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1 21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) info@systemplus.fr - website : November Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 1
2 Glossary Table of Contents (Preliminary) 1. Overview / Introduction Executive Summary Reverse Costing Methodology 2. Companies Profile STMicroelectronics Profile MEMS IMU Portfolio LSM333D Characteristics 3. LSM333D Physical Analysis Physical Analysis Methodology Package Package Characteristics & Markings Package Pin-Out Package X-Ray Package Opening Main Parts Package Opening ASIC RDL Package Opening Dies Bonding Process Package Cross-Section ASICs ASICs Dimensions ASICs Markings ASICs Delayering ASICs Cross-Section MEMS Gyro/Accelero MEMS Gyro/Accelero Dimensions MEMS Gyro/Accelero Markings MEMS Gyro/Accelero bonding pads MEMS Gyro/Accelero Cap Opening MEMS Gyro/Accelero Cap Overview MEMS Gyro/Accelero Sensing Area MEMS Gyro/Accelero Cross-section X/Y-Axis Magnetometer X/Y-Axis Magnetometer Dimensions X/Y-Axis Magnetometer Markings X/Y-Axis Magnetometer Delayering X/Y-Axis Magnetometer Cross-section Z-Axis Magnetometer Z-Axis Magnetometer Dimensions Z-Axis Magnetometer Markings Z-Axis Magnetometer UBM Z-Axis Magnetometer Cross-section 4. Manufacturing Process Flow Global Overview ASICs Process Flow ASIC RDL Process Flow Description of the ASIC Wafer Fabrication Unit MEMS Gyro/Accelero Process Overview MEMS Gyro/Accelero - Sensor Process Flow MEMS Gyro/Accelero - Cap Process Flow MEMS Gyro/Accelero - Wafer Bonding Process Flow Description of the MEMS Accelerometer Wafer Fabrication Unit X/Y-Axis & Z-Axis Magnetometer Process Flow Description of the Magnetometer Wafer Fabrication Unit Component Packaging Process Flow Description of the Assembly Unit 5. Cost Analysis Synthesis of the Cost Analysis Main Steps of Economic Analysis Yields Explanation Yields Hypotheses Die per wafer & Probe Test ASICs Wafer Cost ASICs Back-End 0 : RDL, Probe Test, Backgrinding & Dicing ASICs Die Cost MEMS Gyro/Accelero Wafer Cost MEMS Gyro/Accelero cost per Steps MEMS Gyro/Accelero Die Cost Magnetometer Wafer Cost Magnetometer cost per Steps X/Y-Axis Magnetometer Die Cost Z-Axis Magnetometer Die Cost Back-End: Packaging Cost Back-End: Packaging Cost per steps Back-End: Final test & Calibration Cost LSM333D Component Cost (FE + BE 0 + BE 1) 6. Estimated Price Analysis Definition of Prices Manufacturer Financial Ratios LSM333D Estimated Manufacturer Price LSM333D Estimated Selling Price Contact by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 2
3 Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the STMicroelectronics LSM333D component. The LSM333D is a 9-axis MEMS IMU (3-axis gyroscope + 3-axis accelerometer + 3-axis magnetometer). It is suitable for portable applications: Indoor navigation, Smart user interface, Advanced gesture recognition, Gaming and virtual reality input device, Display/map orientation and browsing, ecompass, Position and motion detection functions, Click/double click recognition, Intelligent power saving for handheld devices). The LSM333D provides accurate output across full-scale ranges up to ±2000dps (rotational acceleration), ±16g (linear acceleration) and ±12 Gauss (magnetic field). Compatible with SMD process, the LSM333D is provided in a 4x4x1mm LGA 24-pin package. Note : The LSM333D integrates a 3-axis Gyroscope, a 3-axis Accelerometer and a 3-axis magnetometer. Notations bellow are used in this report : One die constitute the 3-axis Gyroscope and the 3-axis Accelerometer, it is called : MEMS Gyro/Accelero: A microsystem which comprise two parts, MEMS Cap and MEMS Sensor. Two dies constitute the 3-axis Magnetometer, they are called : X/Y-Axis magnetometer : A sensor die which is used to measure the magnetic field on the X-axis and Y-axis. Z-Axis magnetometer A sensor die which is used to measure the magnetic field on the Z-axis. One die constitutes the control IC for the gyroscope function, it is called : Gyroscope ASIC : An IC die which is used to control the MEMS gyroscope.. One die constitutes the control IC for the accelerometer and magnetometer functions, it is called : Accelero/Magneto ASIC : An IC die which is used to control the MEMS accelerometer and all the 3 axes of the magnetometer. These notations are used both in this report and in the excel file by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 3
4 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 4
5 Package Characteristics & Markings Package type: 24-pin LGA Dimensions: 4mm x 4mm x 1mm Pin pitch: Marking: 0.5mm 9S Q6FBD Package Top view Package side view Package back view 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 5
6 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 6
7 MEMS Gyro/Accelero Dimensions 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 7
8 MEMS Gyro/Accelero Gyroscope Sensor Details 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 8
9 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 9
10 X/Y-Axis Magnetometer Delayering 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 10
11 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 11
12 Main steps of economic analysis ASICs Front-End Cost MEMS Gyro/Accelero Front-End Cost X/Y-Axis Magnetometer Front-End Cost Z-Axis magnetometer Front-End Cost Probe Test Cost Probe Test Cost Probe Test Cost Probe Test Cost Dicing Cost Dicing Cost Dicing Cost Dicing Cost Packaging Cost Final Test Cost Component Cost We perform the economic analysis of the ASICs with the IC Price+ software. We perform the economic analysis of the MEMS Gyro/Accelero, the X/Y-Axis Magnetometer, the Z-Axis Magnetometer and the packaging with the MEMS CoSim+ software by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 12
13 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 13
14 Gyroscope ASIC Front-End Cost 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 14
15 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 15
16 X/Y-Axis Magnetometer - Total Cost & Die Cost 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 16
17 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 17
18 Back-End - Packaging Cost Breakdown 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 18
19 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 19
20 LSM333D Component Cost (FE+BE 0+BE 1) 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 20
21 LSM333D Estimated Selling Price (Medium Yield) 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 21
22 Contact Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. Given the hypothesis presented in this analysis the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) Test +/- 20% IC +/- 8% Packaging +/- 10% These results are open for discussion. We can re-evaluate this component with your information. Please contact us: 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM333D 6-Axis Electronic Compass 22
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Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr December 2013 Version 1 Written by Romain
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