Flip Chip Solder Bump Characterization in 3D with X-Ray Microscopy. J. Gelb, A. Gu, L. Hunter, B. Johnson, and W.
|
|
- Barry Daniels
- 6 years ago
- Views:
Transcription
1 Flip Chip Solder Bump Characterization in 3D with X-Ray Microscopy J. Gelb, A. Gu, L. Hunter, B. Johnson, and W. Yun July 11, 2012
2 3D X-Ray Microscopy (XRM) Integrated Circuit Sample 3D XRM Data Set 1 Semicon West: July 11, 2012
3 Virtual Cross Sections for Physical Analysis Virtual cross sections of 3D images are a valuable tool for physical analysis 2 Semicon West: July 11, 2012
4 Agenda Packaging Challenges Xradia Overview Flip Chip Solder Bump Case Study Summary 3 Semicon West: July 11, 2012
5 The Typical FA Lab Workflow Non-Destructive Isolation of Failure Failure Confirmation Location Destructive Determination of Failure Cause LSI Tester AC and DC Characteristics Electric evaluation jig 2D X-Ray Scanning Acoustic Microscope Lock-In Thermography Time Delay Reflectometry (TDR) Emission Microscope IR-OBIRCH SEM Microprobe Mechanical Cross Section FIB SEM Decapsulation EDX Auger Challenges: Package complexity increasing Existing non-destructive methods lack resolution Destructive techniques provide resolution but don t allow subsequent testing FA getting more difficult 4 Semicon West: July 11, 2012
6 Typical FA Lab Workflow Non-Destructive Isolation of Failure Failure Confirmation Location LSI Tester AC and DC Characteristics Electric evaluation jig 2D X-Ray Scanning Acoustic Xradia Microscope Microscope XRM Lock-In Thermography Time Delay Reflectometry (TDR) Emission Microscope IR-OBIRCH SEM Microprobe Destructive Determination of Failure Cause Mechanical Cross Section FIB SEM Decapsulation EDX Auger Where XRM Fits Isolating failure location Refined failure information Higher success rate with mechanical cross section XRM may also be used in 2D X-ray inspection mode to locate failure Failure Cause Determination Often, cause may be determined from 3D image without mechanical cross section Time dependent, 4D, reliability studies 5 Semicon West: July 11, 2012
7 Semi FA Example: Electro Migration Related Failure SAM VersaXRM SEM X-section Sample Destroyed Non-Destructive XRM is ideal for finding optimal location for physical cross section Source: Applications of 3D X-Ray Microscopy for Advanced Package Development, K. Fahey, R. Estrada (Xradia), L. Mirkarimi, R. Katkar, D. Buckminster and M. Huynh, Tessera Technologies, Inc, IMAPS Long Beach Semicon West: July 11, 2012
8 Agenda - 3D X-ray Microscopy Packaging Challenges Xradia Overview Flip Chip Solder Bump Case Study Summary 7 Semicon West: July 11, 2012
9 Xradia Inc. Pioneer in Ultra-high Resolution 3D X-ray Microscopy Founded in 2000 HQ in Pleasanton, CA U.S. manufacturer shipping worldwide Privately held Comprehensive market focus From Synchrotron largest installed base of synchrotron 3D microscopes To Research and Industry Labs Highest performance X-ray microscopes for: Electronics Materials Science Geosciences Life Sciences 8 Semicon West: July 11, 2012
10 Synchrotron Capabilities within the Laboratory VersaXRM Family UltraXRM-L200 MicroXCT-200 VersaXRM-500 MicroXCT-400 Resolution mm 50 µm 0.5 µm 150 nm 50 nm Synchrotron micro XRM nano XRM beamline Technology developed for synchrotrons...extended to the lab 9 Semicon West: July 11, 2012
11 Micro CT vs X-ray Microscopy Technology Comparison Traditional Projection based Micro CT How Geometric Mag Works GeoMag = (Dss + Dds) Dss Source Detector Resolution depends exclusively upon geometric Geometric Mag magnification D ss Source: Computed Tomography Willi A. Kalender 2 nd revised edition, 2005 Wiley-VCH Publishing D ds Resolution Highest resolution limited to < 1mm samples Source Detector Contrast Working Distance Difficulty discerning low contrast samples Res. degrades as samples get bigger Sample center of rotation Resolution falls off linearly as the sample moves away from the source 10 Semicon West: July 11, 2012
12 Micro CT vs X-ray Microscopy Technology Comparison Traditional Projection based Micro CT Xradia X-Ray Microscopy Source Detector Resolution depends exclusively upon geometric Geometric Mag magnification Source Geometric mag Detector Optical Mag Scintillator Optical mag Resolution Highest resolution limited to < 1mm samples High resolution maintained for samples as large as 50 mm Contrast Difficulty discerning low contrast samples Phase enhanced contrast detector enables excellent imaging of low contrast samples Working Distance Res. degrades as samples get bigger Resolution is maintained, even for larger samples 11 Semicon West: July 11, 2012
13 Resolution (µm) Low Res XRM Maintains High Resolution at Large Working Distances Geometric Mag Based MicroCTs Resolution rapidly degrades with increasing sample size Substantial difference in resolution as sample size increases VersaXRM High Res Working Distance (mm) Source to center of sample rotation 12 Semicon West: July 11, 2012
14 Micro CT vs X-ray Microscopy Technology Comparison MicroCT X-Ray Microscopy 13 Semicon West: July 11, 2012
15 Agenda - 3D X-ray Microscopy Packaging Challenges Xradia Overview Flip Chip Solder Bump Case Study Summary 14 Semicon West: July 11, 2012
16 Flip Chip Solder Bump Voiding problems Voiding may lead to the formation and/or propagation of cracks Voids local stress gradients in bump microstructure Localized heating and electromigration may occur in solder bumps with voids, due to current crowding effects Voids localized lowered resistance 3D XRM segmentation of voids (red) in solder bumps SEM micrograph. Source: prioritylabs.com 15 Semicon West: July 11, 2012
17 X-ray microscopy on flip chip die Exposure times ranging from 15 minutes to 6 hours are used to image a flip chip die in 3D. Solder bump visualization Voids are automatically assigned to each bump 16 Semicon West: July 11, 2012
18 X-ray microscopy on flip chip die Virtually extract and examine individual bumps for voids Individual bumps may be inspected as needed.through virtual extraction Voids color-coded based on volume (red = large, blue = small) 17 Semicon West: July 11, 2012
19 Number of Occurrences Number of Occurrences Automated analysis After virtual void extraction, automated analysis routines may be run, providing a detailed report about the bump and void distribution (and morphology). 25 Bump Size Distribution 25 Void Fraction Distribution x Bump Volume (µm 3 ) Void Volume Fraction Per Bump (%) In this example, the average bump volume is calculated to be µm 3 and the average void volume fraction per bump is 1.14%. 18 Semicon West: July 11,
20 Agenda - 3D X-ray Microscopy Packaging Challenges Xradia Overview Flip Chip Solder Bump Case Study Summary 19 Semicon West: July 11, 2012
21 Summary X-ray microscopy (XRM) is a powerful technique for the characterization of voids within electronic boards and packages, synergistic with existing FA techniques and leading to increased productivity. The Xradia approach to X-ray microscopy marks a departure from traditional micro-ct, enabling new metrology techniques for present and future FA needs. As applied to flip chip void characterization, large arrays of solder bumps may be inspected and statistical analysis performed on the voiding; individual bumps may be virtually extracted and analyzed prior to destructive cross-sectioning. 20 Semicon West: July 11, 2012
22 Thank you for your attention!
YXLON Cougar EVO PLUS
YXLON Cougar EVO PLUS The best small footprint X-ray inspection system for LABORATORY applications Technology with Passion Choose a custom-built EVO solution for premium inspection Why compromise? As technology
More informationAdvancements in Acoustic Micro-Imaging Tuesday October 11th, 2016
Central Texas Electronics Association Advancements in Acoustic Micro-Imaging Tuesday October 11th, 2016 A review of the latest advancements in Acoustic Micro-Imaging for the non-destructive inspection
More informationPerfecting the Package Bare and Overmolded Stacked Dies. Understanding Ultrasonic Technology for Advanced Package Inspection. A Sonix White Paper
Perfecting the Package Bare and Overmolded Stacked Dies Understanding Ultrasonic Technology for Advanced Package Inspection A Sonix White Paper Perfecting the Package Bare and Overmolded Stacked Dies Understanding
More informationX-ray Inspection. Series.
X-ray Inspection Series www.nordsondage.com 2 Nordson DAGE Quadra X-ray Inspection 3 Nordson DAGE Quadra X-ray Inspection Nordson DAGE Quadra X-ray Inspection 3 Your X-ray Inspection Partner Seeing is
More informationLayout Analysis Analog Block
Layout Analysis Analog Block Sample Report Analysis from an HD Video/Audio SoC For any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks. 3685
More informationExplore the Art of Detection
Y.Cougar Microfocus and nanofocus X-ray inspection systems for the electronics industries Explore the Art of Detection Technology with Passion Our specialty: The Art of Detection. Developing outstanding
More informationWafer defects can t hide from
WAFER DEFECTS Article published in Issue 3 2016 Wafer defects can t hide from Park Systems Atomic Force Microscopy (AFM) leader Park Systems has simplified 300mm silicon wafer defect review by automating
More informationB-AFM. v East 33rd St., Signal Hill, CA (888)
B-AFM The B-AFM is a basic AFM that provides routine scanning. Ideal for scientists and educators, the B-AFM is capable of creating high-resolution topography images of nanostructures in standard scanning
More informationFailure Analysis Technology for Advanced Devices
ISHIYAMA Toshio, WADA Shinichi, KUZUMI Hajime, IDE Takashi Abstract The sophistication of functions, miniaturization and reduced weight of household appliances and various devices have been accelerating
More informationLecture 18 Design For Test (DFT)
Lecture 18 Design For Test (DFT) Xuan Silvia Zhang Washington University in St. Louis http://classes.engineering.wustl.edu/ese461/ ASIC Test Two Stages Wafer test, one die at a time, using probe card production
More informationFocused Ion Beam System MI4050
SCIENTIFIC INSTRUMENT NEWS 2016 Vol. 7 SEPTEMBER Technical magazine of Electron Microscope and Analytical Instruments. Technical Explanation Focused Ion Beam System MI4050 Yasushi Kuroda *1, Yoshihisa
More informationAbstract. Keywords INTRODUCTION. Electron beam has been increasingly used for defect inspection in IC chip
Abstract Based on failure analysis data the estimated failure mechanism in capacitor like device structures was simulated on wafer in Front End of Line. In the study the optimal process step for electron
More informationSelection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis
Presented at Nepcon Shanghai 2003 Abstract Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Dr. David Bernard, Dage Precision Industries, 158-29 Hua Shan Road, Feng
More informationMETROTOM. Visible Metrology.
Industrial Metrology from Carl Zeiss METROTOM. Visible Metrology. EN_60_020_148I Printed in Germany SCH-CZ-V/2009 Noo Printed on chlorine-free bleached paper. Subject to change in design and scope of delivery
More informationI n d u s t r i a l M e t r o l o g y f r o m C a r l Z e i s s. METROTOM. Visible Metrology.
I n d u s t r i a l M e t r o l o g y f r o m C a r l Z e i s s METROTOM. Visible Metrology. Maximum Demands on Quality The trend of reducing industrial manufacturing processes is continuing despite the
More informationSemiconductors Displays Semiconductor Manufacturing and Inspection Equipment Scientific Instruments
Semiconductors Displays Semiconductor Manufacturing and Inspection Equipment Scientific Instruments Electronics 110-nm CMOS ASIC HDL4P Series with High-speed I/O Interfaces Hitachi has released the high-performance
More information-Technical Specifications-
Annex I to Contract 108733 NL-Petten: the delivery, installation, warranty and maintenance of one (1) X-ray computed tomography system at the JRC-IET -Technical Specifications- INTRODUCTION In the 7th
More informationWAFER PROBER MODEL. IR-OBIRCH analysis system Infra Red - Optical Beam Induced Resistance CHange AMOS -200
WAFER PROBER MODEL IR-OBIRCH analysis system Infra Red - Optical Beam Induced Resistance CHange AMOS -200 IR-OBIRCH Analysis System The μamos is a semiconductor failure analysis system which uses IR-OBIRCH
More informationMore Info at Open Access Database Process Control for Computed Tomography using Digital Detector Arrays
Digital Industrial Radiology and Computed Tomography (DIR 2015) 22-25 June 2015, Belgium, Ghent - www.ndt.net/app.dir2015 More Info at Open Access Database www.ndt.net/?id=18082 Process Control for Computed
More informationTender Notification for the procurement of a Scanning Electron Microscope" at IISc (Last Date for submission of tenders: 3 rd October 2018)
Tender Notification for the procurement of a Scanning Electron Microscope" at IISc (Last Date for submission of tenders: 3 rd October 2018) Dear Sir/Madam, We are looking for a high-resolution scanning
More informationNon-Destructive Examination Benches and Analysis Laboratories in support to the Experimental Irradiation Process in the Future Jules Horowitz MTR
Non-Destructive Examination Benches and Analysis Laboratories in support to the Experimental Irradiation Process in the Future Jules Horowitz MTR D. Parrat 1, P. Kotiluoto 2, T. Jäppinen 2, C. Roure 1,
More informationProject TRIPLE-S Microscope: Contribution of AMG Technology Ltd.
Project TRIPLE-S Microscope: Contribution of AMG Technology Ltd. V. Stavrov, G. Stavreva EUROSTARS ROADSHOW - SOFIA, May 26 th, 2015 1 About AMG Technology Ltd. Company Technology background Project TRIPLE-S
More informationIR-OBIRCH analysis system -1000
IR-OBIRCH analysis system R Overview The μamos is a semiconductor failure analysis system which uses the IR-OBIRCH method for localization of leakage current paths and the abnormal resistance points in
More informationFEI FIB Focused Ion Beam
Operating Manual Part 1 FEI FIB Focused Ion Beam IF IN DOUBT, ASK 1.00 IF ANYTHING UNUSUAL HAPPENS, OR IF THERE IS ANYTHING YOU ARE UNSURE ABOUT, STOP AND CONTACT ME! DO NOT PROCEED OR ATTEMPT TO FIX THE
More informationDescription. Kingbright
12 SEGMENT BAR GRAPH ARRAY Part Number: DD-12SYKWB Super Bright Yellow Features Suitable for level indicators. Low current operation. Wide viewing angle. Mechanically rugged. Different colors in one unit
More informationISSCC 2003 / SESSION 19 / PROCESSOR BUILDING BLOCKS / PAPER 19.5
ISSCC 2003 / SESSION 19 / PROCESSOR BUILDING BLOCKS / PAPER 19.5 19.5 A Clock Skew Absorbing Flip-Flop Nikola Nedovic 1,2, Vojin G. Oklobdzija 2, William W. Walker 1 1 Fujitsu Laboratories of America,
More informationReliability of Level 1 and Level 2 Packaging in Solid-State Lighting Devices
Reliability of Level 1 and Level 2 Packaging in Solid-State Lighting Devices Lynn Davis, PhD Fellow, RTI International December 8, 2016 1 RTI International is a registered trademark and a trade name of
More informationAuto classification and simulation of mask defects using SEM and CAD images
Auto classification and simulation of mask defects using SEM and CAD images Tung Yaw Kang, Hsin Chang Lee Taiwan Semiconductor Manufacturing Company, Ltd. 25, Li Hsin Road, Hsinchu Science Park, Hsinchu
More informationReliability Qualification Report
S510065-55Z - RoHS Compliant Products Qualified by Similarity S510067-55Z The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies
More informationDevelopment of OLED Lighting Applications Using Phosphorescent Emission System
Development of OLED Lighting Applications Using Phosphorescent Emission System Kazuhiro Oikawa R&D Department OLED Lighting Business Center KONICA MINOLTA ADVANCED LAYERS, INC. October 10, 2012 Outline
More informationAddressing 80 µm pitch Cu Pillar Bump Wafer probing: Technoprobe TPEG MEMS solution
Addressing 80 µm pitch Cu Pillar Bump Wafer probing: Technoprobe TPEG MEMS solution S. Angles STMicroelectronics R. Vallauri Technoprobe Background Overview ST Qualification of TPEG MEMS T3 probing technology
More informationPerformance of a DC GaAs photocathode gun for the Jefferson lab FEL
Nuclear Instruments and Methods in Physics Research A 475 (2001) 549 553 Performance of a DC GaAs photocathode gun for the Jefferson lab FEL T. Siggins a, *, C. Sinclair a, C. Bohn b, D. Bullard a, D.
More informationAutomatic Defect Recognition in Industrial Applications
Automatic Defect Recognition in Industrial Applications Klaus Bavendiek, Frank Herold, Uwe Heike YXLON International, Hamburg, Germany INDE 2007 YXLON. The reason why 1 Different Fields for Usage of ADR
More informationUSE OF DIGITAL X-RAY IMAGING AS A PROCESS CONTROL TOOL FOR LEAD-FREE PWB ASSEMBLY
USE OF DIGITAL X-RAY IMAGING AS A PROCESS CONTROL TOOL FOR LEAD-FREE PWB ASSEMBLY David Bernard Dage Precision Industries Fremont, CA d.bernard@dage-group.com Nick Hoo & Dominic Lodge Soldertec/Tin Technology
More informationSC24 Magnetic Field Cancelling System
SPICER CONSULTING SYSTEM SC24 SC24 Magnetic Field Cancelling System Makes the ambient magnetic field OK for the electron microscope Adapts to field changes within 100 µs Touch screen intelligent user interface
More informationAdvanced WLP Platform for High-Performance MEMS. Presented by Dean Spicer, Director of Engineering
Advanced WLP Platform for High-Performance MEMS Presented by Dean Spicer, Director of Engineering 1 May 11 th, 2016 1 Outline 1. Application Drivers for High Performance MEMS Sensors 2. Approaches to Achieving
More informationPRODUCT NEWS FEI LAUNCHES APREO HIGH- PERFORMANCE SEM RENISHAW OFFERS CONFOCAL RAMAN MICROSCOPE
40 PRODUCT NEWS Larry Wagner, LWSN Consulting Inc. lwagner10@verizon.net FEI LAUNCHES APREO HIGH- PERFORMANCE SEM FEI (Hillsboro, Ore.) announced the new Apreo scanning electron microscope (SEM), offering
More informationCPD LED Course Notes. LED Technology, Lifetime, Efficiency and Comparison
CPD LED Course Notes LED Technology, Lifetime, Efficiency and Comparison LED SPECIFICATION OVERVIEW Not all LED s are alike During Binning the higher the flux and lower the forward voltage the more efficient
More informationThermal Emission Microscope. series
R series 5AHEAI New Highsensitivity detector thermal detector (InSb) Motorized turret with objective lenses Two objective lenses for analyzing thermal emissions Three objective lenses for probing and laser
More informationApplication Note No. 146
Application Note, Rev. 1.2, February 2008 Application Note No. 146 Low Cost 950-2150 MHz Direct Broadcast Satellite (DBS) Amplifier with the BFP420F RF Transistor draws 27 ma from 5 V supply RF & Protection
More informationSC24 Magnetic Field Cancelling System
SPICER CONSULTING SYSTEM SC24 SC24 Magnetic Field Cancelling System Makes the ambient magnetic field OK for the electron microscope Adapts to field changes within 100 µs Touch screen intelligent user interface
More informationVTA1216H Series Linear Photodiode Array (PDA) for X-ray Scanning
DATASHEET Photon Detection VTA1216H Series VTA1216H-L-SC-08-1 The VTA1216H series is a 16-channel High Resolution Photodiode Array (PDA). There are 8 dual-element photodiodes mounted directly on an FR-4
More informationHigh Density Digital Recorder Application Study-The AN/BQH-9(V)1 Program
High Density Digital Recorder Application Study-The AN/BQH-9(V)1 Program THIC Conference October 13, 14, 1998 CARDEROCK DIVISION NAVAL SURFACE WARFARE CENTER Prepared by John Jester DDL OMNI Engineering
More informationElectron Beam Technology
Electron Beam Technology Speed up! High Performance Electron Beam Lithography dedicated electron beam lithography To bridge cutting-edge research and nanofabrication, a dedicated nanolithography solution
More informationVTA0832H Series Linear Photodiode Array (PDA) for X-ray Scanning
DATASHEET Photon Detection VTA0832H Series VTA0832H-L-NC-00-0 The VTA0832H series is a 32-channel High Resolution Photodiode Array (PDA). There are 16 dual-element photodiodes mounted directly on an FR-4
More informationEdiPower II HM Series Datasheet
EdiPower II HM Series Datasheet EdiPower II Series Features : LED light engine High power operation Instant on Long lifetime Copyright 2014 Edison Opto Corporation. All right reserved. The information
More informationNew Medical Light Source using NTT s Communication Laser Technology
(Press release document) January 31, 2013 NTT Advanced Technology Corporation Hamamatsu Photonics K.K. New Medical Light Source using NTT s Communication Laser Technology - NTT-AT and Hamamatsu Photonics
More informationTesting Digital Systems II
Testing Digital Systems II Lecture 2: Design for Testability (I) structor: M. Tahoori Copyright 2010, M. Tahoori TDS II: Lecture 2 1 History During early years, design and test were separate The final
More informationMechanical aspects, FEA validation and geometry optimization
RF Fingers for the new ESRF-EBS EBS storage ring The ESRF-EBS storage ring features new vacuum chamber profiles with reduced aperture. RF fingers are a key component to ensure good vacuum conditions and
More informationReading a GEM with a VLSI pixel ASIC used as a direct charge collecting anode. R.Bellazzini - INFN Pisa. Vienna February
Reading a GEM with a VLSI pixel ASIC used as a direct charge collecting anode Ronaldo Bellazzini INFN Pisa Vienna February 16-21 2004 The GEM amplifier The most interesting feature of the Gas Electron
More informationLaser Beam Analyser Laser Diagnos c System. If you can measure it, you can control it!
Laser Beam Analyser Laser Diagnos c System If you can measure it, you can control it! Introduc on to Laser Beam Analysis In industrial -, medical - and laboratory applications using CO 2 and YAG lasers,
More informationWafer Thinning and Thru-Silicon Vias
Wafer Thinning and Thru-Silicon Vias The Path to Wafer Level Packaging jreche@trusi.com Summary A new dry etching technology Atmospheric Downstream Plasma (ADP) Etch Applications to Packaging Wafer Thinning
More informationScreen investigations for low energetic electron beams at PITZ
1 Screen investigations for low energetic electron beams at PITZ S. Rimjaem, J. Bähr, H.J. Grabosch, M. Groß Contents Review of PITZ setup Screens and beam profile monitors at PITZ Test results Summary
More informationParameter LO RF IF Min Typ Max Diode Option (GHz) (GHz) (GHz) LO drive level (dbm)
Page MMIQHSM The MMIQHSM is a miniaturized, surface-mount multi-octave.7. GHz IQ mixer. It features matched double balanced mixers connected with an integrated LO hybrid and power divider. It can be used
More informationCDSx80 series. package dimensions. cdsc80 series. cdsa80 series. T: F:
1 specifications CDSx80 series package dimensions cdsc80 series cdsa80 series Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.25mm (0.01 ) unless otherwised noted. 3. Specifications
More informationCDSX23 series. package dimensions. T: F:
1 specifications CDSX23 series package dimensions CDSC23 SERIES CDSA23 SERIES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.25mm (0.01 ) unless otherwised noted. 3. Specifications
More informationEdiPower II HM Series (PAR) Datasheet
EdiPower II HM Series (PAR) Datasheet EdiPower II Series Features : LED light engine High power operation Instant on Long lifetime Copyright 2014 Edison Opto Corporation. All right reserved. The information
More informationY.XST225-VF. INTERCONTROLE Escoffier 1 XYLON MG225VF RX PDS
Y.XST225-VF 1 XYLON MG225VF - 0509- RX0905007PDS 1 Table of contents Y.XST225-VF High detail visibility - examples Y.XST225-VF vs. conventional X-ray systems Y.XST225-VF vs. µ-focus X-ray systems Unique
More informationbooks Transmission Electron Microscopy: A Textbook For Materials Science (4 Vol Set)
books Transmission Electron Microscopy: A Textbook For Materials Science (4 Vol Set) This profusely illustrated text on Transmission Electron Microscopy provides the necessary instructions for successful
More informationAdvanced Display Manufacturing Technology
Advanced Display Manufacturing Technology John Busch Vice President, New Business Development Display and Flexible Technology Group September 28, 2017 Safe Harbor This presentation contains forward-looking
More informationRSNA 2006 November 26 to December 1 Chicago. Guest author for ImPACT Dr. Koos Geleijns, Medical Physicist, Leiden University Medical Center.
RSNA 2006 November 26 to December 1 Chicago Guest author for ImPACT Dr. Koos Geleijns, Medical Physicist, Leiden University Medical Center. Once again, more than 60,000 participants (including professional
More informationFeatures. Applications. Part Number Color Package Description
HSMF-C113 and HSMF-C115 Right Angle Tricolor Surface Mount ChipLEDs Data Sheet Description The HSMF-C113 / C115 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the
More informationINSTRUCTIONAL MANUAL FOR LCD ZOOM MICROSCOPE
INSTRUCTIONAL MANUAL FOR LCD ZOOM MICROSCOPE ? 8 LCD Screen? 10.4 LCD Screen LCD Zoom Microscope Instruction Manual Please read the Instruction Manual carefully before installation and keep it for future
More informationScan. This is a sample of the first 15 pages of the Scan chapter.
Scan This is a sample of the first 15 pages of the Scan chapter. Note: The book is NOT Pinted in color. Objectives: This section provides: An overview of Scan An introduction to Test Sequences and Test
More informationNOTES: Dimensions are in mm (inches) Tolerances are +/ (0.010) unless otherwise stated.
Bright Red MST4110C, MST4140C High Efficiency Red MST4910C, MST4940C Green MST4410C, MST4440C TR/QTS/030100-001 PACKAGE DIMENSIONS FEATURES Bright Bold Segments Common Anode/Cathode Low Power Consumption
More informationProduct & Technology Introduction of Half-Cell Module. Technical Service Dept. (Q4 17 Version)
Product & Technology Introduction of Half-Cell Module Technical Service Dept. (Q4 17 Version) 1 MW Technical introduction and Power Roadmap 2 Reliability and Certifications 2 Half Cut Cell Module Compares
More informationFeatures. Applications
HSMF-C118 TriColor ChipLED Data Sheet Description The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging
More informationBTC and SMT Rework Challenges
BTC and SMT Rework Challenges Joerg Nolte Ersa GmbH Wertheim, Germany Abstract Rising customer demands in the field of PCB repair are a daily occurrence as the rapid electronic industry follows new trends
More informationApplication Note AN SupIRBuck MCM Power Quad Flat No-lead (PQFN) Inspection Application Note
Application Note AN-1133 SupIRBuck MCM Power Quad Flat No-lead (PQFN) Inspection Application Note Table of Contents Page Inspection techniques... 3 Examples of good assembly... 3 Summary of rejection criteria...
More informationFeatures. Applications R TOP VIEW
ASMT-CB InGaN Blue,.4mm Low Profile Right Angle Surface Mount ChipLED Data Sheet Description The ASMT-CB of blue color chip-type LEDs is designed with the smallest footprint to achieve high density of
More informationTHE IMPLICATIONS OF RECENT TECHNOLOGY ADVANCES FOR X-RAY INSPECTION IN ELECTRONICS
THE IMPLICATIONS OF RECENT TECHNOLOGY ADVANCES FOR X-RAY INSPECTION IN ELECTRONICS David Bernard, Ph.D. Nordson DAGE Aylesbury, Buckinghamshire, U.K. david.bernard@nordsondage.com Keith Bryant Nordson
More informationFault Localization and Functional Testing of ICs by Lock-in Thermography
Fault Localization and Functional Testing of ICs by Lock-in Thermography O. Breitenstein, J.P. Rakotoniaina, F. Altmann*, J. Schulz**, G. Linse** Max Planck Institute of Microstructure Physics, Weinberg
More informationULM 10 Gb/s VCSEL Array Accelerated Lifetime Study
ULM 10 Gb/s VCSEL Array Accelerated Lifetime Study K.K. Gan, H.P. Kagan, R.D. Kass, J. Moore, S. Smith The Ohio State University June 8, 2012 K.K. Gan Opto Working Group Meeting 1 Outline Test setup Result
More informationNT Output LCD Segment/Common Driver NT7701. Features. General Description. Pin Configuration 1 V1.0
160 Output LCD Segment/Common Driver Features (Segment mode)! Shift Clock frequency : 14 MHz (Max.) (VDD = 5V ± 10%) 8 MHz (Max.) (VDD = 2.5V - 4.5V)! Adopts a data bus system! 4-bit/8-bit parallel input
More informationEE241 - Spring 2001 Advanced Digital Integrated Circuits. References
EE241 - Spring 2001 Advanced Digital Integrated Circuits Lecture 28 References Rabaey, Digital Integrated Circuits and EE241 (1998) notes Chapter 25, ing of High-Performance Processors by D.K. Bhavsar
More informationMANUAL AND SEMIAUTOMATIC SMD ASSEMBLY SYSTEMS. engineered by
MANUAL AND SEMIAUTOMATIC SMD ASSEMBLY SYSTEMS engineered by SWISS MADE SMD placement systems for prototyping and low volumes Manual and semiautomatic models Smooth gliding arm system Air suspended pick-and-place
More informationHarvatek International 2.0 5x7 Dot Matrix Display HCD-88442
Harvatek International 2.0 5x7 Official Product Customer Part No. Data Sheet No. **************** **************** Feb. 13, 2008 Version of 1.2 Page 1/10 DISCLAIMER HARVATEK reserves the right to make
More informationBroken Scan Chains Routinely Debugged with New Optical Technique
t a m V- 3000.0 2500.0 2000.0 1500.0 1000.0 500.0 0.00-500.0-1000.0-1500.0 OSCILLOSCOPE Design file: MSFT DIFF CLOCK WITH TERMINATORREV2.FFS Designer: Microsoft HyperLynx V8.0 Comment: 650MHz at clk input,
More informationNova NanoSEM Superior Imaging and Analytical Performance
Nova NanoSEM Superior Imaging and Analytical Performance FEI Nova NanoSEM scanning electron microscopes combine best-in-class imaging with superb analytical performance in one easy-to-use instrument.
More informationAvoiding False Pass or False Fail
Avoiding False Pass or False Fail By Michael Smith, Teradyne, October 2012 There is an expectation from consumers that today s electronic products will just work and that electronic manufacturers have
More informationLUMIGEN INSTRUMENT CENTER X-RAY CRYSTALLOGRAPHIC LABORATORY: WAYNE STATE UNIVERSITY
Standard Operating Procedure for the Bruker X8 APEX II Single-Crystal X- Ray Diffractometer Contact Manager: Dr. Cassie Ward ward@wayne.edu Office room 061 Chemistry (313) 577-2587 LIC Lab: (313) 577-0518
More informationAt-speed testing made easy
At-speed testing made easy By Bruce Swanson and Michelle Lange, EEdesign.com Jun 03, 2004 (5:00 PM EDT) URL: http://www.eedesign.com/article/showarticle.jhtml?articleid=21401421 Today's chip designs are
More informationFigure 1: AFM image of a Tip-check sample
Atomic Force Microscopy Atomic force microscopy is a microscope technique that involves viewing samples with a resolution of under a fraction of a nanometer. The applications for Atomic Force Microscopy
More informationThe hybrid photon detectors for the LHCb-RICH counters
7 th International Conference on Advanced Technology and Particle Physics The hybrid photon detectors for the LHCb-RICH counters Maria Girone, CERN and Imperial College on behalf of the LHCb-RICH group
More informationDS2176 T1 Receive Buffer
T1 Receive Buffer www.dalsemi.com FEATURES Synchronizes loop timed and system timed T1 data streams Two frame buffer depth; slips occur on frame boundaries Output indicates when slip occurs Buffer may
More informationTutorial on Technical and Performance Benefits of AD719x Family
The World Leader in High Performance Signal Processing Solutions Tutorial on Technical and Performance Benefits of AD719x Family AD7190, AD7191, AD7192, AD7193, AD7194, AD7195 This slide set focuses on
More informationIN-VISION All rights reserved. IN-VISION GmbH. B2B DLP Light Engine and Optical Solutions
IN-VISION 2017. All rights reserved. IN-VISION GmbH B2B DLP Light Engine and Optical Solutions Company Long-term experience in development and manufacturing of high-end optical projection lens assemblies
More informationAIM INTRODUCTION SIMPLIFIED WORKFLOW
CD-R PATENT PROTECTION: BRAND CHARACTERIZATION TO IDENTIFY COUNTERFEIT GOODS USING SIMPLIFIED MASS SPECTROMETRY James Morphet and Eleanor Riches Waters Corporation, Manchester, UK AIM To provide an easy-to-use
More informationET-5050x-BF1W Datasheet
PLCC Series ET-5050x-BF1W Datasheet Features : High luminous Intensity and high efficiency Based on GaN technology Wide viewing angle : 120 Excellent performance and visibility Suitable for all SMT assembly
More informationTWO CHANNEL MICROPHONE PREAMPLIFER
Studio design and build Acoustic consultancy and treatment Sound system design and installation Distribution of high performance, innovative products Own brand pro audio and custom products Cabling Demonstration
More informationLow-Cost, 900MHz, Low-Noise Amplifier and Downconverter Mixer
19-193; Rev 1; 1/ EVALUATION KIT AVAILABLE Low-Cost, 9MHz, Low-Noise Amplifier General Description The s low-noise amplifier (LNA) and downconverter mixer comprise the major blocks of an RF front-end receiver.
More information1. Publishable summary
1. Publishable summary 1.1. Project objectives. The target of the project is to develop a highly reliable high brightness conformable low cost scalable display for demanding applications such as their
More informationFeatures. High Brightness SMD LED Light source
www.edison-opto.com Solid-State Lighting Series 5W MR16 DATASHEET Features High Brightness SMD LED Light source Ecologically Friendly Energy Efficient General Information... 1 Product Dimensions... 2 Product
More informationLarge Area, High Speed Photo-detectors Readout
Large Area, High Speed Photo-detectors Readout Jean-Francois Genat + On behalf and with the help of Herve Grabas +, Samuel Meehan +, Eric Oberla +, Fukun Tang +, Gary Varner ++, and Henry Frisch + + University
More informationLIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only. SINGLE DIGIT LED DISPLAY (0.56 Inch) LSD511/24-XX DATA SHEET REV. : A
SINGLE DIGIT LED DISPLAY (0.56 Inch) LSD511/24-XX DATA SHEET DOC. NO : QW0905- LSD511/24-XX REV. : A DATE : 19 - Jan - 2005 Page 1/7 Package Dimensions 12.5 (0.492") 8.0 (0.315") A 14.2 (0.56") F G B 19.0
More informationMAXIM INTEGRATED PRODUCTS
RELIABILITY REPORT FOR MAX3639ETM+ PLASTIC ENCAPSULATED DEVICES June 21, 2010 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability
More informationPerformance Evaluation of Industrial Computed Radiography Image Display System
Performance Evaluation of Industrial Computed Radiography Image Display System More info about this article: http://www.ndt.net/?id=21169 Lakshminarayana Yenumula *, Rajesh V Acharya, Umesh Kumar, and
More informationLED Display Product Data Sheet LTS-2306CKD-P Spec No.: DS Effective Date: 07/20/2013 LITE-ON DCC RELEASE
LED Display Product Data Sheet LTS-2306CKD-P Spec No.: DS30-2013-0036 Effective Date: 07/20/2013 Revision: - LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1
More informationElectrospinning modifications
Electrospinning modifications Direct current DC Nanofibrous thread (yarn) production Bicomponent fibers Porous fibers Manufacture of thread through electrospinning Spinning from the liquid surface Manufacture
More informationPRODUCT GUIDE CEL5500 LIGHT ENGINE. World Leader in DLP Light Exploration. A TyRex Technology Family Company
A TyRex Technology Family Company CEL5500 LIGHT ENGINE PRODUCT GUIDE World Leader in DLP Light Exploration Digital Light Innovations (512) 617-4700 dlinnovations.com CEL5500 Light Engine The CEL5500 Compact
More information