right Angle Mounting Compatible with IR Reflow Soldering Process Available in a Wide Variety of Colors Available in 8 mm Tape on 178 mm (7") Diameter Reels Description The HSMx-C66 series of chip-type LEDs are designed to illuminate at a right angle to the direction of mounting. When mounted on a PC board, these devices will emit light in a direction parallel to the board. Package Dimensions CATHODE 3. ANODE Applications LCD Backlighting Keypad Side/Backlighting Light Piping Right Angle Indicator The small 3. x 2. mm footprint of the HSMx-C66 is designed for applications where space is limited. These devices are available in four colors and use untinted, nondiffused optics. The HSMx-C66 series of parts are compatible with IR reflow soldering process only..25 CATHODE ANODE POLARITY MARK R.45 TO REINFORCE SOLDERING (NON-PIN CONNECTION) Footprint Parts DH AS High (mm) per Reel AlGaAs Efficiency Red Yellow Green 3. x 2. x 3 HSMH-C66 HSMS-C66 HSMY-C66 HSMG-C66
2 Absolute Maximum Ratings at T A = 25 C Parameter HSMx-C66 Units DC Forward Current [1] 25 ma Power Dissipation 65 mw Reverse Voltage (I R = 1 µa) 5 V Operating Temperature Range 3 to +85 C Storage Temperature Range [2] 4 to +1 C Notes: 1. Derate linearly as shown on Figure Maximum temperature for the tape and reel packaging is 6 C. Optical Characteristics at T A = 25 C Luminous Color Viewing Luminous Intensity I v Peak Dominant Angle Efficacy Wavelength Wavelength 2θ 1 / 2 η v I F = 2 ma λ peak (nm) λ [1] d (nm) (degrees) [2] (lm/w) Part No. Color Min. Typ. Typ. Typ. Typ. HSMH-C66 DH AlGaAs Red HSMS-C66 High Efficiency Red HSMY-C66 Yellow HSMG-C66 Green Notes: 1. The dominant wavelength, λ d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 2. θ 1 / 2 is the off-axis angle where the luminous intensity is 1 / 2 the peak intensity. Electrical Characteristics at T A = 25 C Forward Reverse Voltage V F Breakdown Capacitance C Thermal V R (pf) V F =, Resistance I F = 2 ma I R = 1 µa f = 1 MHz Rθ J-PIN ( C/W) Part No. Color Typ. Max. Min. Typ. HSMH-C66 DH AlGaAs Red HSMS-C66 High Efficiency Red HSMY-C66 Yellow HSMG-C66 Green
3 Color Bin Limits [1] Green Color Bins [1] Dom. Wavelength [nm] Bin ID MIN. MAX. A B C D E Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Yellow/Amber Color Bins [1] Dom. Wavelength [nm] Bin ID MIN. MAX. A B C D H J For HSMC, HSMH, HSMS, HSMZ (Red Color) No color binning available. Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Bin ID min. max. A.1.2 B C.25.5 D.4.8 E F 2. G H J K L M N P Q R S T Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 3
4 GREEN AlGaAs RED RELATIVE INTENSITY.5 YELLOW HIGH EFFICIENCY RED WAVELENGTH nm Figure 1. Relative Intensity vs. Wavelength I E FORWARD CURRENT ma YELLOW AlGaAs RED HER GREEN RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) I F FORWARD CURRENT ma V F FORWARD VOLTAGE V I DC DC FORWARD CURRENT ma T A AMBIENT TEMPERATURE C Figure 2. Forward Current vs. Forward Voltage. Figure 3. Relative Luminous Intensity vs. DC Forward Current. Figure 4. Maximum DC Current vs. Ambient Temperature NORMALIZED INTENSITY ANGULAR DISPLACEMENT DEGREES Figure 5. HSMx-C66 Intensity vs. Angle, Vertical Axis. 4
5 TEMPERATURE 255 C (+5/-) 217 C 3 C/SEC. MAX C MAX. 12 SEC. 1 to 2 SEC. 6 C/SEC. MAX. 6 to 15 SEC. TIME * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 6. Recommended Pb-Free Reflow Soldering Profile RWS CENTER 1.5 USER FEED DIRECTION HSMx-C66 SERIES EMITTED DIRECTION CATHODE SIDE MOUNTING EXAMPLE FOR HSMx-C66 SERIES PRINTED LABEL Figure 7. Recommended Solder Patterns. Figure 8. Reeling Orientation for the HSMx-C66. 5
6 8. ± (.315 ±.39) Ø 2.2 MIN. (Ø.795 MIN.) 1.5 ± (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 13.1 ±.5 (Ø.516 ±.2) ± (7.24 ±.39) 59.6 ± (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Figure 9. Reel Dimensions. 4. ±.1 (.157 ±.4) Ø ( ) CATHODE ±.1 (.69 ±.4) DIM. A (SEE TABLE) 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B (SEE TABLE) Ø ±.1 (.157 ±.4) USER FEED DIRECTION 2. ±.5 (.79 ±.2) DIM. A DIM. B Part Number ±.1 (.4) ±.1 (.4) HSMx-C Figure 1. Tape Dimensions. 6
7 END START THERE SHALL BE A MOUNTED WITH MINIMUM OF 4 mm COMPONENTS (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. THERE SHALL BE A MINIMUM OF 4 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 15 mm-36 mm ( INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. Storage Condition: 5 to 3 6% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 6 +/ 5 C for 2 hours. 7
8 For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (8) or (916) Europe: +49 () China: Hong Kong: (+65) India, Australia, New Zealand: (+65) Japan: (+81 3) (Domestic/International), or (Domestic Only) Korea: (+65) Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) Taiwan: (+65) Data subject to change. Copyright 23 Agilent Technologies, Inc. Obsoletes EN October 7, EN
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