SoC Device Trend & Introduction of ATE Solution

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Audra Mathews
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SoC Device Trend & Introduction of ATE Solution Advantest

Market Trend 1 DVD or Digital movie camera DTV

or STB CATV Broadband Network (Fiber or Wire or

(Wire & Wireless) Digital Still Camera Car

Camera Smart phone Car Electronic The life based

2 Market Trend 1 DVD or Digital movie camera DTV Digital Broadcasting DVD/HDD recorder Digital TV or STB CATV Broadband Network (Fiber or Wire or WiFi) Broadband modem & Router PC Home Network (Wire & Wireless) Digital Still Camera Car navigation & Car TV Digital Single Lens Reflex Camera Smart phone Car Electronic The life based on Smart Phones is increasing. 1 All Rights Reserved - Advantest Corporation

3 A Smart Phone is a lump of SoC Devices CMOS Image S. Appli. BT/ WLAN Chip LPDDR Multi Chip PA A Smart Phone is a collection of the newest technologies. Multi Band RF IC GSM/ CDMA/ LTE Power Manage IC High Speed I/F USB/ Card I/F 3 All Rights Reserved - Advantest Corporation

4 A Demand for SoC Devices of Smart Phone CMOS Image S. Cost Down by One Chip Appli. To Performance More! BT/ WLAN Chip To Low Power Consumption More! LPDDR One Chip PA The demands to SoC Devices in a Smart Phone are more high performance and more cost down. IC One Chip GSM/ CDMA/ LTE High Speed I/F USB/ Card I/F One Chip Multi Band RF To Low Cost More! Power Manage IC 4 All Rights Reserved - Advantest Corporation

Example of Device Multi Fictionalize SoC SiP High Pin Count Test Mixed Signal RF (RF+BB) Modulation Signal Test Add-memory Multi Chip on Board High Speed I/F POP Combine Multi Function Embedded PCB

5 Example of Device Multi Fictionalize SoC SiP High Pin Count Test Mixed Signal RF (RF+BB) Modulation Signal Test Add-memory Multi Chip on Board High Speed I/F POP Combine Multi Function Embedded PCB BB-mixed More High Performance and More Cost Down More Down Size TSV More Performance RF-mixed High Speed I/F Test Memory Test Wireless New Tech. OPT Optical To One Chip (Chip Number Reduce) MEMS All Rights Reserved - Advantest Corporation

6 Problem Points in SoC Device Test 1 Customer Complicated and various correspondences are required of of SoC Device Test. -Investment expansion of of Tester by by impossible to to use use the the conventional Tester. -Cost escalation of of Engineer education and and Tester employment by by two two or or more platform possession. possession. Increase of Test Cost! Vendor The The increase in in development cost. The The timely delivery according to to market demand is is difficult. Complication of of support. 6 All Rights Reserved - Advantest Corporation

7 Problem Points in SoC Device Test 2 Function Performance An old system Function Performance T2000 G 帯, RF ( C System) System change 100M, Mixed ( B System) A Module addition or change 100M, Mixed (T2000) G 帯, RF (T2000) System change 40M, AD/DA ( A System) 40M, AD/DA (T2000) A Module addition or change Time When functions is not enough by evolution of a device, The change with a new system is required. (Increase of an investment cost and an engineer resource.) When functions is not enough by evolution of a device, Correspondence is possible at an addition or change of Module. (investment cost small and an engineer resource is efficient.) 7 All Rights Reserved - Advantest Corporation Time

8 T2000 SoC Test System Concept 1 Common Architecture (H/W & S/W) T2000 Mine Frame Test Head Test Modules Star Pro 2 Main Frame (Max 8 site controller) Light Star Main Frame (1 site controller) LS GS SP2 52 slots Test Head 26 slots Test Head 13 slots Test Head DM Mixed Etc,. DPS 250M 800M 1G AA/BBWGD RF LC DPS500 DPS90 8 All Rights Reserved - Advantest Corporation

9 T2000 SoC Test System Concept 2 SoC Solution SoC for PC, Game etc. Digital Module MCU Solution MCU for Consumer, Automotive PMU32 Module RF Solution Wireless communication (RF) IC (W-LAN IC, Cell Phone IC) Automotive/PMIC Solution Power IC, PMIC etc. Power Module CIS Solution CMOS sensor IC Capture Module High Speed Solution High-speed I/F (DDR,HDMI,PCI) 6GSPM RF Module Provide test solutions with appropriate modules for each area. T2000 Platform + Relay Controller Module Analog Module Sync Module PMU32 Module RF Module Digital Module High-Speed I/F Module Power Supply Module Power Module Capture Module 9 All Rights Reserved - Advantest Corporation

10 Seamless & Scaleable Platform The optimal composition which rinks each needs from development to mass production can be chosen freely. Single Test in development A large number of Parallelism for Reduce COT in mass-production. Seamless Scaleable Ex. Modules Ex. Modules 800MDM Digital DPS500mA Analog/ RF 800MDM Digital DPS500mA Analog/ RF 10 All Rights Reserved - Advantest Corporation

New T2000 Series (6000pin SoC Tester) T2000 Main Frame LSMF 2800pin Tester

13 New T2000 Series (6000pin SoC Tester) An indispensable function (Digital, Power Supply, Analog) is condensed with high density to a general-purpose SoC Device Test. 800MDM 800Mbps 128I/O Digital Module 1GDM 1.1Gbps 256I/O FTA (Functional Test Abstraction) LCDPS 4A 8ch (32A total) DPS500mA 500mA 32ch (16A total) PMU32 16bit/200Ksps 32ch ISVM/VSIM ADC/DAC Linearity test focused BBWGD 16bit/400Msps 8ch AWG 16bit/128Msps 8ch DGT Not Enough THD for Audio 3G Base Band focused AAWGD 24bit/190Ksps 8ch AWG 18bit/820Ksps 8ch DGT High precision Audio focused Device Power Supply Analog Module DPS90A 2A 32ch + 0.8A 32ch GPWGD 16bit/1Msps 16bit/50Msps 16output AWG 18bit/1Msps 16bit/50Msps 8input DGT THD -111dB@1KHz 8output Vref (VSIM) 13 All Rights Reserved - Advantest Corporation

New T2000 Series (6000pin SoC Tester) <T2000 LSMF RECT 550 PB> 550mm <T2000 SP2MF RECT 680 PB> 680mm 480 mm 1 J1016 1 1 2 2 1 1 2 2 2 J1011 J1006 J1001 2 J4001 2 1 J4006 1 2 J4011 J4016 2 520 mm 2 2

14 New T2000 Series (6000pin SoC Tester) <T2000 LSMF RECT 550 PB> 550mm <T2000 SP2MF RECT 680 PB> 680mm 480 mm 1 J J1011 J1006 J J J J4011 J mm 2 2 J5006 J5001 J8001 J8006 A D B C J6006 J6001 J7001 J J2016 J2011 J2006 J J3001 J3006 J3011 J Competitor s User Area Size T2000 HiFix simplifies High parallel DUT performance boards at x4 ease of going to at x8, x16 solution 14 All Rights Reserved - Advantest Corporation

16 12GWSGA RF Module Features 4VSG /4VSA x 4MUX: 16 ports Tx and 16 ports Rx/module VSG (Modulation Signal): 6GHz (CW;12GHz), VSA: 12GHz High C/N mode and High speed (300us) settling mode offered 1-100MHz Low Phase Noise REF-SG Independent resources for 4-DUT testing Expandable up to 128 ports/ system High speed calculation by built in FFT H/W engine Support of Multi-Band / High Parallelism / Multi-Port with Low Cost 17 All Rights Reserved - Advantest Corporation

17 4-resources are Installed /1-module Advantest can offer 2-resources type RF module also, For more Low System Price. (Module Price ½). Competitor s RF Minimum Configuration 38% resources (TT is Slower than T2000 RF for 4DUT LTE Tx.) *Note AWG DGT AWG DGT AWG DGT AWG DGT VSG SP4T SG Up Converter 4 VSA SA Down Converter VSG VNA SP4T 4 SP4T SG Up Converter 4 VSA SA Down Converter VSG VNA SP4T SP4T SG Up Converter 4 VSA SA Down Converter VSG VNA 4 SP4T 4 SP4T SG Up Converter 4 VSA SA Down Converter VNA SP4T 4 Old System Reference SG *Note) The meaning of the figure is actually different in the calculation of theoretical by the test item, the setting parameter, and the Device. 18 All Rights Reserved - Advantest Corporation DIV 4 Advantest 12GWGSGA=1 Module 4

18 4 Parallel Testing w/o port switching AT Example Sampling time DUT 1 DUT 2 Calculation in a Module Data transfer time Used FFT engine DUT 3 DUT 4 T DUT 1 DUT 2 Calculation in a Site Controller DUT 3 DUT 4 Data transfer time T Competitor Example Sampling time DUT 1 DUT 2 Calculation in a Module Data transfer time Used 16 RF ports + 2 RF resources DUT 3 DUT 4 T DUT 1 DUT 2 DUT 3 DUT 4 T 19 All Rights Reserved - Advantest Corporation

19 Example of Full Band-LTE configuration //X4 DUT is proposal configuration -12GWSGAx1, BBWGDx1, 800MDMx2, DPS500mAx2, RC5V192x1, Analog Syncx1 AWG DGT AWG DGT AWG DGT AWG DGT VSG SP4T SG Up Converter 4 VNA VSA SA SP4T Down Converter 4 VSG SP4T SG Up Converter 4 VNA VSA SA SP4T Down Converter 4 VSG SP4T SG Up Converter 4 VNA VSA SA SP4T Down Converter 4 VSG SP4T SG Up Converter 4 VNA VSA SA SP4T Down Converter 4 To DUT2 To DUT3 To DUT4 S X tal BBWGDx1 I Q I Q I Q I Q I Q I Q I Q I Q AWG1 DGT1 AWG2 DGT2 AWG3 DGT3 AWG4 DGT4 To DUT2 To DUT3 To DUT4 Reference SG DIV 4 12GWSGAx1 4 Relay Cont. =16ch/DUT RC5Vx1 (192ch) DPS=16ch/DUT DPS 500x2 (64ch) DM=48ch/DUT <-< 4DUT Mother PB Limit. 800MDMx2 (256ch) To DUT All Rights Reserved - Advantest Corporation

20 T2000 RF Parallelism Result Cellular : 4DUT(Results) / 8DUT(Ramp up inside) LTE : 4DUT(Results) WLAN : 8DUT(Results) WiMAX : 4DUT(Results for Both EDS & FT) DTV Tuner :8DUT(Results) GPS : 4DUT(Results) BlueTooth :4DUT(Results) / 8DUT(Ramp up inside) Zigbee : 4DUT(Results) / 8DUT(Ramp up inside) 21 All Rights Reserved - Advantest Corporation

Daughter Board RF SG Spectrum Analyzer DB1 DB4 DB3 DB2 DB VSG DB VSA For Mass

21 Support TTM by Daughter Board solution In progressing the kind development of only daughter board The correlation working man-hour and the cost are reduced. Daughter Board RF SG Spectrum Analyzer DB1 DB4 DB3 DB2 DB VSG DB VSA For Mass Production Stage <Easy to PB checking> <Easy to correlation checking> 22 All Rights Reserved - Advantest Corporation

23 New T2000 Series (T2000 ISS) CMOS Image Sensor Solution [Capture Rate] IP750EX w/ ICU-D IP750EX w/ ICU-1GL 1.4Gbps 1.2Gbps 1.0Gbps 800Mbps Cell-Phone T2000 ISS 650Mbps 100Mbps DSLR Camcorder DSC [Multi Site] 27 All Rights Reserved - Advantest Corporation

24 Camera Interface Roadmap for Mobile Applications CCP2 CPI CSI-2 CSI-3 Standard SMIA MIPI MIPI MIPI Physical Layer Sub-LVDS 208Mbps (class0) 416Mbps (class1) 650Mbps (class2) Parallel I/F 66MHz MIPI D-PHY 800Mbps to 1Gbps MIPI M-PHY A: 1.25, 2.5 & 5 Gbps B: 1.5, 3, 6 Gbs Status In production In production Plan in 2012 Tester Module Module Module T2000 ISS IP750EX 1.2GICAP 1.2GICAP 1.2GICAP ICU-D + Serial Board ICU-D + Parallel Board T2000 ISS Advantage (ICU-1GL) CCP2 : Compact Camera Port 2 CPI : Camera Parallel Interface CSI-2 : Camera Serial Interface 2 CSI-3 : Camera Serial Interface 3 SMIA : Standard Mobile Imaging Architecture MIPI : Mobile Industry Processor Interface Alliance 28 All Rights Reserved - Advantest Corporation

25 T2000 ISS Technical Advantage High Resolution Movies Seq. Shooting MIPI Interface 1.2Gbps High-speed Capture Serial Capture : 1.2Gbps x 4 Lanes x 4ch Parallel Capture Enable 128M pixel Memory for Movies, Seq. Shooting Enable 800M pix./16 Flames (Legacy product : 800M pix./4 Flames) Lower Price 64 sites Parallel Test Capability 440φ Probe card 252x208mm, Wide User Area (x2.5 times for Legacy Product) 160mmx150mm for 12 wafer High-throughput with New IP Engines Quad Core CPU (Legacy product : Dual Core CPU) 29 All Rights Reserved - Advantest Corporation

27 New T2000 Series (T2000 IPS) Integrated Power device test Solution (A) 10,000 T2000 IPS 1, Hybrid and EV Cars Industrial Train and Power Plant Power Supply and PMIC Automotive General Purpose Inverter Home Appliance T2000 IGBT ,000 3,000 (V) 32 All Rights Reserved - Advantest Corporation

28 Integrated Power Device Integration Trend CY2009 CY2006 CY2012 Next Gen MQFP 128 CY1998 SOIC 8 / CAN Transceiver Hi Quad 64 / System Base Chip LQFP 100 / 12 loop Airbag IC Higher Integration Increasing Pin Count CoT & Big Big pressure pressure to to reduce reduce CoT Reduce Reduce Time-to Time to-market Market 33 All Rights Reserved - Advantest Corporation

T2000 IPS Solution Introduction Integrated Power DUT Mixed

power redistribution Power Matrix 72 power ports High

Purpose Generator + Digitizer Floating Power 32 Analog (85V)

Generators 8 Digitizers 6 Sources 80V/12A Stackable &

Universal Instrument Unique Power Subsystem Few

29 T2000 IPS Solution Introduction Integrated Power DUT Mixed Signal Mixed Signal Power Stages ADC DAC LOAD Cost optimized power redistribution Power Matrix 72 power ports High Voltage Mixed Signal Low Voltage Mixed Signal General Purpose Generator + Digitizer Floating Power 32 Analog (85V) & 32 Digital (24V) 64 Analog (18V) 64 Digital (8V) 8/16 Generators 8 Digitizers 6 Sources 80V/12A Stackable & Gangable Achieve optimum cost by matching device needs Universal Instrument Unique Power Subsystem Few multifunctional instruments cover the widest range of needs. 34 All Rights Reserved - Advantest Corporation

30 T2000 IPS Doubling Parallelism <Competitor PB (380mm x 380mm)> 2 DUT <T2000 PB (550mm x 480mm)> 4 DUT or more DUT 128pin DUT 128Pin DUT 128pin DUT 128pin DUT 128pin DUT 128pin Small user area & lots of relays Huge user area & less relays T2000 IPS doubles site count vs. competitor maximum configuration Larger user area of PB than competitor PB. Reduced number of relays on PB. Simple PB design saves cost for development, manufacturing and maintenance 35 All Rights Reserved - Advantest Corporation

31 PMIC Target Device vs. IPS config. a) Computing & Consumer MPCM 250MDMA MMXH MMXL PMU Digital AWG DGT LMU TMU Pattern Control DM PMU PMU MFHP DGT PMU RC5V GPWG D AWG MMXL 250MDMA MMXH b) Wireless Communication PMU Digital AWG DGT LMU TMU PMU Digital Pattern Control AWG DGT LMU TMU Pattern Control PMU MFHP MPCM DGT PMU GPWG D AWG 1GDM c) Peripherals & Low-end Consumer PMU Digital AWG DGT LMU TMU Pattern Control DPS90A EPPMU (T.B.D) 250MDMA DM PMU MFHP RC5V MMXH 36 All Rights Reserved - Advantest Corporation

32 IGBT Target Device vs. IGBT config. e) IGBT Wafer MMXH MFHP DGT PMU GPWGD AWG SHV2KV SHV Booster d) Power Train, Safety & Control 250MDMA MMXH MMXL DM PMU Digital AWG DGT LMU TMU Pattern Control PMU MPCM PMU MFHP DGT PMU GPWG D AWG f) IGBT Chip MFHP AC/DC Fixture SHV GPWG D DGT PMU AWG SHV2KV SHV Booster Booster MMXH HC600A 37 All Rights Reserved - Advantest Corporation

Benchtop Portability with ATE Performance

Benchtop Portability with ATE Performance Features: Configurable for simultaneous test of multiple connectivity standard Air cooled, 100 W power consumption 4 RF source and receive ports supporting up