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1 BOC-EG-6900 Example ransport Engineering Guide (EG): ellabs 1000 Digital Loop Carrier (previously known as ellabs AccessMAX and AFC UMC1000). Central Office applications. Section able of Contents Page DS Data Sheet (weight, footprint, power, heat, timing, alarms/rm, DF blocks, CLEI) 2 1 Overview 3 2 Equipment requirements 4 3 elay rack layouts 5 4 Mechanized Loop est (ML) methods 6 5 Internal aggregation 6 6 Intact DS3 transport 7 7 System connection details (except VF/DS0) System VF/DS0 connection and DF block layout/pair count/wiring color code Issue evisions Date 1 Original release of Bill Oakes Engineering Guideline for AFC UMC1000. August 6, evise into Word format. August 1, 2007 Acronyms: American Wire Gauge (AWG), Battery Distribution Fuse Board (BDFB), Central Office (CO), Competitive Local Exchange Carrier (CLEC), Digital Cross connect System-electronic (DCS), Digital Loop Carrier (DLC), Digital System Cross connect-manual (DSX), Distributing Frame (DF), Enclosed Network Extension- /CEV/Hut/Prem (ENE), Fiber Distribution Frame (FDF), Local Exchange erminal (LE), Network Element (NE), eceive (X), Support Engineering Guide (SEG), ransmit (X), Voice Frequency (VF). Bill Oakes elecom Consultants (BOC) bill.oakes@att.net, Copyright All rights reserved. 1

2 BOC-EG-6900 Data Sheet: he preface section of all BOC-EGs is a data sheet that provides quick view information for weight, relay rack footprint, peak (LIS 2)/nominal (LIS 1) power amperage, heat dissipation wattage, timing, alarms/remote management, DF block and CLEI code requirements. he data shown is an ultimate condition (relay rack fully loaded with equipment as designed in associated BOC-EG). Even though many relay rack deployments are partially equipped, BOC recommends basing initial space/engineering planning on ultimate data since existing rack layouts typically grow to conclusion without follow-up involvement by planning personnel. Category Weight Footprint Peak/LIS 2 amperage at 42.6V Nominal/LIS 1 amperage at 52V Heat dissipation iming (BIS) Alarms emote management Data sheet for CO ellabs 1000 DLC relay rack equirement emarks One relay rack: 120 pounds. One fuse panel: 10 pounds. hree heat 400 pounds baffles: 15 pounds. Eight fully equipped /0122 shelves (32 pounds each): 256 pounds. 26" wide x 12" 26" wide rack. 5" deep front guard box. 2" deep rear guard box. deep 32 amps 2 or 4 BIS CC outputs 1 discrete 1 or 2 Ethernet L1 DF blocks 9 or 6 CLEI codes (see BOC-SEG-0600 section 4) 11.2 amps 352 watts PWFYAL1CAA SBMFF30B Eight /-0122 shelves at 4 amps each. See BOC-SEG-0500 section 2 for calculation method. Eight /-0122 shelves at 1.4 amps each. Eight /0122 shelves at 44 watts each. Each ellabs 1000 DLC system requires one set of primary and secondary BIS Composite Clock (CC) outputs. One CC set for -57 (one eight shelf system) racks. wo CC sets for G-303 (two four shelf system) racks. 1 status point required on CO alarm system for ellabs 1000 rack fuse panel alarm Each ellabs 1000 DLC system requires one Ethernet L1 connection to the CO remote management system. One Ethernet for -57 (one eight shelf system) racks. wo Ethernet for G-303 (two four shelf system) Nine 100 pair blocks for -57 (one eight shelf system) or six 100 pair blocks for G-303 (two four shelf systems). See BOC-SEG-0300 section 2 or 8. If the DF is Conventional, blocks mount on vertical side. elect 0HPGM05 fuse panel. ellabs or shelf 2

3 BOC-EG Overview: his EG supports CO applications only. ellabs 1000 (previously known as ellabs AccessMAX or AFC UMC1000) is a Digital Loop Carrier (DLC) system designed to transport DS3/DS1/DS0/VF/ADSL signals between CO and ENE locations using fiber and/or copper spans. he CO end is called a Local Exchange erminal (LE). Each system can serve up to 32 ENEs with a maximum of 5 ENEs routed directly to the CO. Copper spans use a Mb/s line rate and interface with CO 1 loop equipment (1000 DLC DS1s cable to DSX-1/DCS for cross connect to 1). Fiber spans use Sonet OC3C or OC12C work/protect cards (two slots) mounted in the 1000 DLC shelves. DLCs can be elcordia -57 Universal (ENE lines interface with CO switch via DF terminated derived pairs), G-303 Integrated (ENE lines interface with CO switch via DSX-1 terminated DS1 circuits) or Mixed (mixture of Universal and Integrated). o provide flexibility for cross connecting ENE special service circuits to the CO switch, all G-303 designated 1000 DLC systems are Mixed (some shelves have derived pairs cabled to DF) DLC systems consist of eight 26 slot shelves. Shelf 1 is designated as Primary since slots 2, are used for remote management, alarm, timing and processing card functions. Shelves 2 to 8 are called Expansion. Power cards are mounted in slot on all shelves. Intra-system communication cards are mounted in shelf 1 slot 3-16 and shelves 2 to 8 slot Intra-CO DS1 and CO-ENE OC3C/OC12C cards (one X/X circuit per card) can be placed in shelf 2 slots Shelves 3 to 8 slots 1-22 have VF/DS0 cards (6 ip/ing pairs per card) for a total of 792 derived pairs. Since shelves 3 to 8 are backplane connectorized (six 25 pair connectors per shelf), 900 pairs are cabled to the DF and terminated in sequence (792 active, 108 dead). An optional OC3C or DS3 card can be placed in shelf 1 slot 1 for connection of ENE ADSL circuits (sum of all Service Provider/elco and CLEC customer ADSL at ENE locations) to the CO FDF or DSX-3/DCS (cross connects to DSL Aggregator, Ciena DN7100 for example, that separates them on a per Service Provider/elco/CLEC basis) DLC systems have an internal aggregation option with some of the top slots being used for DS3 or OC3C Service/Uplink cards (see section 5). Intact DS3 circuits can also be collected at ENE locations, fiber transported to the CO and then handed off to DSX-3/DCS via DS3 cards in mounted in Primary or slots (see section 6). G DLC systems consist of only four shelves. his frees up shelf 1 slots 3-10 (used for shelf 5 to 8 intrasystem communication cards in eight shelf -57 system) for CO-ENE OC3C or OC12C cards. Otherwise, G-303 system shelf 1 has the same functionality as -57 shelf 1. Shelf 2 slots 1-22 are used for DS1 and DLP cards. DLP card pairs are required to support CO switch Virtual Interface Groups (VIG) for integration. G-303 systems typically have only one DLP card pair but could have up to three pairs. Shelves 3 and 4 are backplane connectorized with 300 VF/DS0 pairs (264 active, 36 dead) cabled to the DF. Summarized ENE ADSL, internal Aggregation and Intact DS3 options are also available (as described above for -57). 3

4 BOC-EG Equipment requirements: his section provides part number and mounting/usage details for equipment in ellabs 1000 DLC relay racks. Layouts for -57 and G-303 systems are shown in figure 3A and 3B. he racks can be factory or field assembled (see BOC-SEG-0600 section 9). Part A and B of this section are the factory -57 and G-303 methods. Part C and J are required for both methods (factory or field). Part D to H are the field method for -57 or G-303. A) Factory assembled rack with one 8 shelf -57 system: ellabs part number provides: 1 Newton or elect 12300KW201 Unequal Flange rack (7, 1.75 x 23 drilling, 5 front welded box). 1 elect 0HPGM05 fuse panel. 24 elect 06100B-7.5 fuses (7.5 amp). 16 working and 8 spare. 16 elect designation pins for 7.5 amp fuse. 1 ellabs Primary package (see part F). 5 ellabs Expansion packages (see part G). 3 ellabs heat baffles. 1 Set of intra-rack wiring (includes part A-step 2, B, C, E and H of section 7 System connections). B) Factory assembled rack for two 4 shelf G-303 systems: ellabs part number provides: 1 Newton or elect 12300KW201 Unequal Flange rack (7, 1.75 x 23 drilling, 5 front welded box). 1 elect 0HPGM05 fuse panel. 24 elect 06100B-7.5 fuses (7.5 amp). 16 working and 8 spare. 16 elect designation pins for 7.5 amp fuse. 2 ellabs Primary packages (see part F). 2 ellabs Expansion packages (see part G). 3 ellabs heat baffles. 1 Set of intra-rack wiring (includes part A-step 2, B, C, E and H of section 7 System connections). C) Guard box (factory or field assembly): One 2 rear field mount guard box must be ordered as a separate item so that the footprint depth is 12 (5 front, 2 rear). See BOC-SEG D) elay rack (field assembly): One 7 Unequal Flange rack with 1.75 x 23 drilling code and 5 front welded guard box. See BOC-SEG E) Fuse panel (field assembly): One elect 0HPGM high. See BOC-SEG F) Primary package (field assembly): Provide one for -57 rack or two for G-303 rack. ellabs Primary package part number consists of: two wire wrap shelves; one connectorized shelf; three stand-off sets; two MU cables; two EBF3 fibers; two EBF3-BB fibers; one SNMPI cable; one Backup 1.0 ENG and shelves are 7 high, 12 deep, 19 wide (23 rack adapters included with shelf) with a flush set out (use stand-offs). G) Expansion package (field assembly): Provide five for -57 rack or two for G-303 rack. ellabs Expansion package part number consists of: one connectorized shelf; one stand-off set; one MU cable; two EBF3 fibers. H) Heat baffle (field assembly): Provide three ellabs heat baffles for -57 or G-303 rack. Baffle is 1.75 high, 9.35 deep, 23 wide with a 3.84 front set out. Baffle required between even/odd numbered shelves for routing warm air to rear aisle. Baffle space between even/odd shelves and open space between odd/even shelves is used to route intra-system communication fibers. J) Bulkhead panel (factory or field assembly): Provide one optional ellabs Bulkhead panel and Westek coax assemblies (variable quantity) for DS3 card interface with CO overhead coax. See section 7 part N, Q or. 4

5 3. elay rack layouts: BOC-EG-6900 BV or 43 Fuse panel BV or 43 Fuse panel BU or Bulkhead BU or Bulkhead B or 41 B or 41 BS or 40 BS or 40 B or 39 B or 39 BQ or 38 8 BQ or 38 4 BP or 37 Open space BP or 37 Open space BN or 36 BN or 36 BM or 35 BM or 35 BL or 34 BL or 34 BK or 33 7 BK or 33 3 BJ or Heat baffle BJ or Heat baffle BH or 31 BH or BG or 30 BG or 30 BF or 29 BF or 29 BE or 28 6 BE or 28 2 BD or 27 Open space BD or 27 Open space BC or 26 BC or BB or 25 BB or 25 Primary shelf BA or 24 BA or 24 V or 23 5 V or 23 1 U or Heat baffle U or Heat baffle or 21 or 21 S or 20 S or 20 or 19 or 19 Q or 18 4 Q or 18 4 P or 17 Open space P or 17 Open space N or 16 N or 16 M or 15 M or 15 L or 14 L or 14 K or 13 3 K or 13 3 J or Heat baffle J or Heat baffle H or 11 H or G or 10 G or 10 F or 9 F or 9 E or 8 2 E or 8 2 D or 7 Open space D or 7 Open space C or 6 C or B or 5 B or 5 Primary shelf Primary shelf A or 4 A or 4 AA or 3 1 AA or 3 1 AB or 2 AB or 2 AC or 1 AC or x x 23 FIGUE 3A FIGUE 3B Layout for one 8 shelf -57 Universal system (factory or field assembled). Provide 2" x 2" vertical fiber protection duct on left front upright down to shelf 1 level. Layout for two 4 shelf G-303 Mixed systems (factory or field assembled). Provide 2" x 2" vertical fiber protection duct on left front upright down to shelf 1 level. 5

6 BOC-EG Mechanized Loop est (ML) methods: A) Background: When customers report service problems, their line needs to be tested. In the late 1970s, the Bell System started to deploy SD2P Loop est Frame (LF) remote testing equipment (also known as ML-1). In 1981, next generation SD2P Loop est Systems (LS) were introduced (also known as ML-2). In 2001, ollgrade purchased the Lucent LF/LS product lines. ollgrade also developed their own Digital Measurement Node (DMN) version of this equipment for new testheads or replacement of old ML-1 systems. Around 1980 most Service Providers/elcos began to use CO-ENE Pair Gain (PG) systems (Lucent SLC-96 for example) for transporting customer lines on multiplexed copper pairs. Since ENE lines connect to the CO switch via derived (instead of direct local loop) pairs, SD Pair Gain est Controller (PGC) shelves were added to act as the PG-ML interface since CO switch Number est runks (N) could not be used. An industry standard 25 pair mult runs from the PGC to any CO PG systems (Lucent SLC, Nortel DMS-1, Alcatel Litespan, etc) that require this ENE test line method. Copper based PG systems transport the test circuit on separate CO-ENE Metallic est Pairs (MP). Fiber based PG systems usually insert the test circuit into their fiber overhead for CO-ENE transport. B) ellabs 1000 DLC methods: his system has the ability to fool the CO switch into thinking that -57 or G- 303 derived pairs are actually direct local loop pairs. he Primary shelf 1 slot 22 OSI card acts as an ML interface with the CO switch and then inserts a test circuit onto it s own CO-ENE overhead using the slot 21 DBP card. his eliminates the need for a PGC mult connection. Field experience with 1000 DLC G-303 systems indicates that switch ML flowthrough functions somewhat differently than the -57 method. Even though a PGC mult is still not required for G-303 systems, the testing must come through an ML DF cross connect (see section 7 part G) to a CO switch N circuit. -57 systems do not need this ML DF cross connect unless future conversion to G-303 is anticipated. When deploying new 1000 DLC -57 systems, BOC recommends that engineering vendors consult with Service Provider/elco personnel about the ML DF cross connect issue. 5. Internal aggregation: A) Overview: Service Providers/elcos and CLECs are trying their best to sell DSL service to customers. If those customers are within range of a CO they will interface the network via local loop pairs terminating on the CO MDF vertical side and cross connect to Digital Subscriber Line Access Multiplexer (DSLAM) equipment. If customers are not within range of a CO, a DLC system is deployed at the nearest ENE so DSL service can be sold from that location. Alcatel Litespan-2000/2012 DLC collects regular and DSL circuits at the ENE and groups them into separate fibers for transport to the CO. ellabs 1000 DLC groups regular and DSL circuits separately at the ENE but uses the same ENE-CO transport fiber for both groups DLC CO LE equipment then separates out the summarized group of DSL circuits for OC3C or DS3 uplink (from shelf 1 slot 1 card position) to the CO FDF or DSX-3/DCS (cross connects to DSL Aggregator, Ciena DN7100 for example, that separates them on a per Service Provider/elco/CLEC basis). o provide flexibility, ellabs has developed an internal aggregation feature for the 1000 DLC system (if Service Providers/elcos decide not to use the external DSL Aggregator method). B) ellabs 1000 DLC engineering procedures: In the CO, one 1000 DLC system is selected as the Combination (Combo) LE. Combo LE shelf 8 (if -57) or shelf 4 (if G-303) is used to mount up to eleven Aggregation cards (eight OC3C, three DS3). Four of the OC3C cards are used for a Service function. Fiber from the Service cards runs to an FDF panel. Up to four other 1000 DLC LEs (called Subtending systems in this application) have fiber run from a shelf 1, slot 1 OC3C card (summarized DSL from their ENEs). When these fiber circuits are cross connected, the Combo LE combines all five DSL sets (four Subtending LEs and the Combo LE itself via intra-system fiber). he Combo LE then divides DSL signals into Uplink groups (up to seven) on a per Service Provider/elco/CLEC basis. OC3C (up to four) or DS3 (up to three) cards are used to hand-off the Uplink groups via FDF or DSX-3/DCS cross connect. Since internal Aggregation requires broadband capability, the two EBF3 fibers used for intra-system communication (see section 2G) must be replaced with EBF3-BB. o provide flexibility, Expansion shelves planned for internal Aggregation should still have all VF/DS0 pairs cabled to the DF. 6

7 BOC-EG Intact DS3 transport: Some ENE locations may include equipment with a DS3 Line side (Mux in CEV or adjacent Cell site for example) that requires fiber transport to a CO DLC CO-ENE OC3C and OC12C spans have optional pipes within the optical bandwidth for full DS3 channels. Since system entry and exit is at the DS3 level (no multiplexing of external lower speed signals) this feature is called Intact DS3. LE mounted DS3 cards hand-off the signal to DSX-3/DCS for CO cross connects. A similar feature is available on Alcatel Litespan Each 1000 DLC CO LE Intact DS3 must be completely associated with one ENE location (cannot split DS3 between multiple ENEs). CO-ENE spans can transport one Intact DS3 if OC3C or up to four Intact DS3s if OC12C. If the LE is -57, any combination of up to four Intact DS3s is allowable from up to 4 ENE locations. his can be 1 DS3 for each of 4 OC3C ENEs, 4 DS3 from 1 OC12C ENE, 2 DS3 from each of 2 OC12C ENEs, 1 DS3 from 1 OC3C ENE and 3 DS3 from 1 OC12C ENE, etc. If the LE is G-303, any combination of up to four Intact DS3s is allowable from up to 2 ENE locations. his can be 1 DS3 from each of 2 OC3C ENEs, 4 DS3 from 1 OC12C ENE, 2 DS3 from each of 2 OC12C ENEs, 1 DS3 from 1 OC3C ENE and 3 DS3 from 1 OC12C ENE, etc. Depending on the system configuration, Intact DS3 cards can mount in Primary shelf 1, 2, 4 (G-303 system only) or 8 (-57 system only). Engineering vendors should consult with Service Provider/elco personnel regarding Intact DS3 slot assignments. o provide flexibility, Expansion shelves planned for Intact DS3 should still have all VF/DS0 pairs cabled to the DF. 7. System connection details (see section 8 for VF/DS0): A) Fuse panel: Step 1 for factory or field assembled racks (Dual load redundant input feeders from BDFB): See BOC-SEG section 11 for BDFB fuse/feeder sizing responsibility and BOC-SEG-0700 section 9 for wire material. Provide 4 two hole lugs (.25 studs on.625 centers) for input feeder connections (wire size determined by vendor based on job conditions). LIS 2 for 8 shelf 1000 DLC rack is 32 amps at 42.6V (see BOC-SEG-0500 section 2 for calculation method). Step 2 for field assembled racks only (Chassis ground): Provide 1 two hole lug (No.10 studs on.625 centers) for 6 AWG wire. Connect lug to relay rack ground using 6 AWG wire (see BOC-SEG-0700 section 7 and 9). Step 3 for factory or field assembled racks (Alarms): un 24 AWG Black and ed-black wire pair (see BOC- SEG-0700 section 8) from fuse panel set NO/C wire wrap pins to CO alarm system (Dantel for example) status point. No connection required for V and A set pins. B) Power for or shelf: Step 1 for field assembled racks only: Connect DC IN A and DC IN B N (-48V) and P (N) lugs to rack fuse panel output positions using 16 AWG Black/ed-Black wire pair (see BOC-SEG-0700 section 8). Use ed-black lead for -48V and Black lead for N. ellabs ring terminals provided with shelf. Provide homas & Betts (or generic equivalent) B484 ring terminals for fuse panel end. Maximum drain is 4 amp. Shelf has 5 amp internal fuses. Fuse externally at 7.5 amp (see BOC-SEG-0500 section 14). Snap Ferrite clamp (provided with shelf) around the power leads as close as possible to shelf. C) Chassis ground for or shelf: Step 1 for field assembled racks only: Connect DC IN A G lug to relay rack ground using spare 16 AWG Black wire from part B. ellabs ring terminal provided with shelf. No connection required for DC IN B G lug since internally common with DC IN A G. 7

8 BOC-EG-6900 D) iming for Primary shelf only: Step 1 for factory or field assembled racks (esistors and strap wire): hree 133 Ohm resistors (one is spare) are provided with the Primary package. On the rear side of shelf slot 19, mount one resistor across pins 3-3 and one across pins 4-4. Provide a short length of 22 AWG Black wire (see BOC-SEG-0700 section 8). Use the wire to add rear side straps between slot 19 pin 4 to slot 20 pin 4, slot 19 pin 4 to slot 20 pin 4, slot 19 pin 3 to slot 20 pin 3, slot 19 pin 3 to slot 20 pin 3. Step 2 for factory or field assembled racks ( external timing cables): See BOC-SEG-0100 section 9 for methods. un two single pair timing cables from shelf to CO BIS distribution equipment Composite Clock outputs. Connect primary pair to shelf slot 20 pins 3 (LX lead), 3 (LY lead) and secondary pair to slot 20 pins 4 (LX lead), 4 (LY lead). Do not ground cables at shelf end (no capacitive ground feature). E) iming for or only: Step 1 for field assembled racks only: his connection is only required when there is a possibility that cards on a or will provide DDS related service. Engineering vendors should consult with Service Provider/elco personnel. If future DDS related service is uncertain, BOC recommends making this connection on all Expansion shelves during the initial rack installation (may prevent having to do follow-up job at a later date). See BOC-SEG-0100 section 9 for methods. Provide two single pair timing cables for intra-system connection from each (rear side Alarm Contact Pinfield) to Primary shelf (rear side 1/1 pins for associated slot 3 to 16 intra-system communication cards). pin details are A7 for Primary LX lead, B7 for Primary LY, C3 for Secondary LX, D3 for Secondary LY and D6 for drain wire connection of both cables (do not ground cables at Primary shelf end). Primary shelf details are slot 15/16, 13/14, 11/12, 9/10, 7/8, 5/6, 3/4 for 2 to 8 Primary/Secondary timing respectively and pin 1 (LX lead), 1 (LY lead). F) emote management for Primary shelf only: Step 1 for factory or field assembled racks (wiring of stub cable): Primary package (section 2F) includes one SNMPI stub cable that must be wired to the rear side pins of Primary shelf slot 2. Wire stub cable W-G lead to pin 5, G-W lead to pin 5, W-O lead to pin 2, O-W lead to pin 2. his establishes an Ethernet 10BASE- circuit on the stub cable J45 connector (pin 1 is X+, pin 2 X-, pin 3 X+, pin 6 X-). Step 2 for factory or field assembled racks (external remote management cable): un electrical Ethernet cable with straight pinning (see BOC-SEG-0100 section 10) from shelf slot 2 stub cable J45 connector to CO emote management Ethernet hub equipment. G) Mechanized Loop est for Primary shelf only: Step 1 for factory or field assembled racks (external wiring to DF): See section 4B for requirements. un one 24 AWG quad (see BOC-SEG-0700 section 8) from Primary shelf rear side slot 22 pins (pin 1 for ip lead, 1 for ing lead, 3 for Inhibit lead) to a DF block location as designated by Service Provider/elco personnel. One lead in the quad wire is spare. erminate and stencil leads on one DF block pin column in ip, ing, Inhibit sequence. H) Metallic est mult for or only: Step 1 for field assembled racks only : Primary and Expansion packages (section 2F and 2G) include one MU cable for an intra-system Metallic est mult between shelves. Connect this cable from the MU P33/P34 plug on succeeding to the MU P31/P32 plug on preceding Primary or. 8

9 BOC-EG-6900 J) Intra-system fiber for or only: Step 1 for factory or field assembled racks: Primary package (section 2F) includes two EBF3 fiber assemblies and two EBF3-BB fiber assemblies for intra-system communication. Connect EBF3-BB fibers from (ELU connector on front side of slot 23/24 EBC cards) to Primary shelf (EBC connector on front side of slot 15/16 ELU cards). Connect EBF3 fibers from 3 (ELU connector on front side of slot 23/24 EBC cards) to Primary shelf (EBC connector on front side of slot 13/14 ELU cards). Expansion package (section 2G) includes two EBF3 fiber assemblies. Connect EBF3 fibers from 4, 5, 6, 7, 8 (ELU connector on front side of slot 23/24 EBC cards) to Primary shelf (EBC connector on front side of slot 11/12, 9/10, 7/8, 5/6, 3/4 ELU cards respectively). K) DS1 for only: Step 1 for factory or field assembled racks: Each system can have up to 22 DS1 circuits (card slots 1-22 on ). Some of the slots may be needed for CO-ENE fiber cards or DLP cards per section 1. Engineering vendors should consult with Service Provider/elco personnel about the number of DS1 circuits and their card positions. un one DS1 X cable and one DS1 X cable (see BOC-SEG-0100 section 6 and 14) from shelf to DSX-1 or DCS equipment. Shelf X pins 5/5 connect to DSX-1 OU or DCS IN. Shelf X pins 2/2 connect to DSX-1 IN or DCS OU. Connect shelf X cable drain wire to pin 6 and shelf X cable drain wire to pin 1 (do not ground cable at DSX-1/DCS end). L) CO-ENE span fiber for Primary or 2 only: Step 1 for factory or field assembled racks: Engineering vendors should consult with Service Provider/elco personnel about the number of OC3C/OC12C span fiber circuits and their card positions. Each circuit requires two cards (work and protect). Each card has one set of X/X ports with SC connectors. un the required number of fiber conductors (see BOC-SEG-0400) from shelf to the FDF. Per section 3 figure 3A, 3B, vertical duct material should be provided on the left front upright for protection and management of fiber conductors. M) Summarized DSL fiber for Primary shelf only: Step 1 for factory or field assembled racks: See section 1 and 5B for overview of shelf 1 slot 1 summarized DSL fiber. Engineering vendors should consult with Service Provider/elco personnel. If required, the OC3C card has one set of X/X ports with SC connectors. un two fiber conductors (see BOC-SEG-0400) from shelf to the FDF. N) Summarized DSL DS3 for Primary shelf only: Step 1 for factory or field assembled racks (coax assemblies): See section 1 and 5B for overview of shelf 1 slot 1 summarized DSL DS3. Engineering vendors should consult with Service Provider/elco personnel. If required, the DS3 card has one set of X/X ports with SMB connectors. Provide two Westek ( D /10 (10 foot) G-179 coax assemblies (factory formed with SMB on one end and BNC on the other end). oute coax from DS3 card to plate 42 in rack. Step 2 for factory or field assembled racks (bulkhead panel): Provide (unless already provided for part ) one ellabs Bulkhead panel and mount at plate 42 in rack. Panel is 1.75 high and 19 wide (23 rack adapters included with panel). he panel has a front side designation strip and 24 BNC positions. For every set of two BNCs, stencil the strip as X 1 X, X 2 X, etc reading left to right in alignment with the 24 BNCs (result will be 12 sets of X/X). Connect the Westek coax (X from DS3 card to X on panel, X to X) to bulkhead panel front side X/X-1 (if -57 system or first G-303 system in rack) or X/X-2 (if second G-303 system in rack). Step 3 for factory or field assembled racks (coax to DSX-3/DCS): un two coax conductors from bulkhead panel rear side to DSX-3 or DCS (see BOC-SEG-0200 section 4, 5, 6). wo straight BNC connectors required for bulkhead panel. Bulkhead X connects to DSX-3 OU or DCS IN and X connects to DSX-3 IN or DCS OU. 9

10 BOC-EG-6900 P) Aggregation fiber for 4 or 8 only: Step 1 for factory or field assembled racks: See 5B for background on 4 (G-303 system) and 8 (-57 system) Aggregation fiber. Engineering vendors should consult with Service Provider/elco personnel about the number of OC3C circuits and their card positions. If required, each card has one set of X/X ports with SC connectors. un the required number of fiber conductors (see BOC-SEG-0400) from shelf to the FDF. Q) Aggregation DS3 for 4 or 8 only: Step 1 for factory or field assembled racks (coax assemblies): See section 5B for background on Expansion shelf 4 (G-303 system) and 8 (-57 system) Aggregation DS3. Engineering vendors should consult with Service Provider/elco personnel about the number of DS3 circuits and their card positions. If required, each DS3 card has one set of X/X ports with SMB connectors. For each DS3 card, provide two Westek ( D /19 (19 inch if shelf 8 for -57 system or shelf 4 for second G-303 system in rack) or D /10 (10 foot if shelf 4 for first G-303 system in rack) G-179 coax assemblies (factory formed with SMB on one end and BNC on the other end). oute coax from DS3 card to plate 42 in rack. Step 2 for factory or field assembled racks (bulkhead panel): Provide (unless already provided for part ) one ellabs Bulkhead panel and mount at plate 42 in rack. Panel is 1.75 high and 19 wide (23 rack adapters included with panel). he panel has a front side designation strip and 24 BNC positions. For every set of two BNCs, stencil the strip as X 1 X, X 2 X, etc reading left to right in alignment with the 24 BNCs (result will be 12 sets of X/X). Connect the Westek coax (X from DS3 card to X on panel, X to X) to bulkhead panel front side X/X-1, X/X-2, X/X-3 (if -57 system or first G-303 system in rack) or X/X-4, X/X-5, X/X-6 (if second G-303 system in rack). Step 3 for factory or field assembled racks (coax to DSX-3/DCS): un two coax conductors for each X/X circuit from bulkhead panel rear side to DSX-3 or DCS (see BOC-SEG-0200 section 4, 5, 6). wo straight BNC connectors required per X/X circuit for bulkhead panel. Bulkhead X connects to DSX-3 OU or DCS IN and X connects to DSX-3 IN or DCS OU. ) Intact DS3 for or shelf: Step 1 for factory or field assembled racks (coax assemblies): See section 6 for background on Intact DS3. Engineering vendors should consult with Service Provider/elco personnel about the number of DS3 circuits and their card positions. If required, each DS3 card has one set of X/X ports with SMB connectors. For each DS3 card, provide two Westek ( D /19 (19 inch) or D /10 (10 foot) G- 179 coax assemblies (factory formed with SMB on one end and BNC on the other end). Use 10 foot assemblies if DS3 card in Primary shelf 1, 2 or 4 (first G-303 system in rack). Use 19 inch assemblies if 8 (-57 system) or 4 (second G-303 system in rack). oute coax from DS3 card to plate 42 in rack. Step 2 for factory or field assembled racks (bulkhead panel): Provide (unless already provided for part N or Q) one ellabs Bulkhead panel and mount at plate 42 in rack. Panel is 1.75 high and 19 wide (23 rack adapters included with panel). he panel has a front side designation strip and 24 BNC positions. For every set of two BNCs, stencil the strip as X 1 X, X 2 X, etc reading left to right in alignment with the 24 BNCs (result will be 12 sets of X/X). Connect the Westek coax (X from DS3 card to X on panel, X to X) to bulkhead panel front side X/X-7, X/X-8, X/X-9, X/X-10, X/X-11, X/X-12, X/X-6, X/X-5. Step 3 for factory or field assembled racks (coax to DSX-3/DCS): un two coax conductors for each X/X circuit from bulkhead panel rear side to DSX-3 or DCS (see BOC-SEG-0200 section 4, 5, 6). wo straight BNC connectors required per X/X circuit for bulkhead panel. Bulkhead X connects to DSX-3 OU or DCS IN and X connects to DSX-3 IN or DCS OU. 10

11 BOC-EG System VF/DS0 connection and DF block layout/pair count/wiring color code: A) Cables: Each backplane has six 25 pair connectors that are factory designated JA-1, JA-2, JB-1, JB-2, JC-1 and JC-2. As viewed from rear side of rack, JA-1, JC-1, JC-2 are designed to exit left and JA-2, JB- 1, JB-2 are designed to exit right. wo 25 pair (for JA-1, JA-2) and two 50 pair (has two 25 pair breakout legs for JB-1/JB-2 or JC-1/JC-2) cables should be used for each shelf. wo 75 pair cables (one per side) cannot be used since the binder groups would not terminate in sequence on the DF (would split between separate blocks). he cables should be 1107A type (see BOC-SEG-0100 section 8 and 14) with female connectors on the shelf end. At the shelf end, each cable must have a 3 foot long insulated drain wire that will be connected to relay rack ground by installation. BOC recommends these factory formed cables (see BOC-SEG-0100 section 7 for manufacturer contacts). XXX indicates footage. 25 pair: Cablcon XXX, Conway CCI-337-XXX, Great Lakes XXX or CSI CA4XXXX101SD1. 50 pair: Cablcon XXX, Conway CCI-C338-XXX, Great Lakes XXX or CSI CA4XXXX3C4SD1. B) Pair count: 1000 DLC VF/DS0 pairs should be DF stenciled using a CO Switch Digital Loop Equipment (DLE) method called Carrier Controller Indentifier/Carrier Controller Port (CCI/CCP). his method designates each pair by it s shelf number, shelf slot number and slot pair number. For example, 3, slot 17, pair 4 would be designated See figure 8A, 8B and 8C. C) DF block layout: -57 systems require nine 100 pair blocks. G-303 systems require three 100 pair blocks. See BOC-SEG-0300 section 2 or 8 for block part numbers. If the DF is Conventional, blocks mount on the vertical side. Each shelf has 150 pairs that are terminated in sequence (132 active, 18 dead). Figure 8B and 8C detail the layout. 11

12 JA-1 JA-2 JB-1 Slot Lead Conn Pin Color Slot Lead Conn Pin Color Slot Lead Conn Pin Color BOC-EG W-BL W-BL W-BL -1 1 BL-W -2 1 BL-W -3 1 BL-W W-O W-O W-O -2 2 O-W -3 2 O-W -4 2 O-W W-G W-G W-G -3 3 G-W -4 3 G-W -5 3 G-W W-B W-B W-B -4 4 B-W -5 4 B-W -6 4 B-W W-S W-S W-S -5 5 S-W -6 5 S-W -1 5 S-W BL BL BL -6 6 BL BL BL O O O O O O G G G -2 8 G G G B B B -3 9 B B B S S S S S S BK-BL BK-BL BK-BL BL-BK BL-BK BL-BK BK-O BK-O BK-O O-BK O-BK O-BK BK-G BK-G BK-G G-BK G-BK G-BK BK-B BK-B BK-B B-BK B-BK B-BK BK-S BK-S BK-S S-BK S-BK S-BK Y-BL Y-BL Y-BL BL-Y BL-Y BL-Y Y-O Y-O Y-O O-Y O-Y O-Y Y-G Y-G Y-G G-Y G-Y G-Y Y-B Y-B Y-B B-Y B-Y B-Y Y-S Y-S Y-S S-Y S-Y S-Y V-BL V-BL V-BL BL-V BL-V BL-V V-O V-O V-O O-V O-V O-V V-G V-G V-G G-V G-V G-V V-B V-B V-B B-V B-V B-V V-S V-S V-S S-V S-V S-V FIGUE 8A (continued on page 13) VF/DS0 lead designations and color code. Lead designations are stenciled on the DF block using Switch DLE method. For example, 3, slot 11, pair 4 would be Page 12

13 DEAD PAIS JB-2 JC-1 JC-2 Slot Lead Conn Pin Color Slot Lead Conn Pin Color Slot Lead Conn Pin Color BOC-EG W-BL W-BL W-BL -4 1 BL-W -5 1 BL-W -6 1 BL-W W-O W-O W-O -5 2 O-W -6 2 O-W -1 2 O-W W-G W-G W-G -6 3 G-W -1 3 G-W -2 3 G-W W-B W-B W-B -1 4 B-W -2 4 B-W -3 4 B-W W-S W-S W-S -2 5 S-W -3 5 S-W -4 5 S-W BL BL BL -3 6 BL BL BL O O O -4 7 O O O G G 33 -G -5 8 G G- 8 G B B 34 -B -6 9 B B- 9 B S S 35 -S S S- 10 S BK-BL BK-BL 36 BK-BL BL-BK BL-BK 11 BL-BK BK-O BK-O 37 BK-O O-BK O-BK 12 O-BK BK-G BK-G 38 BK-G G-BK G-BK 13 G-BK BK-B BK-B 39 BK-B B-BK B-BK 14 B-BK BK-S BK-S 40 BK-S S-BK S-BK 15 S-BK Y-BL Y-BL 41 Y-BL BL-Y BL-Y 16 BL-Y Y-O Y-O 42 Y-O O-Y O-Y 17 O-Y Y-G Y-G 43 Y-G G-Y G-Y 18 G-Y Y-B Y-B 44 Y-B B-Y B-Y 19 B-Y Y-S Y-S 45 Y-S S-Y S-Y 20 S-Y V-BL V-BL 46 V-BL BL-V BL-V 21 BL-V V-O V-O 47 V-O O-V O-V 22 O-V V-G V-G 48 V-G G-V G-V 23 G-V V-B V-B 49 V-B B-V B-V 24 B-V V-S V-S 50 V-S S-V S-V 25 S-V FIGUE 8A (continued from page 12) VF/DS0 lead designations and color code. Lead designations are stenciled on the DF block using Switch DLE method. For example, 3, slot 15, pair 4 would be Page 13

14 BOC-EG st Conventional block 2nd Conventional block 3rd Conventional block FIGUE 8B Conventional block layout for ellabs 1000 DLC Expansion shelves. 1st, 2nd, 3rd blocks shown for -57 or G-303 3, 4. 4th through 9th blocks for to 8 not shown. View is from block's front (jumper) side. 14

15 BOC-EG st Cosmic block 2nd Cosmic block 3rd Cosmic block FIGUE 8C Cosmic block layout for ellabs 1000 DLC Expansion shelves. 1st, 2nd, 3rd blocks shown for -57 or G-303 3, 4. 4th through 9th blocks for to 8 not shown. View is from block's front (jumper) side. 15