Layers of Innovation: How Signal Chain Innovations are Creating Analog Opportunities in a Digital World
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1 The World Leader in High Performance Signal Processing Solutions Layers of Innovation: How Signal Chain Innovations are Creating Analog Opportunities in a Digital World Dave Robertson-- VP of Analog Technology
2 Moore s Law and Technology Progression The OVERSIMPLIFIED Story: A steady advance in lithography that drives exponentially greater density, lower cost, lower power, higher speeds, and higher levels of integration. 2
3 Moore s Law and Technology Progression The OVERSIMPLIFIED Story: A steady advance in lithography that drives exponentially greater density, lower cost, lower power, higher speeds, and higher levels of integration. The REAL Story: Evolutionary and Revolutionary innovation across many dimensions that has pushed, pulled, and bounced our industry forward. 3
4 Layers of Innovation in the Semiconductor Industry 4
5 Application/Necessity Driven Innovation PULL 5
6 Technology/Capability Driven Innovation PULL PUSH 6
7 The Evolution of Signal Processing Functions Unobserved Sensed/Observed Measured Analyzed Controlled Mechanical Electrical (analog) Electronic (solid state analog) Electronic (fixed function digital) Software 7
8 Innovation Drives an Expanding Universe 8
9 New Sensor/Actuator Technologies Drive Entirely New Signal Chains Application Signal Chain New Sensor Architecture Circuit Wafer Fabrication/Device Examples: Accelerometers, Gyros, Gas Sensors, Optics 9 New Application drives new signal chains, architectures, circuits
10 A Shift in Signal Processing Emphasis? The First 150 years: The primary challenge is to extract the signal from the background noise. The New Era: Increasingly, the challenge is to extract the signal from dense traffic of other signals, or interferers. 10
11 Advances In Signal Processing: Enlarging Shannon s Box Largest Captureable Signal The Ceiling Useable Signal Bandwidth Effective Dynamic Range The Walls Smallest Detectable Signal The Floor 11
12 Signal Chain Requirements call for Higher Performance Innovations in Circuits and Architecture enable entirely new Signal Chains 12
13 Application Requirements for Dynamic Range and Bandwidth Speed GHz GHz MHz 10 10MHz 1 1MHz kHz kHz Precision in Parts per Unit 100 1,000 10, ,000 1,000,000 10M SONET Flat Panel Digital Oscilloscope DVC DVD Video Radar Distance/ Level Monitor & Control Cable TV Ultrasound Auto Radar Spectrum Analyzer Digital Camera DSL Motor Control Defense/Aero Comms Building Automation Wireless Infrastructure Digital X-Ray Industrial Automation DVD Audio Precision Optics Bio Instruments Process Control Precision PLC/DCS Measurement 1kHz Bits of Resolution MRI CT Patient Monitoring Water Analysis Weigh Scale 13
14 Architectures: Dynamic Range and Bandwidth (Data Converter Example) GHz GHz MHz Precision in Parts per Unit 1,000 10, ,000 1,000,000 10M Up to 40 GHz Flash / Folding Interleaved Pipeline Speed 10 10MHz 1 1MHz kHz SAR Sigma Delta kHz kHz Bits of Resolution 14
15 15 Reflecting on Some Trends...
16 Analog gets cheaper over time 16
17 Analog gets cheaper over time but digital gets cheaper faster! 17
18 Signal Chain Trend: Move Converter Closer to the Source As converter moves towards the antenna, analog signal processing is replaced by digital LO #1 (TUNED) LO #2 FIXED DETECT BROADBAND NARROWBAND But the remaining analog/mixed signal processing gets significantly more challenging 18
19 Wireless Infrastructure Example: Converting More Spectrum and More Channels 13-Bits 270 KSPS Performance
20 Converting More Spectrum and More Channels 14-Bits 125 MSPS Performance
21 Converting More Spectrum and More Channels 14-Bits 16-Bits MSPS Performance
22 Audio Recording, Mastering, Playback, Distribution, Sales from Analog to Digital 22
23 Going Digital Replacement Technology drives Entirely New Applications/Business Models Ultimately: Creating whole new applications Initially: Replace Analog with Digital 23
24 Going Digital Replacement Technology drives Entirely New Applications/Business Models Initially: Replace Analog with Digital There is more Analog in the Digital world than there was in the old Analog World Ultimately: Creating whole new applications 24
25 25 Moore s Law...
26 Process Innovation as a Driving Force PUSH 26
27 ITRS Roadmap Overview ITRS
28 Deep Submicron Challenges for Analog (Moore s Law is Not Universal... ) Reduced Supply Voltages (and signal swings)* Reduced Gain of the transistors ** Leakage Currents in OFF devices Gate Leakage currents Increased 1/f noise In most cases, the analog circuits do not scale as aggressively as digital: cost per function may actually go up. In SNR limited circuits, Capacitance must scale with signal voltage SQUARED, so reduced signal swings may actually lead to an INCREASE in power consumption Nikkei Electronics Seminar
29 The Constraints of Deep Submicron Technology Drive Innovation at the Circuit, Architecture and Signal Chain Levels... Parallelism Digitally Assisted Analog Oversampling CT Sigma Delta Interleaving Differential Symmetric Low Headroom Amps Sub-threshold Design 29
30 30 Integration...
31 Benefits of Integration REWARD Smaller Size Save Package Pins (money) Save Interface Overhead: Area Save Interface Overhead: Power Save Interface Overhead: Speed Allows System Optimization Has become one of the most compelling (perhaps irresistible?) forces in our industry...
32 But These Benefits May Come at a Price... REWARD Smaller Size Save Package Pins (money) Save Interface Overhead: Area Save Interface Overhead: Power Save Interface Overhead: Speed Allows System Optimization Penalty Can no longer independently optimize process selection Greater potential for interference between blocks Increases IC complexity: power supplies Increases IC complexity: schedule Increases IC complexity: risk Increase Verification/Test Complexity May encounter power density issues A thoughtful approach is necessary certain functions may be cheaper/better when not integrated: DRAM, POWER AMP...
33 Key Issues for Optimum Integration Process Technology: which functions can be realized on which technology Interfaces: analog vs. digital, CMOS vs. LVDS vs. SERDES (bandwidth and dynamic range) Package and Board Technology: SoC vs SIP Power: Supply voltages Power Dissipation Risk: Time to Market Market Dynamics: Market size and Life Cycle
34 Summary There are MANY Driving Forces of Innovation in the Semiconductor Industry Innovation in the Different Levels, or Layers is Often Interconnected: a Dance of Push and Pull Forces As Signal Chains Go Digital, the Mixed Signal Functions Become More Challenging Moore s Law and Integration Remain Very Important Drivers in Our Industry, But SOC Integration is Not the Right Answer to All Problems 34
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