CERN-LHCC Addendum ATLAS TDR 19 4 May 2012 A T L A S. Insertable B-Layer. Technical Design Report TDR

Transcription

1 CERN-LHCC Addendum ATLAS TDR 19 4 May 2012 A T L A S Insertable B-Layer Technical Design Report TDR

2 IBL TDR Addendum ATLAS Project Document No: Institute Document No. Created: 17/03/2012 Page: 1 of xx ATL-SYS-XX-XXX Modified: IBL TDR Addendum Abstract This document is an addendum of the ATLAS IBL TDR of September This document focuses on the Mixed Scenario where staves are populated in the centre with planar sensor modules and 3D sensors at the two extremities. Planar sensors will be two chips in module size and 3D single chip. Prepared by: IBL Management Board + D. Ferrere, C. Gemme, W. Trischuk. Checked by: Approved by: G. Darbo, H. Pernegger, M. Nessi, B. Di Girolamo Distribution List ATLAS IBL Collaboration for comments

3 ATLAS Project Document No: Page: 2 of 12 History of Changes Rev. No. Date Pages Description of changes 1 17/03/2012 All First Draft /04/2012 All, Sec.2.4 Overall editing. Added section /05/2012 Sec 2.3, 3 Added section 2.3 and 3

4 ATLAS Project Document No: Page: 3 of 12 Table of Contents 1 INTRODUCTION Sensor Qualification and Production Status MIXED SENSOR SCENARIO Module Layout Stave Layout Module Loading on Stave Electrical services DIAMOND BEAM MONITOR (DBM) REFERENCES... 12

5 ATLAS Project Document No: Page: 4 of 12 1 INTRODUCTION At the time the IBL TDR [1] was submitted in September 2010, the sensor technology to go in the detector was not decided yet. Three technologies were considered for the IBL: planar sensors (n-on-n and n-on-p), 3D sensors (with active or slim edge) and diamond detectors. A program of extensive testing of detector assemblies irradiated to IBL fluence of 5x10 15 n eq /cm 2 and 250 Mrad was carried on in the Spring of Results were presented to the sensor technology review in July The review panel recommendation was to investigate a mixed scenario, in which the 3D technology populates the forward region where the tracking could take advantage of the electrode orientation to give a better z-resolution after heavy irradiation. The implications of the IBL mixed scenario is presented in section 2 of this Addendum document with reference to the module, stave and services design. The Diamond Beam Monitor (DBM) [5] is presented in section [3], which is a spin-off from the IBL technology with prototype assemblies of FE-I4 and diamond sensors. The DBM is a detector that is constructed by the IBL collaboration and will only be installed, if the existing ATLAS Pixel detector will be brought to surface for replacing the Quarter Service Panels (nsqp project). 1.1 Sensor Qualification and Production Status Between the end of 2010 and early 2011, the plans for construction of the IBL were substantially modified by two facts: the change in the LHC long shutdown planning (necessary to install the IBL) and the very good results of the FE-I4A front-end chip, which raised confidence that only minor changes would be needed for the production version. The LHC shutdown to install the IBL, assumed in the IBL TDR, was for the end of The decision of LHC (Chamonix 2011) to have a long shutdown in 2013/14 created for ATLAS the serious possibility to install the IBL at this time. From all the sensor technologies under study for IBL it was considered the two that were more advanced and a more mature stage for possible production were: planar n-in-n and double side 3D sensors. It was therefore decided to restrict the qualification to these two technologies and develop FE-I4 modules to fully qualify in the test beam and at full IBL radiation dose. To fulfil this speed up schedule it was decided, in January 2011, to launch a pre-production of planar sensors from CiS i and of double side 3D sensors from CNM ii and FBK iii. The idea behind: already between 30% to 50% of the sensors by the time of the qualification phase and the subsequent sensor review. The path chosen in shortening sensor prototyping and decision, the success of the version A of the FE-I4 with minor needs for modification together with the high production yield, which shortened the production of the version B by making engineering and production in an unique run saved over one year in the schedule. Further optimizations and reduction of the originally high contingency in the schedule permits to gain the needed time to be ready for the phase 0 LHC shutdown in 2013/14. Figure 1 compares the IBL TDR schedule with the present schedule for the major detector items. The FE-I4B and sensors production are almost completed at March 31 st, confirming the schedule for such critical items. Task Name Start End Days FE-I4B Design FE-I4B Production Slim edge planar sensor production Slim edge 3D sensor production Bump-bonding production Module assembly Bare stave production & QA Module loading, testing and QA Schedule v3 (ready for installation in 2015) Ready for installation ( ) Schedue v5.3a (ready for installation in 2013) Ready for installation ( ) Figure 1: comparison between the IBL TDR schedule (version v.3) and the version prepared for the IBL installation in the 2013/14 LHC shutdown. The comparison is made for the major production items going into the detector. i CiS: Forschungsinstitut fur Mikrosensorik und Photovoltaik GmbH, Konrad-Zuse-Strasse 14, Erfurt, Germany ii CNM: Centro Nacional de Microelectronica (CNM-IMB-CSIC), Campus Universidad Autonoma de Barcelona, Bellaterra (Barcelona), Spain. See iii FBK: Fondazione Bruno Kessler (FBK), Via Sommarive 18, Povo di Trento, Italy. See

6 ATLAS Project Document No: Page: 5 of 12 The recommendation from the review panel are that both technologies fulfil the IBL requirements, and that there is an opportunity to populate the forward region with 3D where the tracking could take advantage of the electrode orientation to give a better z-resolution after heavy irradiation. The IBL collaboration, following the recommendation from the review panel, decided to complete the production of planar and 3D sensors and endorsed the proposal to build enough modules for a mixed IBL sensor scenario where 25% of 3D modules populate the forward and backward part of every stave. Full production of planar sensors will also be made to allow coverage of 100% of IBL in case this is needed. The fractions of planar and 3D sensors that can be put in the IBL are quantized by the granularity of the high voltage services, which individually bias a group of four FE-I4 equivalent area of sensors (i.e. 4 FE-I4 out of 32 in a stave). Backward/forward symmetry restricts only to a multiple of 25% the fraction of planar/3d that can populate each stave. Table 1 and Table 2 show a summary of the planar and 3D sensor production as of 31 st of March There are enough sensors from both technologies to fulfil the mixed scenario, considering the expected overall yield for the module production and stave loading. Batch # Total Received wafers Good DC tiles Yield 86.3 % 86.4 % 89.9 % 87.5 % 91.2 % 94.3 % 89.1% Table 1: Status of planar sensor production at the end of March The IBL in the 75% of planar sensors scenario has 168 tiles. Status Produced Wafers Selected Wafers Yield selected on Good tiles FBK-A10 Completed % 58 FBK-A11 Completed % 14 FBK-A12 Completed % 63 FBK-A13 In proc. (backup batch) - - CNM-1 Completed % 86 CNM-2 Completed % 85 CNM-3 In proc Total % 306 Table 2: Status of planar 3D sensor production at the end of March The IBL, in the 25% of 3D sensors scenario, has 112 tiles. Additionally to the sensors qualification and production, thin modules have been developed with both sensor technologies, making single and double chip assemblies. The prototyping was carried out with 100 µm and 150 µm thin FE-I4 chip. For the IBL, it was decided to stay with 150 µm thickness to be on the safe side to avoid unexpected yields issues. Table 3 summarizes the production of thin modules. Several such modules have been dressed with the flex hybrid and are assigned for stave 0 use.

7 ATLAS Project Document No: Page: 6 of 12 FE-I4 Planar (200µm) 3D (230µm) Total Thickness Single Chip Double Chip Single Chip FE-I4 100 µm µm Total Table 3. Modules bump-bonded at IZM iv with thin FE-I4A chips to qualify the assembly procedure. 2 Mixed Sensor Scenario This section describes the main changes from the IBL TDR design to fulfil the mixed sensor scenario. The impact of the mixed sensor scenario on the IBL construction is on the following items: Module layout and assembly. Stave layout and stave flex. Module loading on stave. Electrical services. 2.1 Module Layout The IBL module outlines for two-chip modules and one-chip modules are geometrical compatible; the physical size of a two single-chip 3D sensor assemblies has the same width as a planar two-chip module. The differences in rφ of both sensors are compatible with the overall IBL envelopes. In Table 4 are listed the geometric parameters for the sensors used in the IBL mixed scenario. Bare module assemblies will be dressed by gluing a flex hybrid circuit on the sensor side; there will be two circuits, one for single-chip 3D assembly and one for the planar double-chip assembly. Such circuits are shown in Figure 2. They will be mechanically different, but electrical very similar once the test pigtail is cut. The reason for having two flex-circuits is for easing the assembly procedure, and not for electrical connections, which will basically stay separate for each of the two FE- I4 chips. In the case of the double-chip module flex, there will be two individual wire-bonding connectors that bring the signals from the stave flex wings together. The connection step, once the modules are on the stave, is the same for single and double modules. In this way the stave with the stave flex becomes compatible for either single or double chip modules. Structure Planar 3D Gap b/w modules 205 µm 205 µm Sensor thickness 200 µm 230 µm Module width (along z) µm µm Bias tab / guard-ring extension (in rφ) 630 µm µm Table 4: main geometrical parameters of the IBL sensor used for planar and 3D sensor modules. A few special precautions have been used in the design of the module flex: The back of the flex (which is glued on the module) has used a 25µm thick polyimide film based coverlay v which is rated to stand 100V/µm to hold the 1000V needed by the planar modules once they have received their full integrated radiation dose. It was sensible considered to maintain the same for the 3D modules, even if it is planned to have V as the maximum operation voltage. Increase in radiation length is low. The high voltage capacitors will be encapsulated using an isolating resin. One candidate is a Polyurethane resin (PUR) vi that was used for the ATLAS SCT. iv Fraunhofer IZM-Berlin, Gustav-Meyer-Allee 25, Berlin v SF302C polyimide film from Shengyi ( vi VU 4453 from Peters (

8 ATLAS Project Document No: Page: 7 of 12 Figure 2: Module Flex Hybrid for single chip (left) and double chip module (right). The flexes come with a pigtail and a test connector, which is cut away before loading on stave. The stave flex wing is glued on the module flex and then connections are provided by wire bonding. The double chip flex is electrically equivalent to two single chip ones. The clock and data signals, which are individual lines on the stave flex, are routed separately on the double module flex to the input of two FE-I4s. Each line is terminated with a 160Ω resistance. This is acceptable being the two stubs only 4 cm long and the frequency of the signals are 40/20 MHz for the clock/data. Single-chip modules use the same routing topology on two separated flexes. FE-I4 chip ID addresses are differentiated by a pull-up wire-bond connection to VDD. This is needed to differentiate the two FE-I4 chips in a module. For the double-chip module, an additional wire-bond is used for only one of the two chips. In case of single-chip module, the wire-bond of one of the two chips making a logical module will have the wire-bond pulled out. The module flexes are produced with a surrounding frame having precision holes for positioning pins in the mounting jigs. When the pigtail is cut, such frames are removed and the modules can then picked up by vacuum tools. This is done at the last moment, before loading to the stave. All tooling and jigs for assembling the modules are made such as to be compatible with both designs. The module testing is done using the USBPix R/O system. Two USBpix systems are connected in master/slave configuration to a double-module using the test connector and an adapter card. Both single and double-chip modules uses the same adapter cards; double modules use additional pin for the extra signal on the test connector. 2.2 Stave Layout The mixed sensor scenario stave layout is shown in Figure 3. The 3D sensors populate the 2 extremities. The area covered with planar and 3D sensors is, respectively, 75 % (equivalent to 24 FE-I4 chips) and 25 % (equivalent to 8 FE-I4 chips). The modules have a fixed gap of 205 µm. The planar and 3D differ slightly in thickness: respectively, 200 µm and 230 µm; and in the rφ the 3D being 700 µm longer. The 3D design floorplan was made compliant for the double and single side design (active edge), where the high voltage connection is foreseen on the same side of the bump-bonding. For this reason the sensor needs to extend over the FE-I4. The Figure 4 shows a cross-section of the stave, (left) at the position of a planar double chip module and (right) at a position where a 3D single chip module is situated.

9 ATLAS Project Document No: Page: 8 of 12 Figure 3: Stave layout for the mixed sensor scenario. 3D sensor modules populate the two stave extremities. The gap between module is fixed of 205 mm. Figure 4: stave cross section at position of a planar module (right) and a 3D module (left). 2.3 Module Loading on Stave The module loading consists of integrating the stave plus stave-flex together with the planar and 3D detector modules while targeting for the highest quality in term of working pixel and modules and, as well, the long term reliability. The 16 procedure steps, which are followed by the module loading and QA site are: 1. The reception tests of stave completed with the stave-flex. This is part of the QA to validate that the stave with the glued stave-flex has a conformal geometry after it is made and has thermally cycled 10 times from -40 C to +40 C. 2. The reception tests of modules. Detector modules qualified at the assembly sites pass visual inspection and basic electrical readout tests at loading site, before the module-flex test pigtail is cut to finally load them on stave. 3. A Guillotine tool cuts the module pigtail. The next operation consists in the removing the wire bonds from the pads that will be used to connect the stave-flex wings. The same pads are used to electrical connect the module test pigtail before loading the module to the stave (see Figure 2). 4. The modules are loaded on the 1 st half of the stave (Figure 5). Six planar and four 3D modules are positioned using precise mechanical references (dowel pins). Module placement accuracy is based on the sensor dicing accuracy, which is +/- 10 microns. The gap between modules of 205 µm (see Figure 3) is fixed by polyimidecoated shims having a thickness of 190 µm. 5. The modules are loaded on the second half stave with the same positioning technique. 6. The 32 flex-wings that are retracted during loading are then released and glued on the module flex with Araldite 2011 (epoxy glue) (see Figure 5). 7. Once the wings are glued, the electrical interconnection between the module-flex and the stave-flex (wings) is done by wire-bonding. Multiple wire-bonds are used for redundancy. The connections bring FE-I4 power and I/O LVDS signals, sensor bias and connections to NTC temperature sensors placed on the module-flexes. Test wirebonds are then pulled up to measure pull force and control the quality of process. 8. The loaded stave is electrically connected through an adapter card ( PCB saver ) to the readout system and cooled by a CO2 system. This step qualifies the stave in near to real operating conditions. Reworking is done in case of needs before moving to CERN for integration into the IBL. 9. Module position is surveyed with respect to stave references. 10. Stave thermal cycling. Ten thermal cycles from -40 C to +40 C are foreseen in the QC procedure. Assembly weaknesses and infant mortality is detected by this means. 11. Survey is repeated and the results are compared with the one from step 9. If displacements or distortions are seen, rework will have to be considered. Such positions are recorded and will be used for initial alignments of the detector modules in the IBL.

10 ATLAS Project Document No: Page: 9 of Complete functional test with cooling and R/O. This test checks integrity and full functionality of all the modules. Bump integrity can be checked with pixel noise measurement without sensor bias: lower noise value on pixel channels is indicator of disconnected bumps. 13. Staying inside envelope is requested by the tight clearance in the IBL. This is particularly critical with respect the neighboring staves where minimal distance is as small as 0.8 mm. Stave-flex wings are the ones that need highest attention. 14. The last operations on the stave is the add of an insulation spacer in the gap between module groups sharing the same sensor bias and a spacer protecting wire-bonds from mechanical damage in case of touching another stave during integration in IBL. 15. The stave is finally transported to CERN SR1 surface building for extensive QA test: burn-in, source scan test and cosmic tests. Each stave, before loading with modules, is mounted onto a handling frame support jig (see Figure 6). The stave stays on the handling frame for all the life, until is integrated as a long (7 m) object (stave + internal services) around the beam-pipe in the IBL. This minimizes mechanical stress in handling staves. The handling frame is made of carbon fibre reinforced plastic (CFRP). Its CTE is about zero and very close to that of the stave. In this way the large thermal excursion during the thermal cycles does not affect the stave with mechanical stress. Figure 5: Tooling to load modules on stave. On the right side are visible 4 3D single-chip sensors, while other 6 double-chip planar sensor modules are shown toward the centre of the stave. Modules are placed with respect to the cut edge of the sensors. In the 200µm gap between modules is placed a peek spacer to electrically isolate neighbour sensors. Bottom left illustration is showing a planar module loaded with ~40g. The bottom right illustration is showing the wing to module flex gluing operation with a jig defining the wing shape during the polymerization.

11 ATLAS Project Document No: Page: 10 of 12 Module thermal contact to the stave is guaranteed by thermal grease, which has been qualified for IBL radiation requirements. Two drops of araldite are added to mechanically stabilize the module attachment to stave. The loading tools consist of almost 80 mechanical parts that are linked to the cradles for the various operations. Few of them are specific to the module geometry like: the grease mask, the alignment ruler and guides, the loading weight. The basic tooling set is therefore compatible for a scenario with different fractions of 3D and planar sensor modules: 25/75 mixed scenario or, in case is needed, full planar scenario. Figure 6: CFRP Handling Frame holding a real stave with mechanical fixation at the two end-blocks and at the middle of the stave (mounted as integrated around the beam pipe). One handling frame is dedicated per loaded stave for all loading, QA and integration operations. 2.4 Electrical services Electrical services have been designed maintaining compatibility between planar and 3D sensors. In particular the high voltage maximum rating of all the components is designed for 1000 V, needed for the bias voltage of the planar sensors when they reach the integrated radiation dose. The modularity in the sensor bias voltage was decided as best compromise between having every single sensor tile controlled individually and the constraints coming from service routing. This modularity was defined in the IBL TDR being a sensor area equivalent to 4 FE-I4 chips. This is maintained in the mixed scenario. The planar and 3D sensors will see quite different operating voltages before and after irradiation. For this reason they need to be connected to separate HV supplies. This constraint, together with the modularity in the sensor power distribution, requires having a minimum modularity of 4 FE-I4 chips equivalent in area for each sensor flavour. The additional backward-forward symmetry in the stave limits to multiples of 25% (8 out of 32 FE-I4 chip area per stave) the coverage with any of the two technologies. The 25% (3D) / 75% (planar) scenario will use two bias lines for the 3D and 6 lines for the planar sensors in each stave. For the 3D it is planned to use sensors from both CNM and FBK. They are similar in operation voltage, but for optimal control of operational settings each HV channel will be connected to only one of the two 3D sensor flavours. The bias current requirement for the HV power supply is defined by the sensor leakage current after integrated dose at the operation temperature. From measurements made during the sensor qualification phase it is found that the planar and 3D sensor have similar currents, which are µa for an area of a FE-I4 chip at -15ºC after a dose of 5x10 15 n eq /cm 2 [2]. The difference in the range of operating voltages between planar and 3D suggests the selection of different models of HV power supplies. The two models of power supplies from iseg vii : Mod. EHS F205n_R51: V outnom = 500 V / I outnom = 10 ma per channel Mod. EHS F210n_R51: V outnom = 1000 V / I outnom = 10 ma per channel vii iseg GmbH, Bautzner Landstr. 23, D Radeberg / OT Rossendorf

12 ATLAS Project Document No: Page: 11 of 12 is an optimal solution to fulfil the sensor requirements. The Pixel detector uses HV power supply from the same series. This additionally simplifies the control and monitor software in the experiment. 3 Diamond Beam Monitor (DBM) Beam monitoring, luminosity measurement and tracking in ATLAS, in the future, must continue to operate in radiation environments at least an order of magnitude harsher than experienced by the current detectors. We observe that, as the environment becomes harsher, detectors lacking fine spatial or timing granularity are challenged to separate of signal from background. To remedy this problem, detectors close to the interaction region are becoming ever more highly spatially segmented. We propose to add the Diamond Beam Monitor (DBM) [5] to ATLAS, which is a spatially segmented upgrade to complement the timing granularity of the existing Beam Crossing Monitor (BCM). Chemical Vapour Deposition (CVD) diamond has a number of properties that make it an attractive alternative for highenergy physics detector applications. Its large band-gap (5.5 ev) and large displacement energy (42 ev/atom) make it a material that is inherently radiation tolerant with very low leakage currents and high thermal conductivity. ATLAS already uses this material in its highly time-segmented (sub-ns) BCM that provides stable luminosity measurements and detailed background characterisations in both during stables beams and while the LHC machine is setting up for collisions. The DBM capitalises on R&D undertaken for the diamond bid to be the IBL sensor. We produced 20 single-chip FE-I4 modules with diamond sensors in When the IBL insertion schedule was advanced to 2013 it was not possible to produce the more than 500 diamond sensors in time to meet the IBL schedule. Instead, we propose to install 24, single-chip IBL modules, with diamond sensors in the forward region of ATLAS, at r = 65 mm from the beam line and z ~ 1m, at rapidities from 3.0 to 3.4. Figure 7 shows two views of the DBM telescopes (on one side of ATLAS the full system has similar arrangements on both sides of ATLAS). Each telescope consists of three single-chip sensors, spread over a 10 cm lever arm. Parametric tracking simulations show this arrangement gives impact parameter resolution of better than 1 mm for tracks from the interaction point (IP) and allowing us to distinguish them from charged particles originating in the up/down-stream collimators. Figure 7: CAD view of the DBM telescopes inside the new Service Quarter Panels (nsqp) [6]. Left: An isometric view of the four telescopes, with their type-0 cables (orange) and PP0 patch panels (green) mounted on the innermost nsqp cruciform. Right: Details of the DBM cooling channel (blue) and it s connection to the from SQP cooling channel (red) between the quarter panel (brown) that will be in place when the DBM telescopes are mounted in July Even for µ = 40 (µ is the mean events number per bunch-crossing) we expect an average of 4 tracks per telescope from the IP. Initial pattern recognition studies show that the DBM modules will have the granularity to un-ambiguously reconstruct 10 or more tracks per telescope arm with low fake-rates. We are implementing a full GEANT model of the DBM in the ALTAS/IBL/Pixel simulation and will continue performance studies for proton collisions, detector albedo/afterglow and representative beam loss and beam-gas background samples, in the coming months. Conversely for µ = 40 we expect to acquire 10,000 tracks per bunch-crossing over a period of one minute, allowing a 1% precision on the bunch-by-bunch luminosity on a time-scale comparable to the basic ATLAS luminosity block. This should not only preserve the precision of the current BCM luminosity measurements, as the LHC rates continue to increase, but also make it more robust as we get to higher doses with correspondingly higher albedo and background rates. Beyond the DBM patch-panel 0 (the green quarter-circle boards in Figure 7) the signals are bundled into cables that are identical to the IBL half-staves. These, in turn, will feed standard IBL type-2 services and IBL RODs. The DBM event fragments will appear as two additional IBL half-stave. The DBM channels will have twelve FE-I4 chips worth of data instead of the sixteen in a real IBL half-stave. The DBM modules will be powered with standard IBL low-voltage (LV) and high-voltage (HV) power supply modules controlled through the standard pixel/ibl control and monitoring system. The

13 ATLAS Project Document No: Page: 12 of 12 only DBM-specific piece of the readout we are developing is an LVDS hit-bus chip that will allow us to accumulate telescope track multiplicities independent of the ATLAS data acquisition system, as a monitor of backgrounds and luminosity even when ATLAS is not taking data. We have assembled and tested ten DBM modules and are working with IZM to finalise the metallisation and bumpbonding procedures. We have studied the performance of four modules in test beams at CERN and DESY and are learning how to calibrate the charge gain for the FE-I4 chip and set the single-channel thresholds to optimise the hit efficiencies for our diamond devices. Over the last year, we have been actively working with a second diamond sensor supplier to complement our erstwhile single source of diamond sensor material. We have received four sensors from this new company that show comparable, or better, signal sizes and have placed an order for ten additional DBM sensors from this new vendor. We expect delivery of these ten additional sensors in July Finally, we have done extensive thermal and mechanical modelling of the support structure design to ensure that the DBM will be thermally neutral in ATLAS. We are beginning the process of manufacturing the mechanical parts to arrive at CERN by the end of Table 5 provides details of the remaining DBM construction and installation milestones. More details can be found in [5]. DBM Milestones Date Testbeam results from Module 0 June 1, 2012 Sensors 1-20 at IZM for module production July 1, 2012 Modules 1-15 ready for Q/A September 1, 2012 Sensors at IZM for module production November 1, 2012 Support Mechanics ready at CERN December 1, 2012 Modules ready for Q/A January 1, 2013 DBM telescopes 1-5 ready for mounting May 1, 2013 DBM telescopes 6-9 ready for mounting June 15, 2013 Mount DBM telescopes in nsqp July 1, 2013 Table 5: Milestones for DBM construction, assembly, testing and installation in ATLAS nsqp. 4 References [1] ATLAS Collaboration, ATLAS Insertable B-Layer Technical Design Report, ATLAS TDR 19, CERN/LHCC , 15 September [2] IBL Collaboration, Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip, to be published on JINST. [3] R. Klingenberg, D. Muenstermann and T. Wittig, Sensor Specifications and Acceptance Criteria for Planar Pixel Sensors of the IBL at ATLAS, ATL-IP-QA-0030, [4] C. Da Via, M. Boscardin, G. Pellegrini, G-F. Dalla Betta, Technical Specifications and Acceptance Criteria for the 3D Sensors of the ATLAS IBL, ATU-SYS-QC-0004, [5] H. Kagan, M. Mikuž and W. Trischuk, ATLAS Diamond Beam Monitor (DBM), ATL-IP-ES-0187, [6] nsqp reference..