[1.9] AMOLED 공정 Introduction OLED Materials Patterning Process Process Equipments
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1 [1.9] AMOLED 공정 Introduction OLED Materials Patterning Process Process Equipments
2 OLED : Organic Light Emitting Diode Organic EL : Organic Electroluminescent 재료및공정 재료의발광메카니즘 Small Molecule ( 저분자 ) Evaporation Polymer ( 고분자 ) Solution Process (Ink Jet Printing) Fluorescence ( 형광 ) Phosphorescence ( 인광 ) 발광방향 Bottom Emission Top Emission 구동방식 Passive Matrix Active Matrix 3
3 Technological elements of OLED production Substrate Driving Light output Material Device structure rigid passive bottom emission Small molecule Single hetero flexible active polymer ETL/EmL HTL top emission hybrid Double hetero ETL EmL HTL RGB generation Encapsulation RGB R G B R G B EL hermetic Down conversion B B B B R B G B B R G B EL CCM solid White light W W W W R W G W B EL CF R G B 4
4 Device Structures (Small Molecule) Glass Substrate Metal cathode Electron transport layer (ETL) Emission layer (EML) Hole transport layer (HTL) Anode (transparent electrode) Organic Layers 양극 ( 투명전극, ITO 등 ) + 정공 두께 : 100 ~ 200 nm 정공수송층 (HTL) 발광층 (EML) + - Exciton 전자수송층 (ETL) 전자 - 음극 ( 낮은일함수금속, Ca, Al:Li, Mg:Ag, 등 ) 1) Carrier Injection 2) Carrier Transport 3) Electron-hole recombination and exciton formation 4) recombination of excitons 5
5 Actual Structure of OLED Additional layer for improved efficiency Injection Layer Reduces the injection barrier between the metal electrode and the organic layer Transport Layer Transports electron and hole to the emission zone Thickness: ~ 1000A White OLED Consists of 2 or 3 layers of light-emitting layers (EML) Cathode Cathode EIL EIL ETL ETL B-EML R-EML HTL G-EML B-EML ~1000A G-EML R-EML HIL HTL Anode HIL RGB OLED Anode White OLED 6
6 Bottom vs Top Emission OLED Mode Bottom Emission Top Emission Structure TFT Glass TFT Glass Aperture Encapsulation High Current Low Simple Large choice of material Easy Low Resistance High Complex Transparent Getter Transparent Cathode Difficult High Resistance 7
7 Patterning Process for Small Molecule OLED on Small Glass 8
8 OLED Process Flow Vacuum Substrate cleaning O2 plasma treatment Glove Box Encapsulation (Dispensing, UV rad.) Panel unloading HIL, HTL deposition Desiccant Cutting R, G, B deposition ETL deposition LiF deposition Encap can/glass loading Encap can/glass cleaning ETL EML HTL Cathode deposition 9
9 OLED Equipments UV Encapsulation Pretreatment Chamber Organic Chamber Loading Chamber Glove Box Unloading Chamber Sputter Chamber Electrode Chamber Organic Chamber 10
10 Gen2 OLED 장비 11
11 OLED 장비및박막공정특징 12
12 Evaporation/ Mask Align System (Small Glass) Point Evaporation Source (Sublimation; solid vapor) 13
13 저분자 RGB Patterning CCD Camera Fine Metal Shadow Mask(Gen. 2 기 준) XXY Alignment 영구자석 Glass Mask Shield Glass Mask Holder Mask Glass Holder Hole position variation : < ±10.0 Mask / Substrate Alignment : < ± 5.0 Thermal expansion, 기판 처짐 등 Total Alignment Accuracy : < ±
14 FMM RGB Patterning 15
15 Evaporation & Shadow Mask Cathode spacer Shadow mask 16
16 Issue : OLED Process Color Patterning Issue R.G.B Evaporation R.G.B Fine Metal Shadow mask Large Size Shadow mask White + CF Open Mask Evaporation Efficiency of White OLED PLED Ink-jet Printing Material Performance Printing Process R.G.B Evaporation RGB Emission White + C/F white Emission PLED RGB Emission Schematic Merit High Efficiency Easy Color Control Simple Process Fine Patterning Large Area Process Issue Fine Patterning Large Size White balance Light Efficiency Loss Material Performance 광량이 1/3 Uniformity문제 고정세가 상대적어려움 17
17 Patterning Process for OLED-TV 18
18 EL Patterning Approaches for Large OLED-TV Large area EL Patterning Method (active) FMM <32 SMS (Small Mask Scanning) Vertical Linear Source White EL + CF RGB Patterning 55 Glass moving 55 Linear source RGB Patterning Vertical FMM white EL 19
19 Linear Evaporation Source for Large Glass (Data from SUNIC) 21
20 Divided Technologies for OLED-TV RGB EL LTPS White EL CF Oxide TFT Gen 6 Gen 8 22
21 23 EL Patterning Process Comparison (+) Evaporation by SMS (Small Mask Scanning) White EL Evaporation + Color Filter Glass moving White EL CF
22 White OLED 24
23 25 55-inch FHD OLED TV employing New Tandem WOLEDs By serial stacking of EL layers, try to improve life time
24 Other Patterning Methods 26
25 LITI - SDI Laser Induced Thermal Imaging 방식 1. Donor Film - PET 등의 Substrate에 OLED 증착/Coating 2. Donor와 Receptor Contact at ATM 3. Thermal Imaging-print by Laser 장점 1. 사용 가능한 물질多 (SM-OLED, PLED) 2. Multi-layer stack ability 3. Thermal Imaging-print by Laser 단점 1. Lifetime degradation by lamination (emission interfaces not good) 2. Particle contamination by contact-type 3. Different materials to conventional OLED need to develop for Transfer 27
26 Ink Jet Printing Print Heads Bank Substrate ITO HTL LEP 31
27 Encapsulation 35
28 Encapsulation Metal Can or Glass 흡습제 (BaO, CaO 등 ) UV 접착제 불활성가스 (Ar, N2) UV Mask UV Light Multiple Layer Sputtered Inorganic Barrier Layers and Vacuum-deposited Polymer Layers Ceramic Layers Isolation Layers Active OLED Glass Substrate Barix coating 36
29 Encapsulation for Large Area AMOLED
30 Flexible OLED 38
31 Manufacturing of Flexible OLED How realistic is the Manufacturing of Flexible AMOLED? SMD Flexible AMOLED Flexible Process Spin Coating of PI Film 열경화 39
32 Permeability issues of Plastic Substrate Issues on OLED - Humidity Protection Permeation of H 2 O for plastic : ~10 g/m 2 day Requirement of H 2 O permeability in OLED 10-6 g/m 2 day ,000,000X gap! It is claimed that multiple layers of organic/inorganic barrier can protect EL from moisture 40
33 Requirement of Thin Film Encapsulation A critical path to Flexible OLED s Success 7 Multiple Layer Sputter/CVD/ALD Sputtered Inorganic Barrier Layers and Vacuumdeposited Polymer Layers Glass Encapsulation Ceramic Layers Isolation Layers Barrier coating Active OLED Glass Substrate Issues: Reliability of moisture protection, Cost of vacuum process, low throughput, Particles
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