MAXIM INTEGRATED PRODUCTS
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1 RELIABILITY REPORT FOR PLASTIC ENCAPSULATED DEVICES May 4, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1/5
2 Conclusion The successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards. Table of Contents I....Device Description V....Quality Assurance Information II....Manufacturing Information III....Packaging Information VI....Reliability Evaluation IV....Die Information...Attachments I. Device Description A. General The MAX17108 includes a 10-channel high-voltage level-shifting scan driver and a VCOM amplifier. The device is optimized for thin-film transistor (TFT) liquid-crystal display (LCD) applications. The high-voltage level-shifting scan driver can swing from +38V to -12V and can swiftly drive capacitive loads. There are two positive supply inputs, which provide flexibility for system design. The operational amplifier features rail-to-rail output, high short-circuit output current, fast slew rate, and wide bandwidth. The MAX17108 is available in a 28-pin, 5mm x 5mm, lead-free thin QFN package with a maximum thickness of 0.8mm for thin LCD panels. Maxim Integrated Products. All rights reserved. Page 2/5
3 II. Manufacturing Information A. Description/Function: 10-Channel High-Voltage Scan Driver and VCOM Amplifier for TFT LCD Panels B. Process: S45URS C. Number of Device Transistors: 2918 D. Fabrication Location: Texas E. Assembly Location: UTL Thailand F. Date of Initial Production: October 21, 2008 III. Packaging Information A. Package Type: 28-pin TQFN 5x5 B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive Epoxy E. Bondwire: Au (1.0 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: # H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per Level 1 JEDEC standard J-STD-020-C J. Single Layer Theta Ja: 47 C/W K. Single Layer Theta Jc: 2.1 C/W L. Multi Layer Theta Ja: 29 C/W M. Multi Layer Theta Jc: 2.1 C/W IV. Die Information A. Dimensions: 60 X 128 mils B. Passivation: Si 3N 4/SiO 2 (Silicon nitride/ Silicon dioxide C. Interconnect: Aluminum/0.5% Cu D. Backside Metallization: None E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn) F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO 2 I. Die Separation Method: Wafer Saw Maxim Integrated Products. All rights reserved. Page 3/5
4 V. Quality Assurance Information A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering) Bryan Preeshl (Managing Director of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135 C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows: = 1 = 1.83 (Chi square value for MTTF upper limit) MTTF 192 x 4340 x 46 x 2 (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV) = 23.3 x 10-9 = 23.3 F.I.T. (60% confidence 25 C) The following failure rate represents data collected from Maxim s reliability monitor program. Maxim performs quarterly 1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at Current monitor data for the S45URS Process results in a FIT Rate of 25C and 55C (0.8 ev, 60% UCL) B. Moisture Resistance Tests The industry standard 85 C/85%RH or HAST testing is monitored per device process once a quarter. C. E.S.D. and Latch-Up Testing The PF52 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-100 ma, 1.5X VCCMax Overvoltage per JESD78. Maxim Integrated Products. All rights reserved. Page 4/5
5 Table 1 Reliability Evaluation Test Results TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES Static Life Test (Note 1) Ta = 135 C Biased Time = 192 hrs. DC Parameters 47 0 Moisture Testing (Note 2) 85/85 Ta = 85 C RH = 85% Biased Time = 1000hrs. DC Parameters 77 0 Mechanical Stress (Note 2) Temperature Cycle -65 C/150 C 1000 Cycles Method 1010 DC Parameters 77 0 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data Maxim Integrated Products. All rights reserved. Page 5/5
MAXIM INTEGRATED PRODUCTS
RELIABILITY REPORT FOR MAX7456EUI+ PLASTIC ENCAPSULATED DEVICES March 10, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
Device Features NF = 0.91 db @ 900MHz at RF connectors of Demo board Gain = 22.0 db @ 900 MHz OIP3 = 36.0 dbm @ 1900MHz, 38.0 dbm @ 2450MHz Output P1 db = 20.5 dbm @ 900/1900/2140 MHz 5V/75mA, MTTF > 100
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
Device Features OIP3 = 28 dbm @ 1900 MHz Gain = 16 db @ 1900 MHz Output P1 db = 15.5 dbm @ 1900 MHz 50 Ω Cascadable Patented temperature compensation Lead-free/RoHS-compliant SOT-89 SMT package Product
Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
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Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.
Device Features OIP3 = 30 dbm @ 1900 MHz Gain = 16.4 db @ 1900 MHz Output P1 db = 17 dbm @ 1900 MHz 50 Ω Cascadable Patented temperature compensation Lead-free/RoHS-compliant SOT-89 SMT package Product
Typical Performance 1. 2 OIP3 _ measured with two tones at an output of 7 dbm per tone separated by 1 MHz. Absolute Maximum Ratings
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Features. = +25 C, LO = 0 dbm, Vcc = Vcc1, 2, 3 = +5V, G_Bias = +2.5V *
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Page 1 The is a passive double balanced MMIC mixer. It features excellent conversion loss, superior isolations and spurious performance across a broad bandwidth, in a highly miniaturized form factor. Accurate,
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v1.117 HMC326MS8G / 326MS8GE AMPLIFIER, 3. - 4. GHz Typical Applications The HMC326MS8G / HMC326MS8GE is ideal for: Microwave Radios Broadband Radio Systems Wireless Local Loop Driver Amplifier Functional
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Features 46. dbm OIP3 @.8 GHz 1. db Gain @ 2 GHz.0 db Gain @ 6 GHz 30.0 dbm P1dB SOT-89 Package Functional Block Diagram General Description The X is a high linearity Hetrojunction Field Effect Transistor
Decorative lighting. Decorative Light
Filament Series Filament 75V Datasheet Decorative Light Decorative lighting Clothing Store Lighting Hotel Lighting Bulb Commercial Lighting Introduction : Filament 75V use packaging technology and serial
Product Specification PE613050
PE63050 Product Description The PE63050 is an SP4T tuning control switch based on Peregrine s UltraCMOS technology. This highly versatile switch supports a wide variety of tuning circuit topologies with
Features. = +25 C, LO = 50 GHz, LO = +12 dbm, USB [1] Parameter Min. Typ. Max. Units. RF Frequency Range GHz. LO Frequency Range GHz
![Features. = +25 C, LO = 50 GHz, LO = +12 dbm, USB [1] Parameter Min. Typ. Max. Units. RF Frequency Range GHz. LO Frequency Range GHz](/thumbs/95/123253929.jpg "Features. = +25 C, LO = 50 GHz, LO = +12 dbm, USB [1] Parameter Min. Typ. Max. Units. RF Frequency Range GHz. LO Frequency Range GHz")
Typical Applications The is ideal for: E-Band Communications Systems Test Equipment & Sensors Military End-Use Automotive Radar Functional Diagram Features Passive: No DC Bias Required Low LO Power: 12
3528 1W 3 Series White
PLCC Series 3528 1W 3 Series White Datasheet PLCC Series Bulb Floor Lamp Wall Light General Tube Light Lighting Introduction : Ultra high luminous efficacy, combined with the flexibility in design due
SKY LF: GPS/GLONASS/Galileo/BDS Low-Noise Amplifier
DATA SHEET SKY65624-682LF: GPS/GLONASS/Galileo/BDS Low-Noise Amplifier Applications GPS/GLONASS/Galileo/BDS radio receivers ENABLE Compass (Beidou) Smartphones Tablet/laptop PCs Enable Personal navigation
15-32 GHz GaAs MMIC Voltage Variable Attenuator EWA4001YB. Voltage Variable Attenuator - Packaged. Device Photo. Features.
- Packaged EWA41YB February 211 Rev 1 Features Broadband Performance: to 32 GHz Dynamic Range: 2 db @ 23 GHz, typical Input IP3: +21 dbm, typical Dual Voltage Control: -1. to V ESD Protection Bias Circuitry
Bulb Down Light Decorative Light
PLCC Series PLCC Series 5630B HE CRI80 Datasheet Bulb Down Light Decorative Light Tube Light Track Light Panel Light Introduction : Edison PLCC 5630B HE series have Ultra high luminous efficacy, combined
Features. = +25 C, LO = 0 dbm, Vcc = Vcc1, 2, 3 = +5V, G_Bias = +2.5V *
Typical Applications The is Ideal for: Cellular/3G & LTE/WiMAX/4G Basestations & Repeaters GSM, CDMA & OFDM Transmitters and Receivers Features High Input IP3: +38 dbm 8 db Conversion Loss @ 0 dbm LO Optimized
Typical Performance 1
Device Features Internally matched to 50 ohms Operated at 3.0V and 5.0V 37.5 dbm Output IP3 at 0dBm/tone at 700MHz 22.5dB Gain at 700MHz 21.1dBm P1dB at 700 MHz 0.40 db NF at 700MHz on evaluation board
Product Specification PE613010
Product Description The is an SPST tuning control switch based on Peregrine s UltraCMOS technology. This highly versatile switch supports a wide variety of tuning circuit topologies with emphasis on impedance
Features OBSOLETE. = +25 C, As an IRM. IF = MHz. Frequency Range, RF GHz. Frequency Range, LO
v.17 Typical Applications The is ideal for: Microwave Radio & VSAT Test Instrumentation Military Radios Radar & ECM Space Functional Diagram Electrical Specifications, T A = +25 C, As an IRM Parameter
6 GHz to 26 GHz, GaAs MMIC Fundamental Mixer HMC773A
FEATURES Conversion loss: 9 db typical Local oscillator (LO) to radio frequency (RF) isolation: 37 db typical LO to intermediate frequency (IF) isolation: 37 db typical RF to IF isolation: db typical Input
HMC412BMS8GE MIXER - SINGLE & DOUBLE BALANCED - SMT. Typical Applications. Features. Functional Diagram. General Description
HMCBMSGE v1.1 Typical Applications The HMCBMSGE is ideal for: Long Haul Radio Platforms Microwave Radio VSAT Functional Diagram Features Conversion Loss: db Noise Figure: db LO to RF Isolation: db LO to