TC production and installation for 2016 run

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1 TC production and installation for 2016 run M. De Gerone on behalf of the TC group Feb. 1st, 2016

2 Summary Progress from last referees meeting: PCBs and BPs production (almost) completed TC structure machining Few results from 2015 pre-engineering run M. De Gerone, Referee MEG 01/02/16 2

3 PCBs and BPs production Individual SiPMs tests finished in PV Last batch of SiPMs (600 pcs = 100PCBs, 5cm) will be delivered to the company for soldering this week All other boards (4cm, L-shaped) are ready and tested in PSI Mass production of the last pixels is currently on going. Individual SiPM tests almost finished in PV; scintillators, PCB and connectors ready; Backplanes are ready and tested, thermal sensors are mounted. Production of PCBs and BPS for BOTH detectors is (almost) completed (fully completed in a couple of weeks from now). All the boards produced till now have been tested (I-V curve). M. De Gerone, Referee MEG 01/02/16 3

First of all, we tested the junction between the central and lateral part of the structure (it wasn t tested in 2015).

4 Status of TC production towards 2016 The machining of the new structure is currently on going in Genova. Reminder We restarted the machining from scratch using a different raw material (moulding). First of all, we tested the junction between the central and lateral part of the structure (it wasn t tested in 2015). Side part Central part junction New material is much more robust. We didn t see any appreciable deformation during machining. M. De Gerone, Referee MEG 01/02/16 4

sistema di raffreddamento) Completamento delle lavorazioni (forature,

5 Status of TC production towards 2016 La lavorazione principale delle strutture (3 x TC) è quasi completa (fresature gole lato esterno per sistema di raffreddamento) Completamento delle lavorazioni (forature, filettature etc) previsto per fine maggio come da schedule. M. De Gerone, Referee MEG 01/02/16 5

6 Status of TC production towards 2016 M. De Gerone, Referee MEG 01/02/16 6

Status of TC production towards 2016 Altre lavorazioni in corso: produzione della parte interna (COBRA step) x 2 Timing Counter produzione dei carrelli per movimentazione / inserimento

7 Status of TC production towards 2016 Altre lavorazioni in corso: produzione della parte interna (COBRA step) x 2 Timing Counter produzione dei carrelli per movimentazione / inserimento TC blocchetti per termalizzazione pixel Termine lavori previsto in Giugno (alcune lavorazioni procedono poi in parallelo all assemblaggio del primo TC) M. De Gerone, Referee MEG 01/02/16 7

$ΔT=(T1-T2)/2 Constant fraction @20-35% del segnale Taglio in carica e altezza segnale per escludere segnali saturati e noise. M.$

8 Alcuni risultati dal beam test (preliminare) Caveat: stato DAQ non ottimale, calibrazione DRS Risoluzione (a 2 pixel): sigma della distribuzione ΔT=(T1-T2)/2 Constant del segnale Taglio in carica e altezza segnale per escludere segnali saturati e noise. M. De Gerone, Referee MEG 01/02/16 8

9 Alcuni risultati dal beam test (preliminare) Confronto risoluzioni in funzione della soglia del constant fraction fra test in laboratorio e pre-engineering run (pixel sullo stesso chip DRS) Valore ottimale in beam test 35% vs 20% in laboratorio (noise?). 15% differenza in risoluzione rispetto alle attese. NB: reso a 2 pixel in lab estratta da misure su singolo pixel M. De Gerone, Referee MEG 01/02/16 9

10 Alcuni risultati dal beam test (preliminare) Risoluzioni di doppio hit (CF 35%) drs chip 1 drs chip 2 σ ~ 60-75ps σ > 70ps pixel id pixel id M. De Gerone, Referee MEG 01/02/16 10

11 Conclusions La produzione delle schede PCB e BP è completata al 90% (rimane da saldare l ultimo batch di SiPM nelle prossime settimane) La lavorazione delle strutture dei 2 TC è in corso. Prevediamo di poter iniziare l assemblaggio del primo rivelatore a fine giugno (dopo beam test 2016). L analisi dei dati raccolti nel beam test 2015 è in corso. Nonostante i problemi di DAQ sembra che almeno l ultimo set di dati raccolti sia utilizzabile. Risoluzioni per ora estrapolate da eventi 2-hit, 60-70ps contro ~55ps attesi. M. De Gerone, Referee MEG 01/02/16 11

12 Back up

13 Status of TC production towards 2016 JAN FEB MAR APR MAY JUN JUL SiPM soldering and test scintillator test pixel assembly / test Structure machining assembly TC install Michel run? M. De Gerone, Referee MEG 01/02/16 13

14 M. De Gerone, Referee MEG 01/02/16 14

15 From last referee meeting: TC production For the 2015 pre-engineering run half of TC downstream sector was built: it corresponds to 128 pixels (16BPs), 256 channels (same number of channels available from DAQ side) It allows testing all detectors features (mechanics, electronics, multi-hit time reso) Pixel, backplane, insertion system, temperature sensors are the final ones. Structure production was delayed by some issues during the machining (structure deformations We will use the current structure this year only: the TC structure will be re-built from scratch for 2016 run. M. De Gerone, Referee MEG 01/02/16 15

From last referee meeting: TC production For the 2015 pre-engineering run half of TC downstream sector was built: it corresponds to 128 pixels (16BPs), 256 channels (same number of channels available

16 From last referee meeting: TC production For the 2015 pre-engineering run half of TC downstream sector was built: it corresponds to 128 pixels (16BPs), 256 channels (same number of channels available from DAQ side) It allows testing all detectors features (mechanics, electronics, multi-hit time reso) Pixel, backplane, insertion system, temperature sensors are the final ones. Structure production was delayed by some issues during the machining (structure deformations We will use the current structure this year only: the TC structure will be re-built from scratch for 2016 run. M. De Gerone, Referee MEG 01/02/16 16

2015 pre-engineering run: mass production

17 2015 pre-engineering run: mass production 139 pixels were produced and tested for this year run (needed: 128) couple scintillator to array with optical cement wait 12 hours couple other side, wait wrap pixel with reflector light shield with tedlar film Production and test rate: 10pixels/day M. De Gerone, Referee MEG 01/02/16 17

event selection / trigger): 3 positions measurement; 90 time resolution; Sr source collected

18 2015 pre-engineering run: mass production Each pixel was individually tested with usual lab setup in thermal chamber (moving stage for position scan, 90 Sr source, reference counter for event selection / trigger): 3 positions measurement; 90 time resolution; Sr source collected charge. Moving stage 73.6ps 4cm 76.8ps 5cm Pixel under test RC counter M. De Gerone, Referee MEG 01/02/16 18

2015 pre-engineering run: TC assembly DS L shape Mixed 5 cm 4 cm for engineering run = equipped with optical fiber 128 pixels / 256 channels we tested all pixel configurations (40/50mm height,

19 2015 pre-engineering run: TC assembly DS L shape Mixed 5 cm 4 cm for engineering run = equipped with optical fiber 128 pixels / 256 channels we tested all pixel configurations (40/50mm height, L-shaped, mixed) a small subset was equipped with optical fibers allows testing of laser calibration system cooling system was not installed tight schedule anyway, no DCH electronics this year thermal block installed only in the inner side for mechanical reasons Assembly procedure is the same as the final (full) detector. M. De Gerone, Referee MEG 01/02/16 19

2015 pre-engineering run: TC assembly Each step of TC

cabling (pixel-bp transition in the inner step),

Few minor issues arose during the operations -

20 2015 pre-engineering run: TC assembly Each step of TC assembly was tested: backplanes and pixels positioning, cabling (pixel-bp transition in the inner step), insertion system. Few minor issues arose during the operations - negligible for this year goal, will be fixed for the next one (see next slide) M. De Gerone, Referee MEG 01/02/16 20

21 2015 pre-engineering run: TC assembly Pixels are mounted on the inner structure using the thermal block as support for the pixel itself. Some pixels have 1 leg on the inner structure and the other on the central one ( mixed pixels). TC Status, MEG Coll. Meet. 10/30/15 21

2015 pre-engineering run: TC assembly A couple of minor issues:

is possible (but negligible) Because of a mistake during the

one wrong position right position Impact on this year run is

22 2015 pre-engineering run: TC assembly A couple of minor issues: Because of the structure deformation, rails position does not exactly fit the grooves made on the structure. We arranged the rails on site - a small (few mm) disalignment of TC is possible (but negligible) Because of a mistake during the machining, the position of a couple of backplanes is not the nominal one wrong position right position Impact on this year run is negligible. Issues will be fixed by remachining the TC structure from scratch (see next) M. De Gerone, Referee MEG 01/02/16 22

2015 pre-engineering run: TC insertion Rails are

23 2015 pre-engineering run: TC insertion Rails are mounted inside COBRA and fixed to the COBRA structure. TC is mounted on a chariot which lodges the same rails as in COBRA. Then the 2 systems are joined in such a way to slide TC inside COBRA (same as MEG TC). TC Status, MEG Coll. Meet. 10/30/15 23

24 2015 pre-engineering run: TC insertion Pixel height was adjusted adding 2.5mm spacers. We did not see any conflicts between TC structure and DCH mockup! TC integration has been fully achieved M. De Gerone, Referee MEG 01/02/16 24

25 2015 pre-engineering run: signal check We use the old DCHs cables for TC cabling. A quick signal check was done before run kick-off using cosmic ray signals and oscilloscope (no waveform studies). 100% working channels M. De Gerone, Referee MEG 01/02/16 25

26 2015 pre-engineering run: a short summary Official beam time started on Dec. 7th but we started to take (TRG) data on Dec. 14th. Laser system was turned on on Dec. 18th. Wave dream waveform readout was achieved on Dec. 19th, then we started to take 24h-shifts till the end of beam time (Dec. 23rd). We found several problems on wave dream side. The main ones: DRS stop cell record had been unavailable until the last evening of DAQ, thus it is not possible to apply DRS time calibration for previously taken data. Double read-out: even cell is a copy of the neighboring odd cell thus effective sampling speed become half. No sync among different boards Large noise on analog front-ends full list in backup slides. M. De Gerone, Referee MEG 01/02/16 26

27 2015 pre-engineering run: what do we achieved? Some of the listed issues will strongly affected data quality: we took meaningful data only on the last 10 hours of run (when DRS stop cell bug was fixed)! seems very difficult to extract reliable time resolutions. Nevertheless, we were able to: test detector integration; test all the HW devices (SiPM bias and current, signals from pixel, temperature readout, etc); make a beam intensity scan; test several trigger configurations; multiple hits, track like events, laser calibration, pedestal ; test laser calibration (on a small pixel subset); develop some analysis tools; partially debug DAQ system. M. De Gerone, Referee MEG 01/02/16 27

28 2015 pre-engineering run: some events M. De Gerone, Referee MEG 01/02/16 28

29 2015 pre-engineering run: some events M. De Gerone, Referee MEG 01/02/16 29

30 2015 pre-engineering run: some events M. De Gerone, Referee MEG 01/02/16 30

31 2015 pre-engineering run: some events M. De Gerone, Referee MEG 01/02/16 31

Laser calibration system 8 pixels were equipped with optical

robust way to inject light into the pixel is to frill a small

32 Laser calibration system 8 pixels were equipped with optical fibers. We were able to test the full chain: laser, light transport from cave to experimental hall, splitter, pixel injection The more robust way to inject light into the pixel is to frill a small (diam. 1.9mm, depth 1mm ) hole in the scintillator. Time resolution is not affected by hole making. M. De Gerone, Referee MEG 01/02/16 32

33 Laser calibration system Laser light is transmitted using a 10m optical fiber from the cavern to the experimental hall. Signal is divided by means of an optical splitter, then fed into pixels. Trigger using laser SYNC signal. Data analysis on going. safe box for splitter pulse from laser pulses to pixels M. De Gerone, Referee MEG 01/02/16 33

34 Temperature read-out We installed 3 sensors for each backplane, but this year we recorded only few of them. 3 days temperature history ΔT on TC surface ~1.5 C ΔT day/night ~ 0.5 C No cooling system, no power dissipation from external sourcesdch M. De Gerone, Referee MEG 01/02/16 34

35 Current increase? 2 days@meg II expected intensity SiPM current seems to increase during the run (~0.5uA / 2 days). Is this due to radiation damages? If so, it could be an issue for long term operations. Deeper studies are ongoing (I-V curve and BD comparison before and after run). M. De Gerone, Referee MEG 01/02/16 35

Pixel: final design 6 SiPMs (Advansid ASD-NUV3S-P) in series connection

Scintillator (Saint Gobain BC422) is glued to SiPMs, PBCs act as a frame

The pixel is electrically connected to the backplanes by means of MCX

Light trapping is increased by wrapping the pixel with a reflector (3M

Light tightness is provided by wrapping the pixel with a thin black foil

36 Pixel: final design 6 SiPMs (Advansid ASD-NUV3S-P) in series connection are soldered on a PCB. Scintillator (Saint Gobain BC422) is glued to SiPMs, PBCs act as a frame for the pixel. The pixel is electrically connected to the backplanes by means of MCX connectors. Thermal link is provided by means of a small Cu block. Light trapping is increased by wrapping the pixel with a reflector (3M mirror film). Light tightness is provided by wrapping the pixel with a thin black foil (Tedlar). 120mm 40/50mm MCX connector Cu thermal link All the items listed above are established. PCBs for all kind of pixels are in production now. First 100 hundred boards are expected to be ready by the first week of April. M. De Gerone, Referee MEG 01/02/16 36

Connectors issue All purchased connectors were sensitive to magnetic field (nickel in body plating) We immediately asked for replacement but not all the needed models were available: - - MCX PLUG,

37 Connectors issue All purchased connectors were sensitive to magnetic field (nickel in body plating) We immediately asked for replacement but not all the needed models were available: - - MCX PLUG, placed on backplane for pixels connection - All replaced, OK MCX edge mount, to be mounted on pixels - We asked for replacement but we got magnetic model again! We are provisionally mounting these connectors for this run (should not be an issue because we will not track any positron this year) waiting for the right ones (order placed). They will be replaced next year - - MCX JACK, mounted on backplane for cables connection - They are placed outside the spectrometer sensitive volume. In principle, we can use these connectors if the magnetic field distortion is negligible. Simulations ongoing. M. De Gerone, Referee MEG 01/02/16 37

38 Current status: Backplanes production 16 backplanes (final layout) has been produced for this year run. Tested in Genova electrical continuity signal and GND lines 1-wire temperature device readout (with stand alone readout system) Mechanics (mounting on TC structure) All tests were OK, just needed a couple of minor modification of the TC structure: A couple of BP are slightly wider than nominal value (+0.2mm), grooves on structure have to be enlarged (will be taken into account in the next detector design) Backplanes are ready to be used in 2015 run. M. De Gerone, Referee MEG 01/02/16 38

TC structure: insertion system A couple of rails

an endless screw which will be fixed on the

fixed in the COBRA before TC insertion Step 2:

39 TC structure: insertion system A couple of rails will be mounted inside COBRA, in order to allow TC to slide in. The fine movement will be provided by means of an endless screw which will be fixed on the bottom side of the Timing Counter Step 1: rails fixed in the COBRA before TC insertion Step 2: TC rails connected to COBRA rails Step 3: TC slides inside COBRA. Endless screw fixed to COBRA Step 4: Final TC position Timing Counter bottom view M. De Gerone, Referee MEG 01/02/16 39

40 TC structure: insertion system binario e struttura portante in alluminio carrello per trasporto TC e inserimento in COBRA All the items are ready. Vite senza fine in ottone e attacco al COBRA Vite agganciata al COBRA e al TC M. De Gerone, Referee MEG 01/02/16 40

1 wire bus - Temperature monitor We put 3 temperature sensor and 1 humidity sensor on each backplanes, and we prepared a stand alone system able to readout them (in final configuration,

41 1 wire bus - Temperature monitor We put 3 temperature sensor and 1 humidity sensor on each backplanes, and we prepared a stand alone system able to readout them (in final configuration, WaveDream will be used to read out). Thermometers are placed also on the inner part (5 sensors) and then connected (and read out) through backplanes. TC Status, MEG Coll. Meet. 10/30/15 41

42 1 wire bus - Temperature monitor For this year we plan to readout sensors from 5 backplanes (3 devices each) TC Status, MEG Coll. Meet. 10/30/15 42

43 Temperature Sensor Extension accuracy ±0.5 3 CHF 1-16 sensors per WD2 board with only one coaxial cable 18 March 2015 MEG Collaboration Meeting, Tokyo M. De Gerone, Referee MEG 01/02/16 43

44 Full list of DAQ problems M. De Gerone, Referee MEG 01/02/16 44

An extreme high resolution Timing Counter for the MEG Upgrade

An extreme high resolution Timing Counter for the MEG Upgrade M. De Gerone INFN Genova on behalf of the MEG collaboration 13th Topical Seminar on Innovative Particle and Radiation Detectors Siena, Oct.