Agilent HSMx-C110/C170/C190/C191/C150 High Performance ChipLED Data Sheet
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1 Agilent HSMx-C11/C17/C19/C191/C15 High Performance ChipLED Data Sheet HSMA-C11/C17/C19/C191/C15 HSML-C11/C17/C19/C191/C15 HSMC-C11/C17/C19/C191/C15 HSMZ-C11/C17/C19 Description These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 65 nm Orange, 626 nm Red for AS AlInGaP and 631 nm red for TS AlInGaP. All packages are binned by both color and intensity, except for red color. These ChipLEDs come either in two top emitting packages (HSMx-C17/C19/C191/C15) or in a side emitting package (HSMx-C11). The right angle ChipLEDs are suitable for applications such as LCD backlighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4 units per reel for HSMx-C17/C19/ C191 and 3 units per reel for HSMx-C11/C15. Features High brightness AlInGaP material Small size Industry standard footprint Diffused optics Top emitting or right angle emitting Available in 3 colors (red, orange, amber) Compatible with IR soldering Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications LCD backlighting Push button backlighting Front panel indicator Symbol indicator Microdisplays Small message panel signage These packages are compatible with IR soldering process.
2 Package Dimensions LED DIE LINE LED DIE MARK 1. (.39) 1.25 (.49) 2.6 (.12 ) 3.2 (.126 ) POLARITY 2. (.79 ).62 (.24) CLEAR EPOXY PC BOARD 3.2 (.126 ) 1.6 (.63 ).5 (.2) LINE 1.5 (.59) DIFFUSED EPOXY.3 (.12) PC BOARD LINE.4 ±.15 (.16 ±.6) 1.4 (.55) POLARITY.3 (.12).4 ±.15 (.16 ±.6) 1. (.39) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C11 HSMx-C17 LED DIE MARK LED DIE MARK 1.6 (.63 ).4 (.16) 1.6 (.63 ).4 (.16) 1. (.39) POLARITY 1. (.39) POLARITY.3 (.12).3 (.12) DIFFUSED EPOXY DIFFUSED EPOXY PC BOARD LINE.3 (.12) PC BOARD LINE.6 (.23).3 (.12).3 ±.15 (.12 ±.6).3 ±.15 (.12 ±.6).3 ±.15 (.12 ±.6).3 ±.15 (.12 ±.6).7 (.28) MIN..7 (.28) MIN. SOLDERING TERMINAL HSMx-C19 SOLDERING TERMINAL HSMx-C191 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. 2
3 Package Dimensions, continued LED DIE MARK 1.6 (.63) 3.2 (.126 ) DIFFUSED EPOXY.6 (.24) PC BOARD 2. (.79) POLARITY 1.1 (.43) LINE.5 ±.2 (.2 ±.8).5 (.2).5 ±.2 (.2 ±.8) SOLDERING TERMINAL HSMx-C15 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. Device Selection Guide Footprint AS AlInGaP AS AlInGaP AS AlInGaP TS AlInGaP Package (mm) [1,2] Amber Orange Red Red Description 1.6 x.8 x.8 HSMA-C19 HSML-C19 HSMC-C19 HSMZ-C19 Untinted, Diffused 2. x 1.25 x.8 HSMA-C17 HSML-C17 HSMC-C17 HSMZ-C17 Untinted, Diffused 3.2 x 1. x 1.5 HSMA-C11 HSML-C11 HSMC-C11 HSMZ-C11 Untinted, Nondiffused 1.6 x.8 x.6 HSMA-C191 HSML-C191 HSMC-C191 Untinted, Diffused 3.2 x 1.6 x 1.1 HSMA-C15 HSML-C15 HSMC-C15 Untinted, Diffused Notes: 1. Dimensions in mm. 2. Tolerance ±.1 mm unless otherwise noted. Absolute Maximum Ratings T A = 25 C HSMA-C11/17/19/191/15 HSML-C11/17/19/191/15 Parameter HSMC-C11/17/19/191/15 HSMZ-C11/17/19 Units DC Forward Current [1,2] ma Power Dissipation 6 65 mw Reverse Voltage (I R = 1 µa) 5 5 V LED Junction Temperature C Operating Temperature Range 3 to to +85 C Storage Temperature Range 4 to to +85 C Soldering Temperature See reflow soldering profile (Figure 7 & 8) Notes: 1. Derate linearly as shown in Figure Drive currents above 5 ma are recommended for best long term performance. 3
4 Electrical Characteristics T A = 25 C Forward Voltage Reverse Breakdown Capacitance C Thermal V F (Volts) V R (Volts) (pf), V F =, I F = 2 I R = 1 µa f = 1 MHz Rθ J-PIN = ( C/W) Parameter Number Typ. Max. Min. Typ. Typ. HSMA-C HSML-C HSMC-C HSMZ-C HSMA-C17/19/191/ HSML-C17/19/191/ HSMC-C17/19/191/ HSMZ-C17/ Optical Characteristics T A = 25 C Luminous Color, Viewing Luminous Intensity Peak Dominant Angle Efficacy I v (mcd) Wavelength Wavelength 2 θ 1/2 η v 2 ma [1] λ peak (nm) λ d [2] (nm) Degrees [3] (lm/w) Number Color Min. Typ. Typ. Typ. Typ. Typ. HSMA-C11 AS Amber HSMA-C17/19/191/15 AS Amber HSML-C11 AS Orange HSML-C17/19/191/15 AS Orange HSMC-C11 AS Red HSMC-C17/19/191/15 AS Red HSMZ-C11 TS Red HSMZ-C17/19 TS Red Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λ d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4
5 Color Bin Limits [1] Orange Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A B C D E F Tolerance: ± 1 nm. Yellow/Amber Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A B C D E F Tolerance: ±.5 nm. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Intensity (mcd) Bin ID Min. Max. Bin ID Min. Max. A N B P C Q D R E S F T G U H V J W K X L Y M Tolerance: ± 15%. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 5
6 1. AS AlInGaP AMBER AS AlInGaP RED RELATIVE INTENSITY.5 AS AlInGaP ORANGE TS AlInGaP RED WAVELENGTH nm Figure 1. Relative intensity vs. wavelength. I F FORWARD CURRENT ma 1 AS AlInGaP 1 TS AlInGaP V F FORWARD VOLTAGE V LUMINOUS INTENSITY (NORMALIZED AT 2 ma) I F FORWARD CURRENT ma I F MAX. MAXIMUM FORWARD CURRENT ma HSMx-C11 HSMx-C15/17/ 19/ T A AMBIENT TEMPERATURE C Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature. 6
7 RELATIVE INTENSITY % ANGLE RELATIVE INTENSITY % ANGLE Figure 5. Relative intensity vs. angle for HSMx-C11. RELATIVE INTENSITY % ANGLE Figure 6. Relative intensity vs. angle for HSMx-C17, C19, C191, and C15. 7
8 1 to 2 SEC. TEMPERATURE C 1 SEC. MAX. 23 C MAX. 4 C/SEC. MAX. 4 C/SEC. MAX. 3 C/SEC. TEMPERATURE 255 C (+5/-) 217 C 3 C/SEC. MAX C MAX. 12 SEC. 6 C/SEC. MAX. 6 to 15 SEC. OVER 2 MIN. TIME TIME Figure 7. Recommended reflow soldering profile. * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 8. Recommended Pb-free reflow soldering profile. 5. (.2).9 (.35).9 (.35) 1.2 (.47).2 (.8) 1.5 (.59) 2. (.79) 1.5 (.59) 1. (.39) CENTERING BOARD 1.2 (.47).9 (.35) 1.2 (.47) Figure 9. Recommended soldering pattern for HSMx-C11. Figure 1. Recommended soldering pattern for HSMx-C (.59).8 (.31).7 (.28).8 (.31) 1.5 (.59) 2. (.79) 1.5 (.59) Figure 11. Recommended soldering pattern for HSMx-C19 and C191. Figure 12. Recommended soldering pattern for HSMx-C15. Note: All dimensions in millimeters (inches). 8
9 USER FEED DIRECTION SIDE PRINTED LABEL Figure 13. Reeling orientation. 8. ± 1. (.315 ±.39) Ø 13.1 ±.5 (Ø.516 ±.2) 1.5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Figure 14. Reel dimensions. Note: All dimensions in millimeters (inches). 9
10 4. (.157) 1.5 (.59) DIM. C (SEE TABLE 1).2 ±.5 (.8 ±.2) 1.75 (.69) DIM. A (SEE TABLE 1) 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B (SEE TABLE 1) 2. ±.5 (.79 ±.2) HSMx-C11 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) 4. (.157) PART NUMBER USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (±.4) DIM. B ±.1 (±.4) COVER TAPE CARRIER TAPE DIM. C ±.1 (±.4) HSMx-C191 SERIES 1.86 (.73).89 (.35).87 (.34) HSMx-C19 SERIES 1.8 (.71).95 (.37).87 (.34) HSMx-C17 SERIES 2.3 (.91) 1.45 (.57).95 (.37) HSMx-C11 SERIES 3.4 (.134) 1.7 (.67) 1.2 (.47) HSMx-C15 SERIES 3.5 (.138) 1.88 (.74) 1.27 (.5) DIM. B (SEE TABLE 1) R 1. ±.5 (.39 ±.2) Figure 15. Tape dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 16, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS Figure 16. Tape leader and trailer dimensions. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 3 6% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 6 +/ 5 C for 2 hours. 1
11 For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (8) or (916) Europe: +49 () China: Hong Kong: (+65) India, Australia, New Zealand: (+65) Japan: (+81 3) (Domestic/International), or (Domestic Only) Korea: (+65) Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) Taiwan: (+65) Data subject to change. Copyright 24 Agilent Technologies, Inc. Obsoletes EN April 23, EN
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