Qualcomm VIVE QCA9500 First WiGig Chipset in 60 GHz Band

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Qualcomm VIVE QCA9500 First WiGig Chipset in 60 GHz Band RF report by Stéphane ELISABETH January 2018 21 rue la Noue Bras de Fer

1 Qualcomm VIVE QCA9500 First WiGig Chipset in 60 GHz Band RF report by Stéphane ELISABETH January rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 1

2 SOMMAIRE 3 o Executive Summary o Reverse Costing Methodology Company Profile 6 o Qualcomm o WiFi History, Evolution & Challenges o Qualcomm 60 GHz PortFolio o Toward 5G Implementation o TP-LINK Talon AD7200 Teardown 24 o WiGig First mmwave Certificated protocol o mmwave communication penetration rate o Doubled sided technology o RF SiP packaging market revenue 29 o Synthesis of the o Module Package 31 Package Views: Dimensions, marking, Block Diagram of the Baseband Board 29 o Baseband Board 34 Board disassembly: Overview, Bill of materials Board Cross-Section : PCB substrate o Baseband SiP 40 Package Views: Dimensions, marking Package Opening: Top, Botttom, Bill of Materials Package Cross-Section : PCB Substrate, Copper Pillars, Dies Summary of Physical Data Summary of main Dies o Baseband Processor & SiP active dies 60 Die View & Dimensions Delayering & main Blocs Die Process Die Cross-Section Die Process Characteristic 77 Discrete packaging Solution of the Antenna Board 79 o Antenna Board 80 Board disassembly: Overview, Bill of materials Board Overview : Patch Antenna, Quasi yagi Type Antenna Ceramic Substrate deprocessing Board Cross-Section: Ceramic substrate, Patch & Quasi yagi Type antenna o RFIC 96 Die View & Dimensions Delayering & main Blocs Die Process Die Cross-Section Die Process Characteristic Manufacturing Process 111 of the main parts o Baseband Processor, RFIC Die Front-End Process & Fabrication Unit o SiP Fabrication Unit o SiP Packaging Process Flow 119 of the cost analysis o Yields Explanation & Hypotheses 122 o Baseband Processor, RFIC 124 Die Front-End Cost Die Wafer Cost Die Cost o SiP Packaging 126 Reconstituted Wafer on Glass Carrier Cost SiP Packaging Cost SiP Packaging Cost per steps SiP Component Cost o Module 131 Module Assembly Cost QCA9500 Component Cost Estimated Selling Price 135 Company services by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 2

3 Executive Summary o Executive Summary o Reverse Costing Methodology This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Qualcomm VIVE QCA9500. The QCA9500 is a complete solution for WiGig application dedicated to mobile devices (Computer) and access point (router). The module comes with two boards linked by a coaxial connection. The first board features an RFIC and innovative antennas, and the second features an advanced System in Package (SiP) using Double Side Molding configuration. The SiP integrates a baseband (BB) processor along with a switch, a regulator, a crystal, a memory and more than 60 SMD components, all in a single package smaller than 40 mm². This is the first double side molding device than we have found in the market, and it could be a key milestone for 5G SiP technology. Developed by Wilocity, a subsidiary company of Qualcomm since 2014, the RFIC features up to four transceivers controlling up to 32 antennas (patch and Quasi-Yagi-Type) for the beamforming at 60 GHz. The SiP uses non-conventional molded packaging developed by Amkor. It has innovative interconnections, enabling the redistribution of the BB processor signal to the PCB. Copper pillars inside the molding and a very thin confined PCB substrate complete the signal distribution structure. This report includes a full analysis of the module, featuring a detailed analysis of the SiP and the antenna board including die analyses, processes and board cross-section. Finally, it contains a complete cost analysis and a selling price estimation of the system by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 3

4 TP-LINK Talon AD7200 Teardown o Qualcomm o WiFi technology o Qualcomm PortFolio o AD7200 Teardown 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 4

5 RF SiP packaging Market Revenue o Communication protocol o mmwave penetration rate o Double sided technology o RF SiP Market revenue 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 5

6 Synthesis of the Physical analysis o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 6

7 Module View & Dimensions o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 7

8 Baseband Board Board Cross-Section o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 8

9 Baseband SiP Package View & Dimensions o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 9

10 Baseband SiP Package Opening o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 10

11 Baseband SiP Package Cross-Section o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 11

12 Baseband SiP Baseband Processor Die Dimensions o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die PGDW: Potential Good Dies per Wafer 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 12

13 Antenna Board Board Overview o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 13

14 Antenna Board Antenna Patch o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 14

15 Antenna Board Board Cross-Section Ceramic Substrate o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 15

16 Antenna Board RFIC Die View & Dimensions o Module o Baseband Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies o Antenna Board Cross-Section RFIC Die 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 16

17 Packaging Process Flow (1/2) o Front-End Process & Fabrication Unit o SiP Process Flow 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 17

18 Baseband Processor Front-End Cost o Supply o Yield Hypotheses o Front-End Cost & Wafer/Die Cost o SiP Packaging Cost o Component Cost 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 18

19 SiP Packaging Cost o Supply o Yield Hypotheses o Front-End Cost & Wafer/Die Cost o SiP Packaging Cost o Component Cost 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 19

20 SiP Component Cost o Supply o Yield Hypotheses o Front-End Cost & Wafer/Die Cost o SiP Packaging Cost o Component Cost 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 20

21 Component Cost o Supply o Yield Hypotheses o Front-End Cost & Wafer/Die Cost o SiP Packaging Cost o Component Cost 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 21

22 Estimated Manufacturer Price o Definition of Prices o Manufacturer Financial o Manufacturer Price 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 22

MARKET AND AND TECHNOLOGY REPORTS - YOLE - DÉVELOPPEMENT RF DEVICES & TECHNOLOGIES Advanced RF System-in-Package for Cell

23 Related Reports o Company services o Related reports o Contact o Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING PACKAGING Advanced RF SiPs for Cell Phones: Reverse Costing Overview IC & RF Smartphone RF Front-End Module Review MARKET MARKET AND AND TECHNOLOGY REPORTS - YOLE - DÉVELOPPEMENT RF DEVICES & TECHNOLOGIES Advanced RF System-in-Package for Cell Phones 2017 RF Front End Modules and Components for Cellphones by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 23

24 COMPANY SERVICES 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 24

services o Related reports o Contact o Legal Costing Tools

25 Business Models a Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>40 reports per years) o Company services o Related reports o Contact o Legal Costing Tools Training 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 25

26 Contact PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE o Company services o Related reports o Contact o Legal Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2018 by System Plus Consulting NXP SCM-i.MX6Q RCP SiP 26

27 ORDER FORM Ref.: SP18374 Please process my order for Qualcomm QCA9500 WiGig Chipset Reverse Costing Report Full Reverse Costing report: EUR 3,990* Annual Subscription (including this report as the first of the year): o 3 reports EUR 8 400* o 5 reports EUR * o 7 reports EUR * o 10 reports EUR * o 15 reports EUR * *For price in dollars please use the day s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT *Our prices are subject to change. Please check our new releases and price changes on The present document is valid 6 months after its publishing date: January 2018 SHIP TO Name (Mr/Ms/Dr/Pr):... Job Title:... Company:... Address:... City: State:... Postcode/Zip:... Country:... VAT ID Number for EU members:... Tel: Date:... Signature:... BILLING CONTACT First Name:... Last Name: Phone:... PAYMENT DELIVERY on receipt of payment: By credit card: Number: Expiration date: / Card Verification Value: By bank transfer: HSBC - CAE- Le Terminal -2 rue du Charron St Herblain France BIC code: CCFRFRPP In EUR Bank code : Branch code : Account : IBAN: FR In USD Bank code : Branch code : Account : IBAN: FR Return order by: FAX: MAIL: SYSTEM PLUS CONSULTING 21 rue La Nouë Bras de Fer Nantes France Contact: sales@systemplus.fr TEL: ABOUT SYSTEM PLUS CONSULTING System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available. Our services: TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS - sales@systemplus.fr Performed by

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STMicroelectronics Proximity Sensor & Flood Illuminator Time of Flight & Illumination device from Apple iphone X

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