InvenSense Fabless Model for the MEMS Industry

Transcription

1 InvenSense Fabless Model for the MEMS Industry HKSTP Symposium Aug 2016 InvenSense, Inc. Proprietary

2 Outline MEMS Market InvenSense CMOS-MEMS Integration InvenSense Shuttle Program and Process

3 MEMS MARKET

4 US$M MEMS Markets by Applications $18,000 $16,000 $14,000 $12,000 $10,000 $8,000 $6,000 $4,000 $2,000 Automotive Consumer Industrial Telecom $ Yole Devéloppement Status of the MEMS Industry April 2014

5 US$M MEMS for Internet of Things (IoT) Market $1,200 $1,000 $800 $600 $400 $200 $ Yole Devélopement Status of the MEMS Industry April 2014

6 Ambient Computing Internet of Things AlwaysOn, and Intuitively Interactive Apps and Services Location + Activity + Time + Environment Sensor Sensor wearabl e energy security control sports 15

7 INVENSENSE

8 ($ in Millions) $372 $253 $209 $153 $80 $97 $3 $8 $29 FY2007 FY2008 FY2009 FY2010 FY2011 FY 2012 FY2013 FY2014 FY2015 Founded 2003 Headquarters San Jose, CA Cash Position $242M (As of 28 June 2015) NYSE: INVN Employees 665 Note: Company fiscal year ends Sunday closest to March 31.

9 Calgary, Canada San Jose, Calif Boston, Mass Grenoble, France Bratislava, Slovakia Milan, Italy Seoul, Korea Shenzhen, China Yokohama, Japan Shanghai, China Hsinchu, Taiwan 9

10 Select Customers Imaging 12% Other/ IoT 10% FY15 Mobile 78% 10

11 Unique Technology & Intellectual Property MEMS Microphones MEMS Sensors Sensor Fusion Fabrication Stabilization Navigation Fingerprint Authentication 11

12 Fabless Business Model CMOS-MEMS Wafer Sort Packaging Proprietary Testing TSMC GlobalFoundries InvenSense ASE Amkor Lingsen InvenSense 1 Billion Unit Capacity Super Efficient Supply Chain Easy Fulfillment of Short Lead Time Upsides 12

13 VALUE OF WAFER-LEVEL CMOS-MEMS INTEGRATION

14 Wafer-level Integration Advantages Low Parasitics Minimize routing and external interconnect Wafer Level Sealing / Packaging Wafer Level Testing Designed for Test

15 Semiconductor Manufacturing Flow for MEMS InvenSense Process CMOS MEMS Wafer TSMC Wafer Sort (e-test) Singulation Integrated Chip Assembly 1 chip Final Test 15 CMOS-MEMS Wafer Sort Packaging FT & Ship Traditional MEMS Process CMOS Wafer Foundry 1 MEMS Wafer Foundry 2 WAT CMOS only MEMS WAT Singulation ASIC Chip Singulation MEMS Chip Assembly Multi-Chip Final Test

16 Applications Benefiting from CMOS Integration High Sensitivity Low signal and low noise requirement High Complexity Large arrays and closed-loop control High Integration Sensor fusion and high-density SoC Low Cost and Small Size Mobile devices and Internet of Things Implantable Sensors

17 INVENSENSE SHUTTLE

18 Challenges for MEMS Product Development Fabrication One product - one process increases barrier to entry Find foundry able and willing to bring up new process Development Fighting both design and process simultaneously Need for fast design iterations to keep up with market New start ups need $50M-$70M, 7+ years to profit Production Over 50% of costs are in package and test Establish high yield and quality Establish reliable supply chain to deliver high quality at low cost Growth Extend and expand product base Maintain competitiveness - add more value and lower cost

19 InvenSense Shuttle Objectives Offer a proven and high volume CMOS-MEMS platform for MEMS fabrication Speed up development cycle and time to commercialization Bring the fabless CMOS scalable production model to MEMS industry

20 InvenSense Shuttle Payoff Innovators Faster development cycle by focusing on innovative MEMS designs and not fabrication Faster and lower cost development cycles InvenSense Collaborate on new ideas and opportunities Building a closer relationship with innovators Potential royalty revenue Market More innovations in MEMS More standardization in the industry

21 InvenSense Shuttle Processes Standard (SOI) Shuttle Process used on InvenSense inertial sensors SOI MEMS integrated with 0.18um CMOS Suitable for: Inertial, Resonators, Pressure, RF Piezo Shuttle Extension of standard process to piezo (AlN) AlN + Si MEMS integrated with 0.18um CMOS Suitable for: RF, Ultrasound, IR, Timing, Audio

22 SOI Shuttle Process Overview MEMS Single-Crystal Si MEMS Structural layer DRIE structure definition No release etch requirement Aluminum-Germanium wafer bond CMOS 0.18 mm Process High voltage LDMOS (up to 24v) 6 Metal layers MEMS Anchored to handle only MEMS Anchored to handle and CMOS Upper Cavity CMOS Contact Moveable MEMS Wire-Bond Pad Bottom Cavity in CMOS Electrode to interact with MEMS Eutectic Bond CMOS Wafer CMOS Top Metal Device Layer Handle Wafer IMD+Pass. Germanium Buried Oxide Top Aluminum

23 Piezo Shuttle Process Overview MEMS AlN + Silicon structural layer Top and Bottom piezo electrodes Port opening to expose MEMS to environment TCF compensation options Aluminum-Germanium wafer bond CMOS 0.18 mm Process High voltage LDMOS (up to 24v) 6 Metal layers MEMS wafer Oxide Al Device layer CMOS wafer AlN Mo Ge IMD

24 Standard Shuttle Process Flow

25 Piezo Shuttle Process Flow MEMS wafer Oxide Al Device layer CMOS wafer AlN Mo Ge IMD 25

26 SAMPLE SHUTTLE PROJECTS

27 Project: Mode-Reversal FM Gyro Collaborators: D. Horsley, B. Boser UC Davis/Berkeley Process: SOI 27

28 Project: CMOS-Integrated High- Frequency Resonators Collaborators: T. Kenny, B. Murmann Stanford University Process: SOI 28

29 Project: Nano-Power Pressure Sensor Collaborators: S. Gambini University of Melbourne Process: SOI 29

30 Shuttle Projects: IR Sensor Collaborators: Mina Rais-Zadeh University of Michigan Process: Piezo IR on IR off 30

31 Projects: Ultrasonic Fingerprint Sensor Lateral distance - y (mm) Collaborators: D. Horsley, B. Boser UC Davis/Berkeley Process: Piezo Fingerprint (optic) 4 3 Fingerprint (ultrasonic) mv Lateral distance - x (mm)

32 INVENSENSE SHUTTLE PROGRAM

33 Summary InvenSense Shuttle Brings the CMOS fabless model to MEMS industry Increases MEMS Value through system integration Enables revolutionary new Smart MEMS products Opens world class foundries to MEMS innovators Reduces time to market Next Shuttle tapes out in December 2016 For More Information Contact us: Register on NF Shuttle Web Site:

34 Thank You InvenSense InvenSense, Inc. Company Inc. Proprietary Confidential