Mass Transfer Technology A Key For Micro-LED Cinemas Commercialization

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1 Mass Transfer Technology A Key For Micro-LED Cinemas Commercialization Boris Kobrin, Ph.D. Sr. Associate Analyst 2018 QLED & Advanced Display Summit at Hollywood, June 27-28, 2018

2 Micro-LED Presentation Information The information in this presentation is derived from n-tech research s latest report, Micro-LED Market Opportunities: The report takes a comprehensive look into the current overall marketplace for Micro-LED technology. This includes the technology itself, potential and contemporary applications, market opportunities, and many of the key names, both established and upcoming. The full report is available for purchase on n-tech s website - 2

3 Micro-LEDs: Superior to LCD & OLED Feature/Technology LCD OLED Micro-LED Light source Backplane (LED) Self-emissive Self-emissive Power consumption High Low (20% of LCD) Very low (10% of LCD) Light efficiency Low (5-7%) Low (5-7%) High (~15%) Contrast Medium (~5K:1) Moderate (10K:1) Very high (1M:1) Response time Slow (ms) Fast (us) Very fast (ns) Operating temperature 0-60 C C C Image retention Low High None Color gamut Medium Very good Very good Black level Medium Very good Very good Brightness Low (<1K nit) Medium (1K-3K nit) Super high (> 1M nit) Lifetime Medium Short Long Resolution <800 ppi <1000 ppi Up to 10,000 ppi Viewing angle Low (108 deg) High (170 deg) High (170 deg) Curved & flexible substrates No Yes Yes Transparent substrates Poor Moderate Good Hybridization No No Yes Weight Heavy Light Light Thickness Thick Thin Thin Scalability Low (<65 ) Moderate (<88 ) High Cost (2018) Low Medium High 3

4 Micro-LED Fabrication Schemes Fully Monolithic EPI TFT or TFT EPI Projector: AR/VR, HUD or Smartwatch TFT first LED first Monolithic Hybrid EPI TFT EPI TFT Projector: AR/VR, HUD) or Smartwatch 3D integration EPI Mass Transfer TFT backplane Direct view: Smartphone, tablet, monitor, TV, video wall 4

5 Mass Transfer of Micro-LED Dies & IC chips B G R IC 5

6 Mass Transfer Methods Pick-and-place transfer (Samsung, Sony) Electrostatic MEMS (Apple/Luxvue) Electrostatic stamp (Cooledge, AUO, VueReal) Elastomer stamp or roll (X-Celeprint, ITRI, KIMM) Ultrasonic/acoustic roll (Innovasonic) Magnetic/electromagnetic stamp (ITRI) Adhesive stamp (PlayNitride, Intel) Mechanical transfer (Rohinni) Thermo-mechanical laser transfer (Uniqarta) Laser ablation transfer (Optivate) Fluidic self-assembly (Nth degree, Sharp, PSI) 6

Low -dislocation G an m aterial has been show n to im prove device perform ance and lim it nonradiative recom bination under low injection conditions [2].

grow th. Figure 4A show s a Q M A T G an -on-sapphire engineered substrate m ade to be used as a print head for m ass-transfer assem bly of m icroled s for displays.

7 Laser-Assisted Transfer 52-4 / V. R. Marinov density range of m A /cm,traditional grow th substrates can have low efficiency due to a higher value of its non-radiative recom bination param eter A. Low -dislocation G an m aterial has been show n to im prove device perform ance and lim it nonradiative recom bination under low injection conditions [2]. The engineered substrate approach can thus im prove device efficiency and lim it variability at the desired current density operating point by using high-quality G an as a seed layer for M O C V D grow th. Figure 4A show s a Q M A T G an -on-sapphire engineered substrate m ade to be used as a print head for m ass-transfer assem bly of m icroled s for displays.the grow th substrate contains num erous features that im prove dow nstream m anufacturing and m icroled device function. functionality of ea non-functional de higher m anufacturi D ue to the need fo devices on a sourc the test m ethod ca not m isclassify a unacceptable level electrolum inescent Photolum inescent EL testing, but E possible.a m icrol light excitation bu injection. Figure 2. A schematic illustrating Uniqarta, SID 2018, 52-4 Uniqarta s laser transfer process. Figure 4: QMAT QMAT, E pimax SID 2018, S ubstrate 25-3 for GaN MicroLE D Manufacturing (A= growth substrate, B= after E PI). The source substrate is preferably a double-side polished sapphire substrate that can allow the individual M icrole D s to be printed or released onto the target display plate in a very fast m anner using a back-illum inated laser beam addressing m ethod. Figure 4B includes a release of a m icroled by a laser beam im pinging Figure 5: Non- Lateral Micro Figure 5 show a po sub-50µm m icrole developed 7 by Te different J (A /cm 2

8 Adhesive Stamp Mass Transfer X-Celeprint (J. Manuf. Proc. 14, 2012 ) 8

9 Elastomeric Drum Mass Transfer Elastomeric drum with ultrasonic actuation Release Ultrasonic generator Display substrate Korea Institute of Machinery and Materials (KIMM) Innovasonic, Inc. 9

10 Figure 3b. Simulated IQE versus LED size and surface recombination velocity. Using Interposers (Cartridges) ntration GaN LED rgets, other defectivity ckplane. Veeco, SID 2018, 45-2 Figure 4. Two-step transfer approach using interposer substrate or cartridge array. 10

11 Example below shows that defect rate can be reduced by 50% by using color conversion solution. Yield Boost by Monochrome Dies with Color Conversion (Quantum Dots) uled Yield Transfer Yield Combined Defect Rate (ppm) RGB with No CC (3x transfer) RGB with CC (1x transfer) 99.9% 99.9% % 99.99% % % Nanosys, microled Day,

12 Mass Transfer Challenges Narrow process window on pick up (chip on the donor should hold firmly until pick up, but connected to it weak enough to be detached by transfer head) Mechanism of selecting chips (due to different density of chips on donor wafer vs display substrate) Narrow process window on placement (chip on the transfer head should hold firmly through the transfer process but be attachment should be weak enough to be detached to display substrate). Various effects could be used to control adhesion/attachment of chips to transfer device. Ultra-high transfer yield requirements - 9-9s ( %), since no dead pixel is allowed in current display products (without redundancy). Throughputs requirements ~ Millions dies/s Very high precision of placement (within 1 µm) Effective (in-situ) inspection/testing methods Smart rework and/or sufficient redundancy scheme 12

13 Comparison of Mass Transfer Technologies Feature/ Technology MEMS Mechanical (pin) Elastomeric stamp Laserassisted Ultrasonicassisted Fluidic selfassembly Reliability Moderate High Moderate High High Low Throughput High Low Moderate High High High Scalability Low Low High High High High Selectivity High High Low High High Moderate Success probability Low Moderate* Moderate High High Low * mini-leds only 13

14 Micro-LED Display Applications Roadmap Application Projection Micro-Displays Direct View Displays BLU Near-eye HUD projector: AR/VR Automotive HUD projector Smart watch Smart phone, Tablet TVs Monitors (<75 ) Video wall (>75 ) Digital signage LCD Backlighting Units Product Size <1 < > LED pitch <10 m <50 m <100 m <100 m <500 m 1-2 mm 500 m- 2 mm LED density ppi ppi ppi ppi ppi ppi ppi LED size 1-5 m m m m m m m Brightness 50K 500 K nit 1K 3K nit nit nit nit nit nit Critical performance advantage against OLED Brightness Resolution Response time Power consump. Weight; Size Lifetime Brightness Power consump. Response time Operation temperatures Lifetime Power consump. Integration with sensors, controllers, etc. Power consump. Integration with sensors, controllers, etc.. Brightness Lifetime Flexibility Feasibility Brightness Resolution Lifetime Cost Cost Fabrication method Monolithic/ hybrid Monolithic/ Hybrid Hybrid/ 3D Hybrid/ 3D 3D 3D 3D Commercialization advantages Low volume Moderate capex Low volume Moderate capex Low cost (less dies) Low capex No No Low volume Low price pressure Low cost Easy fabrication Commercialization challenges Yield Cost Yield Cost Yield OLEDs might be good enough Yield Cost High volumes High capex OLEDs are good Yield Cost High volumes High capex OLEDs are good Yield Cost High capex No Roadmap Short-term: Mid-term: Short-term: Long-term: Long-term: Short-term: Short-term:

15 Forecast: Micro-LED market $B micro-led Market ( ) $71B by 2027 CAGR ~ 65%

Micro-LED Market Segmentation Market Segmentation 2019 3.7% 3.7% Market Segmentation 2025 0.6% 12.

7% BLU Home Theaters Digital Cinemas Digital Signage Smartwatches AR/VR Lighting BLU Home Theaters

16 Micro-LED Market Segmentation Market Segmentation % 3.7% Market Segmentation % 12.9% 2.6% 15.0% 5.5% 11.5% 15.3% 13.3% 59.0% 5.9% 5.6% 4.4% 5.2% 6.2% 10.5% 11.8% 3.7% 3.7% BLU Home Theaters Digital Cinemas Digital Signage Smartwatches AR/VR Lighting BLU Home Theaters Digital Cinemas Digital Signage TVs Smartphones Smartwatches Automotive HUD AR/VR Lighting 3D-printers Lithography LiFi 16

Micro-LED Digital Cinema Market Forecast Micro-LED Digital Cinema Market 2018-2027 8 7

17 Micro-LED Digital Cinema Market Forecast Micro-LED Digital Cinema Market $7B by 2027 CAGR ~ 60%

18 Contact Us facebook.com/pages/n-tech-research twitter.com/ntechresearch linkedin.com/in/n-tech-research Ntechresearch.com/rssfeeds Address: n-tech Research PO Box 3840 Glen Allen, VA Telephone / Fax / Web info@ntechresearch.com 18

MicroLED Displays: Global Trends & Opportunities for Equipment and Material Suppliers

Picture: Sony From Technologies to Market MicroLED Displays: Global Trends & Opportunities for Equipment and Material Suppliers SEMICON EUROPA Jean-Christophe ELOY - CEO - Yole Développement 2017 AGENDA